Overview & Discussion

DISCLAIMER: All company names, product names, and service names mentioned are used for identification purposes only and may be registered trademarks, trademarks, or service marks of their respective owners. All analyses are done without participation, authorization, or endorsement of the manufacturer. Any cost analyses presented in this material are estimates prepared by TechInsights from generally available data. While TechInsights believes that these estimates reflect the probable costs, the actual producer did not supply the data, and therefore the actual costs may be different from these estimates. Furthermore, TechInsights extends no warranties with respect to any information in this document, and shall bear no liability whatsoever for the use of the information.

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Survey PlusTeardown

Report Publish Date 4/1/2015SI Number 38873Analyst Name R. Rychlicki

Product Type PhabletBrand HuaweiDevice Name AscendDevice Model # GX1 SC-CL00Official Release Date 1/1/2015Target Market ChinaRetail Price $410.00Weight (grams) 180.5 (Measured)

Device Dimensions (mm)

161.28 x 84.75 x 10.05 (Measured at Longest/Widest/Thickest Points)

Operating System Android 4.4.2 "KitKat" (Chinese) + Emotion UI

Processor Spec 1.2 GHz Quad-Core Qualcomm Snapdragon 410 (ARM Cortex-A53)

RAM Support 1 GB Mobile LPDDR3 SDRAM

Communications

SIM1: Quad-Band GSM/EDGE; CDMA (800 MHz), W-CDMA (1900/2100 MHz); LTE (1800 MHz); TD-LTE (2500 MHz) SIM2: Quad-Band GSM/EDGE

Connectivity WiFi 802.11b/g/n, Bluetooth 4.0, microUSB 2.0, NFC, FM Radio, GPS w/ A-GPS Support

User Interface Multitouch Capacitive TouchscreenInternal: 8 GBmicroSD Card (max. 32 GB)

Sensors 3-Axis MEMS Accelerometer, Ambient Light/Proximity

Battery Type 3.8 V, 3500 mAh (min) / 3600 mAh (typ), Li-Polymer

Battery Life (Hrs) Use Time: Unknown ; Standby Time: Unknown

Display 6" IPS TFT-LCD, 1280 x 720 Pixels, 16,777,216 Colors

Front Camera 2 MP CMOS

Rear Camera 8 MP BSI CMOS, Autofocus, LED Flash, 1080p HD Video

Product Features

Product Description

Report Information

Storage

Device Observations

The Huawei GX1 SC-CL00 is the first device we’ve analyzed to use the Qualcomm Snapdragon 410 processor.

Also noted during the analysis, there are components to support W-CMDA/LTE Band 1 and W-CDMA Band 2 even though the device specification does not list support for either of these bands.

The RF design only used 1 main antenna and a second Rx diversity (only) antenna. We have seen multiple multi-mode, multi-band devices use 2 antennas for Tx and Rx while designing either a separate Rx diversity antenna or using the 2 main antennas for Tx, Rx, and Rx Diversity.

NFC Controller Broadcom BCM20795

WiFi / Bluetooth Qualcomm Atheros WCN3620Touchscreen Controller Goodix GT915L

Audio Amplifier AWINIC AW8145Accelerometer Bosch Sensortec BMA255

Power Management Qualcomm PM8916RF Transceiver Qualcomm WTR1605L

RAM / ROM SK Hynix H9TQ65A8GTMCUR-KTM

Design WinsFunction Manufacturer Part NumberApplication / Baseband Processor Qualcomm MSM8916

Survey Plus TeardownHuawei Ascend GX1 SC-CL00 Sample Report

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Device AnalysisDesign Wins

http://www.teardown.com

Analysis SummaryWe’ve noted Huawei has used HiSilicon, Marvell, MediaTek, and Qualcomm for its applications / baseband designs in the Ascend product family. The MSM8916 used in the GX1 is more similar in size and pin count to that of the HiSilicon processors we have seen in other Huawei devices.

