Page 1 of 9

OX-228Oven Controlled Crystal Oscillator

• Surface Mount package• SC_CUT Crystal• Low Profile Compact Package• standard frequency: 5,10, 20 MHz (CMOS) 10 MHz (Sinewave)• ultra low aging rate

• Base stations• Test equipment• Synthesizers• Military communication equipment• