Power SiC 2020: Materials, Devices
17
From Technologies to Markets Power SiC 2020: Materials, Devices and Applications Market and Technology Report 2020 Sample © 2020
Transcript of Power SiC 2020: Materials, Devices
From Technologies to Markets
Power SiC 2020: Materials, Devices and Applications
Market and Technology
Report 2020
Sample
© 2020
2
TABLE OF CONTENTS
• Glossary 2
• Table of contents 3
• Report methodology 4
• Companies cited in this report 5
• About the authors 6
• What we got right, what we got wrong 7
• What’s new 11
• Executive summary 15
• Context 52
• Market forecasts 59
• Market trends 84
o Electric and hybrid electric vehicle applications
o Charging infrastructure applications
o Photovoltaic inverter applications
o Power supply applications
o Rail traction applications
o Uninterruptible power supply applications
o Motor drive applications
o Wind applications
o Other applications
• Market shares and supply chain 170
o Power SiC industry supply chain 2020
o Key players and power electronics landscape
o Revenue estimations of power SiC device manufacturers
o Tesla’s SiC supply chain
o Toward vertical integration
o Company profile: Cree/Wolfspeed
o Company profile: ROHM
o Company profile: II-VI
o Strategies of leading SiC device players
o Power module market reshaping
o Securing the wafer supply
o SiC epiwafer manufacturing
o SiC wafer/boule producer status
o SiC N-Type wafer/Boule capacity estimation & forecast
• Focus on Chinese SiC industry 201
• Power SiC manufacturing ecosystem 209
• Technology trends 214
o Power SiC device technology
o Packaging
o Reliability
o Power SiC devices - Commercial status
o SiC wafer and epiwafer
• Outlook and conclusions 268
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GLOSSARYAMB Active Metal Brazed
A, Amp Ampere
ASP Average Selling Price
BEV Battery Electric Vehicle
BJT Bipolar Junction Transistor
BOM Bill Of Materials
BPD Basal Plane Dislocation
BTS Base Transceiver Station
CAGR Compound Annual Growth Rate
CCM Continuous Conduction Mode
CTE Coefficient of Thermal Expansion
CVD Chemical Vapor Deposition
DC Direct Current
DCB Direct Copper-Bonded
DD Dislocation Density
DFIG Double-Fed Induction Generator
DMOS Diffused Metal Oxide Semiconductor
EREV Extended Range Electric Vehicle
EMC ElectroMagnetic Compatibility
EMI ElectroMagnetic Interference
xEV Electric Vehicle/Hybrid Electric Vehicle
FCV Fuel Cell Vehicle
FET Field Effect Transistor
GaN Gallium Nitride
GIT Gate Injection Transistor
GTO Gate Turn-Off
HEMT High Electron Mobility Transistor
HEV Hybrid Electric Vehicle
HVAC Heating, Ventilation and Air Conditioning
HVDC High-Voltage Direct Current
JBS Junction Barrier Schottky
JFET Junction Field Effect Transistor
IEGT Injection-Enhanced Gate Transistor
IC Integrated Circuit
IGBT Isolated Gate Bipolar Transistor
IGCT Integrated Gate-Commutated Thyristor
IPM Intelligent Power Module
IH Induction Heating
LLC
A power converter that is a variant of a
series resonant converter, using two
inductors (Lmagnetizing and Lresonant) and
a capacitor (C).