Component Function:

$14.66

$3.34

$3.27

$10.10

$9.63

$0.40$1.86

$7.18

$0.84

$0.00

$10.00

$20.00

$30.00

$40.00

$50.00

$60.00

SensorSensor

RF ComponentRF Component

Power Management / AudioPower Management / Audio

OtherOther

Memory: MixedMemory: Mixed

Display / TouchscreenDisplay / Touchscreen

ConnectivityConnectivity

Camera / ImageCamera / Image

Applications/BasebandProcessorApplications/BasebandProcessorHuawei Ascend GX1


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Device AnalysisAnalysis Summary


Pkg. Brand CostQualcomm $19.55SK Hynix $9.63Unknown $3.34Qorvo $1.65Himax $1.53Qualcomm Atheros $1.42

Other $3.24Broadcom $0.92Bosch Sensortec $0.58Goodix $0.57AMS $0.26Skyworks $0.24Orient-Chip Semiconductor $0.21Texas Instruments $0.19AWINIC $0.13Murata $0.10Airoha Technology $0.04

OtherOther

Qualcomm AtherosQualcomm AtherosHimaxHimax

QorvoQorvoUnknownUnknownSK HynixSK Hynix

48.44%

23.86%

8.28%

4.08%3.80%3.51%

8.02%

0.00%

10.00%

20.00%

30.00%

40.00%

50.00%

60.00%

70.00%

80.00%

90.00%

100.00%

Vendor Share %

48.44%

23.86%

8.28%

4.08%3.80%3.51%

8.02%

0.00%

10.00%

20.00%

30.00%

40.00%

50.00%

60.00%

70.00%

80.00%

90.00%

100.00%

Vendor Share %

QualcommQualcomm


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Device AnalysisMajor IC Manufacturer Distribution



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Product Label


WiFi/BT/GPSWiFi/BT/GPSWiFi/BT/GPS

Estimated block diagram based on observation of this specific product implementation, manufacturer’s data sheets where available, and best engineering judgment. Certain details of the interface circuitry are not reflected in this block diagram. Partitioning and connectivity are speculative.

4 - Qualcomm#WTR1605L

GSM / CDMA / W-CDMA / LTE / TD-LTE RxD Transceiver + GPS

5 - Qorvo#RF7459A

Multimode, Multiband 3G/4G Power Amplifier

6 - Qorvo#RF7941

TD-LTE Band 41 Power Amplifier

7 - Qorvo#RF1494A

SP10T Antenna Switch

8 - Skyworks#SKY13373-460LF

SP3T RF Switch

DUPL

W-C

DM

A B

1 Tx

LTE

B3 T

x

W-C

DM

A B

2 Tx

CD

MA 8

00Tx

Coupler

11 - Airoha Technology#AR8159 ?GPS LNA

RF

Hig

h/Lo

w B

ands

GSM

Hig

h Ban

d Tx

GSM

900

MH

z Rx

Main AntennaMain AntennaMain Antenna

Rx Diversity AntennaRx Diversity AntennaRx Diversity Antenna

DIPLEXER

13 - Broadcom#BCM20795

NFC Controller

NFCNFCNFC

DUPL DUPL

DUPL

Manufacturer:

QualcommQualcomm

UnknownUnknown

MurataMurataBroadcomBroadcom

WisolWisol

Airoha TechnologyAiroha Technology

To Qualcomm MSM8916

TD-L

TE B

41 T

x

SkyworksSkyworksQorvoQorvo

TD-L

TE B

41 R

xD

TD-L

TE B

41 R

x

W-C

DM

A B

1 RxD

LTE

B3 R

xD

GSM

Low

Ban

d Tx

12 – Qualcomm Atheros#WCN3620

WiFi 802.11b/g/n / Bluetooth 4.0 / FM Radio

9 - Murata#XMSS003Dual SPDT

(DP4T) Antenna Switch

TDK-EpcosTDK-Epcos

? = Unconfirmed

WiF

i/ B

luet

ooth

GPS

W-C

DM

A B

1 Rx

LTE

B3 R

x


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Block DiagramRadio Block


The Huawei GX1 SC-CL00 has similar dimensions and the same display size as the Huawei Ascend Mate 7 MT-TL00.


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FeaturesExterior Features View 1



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FeaturesExterior Features View 2



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ComponentsMajor Components Side 1



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ComponentsMajor Components Side 2


The main enclosure for the Huawei GX1 SC-CL00 is a co-molded piece of Magnesium and PC + GF9% with 5 metal inserts.

