Security C – TSMC Secret 1 Semiconductor Technology and Application 吳振銘...

Security C –TSMC Secret

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Semiconductor

Technology and Application

吳振銘台積電六廠製程整合部經理

2010/03/24


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Semiconductor Brings Fun to Your Life- History, Application and Market

What is Transistor How is IC Fabricated

- Process Modules

- IC Process Flow

- Technology Evolution

What the Semiconductor Fabs Care- Yield improvement

- PFA methodology

- Defect Engineering

- Reliability

A Day’s Work in tsmc


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- Process Modules

- IC Process Flow



- PFA methodology


- Reliability



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Biggest Semiconductor Players


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- Process Modules

- IC Process Flow



- PFA methodology


- Reliability



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Wet etch

Physical dry etch

Chemical dry etch

Chemical + Physical

4 Types of Etch


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Technology Evolution


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Te

ch

no

log

y G

en

era

tio

n (

nm

)

130

90

65

45

32

‘00 ‘02 ‘04 ‘06 ‘08 ‘10 ‘12

00 ITRS

01 ITRS

05 ITRS

TSMC

ITRS: International Technology Roadmap for Semiconductors


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- Process Modules

- IC Process Flow



- PFA methodology


- Reliability



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Imperfect Fabrication Process

• Mask making dust, focusing

• Growing oxide warping in furnace, uneven reactions

• Resist over exposure, not hardened enough

• Etching overetch of resist and/or oxide

• Lateral diffusion affects transistor channel lengths

• Multiple layers mask alignment

• Packaging bonding wires to pins of package


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Yield Improvement

• Defect reduction

• Process window characterization

• Process weakness

• Sweet spot

• Hardware control / PM / Lifetime

• Design improvement

• Innovation


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Manufacturing

DL Daily Management

DL Performance Enhancement

DL Efficiency Improvement

Improve Tool Productivity

Manage Shop Floor Scheduling & Dispatching

6 Manufacturing Operation Module

Manage/Predict WIP Profile

Capacity Management

DL & IDL Recruiting, Training, Retaining & Inspiring

Quality System Management & Logistic Support

Computer Integration Manufacturing

Automation Material Handling System

Integrated Factory Automation

Wafer Production Planning

On Time Delivery

Production Cycle Time ControlPlanning

Tps

MFG CIMModule

DL Daily Management

DL Performance Enhancement

DL Efficiency Improvement

Improve Tool Productivity

Manage Shop Floor Scheduling & Dispatching

6 Manufacturing Operation Module

Manage/Predict WIP Profile

Capacity Management

DL & IDL Recruiting, Training, Retaining & Inspiring

Quality System Management & Logistic Support

Computer Integration Manufacturing

Automation Material Handling System

Integrated Factory Automation

Wafer Production Planning

On Time Delivery

Production Cycle Time ControlPlanning

Tps

MFG CIMModule


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Process Integration Engineer

Process Related and Modules

Process Related and Modules

FEOLBEOL

Q-time, Rework, KLAProcess control CD, overlay, thicknessDevice/ Product characteristic

PhotoEtchThin FilmDiffusionIon ImplantationCMPClean

Multilevel InterconnectSTI, SalicideContact/ Via, MetalPassivationAlignment mark

Technology readiness

New technology development

New product & experiment

Process parameters/SPEC setting

Product and Process qualification

Quality Guarantee

PCM (Process Control Monitor)

Cpk improvement

Defect inspection and reduction

Cp/FT yield improvement

Customer satisfaction

Customer satisfaction index

Engineering notice and lot handling

WAT & QC outgoing inspection

Customer satisfaction

Wafer In-Process


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How We Work on Fast Time-to-Market

Business Engagement Development

Qualification

RD/Fab Joint Technology Meetings

(Yield, Defect, Major issues..) Joint Task Forces for Critical Modules Enlarge Manufacturing Window Joint Effort for Defect Reduction

One Ramp Team: RD and Fab 1st Si Success of Customer NTOs Continuous Yield Improvement Capacity Build-up and Release

Ramp Up

Joint Review for Process Frozen

Process/Product Qualification Process Characterization Process Control Review

Manufacturing Readiness

Customized request MKT/RD/Fab Joint discussion New Tech/tool selection Fab’s Super Highway Service


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- Process Modules

- IC Process Flow



- PFA methodology


- Reliability



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Starting/Ending on Daily Hand over

