STAR Pixel Detector readout prototyping status

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STAR Pixel Detector readout prototyping status

description

STAR Pixel Detector readout prototyping status. Talk Outline. Quick review of requirements and system design Status at last meeting at IPHC RDO hardware status RDO firmware and software status Future development path. 2. RDO Requirements and Design. - PowerPoint PPT Presentation

Transcript of STAR Pixel Detector readout prototyping status

Page 1: STAR Pixel Detector readout prototyping status

STAR Pixel Detectorreadout prototyping status

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Talk Outline

• Quick review of requirements and system design

• Status at last meeting at IPHC

• RDO hardware status

• RDO firmware and software status

• Future development path

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RDO Requirements and DesignIn addition to the detailed requirements imposed by the interface to the

sensors, the RDO system shall:

• Triggered detector system fitting into existing STAR infrastructure (Trigger, DAQ, etc.)

• Deliver full frame events to STAR DAQ for event building at approximately the same rate as the TPC (1 kHz for DAQ1000).

• Have live time characteristics such that the Pixel detector is live whenever the TPC is live.

• Reduce the total data rate of the detector to a manageable level (< TPC rate of ~1MB / event).

• Reliable, robust, cost effective, etc.

Furthermore, this RDO system will be the basis of the future sensor testing including production probe testing so additional functionality will be included to enable this system to have the needed additional capabilities.

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Pixel Detector Design

Ladder with 10 MAPS sensors (~ 2×2 cm each)

MAPSRDObuffers/drivers

4-layer kapton cable with aluminium traces

Mechanical support with kinematic mounts

Cabling and cooling infrastructure

Detector extraction at one end of the cone

New beryllium beam pipe (800 µm thick, r = 2 cm)

2 layers10 modules4 ladders/module

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Functional Data Path – One Ladder

buffer

JTAG, CLK, CTL, markers

buffer

This is a highly parallel readout system. 4 ladders per module (RDO motherboard). 10 modules in the PIXEL detector.

LU protected power

Digital hit data

10 sensors

After power-on and configuration, the sensors are run continuously. Triggering is handled in the next stage of the RDO.

1 Ladder

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Functional Data Path – Phase 1

Each received trigger enables an event buffer for one frame.

The system is dead-time free up to the hardware limit of the number of buffers.

Highly Parallel FPGA based RDO system

AddressCounter(zero-

suppression)

EventBuffer

EventBuffer

EventBuffer

1

2

10

EventBuilder

RDOBuffer

SIU

DAQPC

Disk

160 MHzBinary Data

(4 chains per sensor) * (10 sensors per ladder) *(4 ladders per RDO board) = 160 chains per RDO board

160 independent sensor data chains

One per RDO board

FPGA Block RAM

•40 sensor outputs/ladder•4 ladders/module•1 RDO board/module•3 RDO boards for Phase-1 prototype test system

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Functional Data Path – Final (Ultimate)

•20 sensor outputs/ladder•4 ladders/module•1 RDO board/module•10 RDO boards for system

Each received trigger enables an event buffer for one frame. Triggered event boundaries are determined by data order.

Highly Parallel FPGA based RDO system

EventBuffer

EventBuffer

EventBuffer

1

2

10

EventBuilder

RDOBuffer

SIU

DAQPC

Disk

160 MHz Address only data

(2 chain per sensor) * (10 sensors per ladder) *(4 ladders per RDO board) = 80 chains per RDO board

80 independent sensor data chains

One per RDO board

Same hardware with reconfigured firmware

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RDO System Design – Physical Layout

1-2 mLow mass twisted pair

6 m - twisted pair

Sensors, Ladders, Modules(interaction point)

LU Protected Regulators,Mass cable termination

RDO BoardsDAQ PCs

(Low Rad Area)

DAQ Room

PowerSupplies

Platform

30 m

100 m - Fiber optic

30 m

Control PCs

Platform

30 m

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RDO Status as of 04/2008 LBNL-IPHC meeting

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RDO Status - Hardware

Hardware – RDO motherboard – Fabricated, tested for individual sensor readout (analog and digital). 3 RDO systems loaded and tested.Mass termination board – Fabricated – under test. Full testing will commence with the readout of a 10 sensor ladder. 1 board loaded.LU protected power boards – Fabricated and tested. 5 boards loaded and tested. Low mass cable – Separate presentation.