Unit Part ID No. Qty Description Material Dimensions (mm) Weight

(grams)Enclosure 1 1 Back Enclosure PC 157.81 x 81.59 x 2.26 12.40Enclosure 2 1 Internal Enclosure PC + GF10% 161.04 x 84.46 20.80Enclosure 3 1 Main Enclosure Magnesium + PC + GF9% 160.35 x 83.71 19.30

3Total


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ComponentsMain Enclosures


NE Part ID #2Internal Enclosure PC+GF10%

Includes all antennas

NE Part ID #3Main Enclosures

Co-molded magnesium and PC+GF9% with 5 inserts

NE Part ID #1Back Enclosure PC


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ComponentsMain Enclosures Side 1


NE Part ID #2Internal Enclosure PC+GF10%

Includes all the antennas

NE Part ID #3Main Enclosures

Co-molded magnesium and PC+GF9% with 5 inserts

NE Part ID #1Back Enclosure PC


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ComponentsMain Enclosures Side 2


42.7 mm 12.3 mm 0.1 mm

MainAntenna Element

Length Width Height


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AntennasMain Antenna


33.7 mm 17.3 mm 0.1 mm

Rx DiversityAntenna Element

Length Width Height


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AntennasRx Diversity


23.0 mm 15.6 mm 0.1 mmLength Width Height

WiFi/Bluetooth/GPSAntenna Element


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AntennasWiFi / Bluetooth / GPS


49.1 mm 34.9 mm 0.1 mm

NFCAntenna Element

Length Width Height


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AntennasNFC


In both the 2015 Deep Dive and Survey Plus reports, ICs and modules will be categorized by their function within the system.

These categories are in alignment with the high-level IC function categories currently found in IRIS 2.0. The categories will also be found in the updated excel BoM workbooks which are included with each report.

RAM, SDRAM, etc.Memory: Volatile

NAND, NOR, EEPROMs, etc.Memory: Non-Volatile

DSPs, MCUs, Mixed-Signal Arrays, (non-audio, non-apps, non-baseband) Processors

Mixed Signal

Accelerometer, Barometer, Heart, MEMS Microphones, Pressure, Temperature

Sensor

Diplexers, RF Antenna, RF antenna switches, RF Filters, RF Power Amplifiers, RF Receivers, RF Transceivers, etc.

RF Component

Audio CODECs, Envelope Tracking, Power ManagementPower Management / Audio

Small logic AND, OR gates, LDOs, Transistors, RegulatorsOther

Components with both non-volatile and volatile memoryMemory: Mixed

Display driver, Touchscreen controller, etc.Display / Touchscreen

Antennas, Bluetooth, GPS, USB, WiFi, ZigBee componentsConnectivity

Image Sensors, Video processors, Image co-processors , VGA Camera

Camera / Image

Cellular Modem ProcessorBaseband Processor

Main Processor without cellular modemApplication Processor

Processors which are both Apps/BB ProcessorsApplications/Baseband Processor

Component Function

RAM, SDRAM, etc.Memory: Volatile

NAND, NOR, EEPROMs, etc.Memory: Non-Volatile

DSPs, MCUs, Mixed-Signal Arrays, (non-audio, non-apps, non-baseband) Processors

Mixed Signal

Accelerometer, Barometer, Heart, MEMS Microphones, Pressure, Temperature

Sensor

Diplexers, RF Antenna, RF antenna switches, RF Filters, RF Power Amplifiers, RF Receivers, RF Transceivers, etc.

RF Component

Audio CODECs, Envelope Tracking, Power ManagementPower Management / Audio

Small logic AND, OR gates, LDOs, Transistors, RegulatorsOther

Components with both non-volatile and volatile memoryMemory: Mixed

Display driver, Touchscreen controller, etc.Display / Touchscreen

Antennas, Bluetooth, GPS, USB, WiFi, ZigBee componentsConnectivity

Image Sensors, Video processors, Image co-processors , VGA Camera

Camera / Image

Cellular Modem ProcessorBaseband Processor

Main Processor without cellular modemApplication Processor

Processors which are both Apps/BB ProcessorsApplications/Baseband Processor

Component Function


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Component Function


This battery was similar to the one found in the Deep Dive report for the Huawei Ascend P7 P7-L05, but the battery of the GX1 has a greater capacity than that of the Ascend P7.

HuaweiHB4547B6EBC

3.8Lithium Polymer

3500112.05 x 45.6 x 4.1

634.953.1

250.5Unknown

Pack Rating (mAHrs)Pack Size (mm)

Pack Weight (grams)

Cell Brand

Vol. Energy Density (mWHrs/cc)

Battery PackPack Brand

Cell Type

Pack Part NumberPack Voltage

Wt. Energy Density (mWHrs/g)


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SubsystemsBattery Summary


Camera / Image

Component Function :

23 - Unknown#Unknown2 MP CMOS Image Sensor

UnknownUnknown

5.9 x 5.9 x 4.155.9 x 5.9 x 4.2

0.20.2

CMOS2 MP1/541

Camera Weight (grams)

Optical Zoom

Resolution

Lens ElementsOptical Size

Part Number

2MP Camera Subsystem

Type

Camera Size (mm)

Brand

Subsystem Size (mm)

Subsystem Weight (grams)


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Subsystems2MP Camera Summary



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Subsystems2MP Camera Disassembly


Camera / Image


22 - Unknown#Unknown8 MP BSI CMOS Image Sensor

UnknownHK0GW4A

8.5 x 8.5 x 5.248.5 x 8.5 x 5.2

0.70.7

CMOS BSI8 MP1/2.7

51

Camera Weight (grams)

Camera Size (mm)Subsystem Weight (grams)

Optical Zoom

Subsystem Size (mm)

Type

8MP Camera Subsystem

Part Number

ResolutionOptical SizeLens Elements

Brand


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Subsystems8 MP Camera Summary



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Subsystems8 MP Camera Disassembly


The Huawei GX1 SC-CL00 includes a 6-in.TFT-LCD w/ Chip-in-Glass display similar to that of the Huawei Ascend Mate 7 MT7-TL00.

However, the GX1 uses Goodix for the touchscreen design win versus Synaptics in the Huawei Mate 7.

20 - Himax#PA543C2TFT-LCD Display Driver

21 - Goodix#GT915LCapacitive Touchscreen Controller w/ Memory (2-Die Pkg.)

Display / Touchscreen


DJN Optronics13-360D3-40032158 x 81.6 x 2.7

49.40View Size (mm) 6.00Type TFT w/Chip-in-GlassColors 16777216Rows / Columns 1280 / 720Backlighting Scheme 14 white LEDs

Brand

Weight (grams)Module Dimensions

Panel Metrics

Part Number

Display / Touchscreen


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SubsystemsDisplay / Touchscreen Summary



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SubsystemsDisplay / Touchscreen Disassembly


Secondary Camera

157.20 mm

Vibrator

66

.45

mm

Home/Volume Button Flex

3.5 mm Jack

microUSB 2.0

Microphone


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Main BoardSide 1


Power Management / Audio

Memory: MixedApplications & Baseband Processor

Component Function:

Other

1 - Qualcomm#MSM8916Snapdragon 410 Baseband / Applications Processor

2 - SK Hynix#H9TQ65A8GTMCUR-KTMMultichip Memory - 1 GB Mobile DDR2-S4 SDRAM, 8 GB MLC NAND Flash, Memory Controller (eMMC)

3 - Qualcomm#PM8916Power Management

10 - Texas Instruments#TPS65132ADual Output Power Supply


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Main Board Side 1 IC Identification


RF ComponentConnectivity

Component Function:

4 - Qualcomm#WTR1605LGSM / CDMA / W-CDMA / LTE / TD-LTE RxD Transceiver + GPS

5 - Qorvo#RF7459AMultimode, Multiband 3G/4G Power Amplifier (4-Die Pkg.)

9 - Murata#XMSS003Dual SPDT (DP4T) Antenna Switch

8 - Skyworks#SKY13373-460LFSP3T RF Switch

7 - Qorvo#RF1494ASP10T Antenna Switch

11 - Airoha Technology#AR8159 ?GPS LNA

6 - Qorvo#RF7941TD-LTE Band 41 Power Amplifier (2-Die Pkg.)

AR8190

? = Unconfirmed


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Main Board Side 1 ICs - Radio


1 - Qualcomm#MSM8916Snapdragon 410 Baseband / Applications ProcessorPkg Size: 14 x 12 mm

Applications/Baseband Processor

Component Function:


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Main BoardSide 1 X-Rays & Die Photos


2 - SK Hynix#H9TQ65A8GTMCUR-KTMMultichip Memory - 1 GB Mobile DDR2-S4 SDRAM, 8 GB MLC NAND Flash, Memory Controller (eMMC)Pkg Size: 13 x 11.45 mm

2.1 – SK Hynix#H53R8D23MMobile LPDDR3 SDRAM Memory - 1 GBDie Size: 9.62 x 8.04 mm

2.2 – SK Hynix#H27UBG8T2CMLC NAND Flash Memory - 4 GBDie Size: 9.46 x 8.61 mm

Memory: Non-VolatileMemory: Volatile

Memory: MixedComponent Function:

Other

2.3 - SK Hynix#SM2714AMemory ControllerDie Size: 3.23 x 1 mm


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3 - Qualcomm#PM8916Power ManagementPkg Size: 6.15 x 6.15 mm


Component Function:


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4 - Qualcomm#WTR1605LGSM / CDMA / W-CDMA / LTE / TD-LTE RxD Transceiver + GPSPkg Size: 5.45 x 4.88 mm

RF Components

Component Function:


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5 - Qorvo#RF7459AMultimode, Multiband 3G/4G Power Amplifier (4-Die Pkg.)Pkg Size: 6.95 x 4.96 mm

5.1 - Qorvo#M3D738901Antenna SwitchDie Size: 1.72 x 0.97 mm

5.4 - Qorvo#M4D745923RF Power AmplifierDie Size: 1.58 x 0.81 mm



RF Components

Component Function:


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5.1 - Qorvo#M3D738901Antenna SwitchDie Size: 1.72 x 0.97 mm




5 - Qorvo#RF7459AMultimode, Multiband 3G/4G Power Amplifier (4-Die Pkg.)Pkg Size: 6.95 x 4.96 mm

RF ComponentsComponent Function:


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6.2 - Qorvo#M2D794104Bias ControlDie Size: 0.48 x 0.44 mm

RF ComponentsComponent Function:6 - Qorvo

#RF7941TD-LTE Band 41 Power Amplifier (2-Die Pkg.)Pkg size: 2.5 x 2 mm


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6.2 - Qorvo#M2D794104Bias ControlDie Size: 0.48 x 0.44 mm

RF ComponentsComponent Function:6 – Qorvo

#RF7941TD-LTE Band 41 Power Amplifier (2-Die Pkg.)Pkg size: 2.5 x 2 mm


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Grid = 1 cmRF ComponentConnectivity

Function :

1 - Murata#SAFFB1G84FL0F0AFilter: SAW - LTE Band 3 Rx

2 - Murata#SAFFB2G14FA0F0AFilter: SAW – W-CDMA Band 1 Rx

7 - Murata#SAFEA2G60MA0F0AFilter: SAW - TD-LTE Band 41 Tx

14 - Unknown#UnknownFilter: Balun

10 - Murata#SAFFB1G56KB0F0AFilter: SAW - GPS

3 - Murata#SAFFB1G56FA0F0AFilter: SAW - GPS

11 – TDK-Epcos#B9604Filter: BAW - WiFi / BT

13 - Unknown#UnknownFilter: Diplexer

14 - Unknown#UnknownFilter: Balun

4 - Murata#SAFEL942MFL0F00Filter: SAW - GSM 900 Rx

7 - Murata#SAFEA2G60MA0F0AFilter: SAW - TD-LTE Band 41 Tx

12 - Unknown#UnknownRF Coupler

6 - Murata#SAYRF1G88CA0B0AFilter: SAW - Duplexer - CDMA Band 2

8 - Wisol#SFXG50UZ502Filter: SAW - Duplexer - CDMA Band 1

9 - Wisol#UnknownFilter: SAW - Duplexer - CDMA 800

5 - Murata#SAYFH1G74CA0B0AFilter: SAW - Duplexer - LTE Band 3


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Main BoardSide 1 Modules - Radio


157.20 mm6

6.4

5m

m

microSD

Primary Camera NFC Antenna

Main Antenna

Battery

Rx Diversity Antenna

Touchscreen

Display

Sensor Flex

WiFi/Bluetooth/GPS Antenna

SIM 1

SIM 2 (only GSM)

Microphone


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Main BoardSide 2



Component Function:Other

15 - AWINIC#AW8145Audio Amplifier

16 - Orient-Chip Semiconductor#OCP81311.5 A White LEDs Flash Driver

? = Unconfirmed


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Main BoardSide 2 IC Identification


ConnectivityComponent Function: 12 - Qualcomm Atheros

#WCN3620WiFi 802.11b/g/n / Bluetooth 4.0 / FM Radio

13 - Broadcom#BCM20795NFC Controller w/ EEPROM Memory (2-Die Pkg.)