上班時間08:30 19:30

0810

下班時間Goal

~09:00完成交接

17:00

下午交接17:30

完成交接12:00休息

長官關心Urgent casehandling

Daily work

PIEPIE• Hold lot review and key lots status

• Production yield status

• WAT/Line scrap wafer review

• M1/IM/Final WAT or special module trend chart review

• Customer response

• Urgent case status update

• Trouble tool review & recovery plan

• PM arrangement

• RTM chart review

• SPC trend chart review

• On-duty follow up

• Hold lot review

• Inline, defect case and tool alarm review

• Tool alarm lot or CD/THK OOC lot handling

• Tool release status and WPH improvement

• SPC trend chart review -- CD, THK, E/R, Rs

• Low yield (dog tool) finding

• OCAP follow up

• Daily Move

• Efficiency index

• T/R and Cycle time

• Tool total capacity for WIP

• Make up delay WIP

• Hold lots arrangement

• Special lots support

PEPE

EEEE

MFGMFGPCPCMPEMPE

QCQCCSVCSV

PIEPIE• Hold lot review and key lots status

• Production yield status

• WAT/Line scrap wafer review

• M1/IM/Final WAT or special module trend chart review

• Customer response

• Urgent case status update

• Trouble tool review & recovery plan

• PM arrangement

• RTM chart review

• SPC trend chart review

• On-duty follow up

• Hold lot review

• Inline, defect case and tool alarm review

• Tool alarm lot or CD/THK OOC lot handling

• Tool release status and WPH improvement

• SPC trend chart review -- CD, THK, E/R, Rs

• Low yield (dog tool) finding

• OCAP follow up

• Daily Move

• Efficiency index

• T/R and Cycle time

• Tool total capacity for WIP

• Make up delay WIP

• Hold lots arrangement

• Special lots support

PEPE

EEEE

MFGMFGPCPCMPEMPE

QCQCCSVCSV

PCPCMPEMPE

QCQCCSVCSV


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TSMC Job Function Job

FunctionMajor Job Description &

Career Development適合系所適合原因

PIE(Process

Integration Engineer)

量產產品製程整合，出貨規格，良率分析及客戶服務。研發新產品製程，規格，品質可靠度及客戶服務。工作須與 Module ， RD ， QR ， CSV.. 互相溝通配合，多方面學習。

電機 , 電子，材料，物理，化工 .. 等理工科系。

半導體電性 , 物性及工程分析背景。

PE (Process Engineer)

研製機台的製程條件 , 符合產品的品質要求。建立製程條件的監控方法 , 管制製程穩定性。開發、研究、改善生產流程。

材料，化工，物理，化學，... 等理工相關科系。

半導體製程的工作大量應用材料、物理、化學、機械性質的知識與使用最先進的分析儀器。

EE (Equipment Engineers)

研發改造機台，符合先進製程需求。持續研究開發機台生產力。追求成本下降的機會。維護機台穩定性。

機械，電子，電機等理工相關科系。

高度精密的半導體設備需要有清晰的邏輯概念與機構、設計、控制等相關知識，才能發揮最大效果。


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One Vital Day in Fab - Engineer’s Daily Life -

Hand over meeting

Hand over meeting

Hand over meeting

Hand over meeting

Production meeting

Production meeting

EN & LHexecution

EN & LHexecution

Customer response

Customer response

customermeeting

customermeeting

Yield improvement

Yield improvement

PIEMFGPE/EE

DailyTrend chart

DailyTrend chart

Hold lots handling

Hold lots handling

SPC improvement

SPC improvement

Line excursion

Line excursion

FCCBFCCB

X-Deptmeeting

X-Deptmeeting

EKM & Suggestion

EKM & Suggestion

Technique Board

Technique Board

New project& CIT

New project& CIT

Trouble shooting

Trouble shooting

Costreduction

Costreduction


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The TSMC Value Proposition: Our Trinity of Strengths

客戶的成功客戶的成功

先進技術卓越製造客戶夥伴關係

• 先進技術• 主流製程

• 產能領導者• 立即性與彈性• 最佳的良率與生產週期

• 快速量產

• 專業晶圓製造模式

• 全面性解決方案• 客戶服務導向提供最大整體利益

• 長期、雙贏、信賴

產能與財務優勢


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專業的晶圓製造與服務，改變半導體業專業垂直分工的商業模式

台積公司改變世界半導體業遊戲規則台積公司改變世界半導體業遊戲規則

System/IC Design

Before Before 19861986

System/IC Design

System/IC Design

晶圓製造(Foundry)

封裝 , 測試

1990s1990s After 2000After 2000

System/IC Design

System Design / IC Design

晶圓製造

設計服務

IP 供應商

封裝 , 測試

台積電台積電

台積電台積電

晶圓製造(Fab)

封裝 , 測試

晶圓製造(Fab)

封裝 , 測試

晶圓製造(Fab)

封裝 , 測試


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台積公司價值鏈台積公司價值鏈客戶客戶

核心能力核心能力

系統

產品

設計

光罩

晶圓測試

總測試

台積公司台積公司核心能力核心能力

設計服務設計服務

後端服務後端服務

智財權 (IP)/ 資料庫 (Library)

電子設計自動化 (EDA)設計執行

技術製造

錫鉛凸塊 (Bumping)覆晶 (Flip Chip)


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Thank You

Security C – TSMC Secret 1 Semiconductor Technology and Application 吳振銘...

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Transcript of Security C – TSMC Secret 1 Semiconductor Technology and Application 吳振銘...