Joint International Congress and Exhibition

ELECTRONICS GOES GREEN 2004+

Driving Forces for Future Electronics

Proceedings

September 6 -8 , 2004Berlin, Germany

Fraunhofer IRB Verlag • Stuttgart

Table of Contents

PREFACE 25

CONFERENCE SCOPE 26

CONFERENCE BOARDS 27

OPENING KEY NOTES

SUSTAINABILITY BY INNOVATION 31

Bulmahn, Edelgard • Federal Minister of Research and Education, Bonn, Germany

THE SUSTAINABILITY CHALLENGES FOR THE INDUSTRY 33

GraB, Got thard • Chief Manager, German Electrical and Electronic Manufacturers' Association (ZVEI),

Frankfurt a. M., Germany

A NEW BUSINESS PERSPECTIVE -TURNING GREEN MANUFACTURING

INTOYOUR COMPETITIVE ADVANTAGE 35

Chan, Kei Bill • Chairman, Hongkong Electronics Industries Association (HKEIA), Hongkong, China

SUSTAINABILITY: FAR BEYOND ECO-DESIGN 37

Ehrenfeld, John • Executive Director, International Society for Industrial Ecology, USA

THE RESPONSIBILITY OF THE ELECTRONICS INDUSTRY 43

Toepfer, Klaus • Executive-Director of the United Nations Environment Programme (UNEP), Nairobi, Kenya

ELECTRONICS GOES GREEN-CURRENT AND FUTURE ISSUES 45

Stevels, Ab • Design for Sustainability Lab. Fac. IO, Delft University of Technology, Delft, The Netherlands

Griese, Hansjoerg • Dept.Environmental Engineering, Fraunhofer IZM,Berlin, Germany

TECHNOLOGY TRENDS AND IMPLICATIONS FOR ENVIRONMENTAL HEALTH AND

SAFETY IN SEMICONDUCTOR INDUSTRY 55

Bolanos, Mar io • Director of Semiconductor Packaging Development Organization, Texas Instruments, USA

INDUSTRY CHALLENGES TOWARDS A RECYCLING-BASED ECONOMY 59

Yonemura, Noriyuki • Counselor, Fuji-Xerox, Japan

SUSTAINABILITY, A BIG CHALLENGE FOR BUSINESS 63

Campino, Ignacio • Head of Environmental Affairs Office, Deutsche Telekom AG, Germany

ACHIEVING SUSTAINABLE SOCIETY BY ECO-DESIGN 67

YamamotO, Ryoichi • Professor and Director Center of Collaborative Research, The University of Tokyo, Japan

TECHNICAL SESSIONS

WEEE/ROHS: PERCEPTION; CRITIQUE AND OPTIONS

Take Back of Electric and Electronic Equipment, a European phenomenon? 75

Hieronymi, Klaus • Alliances & Partnerships, Global Take Back Operation, Hewlett-Packard, Germany

WEEE recycling and legislation development in China 77

Chen, Panfeng • INSEAD, Fontainebleau, France

Green Electronics: A U.S. Perspective on Policy, Risk and Product Design 83

Schoenung, Julie M. • Department of Chemical Engineering & Materials Science, University of California, USA

Ogunseitan, Oladele A. • Department of Environmental Health, Science, and Policy, University of California, USA

Saphores, Jean-Daniel M. • School of Social Ecology & Economics Department, University of California, USA

Shapiro, And rew A. • Jet Propulsion Laboratory, California Institute of Technology, USA; University of California, USA

Are WEEE Recycling Rates Technologically and Economically attainable? 89

Homberger, M.; Hieber, M. • Fraunhofer Institute for Manufacturing Engineering and Automation, Stuttgart, Germany

WEEE/ROHS: CORPORATE ACTIVITIES FOR IMPLEMENTATION

Take back of Electronics - The need to re-engineer business processes

Hieronymi, Klaus • Hewlett-Packard Europe, Boblingen, Germany

Take back program for ICN products - a B2B solution for WEEE implementation..

Renner, Horst • Siemens ICN, Munich, Germany

Chryssos, Georgios • eds-r GmbH, Thierhaupten, Germany

Definition of Standard Components to Streamline Material Declarations for

Complex Electrical and Electronic Products - Experiences from Siemens Medical

Solutions and Agfa-Gevaert

Nissen, Nils F. • Siemens AG, Corporate Technology CT MM DM, Berlin, Germany

Bock, Hans-Christian • Siemens AG, Medical Solutions, EH&S, Erlangen, Germany

Karl, Georg • Agfa-Gevaert AG, Corporate Ecodesign Equipment, Munich, Germany

Good Declaration Practice

Schulz, Gerd • EpcosAG, Germany

Pophal, Christian • ZVEI, Fachverband Bauelemente, Frankfurt a. M., Germany

Sartorius, Ingo • PlasticsEurope Deutschland, Frankfurt/Main, Germany

Dietrich, Marcus • ZVEI, Frankfurt/Main, Germany

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99

103

109

WEEE/ROHS: NATIONAL IMPLEMENTATION IN EUROPE

WEEE legislation treatment and reuse activities in Hungary 115

Garamvolgyi, Emo; Istvan, Zoltan • Bay Zoltan Foundation for Applied Research, Institute of Logistics and Production

Systems (BAY-LOGI), Miskolctapolca, Hungary

WEEE in Slovenia - before and after the 13th of August 2004 121

Laurencic, Sergej • Ministry of the Environment, Spatial Planning and Energy for the Republic of Slovenia, Slovenia

Development of a sustainable WEEE recovery infrastructure in Finland, and stages of

end-of-life management of electronics 123

Pongracz, Eva; Yla-Mella, Jenni • University of Oulu, Department of Process and Environmental Engineering, Finland

Tanskanen, Pia • Nokia Research Center, Finland

Kaakinen, Juhani • Northern Ostrobothnia Environmental Centre, Oulu, Finland

Phillips, Paul S. • University College Nothampton, SITA centre for Sustainable Wastes Management, UK

Keiski, Riitta L. • University of Oulu, Department of Process and Environmental Engineering, Oulu, Finland

Implementation of WEEE and RoHS within SMEs in Austria 129

Luckner, Ernst • KERP - Center of Excellence for Electronic Scrap Recycling and Sustainable Product Design, Austria

WEEE/ROHS: TECHNICAL ASPECTS OF COMPLIANCE

Experiences with WEEE Take Back Systems using the Example of Mobile Phones 135

Beigl, P.; Schneider, R; Salhofer, S. • Institute of Waste Management, BOKU - University for Applied Life

Sciences and Natural Resources, Vienna, Austria

Comparison of European Monitoring Standards for the Recycling of CFC-Containing

Refrigerators and Freezers 141

Hug, Erhard • Roos+Partner AG, Luzern, Switzerland

Chappot , Anne-Christ ine • Ecoservices Sari, Yverdon-les-Bains, Switzerland

FranOV, Emil • Carbotech AG, Basel, Switzerland

Gauglhofer, Johannes; Hischier, Roland; Wager, Patrick • EMPA, St. Gallen, Switzerland

Hediger, Robert • S.EN.S, Zurich, Switzerland

Safe Recovery of Liquid Crystal Displays (LCDs) in compliance with WEEE 147

Martin, Roland; Simon-Hettich, Brigitte; Becker, Werner • Merck KGaA, Darmstadt, Germany

