Red (655 nm) and Infrared Emitter (940 nm) Draft Version α ...€¦ · DRAFT - This design is for...
Transcript of Red (655 nm) and Infrared Emitter (940 nm) Draft Version α ...€¦ · DRAFT - This design is for...
2019-07-05 1
DRAFT - This design is for Reference only. Subject to change without notice.
2016-11-11
Red (655 nm) and Infrared Emitter (940 nm)
Draft Version α.2
SFH 7015
Ordering Information
Features:
• SMT package with red (655 nm) and IR emitter (940 nm)
• Suitable for SMT assembly
• Available on tape and reel
• Emitters can be controlled separately
• Emitter 1 = red, Emitter 2 = IR
Applications
• Biomonitoring
Notes
Depending on the mode of operation, these devices emit highly concentrated non visible infrared light which
can be hazardous to the human eye. Products which incorporate these devices have to follow the safety
precautions given in IEC 60825-1 and IEC 62471.
Type: Package: Ordering Code
SFH 7015 SMT Multi CHIPLED Q65112A7658
2019-07-05 2
DRAFT - This design is for Reference only. Subject to change without notice.
Draft Version α.2 SFH 7015
Maximum Ratings
Characteristics (TA = 25 °C)
Parameter Symbol Values Unit
Operating and storage temperature range Top; Tstg -40 ... 85 °C
Reverse voltage VR 5 V
ESD withstand voltage(acc. to ANSI/ ESDA/ JEDEC JS-001 - HBM)
VESD 2 kV
Emitter 1 (red)
Forward current IF (DC) 40 mA
Surge current
(tp ≤ 400 µs, D = 0 .005)
IFSM 0.6 A
Power consumption Ptot 120 mW
Emitter 2 (IR)
Forward current IF (DC) 60 mA
Surge current(tp ≤ 200 µs, D = 0.005)
IFSM 1 A
Total power dissipation Ptot 110 mW
Note: The stated maximum ratings refer to one chip, unless otherwise specified.
Parameter Symbol Values Unit
Emitter 1 (red)
Peak wavelength(IF = 20 mA, tp = 20 ms)
(typ) λpeak 660 nm
Centroid wavelength(IF = 20 mA, tp = 20 ms)
(typ) λcentroid 655 nm
Spectral bandwidth at 50% of Imax
(IF = 20 mA, tp = 20 ms)(typ) ∆λ 17 nm
Half angle (typ) ϕ ± 60 °
Dimensions of active chip area (typ) L x W 0.3 x 0.3 mm x
mm
Rise and fall time of Ie ( 10% and 90% of Ie max)(IF = 100 mA, RL = 50 Ω)
(typ) tr, tf 17 ns
Forward voltage
(IF = 20 mA, tp = 20 ms)
max typ min
VF
2.80
2.101.65
V
Draft Version α.2 SFH 7015
2019-07-05 3
DRAFT - This design is for Reference only. Subject to change without notice.
Reverse current
(VR = 5 V)
IR not designed for
reverse operation
µA
Total radiant flux(IF = 20 mA, tp = 20 ms)
(typ) Φe 13 mW
Radiant intensity
(IF = 20 mA, tp = 20 ms)
(typ) Ie, typ 4 mW/sr
Radiant intensity(IF = 20 mA, tp = 20 ms)
(min) Ie, min 2 mW / sr
Temperature coefficient of Ie or Φe
(IF = 20 mA, tp = 20 ms)
(typ) TCI -0.7 % / K
Temperature coefficient of VF
(IF = 20 mA, tp = 20 ms)(typ) TCV -1.7 mV / K
Temperature coefficient of wavelength
(IF = 20 mA, tp = 20 ms)
(typ) TCλ 0.18 nm / K
Thermal resistance junction - ambient, mounted on PC-board (FR4) 1) page 16
(max) RthJA 590 K / W
Emitter 2 (IR)
Peak emission wavelength(IF = 20 mA, tp = 20 ms)
(typ) λpeak 950 nm
Centroid wavelength
(IF = 20 mA, tp = 20 ms)
(typ) λcentroid 940 nm
Spectral bandwidth at 50% of Imax
(IF = 20 mA, tp = 20 ms)(typ) ∆λ 42 nm
Half angle (typ) ϕ ± 60 °
Dimensions of active chip area (typ) L x W 0.3 x 0.3 mm x mm
Rise and fall times of Ie ( 10% and 90% of Ie max)(IF = 100 mA, RL = 50 Ω)
(typ) tr / tf 16 ns
Forward voltage(IF = 20 mA, tp = 20 ms)
max typ min
VF
1.61.31.0
V
Reverse current (typ (max)) IR not designed for
reverse operation
µA
Total radiant flux(IF = 20 mA, tp = 20 ms)
(typ) Φe 10 mW
Radiant intensity
(IF = 20 mA, tp = 20 ms)
(typ) Ie, typ 3 mW/sr
Parameter Symbol Values Unit
2019-07-05 4
DRAFT - This design is for Reference only. Subject to change without notice.