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Main BoardSide 2 ICs - Radio


Sensor

Component Function:

14 - Bosch Sensortec#BMA250E3-Axis MEMS Accelerometer (2-Die Pkg.)


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Main BoardSide 2 ICs - Sensors


12 - Qualcomm Atheros#WCN3620WiFi 802.11b/g/n / Bluetooth 4.0 / FM RadioPkg size: 3.54 x 3.3 mm

ConnectivityComponent Function:


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SensorComponent Function :

19 - AMS#TMD2771xAmbient Light / Proximity Sensor, IR Emitter LED

EarpieceEarpiece

Speaker

Main Board

Speaker

Main Board


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Other SubstratesSensor Flex


COST ESTIMATION PROCESSOverview and Discussion

Cost modeling is tricky business. Multiple variables affect the actual production costs a manufacturer will experience, including development expenses, unit volumes, supply-and-demand in component markets, die yield-curve maturity, OEM purchasing power, and even variations in accounting practices. Different cost modeling methods employ different assumptions about how to handle these and other variables, but we can identify two basic approaches: that which seeks to track short-term variations in the inputs to the production process, and that which strives to maintain comparability of the output of the model across product families and over time. TechInsights’ philosophy in cost modeling is to emphasize consistency across products and comparability over time, rather than to track short-term fluctuations. During the past eight years, we have developed an estimation process that, while necessarily lacking an insider’s knowledge of the cost factors that impact any one manufacturer, is reasonably accurate in its prediction of unit costs in high-volume production environments. We do not claim that the model will produce the “right” answer for your firm’s environment. However, TechInsights does give customers a key analytical tool with a complete set of data in our Bill of Materials (BOM). The BOM allows readers to 1) scrutinize the assumptions behind our cost model and 2) modify the results based on substitution of their own component cost estimates where they have better information based on inside knowledge.

Our estimation process decomposes overall system cost into three major categories: Electronics, Mechanical, and Final Assembly. We begin by creating a complete electronics bill-of-materials (BOM). Each component from the largest ASIC to the smallest discrete resistor is entered into a BOM table with identifying attributes such as size, pitch, I/O count, package type, manufacturer, part number, estimated placement cost, and die size (if the component is an IC). Integrated circuit costs are calculated from measured die area. Using assumptions for wafer size, process type, number of die per wafer, defect density, and profit margin in combination with die area, an estimate of semiconductor cost is derived. Costs for discrete components and interconnect are derived from assumption tables which relate BOM line items to specific cost estimates by component type and estimates for part placement costs are included. For LCD display costs, we employ a model which tabulates expected cost from measurements of glass area, LCD type, and total pixel resolution. When market costs are available from alternative sources, LCD panel costs are taken from and referenced to these sources.

Costs of non-electronic components such as molded plastic enclosures and metallic components are measured in terms of weight, size, thickness, type of material, and complexity to arrive at their estimated cost. Other system items such as optics, antennas, batteries and displays are costed from a set of assumption tables derived from a combination of industry data, average high volume costs, and external sources. For final assembly, we re-build the torn-down product, tabulating stepwise assembly times as the reconstruction proceeds, to reach a total assembly time. Using a labor rate assumption for the country of origin, we then calculate final assembly cost.

The three major categories for system cost contributors can be broken down into the subcategories of ICs, other electronics parts, displays, batteries (as appropriate), camera modules, electronics assembly, non-electronic elements, and final assembly. By adding the cost estimates for each of these subcategories, an overall estimated cost is derived for the system under evaluation. Product packaging and accessories (CDs, cables, etc.) are also documented and estimated for their contribution to total cost as appropriate.