WEEE/ROHS: HOLISTIC PERSPECTIVE

Sustainable Products and Non-Sustainable Manufacturing Systems: a Paradigm Shift

Cannot be Missed 153

Nagel, M. H.; Tomiyama, T. • Delft University of Technology, Section Design & Life Cycle Engineering

Faculty of Mechanical Engineering and Marine Technology, Delft, The Netherlands

"Never change a running process?" - Key factors for substitution decisions in complex

products and production processes 159

Lohse, Joachim • Oko-lnstitut e.V, Freiburg, Germany

LiBner, Lothar • Kooperationsstelle Hamburg, Germany

Theoretical consideration on optimization of self sustainable recycling system 165

Hayashi, Hidetaka; Suga, TadamotO • The University of Tokyo , Tokyo, Japan

WEEE/ROHS: ECO-LABEL AND MARKING

WEEE Marking 173

Schneider, Andreas • Sony International (Europe) GmbH

Baynes, And rew • Apple Computers Europe

Crone, Joachim • Agfa-Gevaert AG, Germany

Kreis, Horst • AEG Haushaltsgerate GmbH, Germany

Lead-free Board Marking as Marking for Environmental Issues 175

Stobbe, Irina • TU Berlin, Research Center Microperipherics, Berlin, Germany

Liong, BudiantO • Fraunhofer Institute for Reliability and Microintegration IZM, Berlin, Germany

Nimmo, Kay • Soldertec/ITRI, St. Albans, UK

The communication tool for environmental attributes of IT products 181

Wendschlag, Hans • Hewlett-Packard, Stockholm, Sweden

Blue Angel for Green Electronics 183

Bottcher-Tiedemann, Christiane; Jacobs, Brigitte • Federal Environmental Agency, Berlin, Germany

INTEGRATED APPROACHES FOR LEGAL COMPLIANCE

Life-Cycle Impacts of Lead and Lead-Free Solder use in Reflow Soldering ofElectronics Manufacturing 191Geibig, Jack; Socolof, M. L. • University of Tennessee Center for Clean Products and Clean Technologies, USA

A DfE Framework for Sustainable IT Products 197

Brady, Todd; McManus, Terry • Intel Corporation, Chandler, Arizona, USA

Evaluating the sustainability impacts of emerging regulations in the electronicsindustry-A comparison of US and European approaches 203

Darby, Lauren; Hines, Frances; Williams, Andrew • ESRC Centre for Business Relationships, Accountability,Sustainability and Society (BRASS), Cardiff, United Kingdom

Virtual Teams and Legal Compliance 209

Sweatman, Andrew; Aitchison, Katie • ESHconnect, San Jose, USA and Melbourne, Australia

EXTENDING THE LIFE-SPAN OF PRODUCTS

Partnerships for e-waste recycling 215

Spies, Sandra; Wucke, Anja • GTZ, Eschborn, Germany

Substituting computers for services - potential to reduce ICT's environmental footprint 217

Plepys, Andrius • International Institute for Industrial Environmental Economics at Lund University, Sweden

Pay-per-use models in the IT sector - A driver for re-use and refurbishment? 223

Nittnaus, P.; BrandstOtter, M. • Austrian Society for Systems Engineering and Automation, Vienna, Austria

Knoth, R. • ReUse Elektro(nik)produkte- und Bauteileverwertung GmbH, Vienna, Austria

Kopacek, B. • Ecotronics Eco-Efficient Electronics and Services, Vienna, Austria

Kopacek, P. • Vienna University of Technology, Department for Sustainable Development and Business, Vienna, Austria

Environmental, Social, and Economical Implications of Cross-border Second-handEE Product Flows 229

Sleinotaite-Budriene, Lina • Apini, Institute of Env. Engineering, Vilnius, Lithuania

EFFICIENT TAKE-BACK SYSTEMS AND LOGISTICS

Simulation Analysis of Globally Integrated Logistics and Recycling Strategies 235Song, Sang J.; Kubota, Hiroshi • Hiroshima Institute of Technology, Graduate School of

Mechanical Systems Engineering, Department of Information and Intelligent Systems Engineering, Hiroshima, Japan

Supply Chain Management in Take Back of WEEE 241Eckerth, Gregor • INTERSEROH AG, Cologne, Germany

Take Back needs Logistics 245Hansen, Uwe • University of Applied Sciences RheinAhrCampus, Remagen, Germany

Take-back systems-a logistic and economic comparison 251Hauser, Henhk; Hohaus, Christian • Fraunhofer Institute for Materialflow and Logistics, Dortmund, Germany

TAKE-BACK QUANTITIES AND MONITORING

Disposal-behaviour prognosis for electrical consumer goods 257Hora, Maike • econcept, agency for sustainable design, Cologne, Germany

Approaches to Estimate Future Quantities of Waste Electrical and ElectronicEquipment (WEEE) 263Walk, Wo l fgang • Forschungszentrum Karlsruhe, Institute for Technical Chemistry,

Department of Technology-Induced Material Flow (ITC-ZTS), Karlsruhe, Germany

Rules on compliance with Article 7 of the WEEE Directive - Monitoring reuse, recyclingand recovery rates 269Sander, Knut; Zangl, Stephanie • Okopol GmbH, Hamburg, Germany

DISASSEMBLY TECHNOLOGIES

"Active Disassembly Using Smart Materials" End of Life Technology for WEEE - Resultsfrom the Framework V project 275Arnaiz, SixtO • GAIKER Centra Tecnologico, Zamudio, Spain

Bodenhoefer, Karl • Sony International (Europe) GmbH, Stuttgart, Germany

Harrison, David; Hussein, Habib • Brunei University, Runnymede, United Kingdom

Herrmann, Constant in • PE Europe GmbH, Stuttgart, Germany

Irasarri, Luis; Malaina, Mercedes indumetai Recycling, Bilbao, Spain

Schnecke, Doreen • Motorola Advanced Technology Center-Europe, Taunusstein, Germany

Tanskanen, Pia • Nokia Research Centre, Helsinki, Finland

Hybrid Disassembly System for Cellular Telephone End-of-Life Treatment 281Kniebel, Martin; Seliger, GGnther; Basdere, Bahadir • Technical University Berlin, Institute for MachineTools and Factory Management, Dept. of Assembly Technology and Factory Management, Berlin, Germany

Increased Reliability through Assessment of Standard Components with Life Cycle Units ... 287Buchholz, Alexander • Institut fur Werkzeugmaschinen und Fabrikbetrieb, TU Berlin, Germany

Middendorf , Andreas • TU Berlin, Research Center Microperipherics, Dept. Sustainable Technologies, Germany

Ray, Priyadip • TU Berlin, Germany

Reichl, Herbert • TU Berlin, Research Center Microperipherics, Berlin, Germany

Seliger, GQnther • Institut fur Werkzeugmaschinen und Fabrikbetrieb, TU Berlin, Germany

SUSTAINABILITY STRATEGIES FOR BUSINESS

Using Sustainability to Manage Risk, especially Reputational Risk 295Goluke, Ulrich • blue-way, Diessen, Germany

Governance of new technologies for innovations towards sustainability 299Turk, Volker; Von Geibler, Justus; Kuhndt, Michael • Wuppertal Institute for Climate, Environment andEnergy, Research Group Sustainable Production and Consumption, Wuppertal, Germany

