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S. Reda EN160 SP08 Design and Implementation of VLSI Systems (EN1600) Lecture11: Delay Estimation...
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Transcript of S. Reda EN160 SP08 Design and Implementation of VLSI Systems (EN1600) Lecture11: Delay Estimation...
S. Reda EN160 SP’08
Design and Implementation of VLSI Systems(EN1600)
Lecture11: Delay Estimation
Prof. Sherief RedaDivision of Engineering, Brown University
Spring 2008
[sources: Weste/Addison Wesley – Rabaey/Pearson]
S. Reda EN160 SP’08
Circuit characterization: delay and power estimation
Delay estimation Logical effort for delay estimation Power estimation Interconnects and wire engineering Scaling theory
S. Reda EN160 SP’08
Delay definitions
• tpdr: rising propagation delay– From input to rising output crossing VDD/2
• tpdf: falling propagation delay– From input to falling output crossing VDD/2
• tpd: average propagation delay. tpd = (tpdr + tpdf)/2• tcdr: rising contamination (best-case) delay
– From input to rising output crossing VDD/2• tcdf: falling contamination (best-case) delay
– From input to falling output crossing VDD/2• tcd: average contamination delay. tpd = (tcdr + tcdf)/2• tr: rise time
– From output crossing 0.2 VDD to 0.8 VDD• tf: fall time
– From output crossing 0.8 VDD to 0.2 VDD
S. Reda EN160 SP’08
How to calculate delay? Just run SPICE!
(V)
0.0
0.5
1.0
1.5
2.0
t(s)0.0 200p 400p 600p 800p 1n
tpdf = 66ps tpdr = 83psVin Vout
• Time consuming• Not very useful for designers in evaluating different options
and optimizing different parameters
• We need a simple way to estimate delay for “what if” scenarios.• Fidelity vs. accuracy
S. Reda EN160 SP’08
Transistor resistance
In the linear region
• Not accurate, but at least shows that the resistance is proportional to L/W and decreases with Vgs
• If R/C are for a unit size transistor then a transistor of K unit width has KC capacitance and R/K resistance
• The resistance of a PMOS transistor = 2× resistance of NMOS transistor of the same size
S. Reda EN160 SP’08
Switch-level RC models
• Use equivalent circuits for MOS transistors– Ideal switch + capacitance and ON resistance
– Unit nMOS has resistance R, capacitance C
– Unit pMOS has resistance 2R, capacitance C
• Capacitance proportional to width• Resistance inversely proportional to width
kg
s
d
g
s
d
kCkC
kCR/k
kg
s
d
g
s
d
kC
kC
kC
2R/k
S. Reda EN160 SP’08
Inverter RC delay estimate
• Estimate the delay of a fanout-of-1 inverter in response to a step input function
C
CR
2C
2C
R
2
1A
Y
C
2C
C
2C
C
2C
RY
2
1
tpd = 6RC
S. Reda EN160 SP’08
Elmore delay model
• ON transistors look like resistors• Pullup or pulldown network modeled as RC ladder• Elmore delay of RC ladder
R1 R2 R3 RN
C1 C2 C3 CN
( ) ( )nodes
1 1 1 2 2 1 2... ...
pd i to source ii
N N
t R C
RC R R C R R R C
− −≈
= + + + + + + +
∑
S. Reda EN160 SP’08
Example: 3-input NAND gate
• Sketch a 3-input NAND with transistor widths chosen to achieve effective rise and fall resistances equal to a unit inverter (R).
3
3
222
3
S. Reda EN160 SP’08
Example: 3-input NAND gate
2 2 2
3
3
33C
3C
3C
3C
2C
2C
2C
2C
2C
2C
3C
3C
3C
2C 2C 2C
• Annotate the 3-input NAND gate with gate and diffusion capacitance
S. Reda EN160 SP’08
Example: 3-input NAND gate
• Annotate the 3-input NAND gate with gate and diffusion capacitance
9C
3C
3C3
3
3
222
5C
5C
5C
S. Reda EN160 SP’08
Computing the rise and fall delays
• Estimate rising and falling propagation delays of a 2-input NAND driving h identical gates.
h copies
6C
2C2
2
22
4hC
B
Ax
Y
R
(6+4h)CY ( )6 4pdrt h RC= +
( )( ) ( ) ( )( )
2 2 22 6 4
7 4
R R Rpdft C h C
h RC
= + + +⎡ ⎤⎣ ⎦= +
(6+4h)C2CR/2
R/2x Y
S. Reda EN160 SP’08
Delay components
• Delay has two components:– Parasitic delay (due to gate own diffusion capacitance)
• 6 or 7 RC
• Independent of load
– Effort delay• 4h RC
• Proportional to load capacitance
S. Reda EN160 SP’08
Contamination delay• Best-case (contamination) delay can be substantially less than
propagation delay.• Ex: If both inputs fall simultaneously
6C
2C2
2
22
4hC
B
Ax
Y
R
(6+4h)CYR
( )3 2cdrt h RC= +
• Order of inputs also impact propagation delay. Which is better AB=10 -> 11 or AB=01 ->11?
S. Reda EN160 SP’08
Diffusion capacitance
7C
3C
3C3
3
3
222
3C
2C2C
3C3C
IsolatedContactedDiffusionMerged
UncontactedDiffusion
SharedContactedDiffusion
• we assumed contacted diffusion on every s / d.• Good layout minimizes diffusion area• Ex: NAND3 layout shares one diffusion contact
– Reduces output capacitance by 2C– Merged uncontacted diffusion might help too
S. Reda EN160 SP’08
Layout Comparison
• Which layout is better?
AVDD
GND
B
Y
AVDD
GND
B
Y