Draft Version α.2 SFH 7015
Radiant intensity
(IF = 20 mA, tp = 20 ms)
(min) Ie, min 1.5 mW/sr
Temperature coefficient of Ie or Φe
(IF = 20 mA, tp = 20 ms)(typ) TCI -0.3 % / K
Temperature coefficient of VF
(IF = 20 mA, tp = 20 ms)
(typ) TCV -0.8 mV / K
Temperature coefficient of wavelength(IF = 20 mA, tp = 20 ms)
(typ) TCλ 0.3 nm / K
Thermal resistance junction - ambient, mounted on
PC-board (FR4) 1) page 16 (max) RthJA 670 K / W
Parameter Symbol Values Unit
Draft Version α.2 SFH 7015
2019-07-05 5
DRAFT - This design is for Reference only. Subject to change without notice.
Diagrams
Emitter 1 (red)
Relative Spectral Emission 2) page 16
Irel = f(λ), TA = 25°CRadiant Intensity 2) page 16
Ie / Ie(20 mA) = f(IF), single pulse, tp = 25 µs, TA= 25°C
5500
nm
%
OHF05734
Irel
λ600 650 700 750
10
20
30
40
50
60
70
80
100OHF05735
310
FI102 mA
(20 mA)e
5
10 -1
10
5
0
101
102
101010
eΙΙ
2019-07-05 6
DRAFT - This design is for Reference only. Subject to change without notice.
Draft Version α.2 SFH 7015
Max. Permissible Forward Current
IF, max = f(TA), RthJA = 590 K / WForward Current 2) page 16
IF = f(VF), single pulse, tp = 100 µs, TA= 25°C
Permissible Pulse Handling Capability
IF = f(tp), TA = 25 °C, duty cycle D = parameterPermissible Pulse Handling Capability
IF = f(tp), TA = 85 °C, duty cycle D = parameter
SFH 7014
0 20 40 60 80T
A
[°C]
0
10
20
30
40I
F
[mA]SFH 7014
2.0 2.5 3.0 3.5 4.0 4.5V
F
[V]
0.005
0.01
0.05
0.1
0.5I
F
[A]
SFH 7014
10-5 10-4 10-3 0.01 0.1 1 10 100t
p
[s]
0.0
0.2
0.4
0.6I
F
[A]
: D = 1: D = 0,5: D = 0,2: D = 0,1: D = 0,05: D = 0,02: D = 0,01: D = 0,005
SFH 7014
10-5 10-4 10-3 0.01 0.1 1 10 100t
p
[s]
0.0
0.1
0.2
0.3
0.4
0.5
I
F
[A]
: D = 1: D = 0,5: D =0,2: D =0,1: D =0,05: D =0,02: D =0,01: D =0,005
Draft Version α.2 SFH 7015
2019-07-05 7
DRAFT - This design is for Reference only. Subject to change without notice.
Diagrams
Emitter 2 (IR)
Relative Spectral Emission 2) page 16
Irel = f(λ), TA = 25°CRadiant Intensity 2) page 16
Ie / Ie(20 mA) = f(IF), single pulse, tp = 100 µs, TA= 25°C
8000
nm
%
OHF04134
20
40
60
80
100
Irel
λ850 900 950 1025
OHF05669
310
Ιe
(20 mA)e
Ι
FI102110100 mA
10-2
10-1
100
101
210
2019-07-05 8
DRAFT - This design is for Reference only. Subject to change without notice.