NTT Group Activities and Initiatives on Environmental Protection 301Aok i , Tadahito • Nippon Telegraph and Telephone Corporation, Tokyo, Japan

Ibata, Yasuhiro • NTT Communications Corporation, Tokyo, Japan

Nakamura, Jiro; Nishi, Shiro • NTT Information Sharing Laboratory Group, Tokyo, Japan

Integrated Product Policy (IPP) as an Opportunity for Enterprises to Meet Ecological andEconomical Goals - A Combined Approach of Bavaria and Siemens Medical Solutions 307Steinmetzer, Hans-Christian • Bavarian State Ministry of the Environment, Public Health and Consumer

Protection, Munchen, Germany

Schroder, Freimut Siemens Medical Solutions, Erlangen, Germany

LEADFREE ELECTRONICS: TRENDS AND TRANSITION

Technological Innovation started by Environmental Concerns 315MQller, Jutta • Fraunhofer IZM, Department Environmental Engineering, Berlin, Germany

HagelQken, Marcel • Research Center for Microperipheric Technologies, TU Berlin, Germany

Griese, Hansjorg • Fraunhofer Institute for Reliability and Microintegration IZM, Department

Environmental Engineering, Berlin, Germany

Reichl, Herbert • Research Center for Microperipheric Technologies, TU Berlin, Germany

Trends in soldering have to match with lead-free solders 321Diepstraten, Gerjan • Vitronics Soltec BV, Oosterhout, The Netherlands

Barbini, Denis • Vitronics Soltec Inc., Stratham, NH, USA

Requirements, Solutions and Conversion Roadmap for Lead Free- andHalogen Free IC-devices and Components 325Burger, Klaus • Atmel Germany GmbH, Heilbronn, Germany

Pb-free Production of Telecommunication Network Equipment: Technological andLogistical Challenges 329Michel, HanS-JQrgen • Siemens AG, ICN M&L TDC CE MC2, Bruchsal, Germany

LEADFREE ELECTRONICS: COMPONENTS

Global Col laborat ion for Lead-Free - IMS Project EFSOT 337

OkamotO, Masahide; Serizawa, Koji; Harada, Masahide • Production Engineering Research Laboratory,

Hitachi Ltd., Yokohama, Japan

Deubzer, Otmar • TU Berlin, Research Center Microperipherics, Dept. Sustainable Technologies, Berlin, Germany

Cho, Il-Je; Chae, Kyu-Sang • LG Production engineering Research Center, Corea

Current status of lead-free solder in Japan and energy consumption of soldering process .. 343Fujino, Masahisa; Suga, Tadatomo • Research Center for Advanced Science Technology,

The University of Tokyo, Japan

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Whisker Formation on Sn-Plated Components 347

Oberndorf f , P.; Klerk, J. • Philips Centre for Industrial Technology, Eindhoven, The Netherlands

Dittes, M. • Infineon Technologies AG, Regensburg, Germany

Crema, P. • ST Microelectronics, Agrate Brianza, Italy

Proposal of Accelerated Life - Test Methodology for Lead-Free Electronic Products 353

Drozd, Zdzislaw; Drozd, Jaroslaw; Szwech, Marcin • Warsaw University of Technology, Institute of Precisionand Biomedical Engineering, Division of Precision and Electronic Product Technology, Warszawa, Poland

LEADFREE ELECTRONICS: SOLDERS

Optimization of lead free solder paste for robust process~and reliable solder joint 361

Laugt, Anne-Marie • Avantec, France •Evers, C.J. • Philips CFT, The Netherlands

Caban, D. • Thomson Multimedia, France

Wilczek, P.; Spilka, G. • AB Mikroelektroniks, Austria

Effect of Interfacial Microstructure on Joint Strength between Sn-Ag-Cu and Sn-Zn-Bi

solders and Cu Substrate 363

Hirose, Akio; Yanagawa, Hiroto; Ide, Eiichi; Kobayashi, Kojiro F. • Department of Manufacturing Science,Graduate School of Engineering, Osaka University, Japan

Development of Micro-structured Sn-2Ag-0.1AI Solder with Highly ThermalFatigue Durability 369Tanaka, Junichi • Graduate School of Engineering, Hokkaido University, Sapporo, Japan

Takashima, Toshiyuki • Department of Mechanical Engineering, Hokkaido Institute of Technology, Sapporo-shi, Japan

Yoshimi, Kenji; Serizawa, Koji • Hitachi, Ltd. Production Engineering Research Laboratory, Yokohama, Japan

Narita, Toshio • Graduate School of Engineering, Hokkaido University, Sapporo, Japan

Simple Removal Method of Enriched Copper from Lead-free Soldering Bath 373

Nishikawa, Hiroshi • Center for Advanced Science and Innovation, Osaka University, Japan

TakemOtO, Tadashi • Joining and Welding Research Institute, Osaka University, Osaka, Japan

Takahashi, Toshihide • Graduate School, Osaka University, presently at Toshiba Corporation, Japan

LEADFREE ELECTRONICS: PRINTED WIRING BOARDS

PCBs with immersion tin finish - some experiences with lead-free reflow process 381

Bukat, Krystyna; Koziol, G.; Sitek, J.; Borecki, J.; Hackiewicz, H. • Tele and Radio Research Institute, PolandMerkle, H.; Schroder, S. • Ormecon Chemie GmbH & Co.KG, Ammersbek, GermanyGirulska, A.; Gardela, K. • Eldos Sp. z o.o., Wroclaw, Poland

An optimizing method of Printed Wiring Board design compatible withlead-free soldering 387

Kikuchi, Shunichi; Yamada, Mitsutaka; Iketaki, Kenji; Yamamoto, Tsuyoshi;Higashi, Osamu • Fujitsu Limited, Kawasaki, Japan

The influence of the micro alloying element Ni on mechanical and solderingproperties of tincopper alloys 393

Lantzsch, Michael; Jost, Gregor; Berger, Thomas • BaiverZinn, Balve, Germany

LEADFREE ELECTRONICS: IMPLEMENTATION

Practical application of lead free solder in Electronic production 401

Chae, Kyu-Sang; Min, Jae-Sang; Kim, Ik-Joo; Cho, Il-Je • LG Electronics, Corea

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Component Supplier's Qualification of Lead-Free/Green Package Solutions 407

Lange, Bernhard; Huckabee, James; Romm, Doug • Texas instruments, Dallas, TX, USA

Wave Soldering Process with Sn-Zn Lead-free Solder 413

Katayama, Naoki; Tanaka, Hiroyuki; Akanuma, Masanobu • Hokkaido industrial Research institute,Sapporo-shi, Japan

Miyazaki, Makoto; Ogata Shigeyuki • Nagano OKI Electric Co., Ltd, JapanYoshida, Akio; Nishiyama Yoshihiro • OKI Electric Industry Co., Ltd, Japan

LEADFREE ELECTRONICS: ASSESSMENT

Evaluation of Environmental and Biological Impact of Pb-Free Solder 421

Satoh, Hiroshi • Tohoku University, Sendai, Japan

Chiba, M o m o k o • Juntendo University, Tokyo, Japan

TakamatSU, Takejiro • National Institute of Environmental Studies, Tsukuba, Japan