LV-HV Low Voltage to High Voltage
MESFET Metal-Semiconductor FET
MISFET Metal-Insulator FET
MOSFET Metal-Oxide-Semiconductor FET
MOCVD Metal-Organic Chemical Vapor Deposition
NEV Neighborhood Electric Vehicle
OBC On-Board Charger
OEM Original Equipment Manufacturer
PEPDCPrimary Electrical Power Distribution Center
PCB Printed Circuit Board
PCS Power Conversion System
PCU Power Control Unit
PFC Power Factor Correction
PHEV Plug-in Hybrid Electric Vehicle
POL Point-Of-Load
PSU Power Supply Unit
PV PhotoVoltaic
PWM Pulse Width Modulation
Ron/Rdso
nOn-state Resistance
RF Radio Frequency
SBD Schottky Barrier Diode
S.C. Semi-conducting
SD Surface Defect
Si Silicon
S.I. Semi-insulating
SiC Silicon Carbide
SJMOSFET Super Junction MOSFET
SMD Surface Mount Device
SMPS Switching Mode Power Supply
SSV Start-Stop Vehicle
T° Temperature
TAM Total Available Market
T&DElectricity Transport and
Distribution
UPS Uninterruptible Power Supply
VSC Voltage Source Converter
WBG Wide Band Gap
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REPORT METHODOLOGY
Market
Volume (in Munits)
ASP (in $)
Revenue (in $M)
Yole’s market forecast model is based on the matching of several sources:
Information
Aggregation
Preexisting
information
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ABB, Alstom, Ascatron, Aymont, Bombardier, Basic Semiconductor, BrückwellTechnology, Caly Technology, Clas-SiC wafer fab, Cree/Wolfspeed, CRRC, Danfoss, Delphi, DENSO, Dow Corning, Epiworld, Episil, Fraunhofer IISB, Fuji Electric, GE, GeneSiC, Global Power Device, Global Power Technology, GTAT, Hestia Power,
Hitachi, IBS, II-VI, Infineon, MicroSemi, Mitsubishi Electric, Norstel, Northrop Grumman, NXP, ON Semiconductor, Panasonic, Philips, Powerex, Raytheon, RENESAS, ROHM, SananIC, Sanrex, Schneider Electric, Semikron, SemiQ, Shindengen, SiCrystal, SICC, Siemens, SMA, STMicroelectronics, Tankeblue, Toshiba, Toyota, United Silicon
Carbide, WeEn, X-Fab, Yaskawa, and more.
COMPANIES CITED IN THIS REPORT
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ABOUT THE AUTHORS
Ahmed Ben Slimane, PhD. is a Technology & Market Analyst, specialized in Compound Semiconductors & Emerging Substrates at Yole Développement
(Yole). As part of the Power & Wireless team, Ahmed is contributing to the development of dedicated collection of compound semiconductors market &
technology reports and monitor. Previously, he worked as an epitaxy (MBE/MOCVD) & fabrication process engineer for GaAs-based photovoltaic applications
at TOTAL and IPVF (Paris-Saclay, France). Ahmed also completed his PhD in Material Engineering from KAUST (Saudi Arabia), where his mission was focused
on GaN-based microstructures for flexible solid-state lighting. During his career, Ahmed Ben Slimane proposed lot of presentations towards an international
audience. He authored/co-authored more than 20 publications in the semiconductor field and submitted a patent on the III-V hetero-structure for PV
industry.Ahmed obtained his Master Degree in Electronics Engineering from INPG (Grenoble, FR).
E-mail: [email protected]
Ahmed BEN-SLIMANE
Biographies & Contacts
Ezgi Dogmus, PhD. is Team Lead Analyst in Compound Semiconductor & Emerging Substrates activity within the Power & Wireless Division at YoleDéveloppement (Yole). She is managing the expansion of the technical expertise and the market know-how of the company. In addition, Ezgi actively assistsand supports the development of dedicated collection of market & technology reports, monitor as well as custom consulting projects. Prior to Yole, Ezgiworked as a process development engineer for GaN-based RF and power solutions at IEMN (Lille, France). Ezgi has authored or co-authored more thantwelve papers. After graduating from University of Augsburg (Germany) and Grenoble Institute of Technology (France), Ezgi received her PhD. inMicroelectronics at IEMN (France).
Email: [email protected]
Ezgi DOGMUS
Poshun CHIUPoshun Chiu is a Technology & Market Analyst specializing in Compound Semiconductor & Emerging Substrates at Yole Développement (Yole). As a memberof the Power Electronics & Wireless division at Yole, Poshun focuses on power, RF, and opto-electronics. He is engaged in the development of technology andmarket reports and is also involved in custom projects. Before joining Yole, Poshun had 9 years’ experience in R&D and product management at Epistar (TW& CHN). He is the author or co-author of more than 10 patents in solid-state-lighting. Poshun was also engaged in the development and evaluation of novelapplications of process technology and components based on relevant semiconductor material systems Poshun received an MSc degree in Microelectronicsfrom National Cheng Kung University (TW) and an MBA from IESEG School of Business(FR).