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RDO Status – Firmware and Software

Control Logic State Machine

JTAG

TCD Interface / logic

SRAM controller

ADC Controller

Address counter

Event FIFOs

Header Builder

Event Builder

Clk / Marker / START /logic and monitor

LU monitor / control

Temp. ADC controller

Internal Monitoring

Control Interface

SIU Interface

USB Interface

Soft CPU

•Status as shown above. •Software is on a parallel path

See http://rnc.lbl.gov/hft/hardware/docs/Phase1/index.html for full documentation

Mimostar-3 Testing

Phase-1 ladder Testing

Same for all

Phase-1 Testing

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RDO Status – Firmware and Software

•Phase-1 readout firmware and software are complete and working for analog and digital data for individual sensor testing.•DDL optical link and USB based data paths are both functional.•Analysis software for Phase-1 data is mostly complete. We are using both Root and Labview based analysis paths.•Scripting needed for automated testing of sensors is complete and working.•The analysis path for 10 sensor ladders is expected to be a simple extension of the existing framework.

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• Adaptation of the existing individual testing system for use in automated probe testing.

• Development of the 10 sensor ladder readout firmware and software.

• Design and implementation of a slow control system for the detector.

• Extension of the system into multi-ladder / multi-sector readout.

RDO Status – Future Development

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Parameters and Data Rates

Item Number

Bits/address 20

Integration time 200 µs

Luminosity 8 × 1027

Hits / frame on Inner sensors (r=2.5 cm)

246

Hits / frame on Outer sensors (r=8.0 cm)

24

Final sensors (Inner ladders) 100

Final sensors (Outer ladders) 300

Event format overhead TBD

Average Pixels / Cluster 2.5

Average Trigger rate 1 kHz

Item Number

Bits/address 20

Integration time 640 µs

Luminosity 3 × 1027

Hits / frame on Inner sensors (r=2.5 cm)

295

Hits / frame on Outer sensors (r=8.0 cm)

29

Phase-1 sensors (Inner ladders) 100

Phase-1 sensors (Outer ladders) 300

Event format overhead TBD

Average Pixels / Cluster 2.5

Average Trigger rate 1 kHz

Phase-1 Final (Ultimate)

Raw data rate from sensors = 32 GB/secData rate to storage = 237 MB/sec(Scaled to full size detector)

Data rate to storage = 199 MB/sec

Note: Data rates for hit data only for Au-Au central collisions including peripheral collision electrons. Sensor noise is not included.

Item Number

Bits/address 20*

Integration time 640 µs

Luminosity 3 × 1027

Hits / frame on Inner sensors (r=2.5 cm) 295

Hits / frame on Outer sensors (r=8.0 cm) 29

Phase-1 sensors (Inner ladders) 100

Phase-1 sensors (Outer ladders) 300

Event format overhead TBD

Average Pixels / Cluster 2.5

Average Trigger rate 1 kHz

Item Number

Bits/address 20*

Integration time 200 µs

Luminosity 8 × 1027

Hits / frame on Inner sensors (r=2.5 cm) 246

Hits / frame on Outer sensors (r=8.0 cm) 24

Final sensors (Inner ladders) 100

Final sensors (Outer ladders) 300

Event format overhead TBD

Average Pixels / Cluster 2.5

Average Trigger rate 1 kHz

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DDLController

USBController

Command decoder

Event builder

Frame FIFO

ADC LVDS SPARE IO

SRAM controller

Global control register(access every module)

TemperatureADC

Internal processor(contact outside by SPARE IO)

TCD

This is the block diagram of firmware structure of pixel readout boardThick arrow means connection to outside of FPGABlock which connects to outside of FPGA includes IO pins and controller.Cross lines denotes NO connection.

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