Kuboi, Toru • Shizuoka University, Shizuoka, Japan

Omae, Kazuyuki • Keio University, Tokyo, Japan

Life Cycle Assessment of Lead Free Solders 427

Alvarado Ascencio, Carmen; Nordahl Madsen, Jacob • PRe Consultants BV, Amersfoort, The Netherlands

Sustainable Use and Restrictions of Metals in the Electronics Industry 433

Deubzer, Otmar; Reichl, Herbert • TU Berlin, Research Center Microperipherics, Berlin, Germany

Madsen, Jacob • Pre Consultants, Amersfoort, The Netherlands

Griese, Hansjoerg • Fraunhofer IZM, Berlin, Germany

Van der Wei , Hans • Philips, Eindhoven, The Netherlands

Life Cycle Impact Assessment of Lead-free Solder Considering the Differences

of Waste Stages 439

Itsubo, Norihiro; Noh, Jaesung; Inaba, Atsushi •National Institute of Advanced Industrial Science and Technology (AIST), Ibaraki, Japan

PRACTICAL APPLICATION OF ENVIRONMENTAL ASSESSMENT

Estimating environmental impact scores and related uncertainties using the

Eco-PaS methodology 447

Dewulf , W i m ; Duf lou, Joost • Katholieke Universiteit Leuven, Mechanical Engineering Department, Belgium

Mind Your Steps Towards Sustainability - Developing Product Sustainability Indicatorsfor Cellular Phones 453

Stutz, Markus • Motorola GmbH, Motorola Advanced Technology Center - Europe, Taunusstein, Germany

Graulich, Kathrin • Oko-lnstitut e.V, Freiburg, Germany

Ebinger, Frank • Universitat Freiburg, Institut fur Forstokonomie, Freiburg, Germany

The Applicability of Public LCI Databases in the Framework of an Integrated

Product Policy in the Area of the Electronics Industry - a Case Study with the

Swiss Database "ecoinvent" 459

Hischier, Roland; Lehmann, Martin • Swiss Federal Laboratories for Materials Testing and Research (EMPA),Technology and Society Laboratory/ LCA Group, St. Gallen, Switzerland

Life Cycle Assessment of D-Lamp (XENARC) 461

Wongdeetha i , Angkarn ; Ertel, Jurgen K. • chair of industrial Sustainability,

Faculty of Environmental Sciences and Process Engineering, Brandenburg University of Technology Cottbus, Germany

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ECO-DESIGN SUPPORT

Implementing ecodesign for EEE-products 469

Eikelenberg, N.L.W.; Kok, I. C ; Tempelman, E. • TNO Industrial Technology, Eindhoven, The Netherlands

Integrating Life Cycle Analysis (LCA) with Process Modelling 475

Chen, Yue; McRae, Gregory • Massachusetts Institute of Technology, Cambridge, MA, USA

Designing Environmentally Friendly Products in Conformity with the

M a r k e t - A Holistic Analysis of Product Characteristics 481

Oberender, Christof; Birkhofer, Herbert • Darmstadt University of Technology, Institute for ProductDevelopment and Machine Elements, Darmstadt, Germany

Requirements and solutions for a practicable ecological product assessment 487

Nissen, Nils F. • Siemens AG, CT MM DM, Berlin, GermanyPaeglow, Sabrina • PhD student at Technical University of Berlin, GermanyWalachowicz, Frank • Siemens AG, CTMM DM, Berlin, Germany

ECO-DESIGN TOOLS

Analysis of the characteristics of QFDE and LCA for ecodesign support 495Sakao, Tomohiko • Mitsubishi Research Institute, Inc., Tokyo, JapanKaneko, Kazuhiko • Ebara Corporation, JapanMasui, Keijiro • The New Energy and Industrial Technology Develpoment Organization, Tokyo, JapanTsubaki, Hiroe • University of Tsukuba, Japan

"Welcome to the Jungle" - Survival of the Fittest Environmental Screening Indicators? 501

Hageluken, Marcel; Schischke, Karsten • TU Berlin, Research Center Microperipherics, Dept. SustainableTechnologies, Berlin, GermanyMQller, Jutta; Griese, Hansjorg • BeCAPc/o Fraunhofer IZM Dept. Environmental Engineering, Berlin, Germany

Integrating FMEA with TRIZ for Eco-lnnovation 509

Yen, Sheng-Bou; Chen, Jahau Lewis • Department of Mechanical Engineering, National Cheng KungUniversity, Tainan, Taiwan

Simple LCA by Response Surface Method for Multidisciplinary Design of Eco-Product 515Chen, Jahau Lewis; Chien, Hsiao-Wen • Department of Mechanical Engineering, National Cheng KungUniversity, Tainan, Taiwan

PRODUCT DATA MANAGEMENT: IMPLEMENTATION

Integrated Environmental Compliance Management - The Importance of Being Smart 523

Schulze, Bert • TechniData AG, Markdorf, Germany

Enabling the Paperless World with RosettaNet 529

Robson, Colin • RosettaNet, United Kingdom

Trials for Product's data Management through RosettaNet using RosettaNetTechnical

Dictionary (RNTD) and Partner Interface Processes (PIP) 2A10 533

Hashimoto, Shinya, • NEC Electronics Corp., Kanagawa, JapanSato, Katsumi • Sony Corp., JapanItO, Seigo • Toshiba Corp., JapanImamura, Eita • Fujitsu Ltd., JapanFukuda, Hisashi; Mackin, John • RosettaNet, Japan

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PRODUCT DATA MANAGEMENT: CONCEPTS

Environmental Life Cycle Information Management and Acquisition - First Experiencesand Results from Field Trials 541Bodenhofer, Karl; Schneider, Andreas • Sony International (Europe) GmbH (SIE), Stuttgart, Germany

Cock, T im; Brooks, Andrew; Sands, Graham • Merloni Elletrodomestici, Stoke-on-Trent, United Kingdom

Al lman, Lee; Simon, Ma t thew • Sheffield Hallam University, Sheffield, United Kingdom

Chong, Seng Kwong ; Yang, Kevin • De Montfort University, Leicester, United Kingdom

Delannoy, Olivier; Catanese, Bruno • Cybemetix, Rousset, France

Muller, Katrin • Motorola GmbH, Taunusstein, Germany

Environmental product information management in the automotive electronicssector- integrated reporting on material contents and product recyclability 547Jurgens, Gunnar • Continental Automotive Systems, Frankfurt, Germany

Strategies for Compliance and DfE: Managing Data throughout the Supply Chain 551Goodall, Catherine • EPI, Jamestown, Rl, USA

UBIQUITOUS ELECTRONICS

The Future Impact of ICTon Environmental Sustainability 559Van Wunnik, Christine; Rodriguez Casal, Carlos; Delgado Sancho, Luis; Burgelman, JeanClaude; Desruelle, Paul • Institute for Prospective Technological Studies, European Commission, DG-JRC, Spain

The Impacts of Pervasive Computing on Health and Environment 565

Erdmann, Lorenz; Behrendt, Siegfried • Institute for Futures Studies and Technology Assessment (IZT), Germany

Polytronics: Technology Trends and Environmenta l Issues 571

Bock, K.; Burghart, M.; Klink, G.; Potter, H.; Muller, J. • Fraunhofer Institute for Reliability and

