PPPL: CAD Development of Modular Coils

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PPPL: CAD Development of Modular Coils July 21, 2003

description

July 21, 2003. PPPL: CAD Development of Modular Coils. 1.5. Surface A. 1.0 nominal. 1.5. Surface B. 6.664. .31 x .38 VPI groove. 2.664. 1/8 foam layer. 5.0. 1.675 x 4.671 winding pack. 4.671. clamp. 1/8 VPI layer. 4.1. 1. 5.1. 2. Modular Coil - C (13). - PowerPoint PPT Presentation

Transcript of PPPL: CAD Development of Modular Coils

Page 1: PPPL: CAD Development of Modular Coils

PPPL:CAD Development of Modular Coils

July 21, 2003

Page 2: PPPL: CAD Development of Modular Coils

4.671

4.1

5.1

1.0 nominal

5.0

.31 x .38VPI groove

1/8 foamlayer

1/8 VPIlayer

1.675 x 4.671winding pack

clamp

2.664

1.5

1.5

6.664 Surface B

Surface A

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Modular Coil - A (11)

Modular Coil - B (12)

Modular Coil - C (13)

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Interference Concerns

This collision should be able to be avoided with a tweak to the surface

Since there is no “Wing” in this area we’ll have an extra 1.5” to work with 4

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Modular Coil - A (11)

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Modular Coil - B (12)

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Modular Coil - C (13)

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Winding-Clamp Concern Areas

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