Si3N4 Deposition & the Virtual Chemical Vapor Deposition Lab · Milo Koretsky Chemical Engineering...
Transcript of Si3N4 Deposition & the Virtual Chemical Vapor Deposition Lab · Milo Koretsky Chemical Engineering...
Si3N4 Deposition & the Virtual
Chemical Vapor Deposition Lab
Making a transistor, the general process
A closer look at chemical vapor deposition and the virtual lab
Images courtesy Silicon Run Educational Video, VCVD Lab Screenshot
On a wafer, billions of transistors are housed on a single square chip. One malfunctioning transistor could cause a chip to short-circuit, ruining the chip. Thus, the process of creating each microscopic transistor must be very precise.
Wafer image: http://upload.wikimedia.org/wikipedia/fr/thumb/2/2b/PICT0214.JPG/300px-PICT0214.JPG
Why Si3N4 Deposition…Making
Microprocessors
http://vista.pca.org/yos/Porsche-911-Turbo.jpg
http://www.sonyericsson.com/cws/products/mobilephones
/overview/x1?cc=us&lc=en
What size do you think an
individual transistor being
made today is?
Size of Transistors
Scaling of successive generations of MOSFETs into the nanoscale regime (from Intel).
One chip is made of millions or billions of transistors
packed into a length and width of less than half an
inch. Channel lengths in MOSFET transistors are
less than a tenth of a micrometer. Human hair is
approximately 100 micrometers in diameter.
Transistor: MOS
We will illustrate the process sequence of
creating a transistor with a Metal Oxide
Semiconductor(MOS) transistor.
Wafers – 12” Diameter
p-Si
Insulatorconductor
n-Si
Source DrainGate
n-Si
½” to ¾”
Image courtesy: Pro. Milo Koretsky
Chemical Engineering Department at OSU
IC Manufacturing ProcessIC Processing consists of selectively
adding material (Conductor, insulator,
semiconductor) to, removing it from or
modifying it
Wafers
Deposition /
OxidationEtching / CMP
Loop
Photo/
Pattern
Transfer Cle
an
Cle
an Ion Implant /
Anneal
Graphics copy-write Pro. Milo Koretsky
Chemical Engineering Department at OSU
(Note that these steps are not all the steps to create
a transistor. Some steps are skipped. This is purely to
show the various stages in the loop to create a transistor.)
Making a Transistor:
Starting Silicon Wafer
Dep
os
ition
/
Oxid
atio
n
Lo
op
Ph
oto
/
Patte
rn
Tra
ns
fer
Etc
hin
g /
CM
P
Clean
Ion
Imp
lan
t /
An
ne
al
Si
Wafers
Graphics copy-write Pro. Milo Koretsky
Chemical Engineering Department at OSU
Clean substrate
Si
Polished Silicon Wafer
Graphics copy-write Pro. Milo Koretsky
Chemical Engineering Department at OSU
Dep
os
ition
/
Oxid
atio
n
Lo
op
Ph
oto
/
Patte
rn
Tra
ns
fer
Etc
hin
g /
CM
P
Clean
Ion
Imp
lan
t /
An
ne
al
Chemical Vapor Deposition: Si3N4
Si
Graphics copy-write Pro. Milo Koretsky