Microintegration, Munich and Berlin, Germany

Hageluken, M. • TU Berlin, Research Center Microperipherics, Dept. Sustainable Technologies, Berlin, Germany

Design for a Sustainable Society utilizing Information & Communication Technologies 577FujimotO, Jun • Research Center for Advanced Science & Technology, University of Tokyo, Japan

MatSumotO, M. • Fundamental and Environment Laboratories, NEC Corporation, Japan

ECO-DESIGN IN PRACTICE

Fujitsu Siemens Computers Green Design Concept 585Podratzky, Harald • Fujitsu Siemens Computers, Augsburg, Germany

A Practical Approach to Implementing CSR in the Electronics Industry:Global Supply Chain Management focusing on Corporate Social Responsibility 591Jamieson, Saul • Panasonic Mobile Communications Development of Europe (PMCDE), United Kingdom

Hilbron, Raphael • Vodafone Group Pic, UK

Rice, Gareth • Panasonic Mobile Communications Development of Europe (PMCDE), United Kingdom

Clift, Roland; Wehrmeyer, W. • Centre for Environmental Strategy, University of Surrey., United Kingdom

Environmental Assessment of products at Philips Electronics 597

Van der Wei, Hans; Bisschop, Marielle • Philips CFT, Eindhoven, The Netherlands

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Micro Systems Design Work Flows - Assessment of Environmental Driven Criteria 603

Ong, Kilian • Technical University Hamburg-Harburg, Germany

Schischke, Karsten • TU Berlin, Research Center Microperipherics, Dept. Sustainable Technologies, Berlin, Germany

Kasper, Manf red • Technical University Hamburg-Harburg, Germany

Middendor f , Andreas • TU Berlin, Research Center Microperipherics, Dept. Sustainable Technologies, Germany

Griese, Hansjoerg • Fraunhofer IZM, Berlin, Germany

Reichl, Herbert • TU Berlin, Research Center Microperipherics, Dept. Sustainable Technologies, Germany

ENERGY SUPPLY: PHOTOVOLTAIC AND FUEL CELL TECHNOLOGY

Portable fuel cell performance; the influence of environment and user profile 611

Flipsen, B.; Coremans, B. • Delft University of Technology, Delft, the Netherlands

A MEMs Based Planar Micro Fuel Cell with Self Breathing Cathode Side 617

Wagner, Stefan; Hahn, Robert; Krumbholz, Steffen; Reichl, Herbert • Fraunhofer institute for Reliability

and Microintegration IZM, Berlin, Germany

Solar Energy makes SENSEAnalysis, Development, Improvements at the Example of Solar Modules 623

Warburg , Niels • Universitat Stuttgart, IKP, Abt. Ganzheitliche Bilanzierung, Echterdingen, Germany

Springer, Johann • Zentrum fur Sonnenenergie- und Wasserstoff-Forschung Baden-Wurttemberg, Germany

Wors ing, Katharina • Fraunhofer-Gesellschaft, Institut fur Chemische Technologie, Pfinztal, Germany

Irasarri, Miguel • GAIKER Technology Center, Zamudio, Spain

ENERGY EFFICIENCY

Energy Efficient Microprocessor Design: More Performance With Less Power 629

Sadowy, Donna • Advanced Micro Devices, Inc., Sunnyvale, CA, U.S.A;

AMD Saxony Limited Liability Company & Co. KG, Dresden, Germany

Eco-Design And Human Powered Devices 635

Kazazian, Thierry • 02 France, Paris, France

Jansen, Arjen • PES research group, Delft University of Technology, The Netherlands

Energy consumption issues in portable electronics 641

Strijk, R. • Delft University of Technology, The Netherlands

SMEs Helping Close the Digital Divide - RE Powered ICTs 647

Agbemabiese, Lawrence; Otto, Martina • United Nations Environment Programme, Division of Technology,

Industry and Economics, Paris, France

METAL-ORIENTED MATERIAL RECYCLING

Gold recovery from printed wiring board using bioleaching 653

Kita, YoshitO • Faculty of engineering, Osaka university, Japan

Nishikawa, Hiroshi • Center for Advanced Science and Innovation, Osaka University, Japan

TakemotO, Tadashi • Joining and Welding Research Institute, Osaka University, Japan

Eco Efficient Optimization of Pre-processing and Metal Smelting 657

Van Heukelem, Arnout; Reuter, Markus; Huisman, Jaco • TU Delft, Delft, The Netherlands

Hageluken, Christian; Brusselaers, Johan • Umicore Precious Metals Refining, Hoboken, Belgium

15

SEES Project - How to improve the Recyclability Potential of Automotive Electronics 663Alonso, Juan Carlos • Lear Automotive (EEDS) Spain SL, Vails, Spain

Lichtenvort, Kerstin • Technical University of Berlin, Systems Environmental Engineering, Germany

Arnaiz, SixtO • GAIKER Centra Tecnol6gico, Zamudio, Spain

PLASTICS-ORIENTED MATERIAL RECYCLING

Screening QWERTY Analysis on Printer Cartridges Recycling 671Huisman, Jaco • Design for Sustainability Research Group, TU Delft, Delft, The Netherlands

Scheijgrond, Jan Wi l lem • EPSON Europe, Amsterdam, The Netherlands

Industrial N e t w o r k : Recycling plastics f r o m WEEE : 677

Maurer, Andreas; Schlummer, Mart in • Fraunhofer-lnstitute for Process Engineering and Packaging,

Department Product Safety and Analysis, Freising, Germany

Recyclable I M D : A Solution for Decorated Plastic Parts? 683

Schnecke, Doreen • Motorola GmbH, Motorola Advanced Technology Center - Europe, Taunusstein, Germany

GQnther, J6rg • Kunststoff-lnstitut Ludenscheid GmbH, Germany

GREEN ICT APPLICATIONS

WLAN versus LAN - Environmental Impacts of Small and Medium SizedLocal Area Networks 691Quack, Dietlinde; Hottenroth, Heidi • Oko-lnstitute.V, Freiburg, Germany

Key Environmental Performance Indicators (KEPIs): A New Approach toEnvironmental Assessment 697Singhal, Pranshu • International Institute for Industrial Environmental Economics (WEE) at Lund University, Sweden

Ahonen , Salla • Nokia Corporation, Finland

Rice, Gareth • Panasonic Mobile Communications Europe (PMCE), United Kingdom

StUtZ, Markus • Motorola Advanced Technology Centre, Germany

Terho, Markus • Nokia Corporation, Finland

Van der Wei ' Hans • Philips CFT, The Netherlands

Life Cycle Assessment of 3rd Generation Nokia Handset 703McLaren, Jake • Nokia Multimedia, Imaging Business Unit, Summit Avenue, Farnborough, Hampshire, UK

Piukkula, Niina • Tampere University of Technology, Department of Environmental Technology,

Occupational Safety Engineering

Ecological and Economical Effects of Future Services by Information andCommunications Technology 707Nakamura, Jiro; Nishi, Shiro • NTT Information Sharing Laboratory Groups, NTT Corporation, Japan.