We believe our cost estimates generally fall within 15 percent of the “right answer,” which itself can vary depending on the market and OEM-specific factors mentioned earlier. While the TechInsights cost model is imperfect, it yields important insights into technology and business dynamics along with good first-order contributions to system cost by component type. Additionally, the consistency of approach and gradual modification to assumptions (smoothing out frequently-shifting pricing factors) hopefully yields a credible, but user-modifiable, view of OEM high volume cost-to-produce.

Please feel free to contact us at [email protected] with any comments, questions, or proposed corrections with respect to our cost estimates. We welcome your input.


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Overview & Discussion


MetricsOverview and Discussion

In our product teardowns, we gather a series of metrics for product profiling and comparison. Some metrics focus on system characteristics such as total silicon area, total system semiconductor storage capacity, and total connection count. Other metrics reflect more subtle aspects of electronics assembly such as connection density, average component I/O count, and silicon tiling density. Taken as a whole, the metrics allow deeper comparison and benchmarking across multiple disciplines and multiple products. Key metrics we gather on products are described below along with their definitions and what they tend to say about the system under study. Most metrics can be used both in comparing similar products for benchmarking purposes or for quantifying differences in levels of complexity between dissimilar product types. Data fall into two categories; either “raw” measured data or ratios of these measured data sets.

Total Silicon Area : This metric describes the total area of silicon as measured from X-ray or direct measurement of ICs. The area is an expression of the enclosed bare die area and excludes packaging area. The aggregate silicon area is a good benchmark to show how integrated a design might be when making comparisons to similar systems. Total silicon area also reflects the major cost driver for most systems we examine. Silicon Tiling Density : Ratio of Total Silicon Area to total printed circuit board “projected” area (i.e. the simple board area and not the cumulative surface area of both sides of the board). This metric directly reflects the level of efficiency and aggressiveness in integrated circuit packing and placement. Single digit Silicon Tiling Density is typical but silicon coverage of 10% - 20% has been seen in some of the most advanced products we have examined. Higher Tiling Densities often correspond with the use of chip scale packaging (CSPs) or other small form-factor IC packaging technologies. High density circuit boards are also often a supporting technology.Number of Parts : Total component count including ICs, passives, modules, connectors, etc., each separated out in our reporting.Number of Connections : The total number of connections corresponds to the total number of interconnects introduced by the aggregate component set and reflects any electrical connection observed (solder joints, adhesive interconnect, or connector terminal interfaces).Opportunity Count : Opportunity Count is the total number of parts plus the total number of connections; the name reflects that each of these constituent elements represents an opportunity for failure. A high opportunity count means more complex and riskier electronics assembly. Average Pin Count (APC) : Ratio of total number of component terminals to total number of parts, at the system level. This metric reflects the ‘average’ terminal complexity of the components and often provide a signature of integration level and/or “digital-ness” of the overall product. Low APCs reflect a high number of discretes or other low-pincount devices often characteristic of analog circuitry. Conversely, high APCs are characteristic of highly integrated, high-pincount assemblies, often those composed largely of digital integrated circuits.Connection Density : This metric is a ratio of the total Number of Connections to total printed circuit board assembly area, in units of connections per sq. inch. The metric provides data related to the Silicon Tiling Density above, but with an emphasis on complexity of I/O interconnect. For example, with a fixed Connection Density, high tiling density of low-pincount memory chips is more readily achieved than comparable silicon tiling of high pincount logic.Part Density : This metric is a ratio of the total Number of Parts to total printed circuit board assembly area, in units of components per sq. inch. The metric provides data related to the Silicon Tiling Density and Connection Density as described above, but with an emphasis on density and complexity of component packing efficiency. For example, low Part Density of high-pincount devices can pose an equal challenge in Connection Density to high Part Density of low-pincount devices. High Part Density does reflect challenges in surface mount assembly in terms of (typically) precision of placement, number of placements, and engineering of part clearances.Routing Density (heuristic estimate) = 3*(Average Pin Count)*√Part Density. The Routing Density metric is an empirically derived relationship that characterizes the wiring density of the interconnect used to support the interconnection of components in a planar electronic assembly (i.e. the circuit board). Architectural issues such as bussing or other factors affecting the regularity of wiring impact the actual Routing Density needed to support a given application, but the metric provides a ready measure of wiring complexity.


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RevisionsOverview and Discussion

Periodically we will make revisions to these reports. In the event a revision is made, the information below may be referenced as a summary of the changes which were made.


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Overview & Discussion

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