Chemical Engineering Department at OSU
Dep
os
ition
/
Oxid
atio
n
Lo
op
Ph
oto
/
Patte
rn
Tra
ns
fer
Etc
hin
g /
CM
P
Clean
Ion
Imp
lan
t /
An
ne
al
Process 200 Wafers at a Time
Spin Coating of Photoresist
Si
mask
Graphics copy-write Pro. Milo Koretsky
Chemical Engineering Department at OSU
Dep
os
ition
/
Oxid
atio
n
Lo
op
Ph
oto
/
Patte
rn
Tra
ns
fer
Etc
hin
g /
CM
P
Clean
Ion
Imp
lan
t /
An
ne
al
Develop Photoresist
Si
Graphics copy-write Pro. Milo Koretsky
Chemical Engineering Department at OSU
Dep
os
ition
/
Oxid
atio
n
Lo
op
Ph
oto
/
Patte
rn
Tra
ns
fer
Etc
hin
g /
CM
P
Clean
Ion
Imp
lan
t /
An
ne
al
Plasma Etch Si3N4
Si
Graphics copy-write Pro. Milo Koretsky
Chemical Engineering Department at OSU
Dep
os
ition
/
Oxid
atio
n
Lo
op
Ph
oto
/
Patte
rn
Tra
ns
fer
Etc
hin
g /
CM
P
Clean
Ion
Imp
lan
t /
An
ne
al
Plasma Etch: Strip Photoresist
Si
Graphics copy-write Pro. Milo Koretsky
Chemical Engineering Department at OSU
Dep
os
ition
/
Oxid
atio
n
Lo
op
Ph
oto
/
Patte
rn
Tra
ns
fer
Etc
hin
g /
CM
P
Clean
Ion
Imp
lan
t /
An
ne
al
Ion Implantation
Si
IONS IONSIONS
1.75 u
1/50th of a human hair
Graphics copy-write Pro. Milo Koretsky
Chemical Engineering Department at OSU
Dep
os
ition
/
Oxid
atio
n
Lo
op
Ph
oto
/
Patte
rn
Tra
ns
fer
Etc
hin
g /
CM
P
Clean
Ion
Imp
lan
t /
An
ne
al
Anneal
Si
HEAT HEATHEAT
Activate (& diffuse) the dopant
• Clean before anneal
Graphics copy-write Pro. Milo Koretsky
Chemical Engineering Department at OSU
Dep
os
ition
/
Oxid
atio
n
Lo
op
Ph
oto
/
Patte
rn
Tra
ns
fer
Etc
hin
g /
CM
P
Clean
Ion
Imp
lan
t /
An
ne
al
The Final Steps…a completed transistor
Gate: +
e- e-
Source - Drain: +
Si
Graphics copy-write Pro. Milo Koretsky
Chemical Engineering Department at OSU
Chemical Vapor Deposition A Closer Look: Si3N4
Graphics copy-write Pro. Milo Koretsky
Chemical Engineering Department at OSU
Reactions:
__SiCl2H2 (g)Dichlorosilane
++ Si3N4 (s)Silicon
nitride
__NH3 (g)Ammonia
H2 (g)Hydrogen
HCl (g)Hydrogen chloride
+
DCS (gas)
NH3 (gas)
Silicon
nitride
NH4Cl (gas)H2 (gas)
NH3 (gas)
DCS (gas)
__HCl (g)Hydrogen chloride
+ ___NH4 Cl(g)Ammonium chloride
__NH3 (g)Ammonia
Chemical Vapor Deposition A Closer Look: Si3N4
Graphics copy-write Pro. Milo Koretsky
Chemical Engineering Department at OSU
Reactions:
3 SiCl2H2 (g)Dichlorosilane
++ 1 Si3N4 (s)Silicon
nitride
4 NH3 (g)Ammonia
6 H2 (g)Hydrogen
6 HCl (g)Hydrogen chloride
+
DCS (gas)
NH3 (gas)
Silicon
nitride
NH4Cl (gas)H2 (gas)
NH3 (gas)
DCS (gas)
1 HCl (g)Hydrogen chloride
+ 1 NH4 Cl(g)Ammonium chloride
1 NH3 (g)Ammonia
Overall Reaction:
3 SiCl2H2 (g)Dichlorosilane
(DCS)
++ Si3N4 (s)Silicon
nitride
10 NH3 (g)Ammonia
6 H2 (g)Hydrogen
6 NH4Cl (g)Ammonium chloride
+
What factors do you think
affect the reaction and film
growth?