GREENING THE GLOBAL SUPPLY CHAIN

Role and Strategy of OEM in a Green Supply Chain 715 \Shih, Li-Hsing • Department of Resources Engineering, National Cheng Kung University, Tainan, Taiwan •

Product Chain Collaboration and Environmental Innovations - A Task for Different iStakeholders 719 IRemmen, Arne; Moosgard, Met te • Aalborg University, Aalborg, Denmark 3

16

Strengthening the Capacity of SMEs and Local Authorities in Developing Countriesto Tackle Environmental Requirements in the Supply Chain 723Sonnemann, Guido • Division of Technology, Industry and Economics (DTIE),

United Nations Environment Programme (UNEP), Paris, France

"Made in China" - Challenges and Opportunities for Companies from a SociallyResponsible Investment Point-of-View 727Plinke, Eckhard; Ashida, Mak iko • Sarasin Sustainable Investment, Bank Sarasin & Cie. AG, Basel, Switzerland

Managing Global Responsibility 733Saur, Konrad • Five Winds International, Donzdorf, Germany

NEW MATERIALS: PRINTED WIRING BOARDS

New Technology for a Sustainable Printed Circuit Board Manufacturing Process 741Bains, Narinder; Geraghty, Kate; Goosey, Martin • Rohm and Haas Electronic Materials, Coventry, UK

Thermoplastic Printed Circuit Boards for Future Electronics 747Moller, Mar t in ; Gensch, Carl-OttO • Oko-lnstitut e.V., Freiburg, Germany

AltStadt, Volker • Universitat of Bayreuth, Bayreuth, Germany

Behrendt, Mathias • Reifenhauser GmbH &Co. KG, Troisdorf, Germany

Glode, Stefan • LOberg Elektronik GmbH & Co. KG, Weiden, Germany

Kostelnik, Jan • Wurth Elektronik GmbH & Co. KG, Rot am See, Germany

Langenfelder, Dieter • Universitat of Bayreuth, Bayreuth, Germany

Landeck, Hubert • KEW Konzeptentwicklung GmbH, Kronach, Germany

Park, Heyje • Wurth Elektronik GmbH & Co. KG, Rot am See, Germany

Scheel, Wo l fgang • Fraunhofer IZM, Berlin, Germany

Wahlen, Lars • Lehmann&Voss&Co., Hamburg, Germany

Renewable resources for use in printed circuit boards 753Nagele, Helmut; Pfitzer, Jl irgen • TECNAROGmbH, Eisenach/Stedtfeld, Germany

Lehnberger, Chr istoph • Andus Electronic GmbH, Berlin, Germany

Landeck, Hubert • KEW Konzeptentwicklung GmbH, Germany

Birkner, Klaus • Loewe Opta GmbH, Germany

Viebahn, Ulrich • Maschinenfabrik Viebahn GmbH, Germany

Muller, Jutta; Schmidt, Ralf; Scheel, Wo l fgang • Fraunhofer Institute for Reliability and Microintegration

IZM, Berlin, Germany

Hageluken, Marcel • TU Berlin, Research Center Microperipherics, Dept. Sustainable Technologies, Berlin, Germany

Measurement of VOC and SVOC Emissions from Electronic Consumer Productswith a i m 3 Emission Test Chamber 759Wensing, Michael • Fraunhofer Wilhelm-Klauditz-lnstitute(WKI), Material Analysis and Indoor Chemistry,

Braunschweig, Germany

NEW MATERIALS: FLAME RETARDANTS

Highly Efficient Flame Retardant Curing Agent for Epoxy Resins 767Blundell, Cefn • AKzo Nobel Chemicals bv, Amersfoort, The Netherlands.

Levchik, S.; Piotrowski, A. • Akzo Nobel Chemicals, Dobbs Ferry, NY, USA

17

New environmentally-friendly Phosphorus based Flame Retardants for Printed CircuitBoards as well as Polyamides and Polyesters in E&E Applications 771DietZ, Mathias • Clariant GmbH, Knapsack, Germany

Hoerold, Sebastian; Nass, Bernd; Schacker, Ot tmar • Clariant GmbH, Gersthofen, Germany

Schmitt, Elmar • Clariant GmbH, Sulzbach am Taunus, Germany

Wanzke, Wo l fgang • Clariant GmbH, Gersthofen, Germany

Sustainability Concerns For Flame Retarded Plastics Used in Electrical andElectronic Equipment Applications 777

Dawson, Raymond B.; Landry, Susan D. • Albemarle Corporation, Baton Rouge, LA, USA

Environmental and Economic Implications of a Shift to Halogen-FreePrinted Wiring Boards 783

Bergendahl, Carl Gunnar • IVF Industrial Research and Development Corporation, Molndal, Sweden

Lichtenvort, Kerstin • Technical University of Berlin, Systems Environmental Engineering, Germany

Johansson, Glenn; Zackrisson, Mats • IVF Industrial Research and Development Corporation, Molndal, Sweden

NyySSOnen, Jonna • Aspocomp Oy, Salo, Finland

GREEN SEMICONDUCTOR PROCESSES

Implementing Cleaner Production in Semiconductor and Printed Circuit BoardIndustry in India 791Sethi, V. C ; Pandey, U. C. • Ministry of Communication and Information Technology, Department of

Information Technology, CGO Complex, New Delhi, India

Schischke, Karsten • TU Berlin, Research Center Microperipherics, Dept. Sustainable Technologies, Germany

Griese, Hansjoerg • Fraunhofer Institute for Reliability and Microintegration IZM, Department Environmental

Engineering,Berlin, Germany

Reichl, Herbert • TU Berlin, Research Center Microperipherics, Berlin, Germany

Improving the Environmental Performance of In Situ PECVD Chamber CleaningProcesses by studies of CVD Reactor Clean Performance and Field Evaluation ofOptimised Processes 797Sistem, Mark • Air Products PLC, Crewe, United Kingdom

Johnson, And rew D.; Elder, Delwin L.; Ji, Bing; Karwacki, Eugene J. • Air Products and chemicals, inc.,

Allentown, USA

Green Technological Process of Dry Laser Vacuum Microlithography andEquipment Clasterfor its Realisation in ASIC Manufacturing 803Tochitsky, E. I.; Obukhov, V. E. • "Plasmoteg" SEC of the Physical Technical Institute of the

National Academy of Sciences of Belarus, Minsk, Belarus

Tochitsky, Y. I. • Concern "Planar", Minsk, Belarus

Hoepf l , R. • University of Applied Sciences, Deggendorf, Germany

GREEN SEMICONDUCTOR MANUFACTURING

Decision making for the installation of environment protection equipment inSemiconductor Manufacturing 809Lassig, B.; Rail, F. • M+W Zander, Stuttgart, Germany

Schmidt, M. • University of applied science, Pforzheim, Germany

Schottler, M. • M+W Zander, Stuttgart, Germany

Selection Experience and Analysis of Point-of-Use Abatement Systems for theSemiconductor Industry 815Oetjen, Eckhard • AMD Saxony Limited Liability Company & Co. KG, Dresden, Germany

18

Beyond the walls of Semiconductor Fabs: Energy intensity of high grade materials 821

Plepys, Andr ius • The International Institute for Industrial Environmental Economics at Lund University, Sweden

Schischke, Karsten • TU Berlin, Research Center Microperipherics, Dept. Sustainable Technologies, Germany

