Sensonor STIM210 High-precision MEMS Gyro Module teardown reverse costing report by published Yole...

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March 2014 – Version 1 – Written by Romain Fraux

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Sensonor STIM210 Gyro Module

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Glossary1. Overview / Introduction 4

– Executive Summary– Reverse Costing Methodology

2. Company Profile 7– Sensonor Profile– STIM210 Specifications

3. Physical Analysis 15– Synthesis of the Physical Analysis– Physical Analysis Methodology– 3.1 Module 18

– Module View, Dimensions & Pin-out– Module Opening

– 3.2 Electronic Board 24– Top Side – Components Markings– Top Side – Components Identification– Bare Dies Connections– Bottom Side – Components Markings– Bottom Side – Components Identification

– 3.3 Digital ASIC 36– View, Dimensions & Marking– Delayering, Process Identification– Cross-Section

– 3.4 Mixed-Signal ASIC 48– View, Dimensions & Marking– Delayering, Process Identification– Cross-Section

– 3.5 MEMS Gyroscope 59– View, Dimensions & Marking– Bond Pads & Bond Pads Opening– MEMS Cap Removed– MEMS Sensing Area– MEMS Gyro Principle– MEMS Cross-Section: Structure– MEMS Cross-Section: Masses– MEMS Cross-Section: Electrode– MEMS Cross-Section: Buried Connections– MEMS Cross-Section: Getter

4. Manufacturing Process Flow 96– Global Overview– Digital ASIC Front-End Process & Wafer Fab Unit– Mixed-Signal ASIC Front-End Process & Wafer Fab Unit– MEMS Process Flow & Wafer Fab Unit– Module Assembly Process Flow & Assembly Unit

5. Cost Analysis 119– Synthesis of the cost analysis– Main steps of economic analysis– Yields Hypotheses– 5.1 Digital ASIC 124

– Front-End Cost– Probe Test & Dicing Cost

– Wafer Cost & Die Cost– 5.2 Mixed-Signal ASIC 129

– Front-End Cost– Probe Test & Dicing Cost

– Wafer Cost & Die Cost– 5.3 MEMS Gyroscope 134

– Front-End Cost– Front-End Cost per process steps– Probe Test & Dicing Cost

– Wafer Cost & Die Cost– 5.4 BOM Cost 143

– Electronic Board BOM Cost– Housing BOM Cost– Material Cost Breakdown

– 5.5 Module Assembly & Test Cost 149– Electronic Board Assembly Cost– Housing Assembly Cost– Final Test & Calibration Cost

– 5.6 Module Cost & Price 157– STIM210 Module Cost– STIM210 Module Estimated Price

Contact 161


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• This full reverse costing study has been conducted to provide insight on technology data,

manufacturing cost and selling price of the STIM210 Multi-Axis Gyro Module supplied by Sensonor.

• MEMS gyroscopes for tactical grade applications made a lot of progress in the past few years in

term of reliability. They are now accepted in high-reliability environments, and are even starting to

replace FOGs and other technologies in tactical applications.

• With a bias instability of 0.5°/h and 10°/h bias error over the operating temperature range, the

Sensonor STIM210 is the world highest performance silicon MEMS gyroscope. The module is

available without export control (ITAR-free).

• The analyzed module is a complete system offering 3 axes MEMS gyros associated with a 32-bit

microcontroller which provides flexibility in device configuration.

• The MEMS gyros are associated with ASIC dies and are mounted on a silicon plate directly

connected to the housing of the module, allowing to reduce the mechanical strain.

• The Sensonor gyroscope dies use a “butterfly” structure with two masses operating in an anti-phase

movement and asymmetric beams allowing them to bend both transversely and laterally.


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The reverse costing analysis is conducted in 3 phases:

Teardown analysis

• Package is analyzed and measured• The dies are extracted in order to get overall data: dimensions, main blocks, pad number and pin out, die marking• Setup of the manufacturing process.

Costing analysis

• Setup of the manufacturing environment• Cost simulation of the process steps

Selling price analysis

• Supply chain analysis• Analysis of the selling price


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44.8mm

Global view of the STIM210 Gyro Module

38.6mm

21

.5m

m


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• The die marking includes:

SWA17C1

E0512X8PCL2

ASIC Die Marking


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• The die marking includes:

IMEGO

ASIC Die Marking


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Sensonor Gyro Process Synthesis


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Reverse costing analysis represents the best cost/price evaluation given the publically available data, and estimates completed by industry experts.

Given the hypothesis presented in this analysis, the major sources of correction would lead to a +/- 10% correction on the manufacturing cost (if all parameters are cumulated)

These results are open for discussion. We can reevaluate this circuit with your information. Please contact us:

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Sensonor STIM210 High-precision MEMS Gyro Module teardown reverse costing report by published Yole...

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