Temperature
Concentration
Reaction/Deposition Time
Virtual CVD OverviewChoosing the Virtual CVD reactor parameters
Pressure
is Fixed
Factors that Effect Reaction and Film Growth:
Concentration
SiCl2H2 (gas)
NH3 (gas)
NH4Cl (gas)H2 (gas)
NH3 (gas)
SiCl2H2 (gas)
Absolute flow rates of
NH3 to SiCl2H2
Ratio of NH3 to SiCl2H2
Pressure (fixed)
PV = nRT
Graphics copy-write Pro. Milo Koretsky, Chemical Engineering Department at OSU and Silicon Run Educational Video
There are 5
temperature zones
Remember (18.12, Addison-Wesley, Chemistry)
Rate = k[A]1
Factors that Effect Reaction and Film Growth:
Temperature
k k0 exp Ea, f
RT
The Arrhenius Equation
En
erg
y
Reaction coordinate
Ea,f
A
B
First order reaction (thermal):
A B
What can you do with the 5 temperature
zones???
Factors that Effect Reaction and Film Growth:
Temperature
SiCl2H2 (gas)
NH3 (gas)
NH4Cl (gas)H2 (gas)
NH3 (gas)
SiCl2H2 (gas)
PV = nRT
Graphics copy-write Pro. Milo Koretsky, Chemical Engineering Department at OSU and Silicon Run Educational Video
Factors that Effect Reaction and Film Growth:
Deposition Time aka Reaction Time
Reaction/Deposition Time = the
amount of time the reactor runs
How do you think deposition time
effects the film thickness???
Virtual CVD Overview
Each run costs $
Choosing the Virtual CVD reactor parameters
Pressure
is Fixed
0
200
400
600
800
1000
-150 -50 50 150
Fil
m T
hic
kn
es
s [
A]
Film thickness is determined by the amount of material
that reacts and is grown on the wafer
Uniformity describes the evenness of film thickness on
the wafer
Measurement – Thickness & Uniformity
45% Uniformity 100% Uniformity
0
200
400
600
800
1000
-150 -50 50 150
Fil
m T
hic
kn
es
s [
A]
x position x position
Film thickness is determined by the amount of material
that reacts and is grown on the wafer
Uniformity describes the evenness of film thickness on
the wafer
Measurement – Thickness & Uniformity
SiCl2H2 (gas)
NH3 (gas)
NH4Cl (gas)H2 (gas)
NH3 (gas)
SiCl2H2 (gas)
0
50
100
150
200
0 2000 4000 6000 8000 10000
Waf
er #
Thickness [A]
79% Overall Efficiency
50% Overall Efficiency
Measurement via Ellipsometer
The ellipsometer is used to measure the
thickness and refractive index of
transparent films.
It is made of a light source and polarizer
on one side and a analyzer and detector
on the other side.
Light from the source is polarized
and reflected off the film.
The analyzer is rotated till no light
passes through it.
The angle of rotation depends on the
thickness of the film.
Analyzer &
Detector
Light Source,
Control &
Polarizing
Sheet
Light Source
Light Control
Polarizing
Sheet
Analyzing
Polarizer
Detector
Substrate
Virtual CVD Overview
Each measurement costs $
Choosing the locations on the wafer to measure
Virtual Chemical Vapor Deposition
(VCVD) Program
Photo Courtesy of http://webmedia.national.com/gallery/06/06_rgb.jpg
VCVD Program
Semiconductor Manufacturing Fab
Your Objectives:
Determine how temperature, flow rates, and
reaction time impact deposition of Si3N4
Minimize cost of testing process used to
determine the impact of these parameters
Extra Credit: Find an optimized “recipe” that
produces high uniformity (within wafer and
between wafers) and meets a target
thickness of 1000 Angstroms
Economy of Transistors
~$300 /chip
X ~200 chips/wafer
X 200 wafers/furnace
load =
$12 Million
per furnace
loadhttp://www.dvhardware.net/article16696.html
http://www.nitride.co.jp/english
/products/wafer.html
Let’s Get Started
Open VCVD Program...