SEMICONDUCTOR EQUIPMENT DECOMMISSIONING

Decommissioning - Five critical steps to minimize both risk and cost 829

Barnes, Robert • Robert Barnes Associates, Scottsdale, Arizona, USA

Disposition of Assets-Tools 835

Melief, Ron • ASML & SEC/N, The Netherlands

SEMI Guidelines for Decommissioning and Decontamination 837

Lucas, Pierre • Semiconductor Equipment and Materials International (SEMI), Brussels, Belgium

SPECIAL: 10 YEARS OF CARE ELECTRONICS AND 5 YEARS OF SCARE

Introduction to CARE Electronics and SCARE 841

Kopacek, Bernd; Scheidt, LutZ-GGnther • International CARE Electronics Office, Vienna, Austria

NOVEL APPROACHES

Ecodesign in industry is not an environmental issue 855

Pascual, Oriol • Design for Sustainability Program, Delft University of Technology, The Netherlands

Stevels, A b • Environmental Competence Centre, Philips Consumer Electronics, Eindhoven, The Netherlands

Beyond Eco-Efficiency: A Strategy for Eco-Effective Product and System Design 861

Braungart, Michael • EPEA Internationale Umweltforschung GmbH, Hamburg, Germany and McDonough

Braungart Design Chemistry, Charlottesville, USA

Bollinger, And rew • McDonough Braungart Design Chemistry, Charlottesville, VA, USA

Visualising the Environmental Appearance of Audio Products 865

Stilma, Margo t • University of Twente, Enschede, The Netherlands

Stevels, A b • TU Delft, The Netherlands and Philips Consumer Electronics, Eindhoven, the Netherlands

Christiaans, Henri; Kandachar, Prabhu • TU Delft, The Netherlands

Managing Energy Related Green House Gas Emissions: What Are Your Options? 871

Meissen, Ronald • Baxter International, Deerfield, IL, USA

Eagan, Patrick • University of Wisconsin-Madison, Madison, Wl, USA

EDUCATION AND TRAINING

New Subject "Life Cycle Engineering" at Technical University Braunschweig toBring Topics of Actual Concern into Students' Education 879

Herrmann, Christoph; Ohlendorf, Martin, Dettmar, Tina • institute of Machine Tools and Production

Technology (IWF), Technical University Braunschweig, Germany

Using Life Cycle Assessment in Design for Environment Education of Product

Development Staff 885

Jauhiainen, Hannu • Vaisala Oyj, Helsinki, Finland

Kaipainen, Jukka; Ristolainen, Eero; Valkama, Jani • Tampere University of Technology, Institute of Electronics,

Tampere, Finland

19

The Life Cycle of Mobile Phones - A School Teaching Project 891

Schmidt, Christine; Wichmann, Anka • wibz wartenberger innovations- & bildungszentrum gGmbH, GermanyMiddendorf, Andreas; Schischke, Karsten • TU Berlin, Research Center Microperipherics,Dept. Sustainable Technologies, Germany

Benchmarking ICT companies on the management of social and environmentalissues in their supply and disposal chains 897Kruse, Claudia • ISIS Asset Management, London, United Kingdom

GREEN ELECTRONICS PACKAGING

Environmentally Friendly Semiconductor Packages:The Design of an Innovative Leadless Package Concept 901

Kilger, I ; Theuss, H.; Paulus, S.; Dangelmaier, J.; Dittes, M.; Pressel, K. •Infineon Technologies AG, Regensburg, Germany

Practical study of implementing measures for EuP on the example of an

environmental roadmap of embedded components 907

Herrmann, Constant in • PE Europe GmbH, Leinfelden-Echterdingen, Stuttgart, Germany

Environmental Assessment of Embedded Chip Manufacturing Technology 913

Andrae, Anders S. G.; Chen, Caroline • SMIT, Sino-Swedish Microsystems Integration and Technology Centre

and Division of Electronics Production, Chalmers University of Technology, Gothenburg, Molndal, Sweden

Schischke, Karsten; Hageluken, Marcel • TU Berlin, Research Center Microperipherics, Dept. Sustainable

Technologies, Berlin, Germany

Liu, Johan • SMIT, Sino-Swedish Microsystems Integration and Technology Centre and Division of

Electronics Production, Chalmers University of Technology, Gothenburg, Molndal, Sweden;

IVF, Industrial Research and Development Corporation, Sweden

REACH REGULATION

Towards a EU Regulation on Registration, Evaluation, Authorisation and Restriction

of Chemicals (REACH): impact on the microelectronic industry 921

Lucas, Pierre • Semiconductor Equipment and Materials International (SEMI), Brussels, Belgium

REACH and the Electronic Industry: Tasks, Problems and Chances for Downstream Users.... 927

Bunke, Dirk; Harms, Wiebke; Hermann, Andreas • oko-institut e.v, Freiburg, Germany

REACH - What are we facing? 933

Lendle, Hubert • BASF AG, Ludwigshafen, Germany

SYSTEM RELIABILITY, LIFETIME AND FAILURE ESTIMATION

Failure Rate Prediction Models used for Reliability Monitoring of Electronic Systems 939

Held, Marcel; Sennhauser, Urs • Swiss Federal Laboratories for Materials Testing and Research (EMPA),

Duebendorf, Switzerland

Application of Health Monitoring to Product Take-back Decisions 945

Vichare, Nikhil; Rodgers, Peter; Azarian, Michael H.; Pecht, Michael • CALCE Electronic Products andSystems Center, University of Maryland, MD, USA

System Reliability - A Key to Eco-Efficiency 951

Middendorf, Andreas; NeSS, Olaf; Reichl, Herbert • Berlin Center of Advanced Packaging, TU Berlin, Germany

20

Prediction of the technical life of strongly innovative products using dynamicreliability models 957Hulsken, GUUS • Flextronics, Venray, The Netherlands

Van den Bogaard, J.A.; Brombacher, A.C. • Eindhoven University of Technology, The Netherlands, and

National University of Singapore

Theunissen, T.; Peeters, B. • Flextronics, Venray, The Netherlands

SPECIAL LECTURES

FUTURE TECHNOLOGY AND PRODUCTS

NEMI's Activities to Strengthen the Electronics Manufacturing Supply Chain 967Pfahl, Robert C. Jr. • National Electronics Manufacturing Initiative (NEMI), Herndon, VA, USA

Packaging Trends seen by ITRS 973Wolf , JQrgen • Fraunhofer IZM, Germany

Adams, Joe • Skyworks Solutions, Corp., USA

Reichl, Herbert; Aschenbrenner, Rolf • Fraunhofer IZM, Germany

The Future of Electronics and EHS 979McManus, Terrence J. • Intel Corporation, Chandler, AZ, USA

REALIZATION OF THE EUP-DIRECTIVE

The EuP Directive proposal: a framework for continuous improvement of theenvironmental performance of energy-using products 987Papadoyannakis, Michail; Brisaer, Andre • European Commission, DG Enterprise, Brussels, Belgium

Towards an optimalization of the proposed framework Directive for the setting ofeco-design requirements for energy-using products (EuP) 991Schoenmakers, Theo • Environmental Competence Centre, Philips Consumer Electronics, Eindhoven, The Netherlands

Stevels, Ab • Faculty of Industrial Design Engineering, TU Delft, Delft, The Netherlands

The Energy Using Products (EuP) Directive and product chain innovation 997Van Rossem, Chris; Dalhammar, Carl • International Institute for Industrial Environmental Economics at