Draft Version α.2 SFH 7015
Max. Permissible Forward Current
IF, max = f(TA), RthJA = 670 K / WForward Current 2) page 16
IF = f(VF), single pulse, tp = 100 µs, TA= 25°C
Permissible Pulse Handling Capability
IF = f(tp), TA = 25 °C, duty cycle D = parameterPermissible Pulse Handling Capability
IF = f(tp), TA = 85 °C, duty cycle D = parameter
SFH 7014
0 20 40 60 80T
A
[°C]
0
20
40
60I
F
[mA]
0
I
OHF05642
F
VF
mA
V
102
310
010
110
1 2 3 4
SFH 7014
10-5 10-4 10-3 0.01 0.1 1 10 100t
p
[s]
0.0
0.2
0.4
0.6
0.8
1.0I
F
[A]
: D = 1: D = 0,5: D = 0,2: D = 0,1: D = 0,05: D = 0,02: D = 0,01: D = 0,005
SFH 7014
10-5 10-4 10-3 0.01 0.1 1 10 100t
p
[s]
0.0
0.2
0.4
0.6I
F
[A]
: D = 1: D = 0,5: D =0,2: D =0,1: D =0,05: D =0,02: D =0,01: D =0,005
Draft Version α.2 SFH 7015
2019-07-05 9
DRAFT - This design is for Reference only. Subject to change without notice.
Radiation Characteristics 2) page 16
Irel = f(ϕ), TA= 25°C
Package Outline
Dimensions in mm.
0
0.2
0.4
1.0
0.8
0.6
ϕ
1.0 0.8 0.6 0.4
0˚10˚20˚40˚ 30˚ OHL01660
50˚
60˚
70˚
80˚
90˚
100˚0˚ 20˚ 40˚ 60˚ 80˚ 100˚ 120˚
2019-07-05 10
DRAFT - This design is for Reference only. Subject to change without notice.
Draft Version α.2 SFH 7015
Pinning
Pin Description
1 NC
2 Cathode Emitter 1 (655 nm)
3 Anode Emitter 1/2
4 Cathode Emitter 2 (940 nm)
Approximate Weight:
3 mg
Recommended Solder Pad
Dimensions in mm.
Draft Version α.2 SFH 7015
2019-07-05 11
DRAFT - This design is for Reference only. Subject to change without notice.
Reflow Soldering Profile
Product complies to MSL Level 3 acc. to JEDEC J-STD-020E
00
s
OHA04525
50
100
150
200
250
300
50 100 150 200 250 300
t
T
˚C
St
t
Pt
Tp240 ˚C
217 ˚C
245 ˚C
25 ˚C
L
OHA04612
Profil-Charakteristik
Profile Feature
Ramp-up Rate to Preheat*)
25 °C to 150 °C2 3 K/s
Time tS TSmin to TSmax
tS
tL
tP
TL
TP
100 12060
10 20 30
80 100
217
2 3
245 260
3 6
Time25 °C to TP
Time within 5 °C of the specified peaktemperature TP - 5 K
Ramp-down Rate*TP to 100 °C
All temperatures refer to the center of the package, measured on the top of the component
* slope calculation DT/Dt: Dt max. 5 s; fulfillment for the whole T-range
Ramp-up Rate to Peak*)
TSmax to TP
Liquidus Temperature
Peak Temperature
Time above Liquidus temperature
Symbol
Symbol
Einheit
Unit
Pb-Free (SnAgCu) Assembly
Minimum MaximumRecommendation
K/s
K/s
s
s
s
s
°C
°C
480
2019-07-05 12
DRAFT - This design is for Reference only. Subject to change without notice.
Draft Version α.2 SFH 7015
Taping
Dimensions in mm.
Tape and Reel
8 mm tape with 3000 pcs. on ∅ 180 mm reel
D0
2P
P0
1P
WFE
Direction of unreeling
N
W1
2W
A
OHAY0324
Label
Leader:Trailer:
13.0
Direction of unreeling
±0.2
5
min. 160 mm *min. 400 mm *
*) Dimensions acc. to IEC 60286-3; EIA 481-D
Draft Version α.2 SFH 7015
2019-07-05 13
DRAFT - This design is for Reference only. Subject to change without notice.
Tape dimensions [mm]Tape dimensions in mm
Reel dimensions [mm]Reel dimensions in mm
Barcode-Product-Label (BPL)
Dry Packing Process and Materials
Note:Moisture-sensitive product is packed in a dry bag containing desiccant and a humidity card.
Regarding dry pack you will find further information in the internet. Here you will also find the normative references like JEDEC.