E-mail: [email protected]
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2019-2025 POWER SIC MARKET FORECAST SPLIT BY APPLICATION
$225M
xEV (main inverter+OBC+DC/DC converter)
Photovolatics + energy storage systems
xEV charging infrastructure
PFC/Power supply
Rail
Motor drive
UPS
Others (wind, defense, R&D etc.)
$1553M
CAGR:+38%
$314MCAGR:
+17%
$225MCAGR:
+90%
$154M
CAGR:
+6%
2019
$541M
2025
$2562M
CAGR2019-2025:
+30%
$5M
$125M
$107M$9M
$118M
CAGR:
55%
$14M
$38M
CAGR
18%
$25M
$89M
CAGR
24%
$32M$69M
CAGR
13%
Power SiC: Materials, Devices and Applications 2020 | Sample | www.yole.fr | ©2020
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YOLE’S ANALYSIS OF COVID-19 IMPACT ON SiC ADOPTION IN EV/HEV IN 2020
Power SiC: Materials, Devices and Applications 2020 | Sample | www.yole.fr | ©2020
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STRATEGIES OF LEADING SiC DEVICE PLAYERS IN YOLE'S UNDERSTANDING
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REVENUE ESTIMATIONS OF N-TYPE SiC SUBSTRATE SUPPLIERS
2018 – 2019 and eH1-2020
• N-type only, Semi-Insulating SiC wafer not included.
• Cree-Wolfspeed : includes external power device sales and
internal use.
Power SiC: Materials, Devices and Applications 2020 | Sample | www.yole.fr | ©2020
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SiC N-TYPE WAFER/BOULE CAPACITY ESTIMATION & EXPECTATION
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ROADMAP FOR POWER SiC DEVICES
SiC device*
revenue
Power
supply
High power applications
First
devicePV
EV/HEV
20302010 20202000
$1B
$2B
> $3B
Charging
infrastructure
*SiC device includes discrete diodes, transistors and modules.
2018 2020
Who is
next ?
SiC in EV/HEV main inverter
target
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POWER SIC BUSINESS: FROM SUBSTRATE TO MODULE
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Contact our
Sales Team
for more
information
YOLE GROUP OF COMPANIES RELATED REPORTS
Yole Développement
Power SiC: Materials, Devices and Applications 2020 | Sample | www.yole.fr | ©2020
Status of the Power Electronics Industry 2020
Power Electronics for Electric & Hybrid Electric Vehicles 2020
Discrete Power Device Packaging: Materials Market and Technology
Trends 2019
Status of the Power Module Packaging Industry 2019
15
Contact our
Sales Team
for more
information
YOLE GROUP OF COMPANIES RELATED MONITOR
Yole Développement – Compound Semiconductor Monitor Service
Yole Development tracks the GaN, SiC, GaAs, InP semiconductors on a quarterly basis through “The Compound Semiconductor Monitor Service” launched in Q4-2019. Our service includes:
What is the difference between Power SiC Report and the Compound Semiconductor (CS) Monitor ?
While our Power SiC 2020 includes an annual update on the Power SiC device, epiwafer and wafer markets as well as the ecosystem
and technology aspects, the CS Monitor Service includes:
8 SiC COMPANIES to start with:
Module 1: Power SiC and GaN, available since Q4-2019
Module II: RF GaAs and GaN, available since Q3-2020
Module III: GaAs and InP Optoelectronics, available in Q3-2021
1.Quarterly update of market data in terms of volume (Munits), ASP ($), Value
($) in following deliverables1.PDF slide deck with graphs and comments/analysis covering expected
evolutions
2.Excel database with all historical and forecast data
2.Analysis of: 1.Market’s variations
2.Main players’ manufacturing and technology evolution/ranking
3.Changes in the supply chain
4.Players’ strategies
3.Direct access to the analysts during the subscription period providing an
opportunity for on-demand Q&A and discussions regarding trends, analyses,
forecasts, and breaking newsPower SiC: Materials, Devices and Applications 2020 | Sample | www.yole.fr | ©2020
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Contact our
Sales Team
for more
information
YOLE GROUP OF COMPANIES RELATED REPORTS
System Plus Consulting
SiC Diode Comparison 2020 Wolfspeed All-SiC Module CAB450M12XM3
SiC MOSFET Comparison 2019
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