Lund University, Sweden

GUIDING INITIATIVES

TOWARDS SUSTAINABILITY IN THE ICT INDUSTRY

Sustainability needs Communication - German ICT- industry's strategy topromote Sustainability 1007Tobias, Mar io • BITKOM, Berlin, Germany

Pongratz, Siegfried • Motorola Advanced Technology Center, Taunusstein, Germany

Virtual Worlds and Real Worlds: Substitution or Addition? 1013Schauer, Thomas • European Support Center, Club of Rome, Vienna, Austria

The Project NIK: Sustainability in Information and Communication Technologies 1019Weigmann, Uwe; Dompke, Mario; Folk, Kerstin; Lahser, Kerstin •German Aerospace Center (DLR), Berlin, Germany

21

A Sustainability Approach to Future Microsystems Technology 1025Reichl, Herbert • Research Center for Microperipheric Technologies, Technical University Berlin; Germany

Griese, Hansjoerg; Stobbe, LutZ • Fraunhofer Institute for Reliability and Microintegration, IZM Berlin, Germany

BUSINESS MODELS FOR E-WASTE AND REUSE

SOLVING THE E-WASTE PROBLEM: TOWARDS IMPLEMENTATION 1031Kuehr, Ruediger • United Nations University, Zero Emissions Forum, European Focal Point, Hamburg, Germany

CLOSING KEY NOTES

Global Marshall Plan Initiative 1035

Finkbeiner, Frithjof • Global Contract Foundation German Association of the Club of Rome

Growth into smaller dimensions 1039

Kroy, Walter • CEO, Tharsos AG, Germany

POSTER SESSIONS

Measurement of flame retardants in technical plastics with different spectroscopicmethods and their application 1045Becker, W.; Eisenreich, N. • Fraunhofer Institut fur ChemischeTechnologie, Pfinztal, Germany

Reliable testing of the RoHS compliance by flame retardant analysis with

online-GPC-HPLC-UV and HPLC-UV/MS 1047

Maurer, Andreas; Schlummer, Martin, Brandl, Fritz • Fraunhofer-lnstitute for Process Engineering andPackaging, Germany

Chemical Analysis of Electrical and Electronic Equipment in the Context of the

RoHS Directive 1049

Wolf, Marion; Pohlein, Manfred; Al-Twaiq, Abdel Mnim; Urpi Bertran, Raquel; Van Eldik, Rudi •Institute for Inorganic Chemistry, University of Erlangen-Nurnberg, Erlangen, Germany

Investigation on emissions of volatile and semi volatile compounds (VOC, SVOC),dust and ozone from electronic consumer products 1051Kemmlein, Sabine; Rockstroh, Jens; Jann, Oliver • Federal Institute for Materials Research andTesting (BAM), Germany

X-Ray Inspection of Lead-Free Solder Joints 1053

Roth, H. • Phoenix X-Ray Systems + Services GmbH, Wunstorf, Germany

Development of reuse and recycling technologies for lead-free printed circuit boards 1055

Miguel,Rafael; Cacho, Inigo • GAIKER Centra Tecnologico, Parque Tecnologico, Zamudio, Spain

Irasarri, Luis • Indumetal Recycling, S.A.; Asua-Erandio, Spain

Environmental Product Assessment The Rapid Environmental Assessment Lab REAL 1057Riess,Michael; Smirnow, Julia; Muller, Katrin; Stutz; Markus • Motorola GmbH, Physical RealizationResearch Center- Europe, Taunusstein, Germany

22

How to assess the environmental impact of electronics? 1059

Ciroth, Andreas • GreenDeltaTC GmbH, Berlin, Germany

Electronics Fabrication with Dissolved Ozone - T h e Green Solution 1061

Gottschalk, Christiane; Lohr, Joachim; Schnaiter, Gerhard • AstexGmbH, Berlin, Germany

EcoEngineering of a carbon fiber adsorption 1063La'SSig, B. • M+W Zander Stuttgart, Germany

Contributions to LCA of semiconductors using the cumulated energy demand (CED) 1065

Elser, Andrea; Rail, Friedemann; Schottler, Martin • M+W Zander, Stuttgart, Germany

Environmental Performance Indicator (EPI) Based Rating System for Eco-EfficientRecycling of Waste Electrical and Electronic Equipment 1067Franov, Emil • Carbotech AG, Basel, SwitzerlandChappot, Anne-Christine • Ecoservices Sari, Yverdon-les-Bains, SwitzerlandGauglhofer, Johannes; Hischier, Roland, Wager, Patrick • EMPA, St. Gallen, SwitzerlandHug, Erhard • Roos+Partner AG, Luzern, SwitzerlandHediger, Robert • S.EN.S, Zurich, Switzerland

Material Recovery from Mobile Phones by the CreaSolv® Process 1069

Schlummer, M.; Maurer, A. • Fraunhofer IW, Department Product Safety and Analysis, Freising, GermanyAltnau, Gerald. • CreaCycle GmbH, Grevenbroich, Germany

S.EN.S-OnlineSystem - An example of a recycling system based on compulsory

take-back and voluntary financing 1071

Hediger, Robert; Werder, Gustav; Rothlisberger, Andreas • S.EN.S Swiss Foundation for WasteManagement, Zurich

Dismantling of New Generation Refrigerators and Freezers ContainingVOC: Results of a Test Campaign 1073Hug, Erhard • Roos+Partner AG, Luzern, SwitzerlandChappot, Anne-Christine • Ecoservices Sari, Yverdon-les-Bains, SwitzerlandFranov, Emil • Carbotech AG, Basel, SwitzerlandGauglhofer, Johannes; Hischier, Roland, Wager, Patrick • EMPA, St. Gallen, SwitzerlandHediger, Robert • S.EN.S, Zurich, Switzerland

Automatic Brand Identification of WEEE 1075

Chen, Panfeng; Ertel, Jurgen K. • BTU-Cottbus, GermanyScheider, Andreas • SONY International (Europe) GmbH, Stuttgart, Germany

Designing Eco-efficient Product Resource Cycles 1077

Eikelenberg, Nicole • TNO Industrial Technology, Eindhoven, The Netherlands

Huisman, Jaco • Technical University Delft, Delft, The Netherlands

Ansems, Toon • TNO Environment, Energy and Process Innovation, Apeldoorn, The Netherlands

Van Kasteren, Han • Technical University Eindhoven, Eindhoven, The Netherlands

Automotive EES Recycling Flows 1079

Fleischer, Gunter; Dose, Julia; Greif, Andre; Lichtenvort, Kerstin • Technical University of Berlin,Systems Environmental Engineering, Berlin, Germany

23

Influence of Product Failure on Comparative Life Cycle Assessments ofProtective Packaging 1081

Wever, Renee; Boks, Casper; Stevels, Ab • School of Industrial Design Engineering, Delft University of

Technology, Delft, NL

Volume efficiency as an environmental strength of moulded pulp protective packaging 1083

Wever, Renee; Boks, Casper; Kandachar, Prabhu; Brezet, Han • School of industrial Design Engineering,Delft University of Technology, Delft, NL

Electronic Waste in Developing Countries - Recycling, Responsibility, Revenue? 1085

Wucke, Anja; Spies, Sandra • GTZ, Eschbom, Germany

AUTHOR INDEX 1087

24