W P0 P1 P2 D0 E F
8 + 0.3 / -0.1 4 ± 0.1 2 ± 0.05
or
4 ± 0.1
2 ± 0.05 1.5 ± 0.1 1.75 ± 0.1 3.5 ± 0.05
A W Nmin W1 W2max
180 8 60 9 11.4
OHA04563
(G) GROUP:
1234567890(1T) LOT NO: (9D) D/C: 1234
(X) PROD NO: 123456789
(6P) BATCH NO: 1234567890
LX XXXX
RoHS Compliant
BIN1: XX-XX-X-XXX-X
MLX
Temp STXXX °C X
Pack: RXX
DEMY XXX
X_X123_1234.1234 X
9999(Q)QTY:
SemiconductorsOSRAM Opto
XX-XX-X-X
EXAMPLE
X_X123_1234.1234 X
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
XXX
X_X123_1234.1234 X
XX-XX-X-X
EXAMPLE
EXAMPLE
Pack: RXX
DEMY
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
(9D) D/C: 1234
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
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EXAMPLE
EXAMPLE
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EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
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EXAMPLE
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EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
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1234567890EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
(6P) BATCH NO: 1234567890EXAMPLE
SemiconductorsOSRAM Opto
EXAMPLE
EXAMPLE
X_X123_1234.1234 X
Pack: RXX
DEMY
X_X123_1234.1234 X
(9D) D/C: 1234(9D) D/C:
1234567890(6P) BATCH NO: 1234567890
OSRAM Opto
XXX
X_X123_1234.1234 X
XX-XX-X-X
Pack: RXX
DEMY
Semiconductors
OHA00539
OSRAM
Moisture-sensitive label or print
Barcode label
Desiccant
Humidity indicator
Barcode label
OSRAM
Please check the HIC immidiately afterbag opening.
Discard if circles overrun.Avoid metal contact.
WET
Do not eat.
Comparatorcheck dot
parts still adequately dry.
examine units, if necessary
examine units, if necessary
5%
15%
10%bake units
bake units
If wet,
change desiccant
If wet,
Humidity Indicator
MIL-I-8835
If wet,
Mois
ture
Level 3
Flo
or tim
e 168 H
ours
Mois
ture
Level 6
Flo
or tim
e 6 H
ours
a) H
um
idity
Indic
ato
r C
ard
is >
10%
when read a
t 23 ˚C
± 5
˚C
, or
reflo
w, vapor-
phase
reflo
w, or equiv
ale
nt pro
cessin
g (peak p
ack
age
2. A
fter th
is b
ag is
opened, devic
es t
hat w
ill b
e s
ubje
cte
d to in
frare
d
1. S
helf
life in s
eale
d b
ag: 24 m
onth
s a
t < 4
0 ˚C
and <
90%
rela
tive
hum
idity (
RH
).
Mois
ture
Leve
l 5a
at fa
cto
ry c
onditio
ns o
f
(if bla
nk,
seal d
ate
is id
entica
l w
ith d
ate
code).
a) M
ounte
d w
ithin
b) S
tore
d a
t
body tem
p.
3. D
evic
es require b
akin
g, befo
re m
ountin
g, if:
Bag s
eal d
ate
Mois
ture
Leve
l 1
Mois
ture
Level 2
Mois
ture
Level 2a
4. If b
akin
g is
required,
b) 2a o
r 2b is
not m
et.
Date
and tim
e o
pened:
refe
rence
IP
C/J
ED
EC
J-S
TD
-033 for bake
pro
cedure
.
Flo
or tim
e s
ee b
elo
w
If b
lank,
see b
ar code la
bel
Flo
or tim
e >
1 Y
ear
Flo
or tim
e 1 Y
ear
Flo
or tim
e 4 W
eeks1
0%
RH
.
_<
Mois
ture
Leve
l 4
Mois
ture
Level 5
˚C).
OP
TO
SE
MIC
ON
DU
CTO
RS
MO
ISTU
RE
SE
NS
ITIV
E
This
bag c
onta
ins
CA
UTIO
N
Flo
or tim
e 72 H
ours
Flo
or tim
e 48 H
ours
Flo
or
tim
e 24 H
ours
30 ˚C
/60%
RH
.
_<
LE
VE
L
If b
lank,
see
bar code label
2019-07-05 14
DRAFT - This design is for Reference only. Subject to change without notice.
Draft Version α.2 SFH 7015
Transportation Packing and Materials
Dimensions of transportation box in mm
Width Length Height
191 ± 5 195 ± 5 30 ± 5
OHA02044
PACKVAR:
R077Additional T
EXT
P-1+Q-1
Multi TOPLED
Muste
r
OSRAM Opto
Semiconductors
(6P) BATCH N
O:
(X) P
ROD NO:
10
(9D) D/C
:
11(1T) LOT N
O:
210021998
123GH1234
024 5
(Q)Q
TY: 2000
0144
(G) G
ROUP:
260 C R
T
240 C R
3
220 C R
MLBin3:Bin2: Q
-1-20
Bin1: P-1-20
LSY T676
22a
Temp ST
R18DEMY
PACKVAR:
R077Additional T
EXT
P-1+Q-1
Multi TOPLED
Muste
r
OSRAM Opto
Semiconductors
(6P) BATCH NO:
(X) P
ROD NO:
10
(9D) D/C
:
11(1T) LOT N
O:
210021998
123GH1234
024 5
(Q)Q
TY: 2000
0144
(G) G
ROUP:
260 C R
T
240 C R
3
220 C R
MLBin3:Bin2: Q
-1-20
Bin1: P-1-20
LSY T676
22a
Temp ST
R18DEMY
OSRAM
Packing
Sealing label
Barcode label
Mois
ture
Leve
l 3
Flo
or tim
e 168 H
ours
Mois
ture
Leve
l 6
Flo
or tim
e 6 H
ours
a) H
um
idity
Indic
ato
r C
ard
is >
10%
when read a
t 23 ˚C
± 5
˚C
, or
reflow
, va
por-
phase
reflo
w, or equiv
ale
nt pro
cess
ing (peak p
acka
ge
2. A
fter th
is b
ag is
opened, devic
es t
hat w
ill b
e s
ubje
cted to in
frare
d
1. S
helf
life in
seale
d b
ag: 24 m
onth
s at < 4
0 ˚C
and <
90%
rela
tive h
um
idity (
RH
).
Mois
ture
Level 5a
at fa
cto
ry c
onditi
ons o
f
(if bla
nk, se
al d
ate
is id
entic
al w
ith d
ate
code).
a) M
ounte
d w
ithin
b) S
tore
d a
t
body t
em
p.
3. D
evic
es r
equire b
akin
g, befo
re m
ountin
g, if:
Bag s
eal d
ate
Mois
ture
Leve
l 1
Mois
ture
Leve
l 2
Mois
ture
Leve
l 2a
4. If b
akin
g is
required,
b) 2a o
r 2b is
not m
et.
Date
and tim
e o
pened:
refe
rence IP
C/J
ED
EC
J-S
TD
-033 for bake
pro
cedure
.
Flo
or tim
e s
ee b
elo
w
If b
lank, see b
ar co
de la
bel
Flo
or tim
e >
1 Y
ear
Flo
or tim
e 1 Y
ear
Flo
or tim
e 4 W
eeks1
0%
RH
.
_<
Mois
ture
Leve
l 4
Mois
ture
Level 5
˚C).
OP
TO S
EM
ICO
ND
UC
TOR
S
MO
ISTU
RE
SE
NS
ITIV
E
This b
ag c
onta
ins
CA
UTIO
N
Flo
or tim
e 72 H
ours
Flo
or tim
e 48 H
ours
Flo
or tim
e 24 H
ours
30 ˚C
/60%
RH
.
_<
LE
VE
L
If b
lank, se
e
bar code label
Barcode label
Draft Version α.2 SFH 7015
2019-07-05 15
DRAFT - This design is for Reference only. Subject to change without notice.
Disclaimer
OSRAM OS assumes no liability whatsoever for any use of this document or its content by recipient
including, but not limited to, for any design in activities based on this preliminary draft version.
OSRAM OS may e.g. decide at its sole discretion to stop developing and/or finalising the underlying design at any
time.
Language english will prevail in case of any discrepancies or deviations between the two language wordings.
Attention please!
The information describes the type of component and shall not be considered as assured characteristics.
Terms of delivery and rights to change design reserved. Due to technical requirements components may contain
dangerous substances.
For information on the types in question please contact our Sales Organization.?If printed or downloaded, please find
the latest version in the Internet.
Packing
Please use the recycling operators known to you. We can also help you – get in touch with your nearest sales office.
?By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing
material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any
costs incurred.
Components used in life-support devices or systems must be expressly authorized for such purpose!
Critical components* may only be used in life-support devices** or systems with the express written approval of
OSRAM OS.
*) A critical component is a component used in a life-support device or system whose failure can reasonably be
expected to cause the failure of that life-support device or system, or to affect its safety or the effectiveness of that
device or system.
**) Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or
maintain and sustain human life. If they fail, it is reasonable to assume that the health and the life of the user may be
endangered.
2019-07-05 16
DRAFT - This design is for Reference only. Subject to change without notice.
Draft Version α.2 SFH 7015
SMILE Sprint 25 Review
Glossary
1) only one chip on
2) Typical Values: Due to the special conditions of the manufacturing processes of LED, the typical data or
calculated correlations of technical parameters can only reflect statistical figures. These do not necessarily
correspond to the actual parameters of each single product, which could differ from the typical data and calculated
correlations or the typical characteristic line. If requested, e.g. because of technical improvements, these typ. data
will be changed without any further notice.
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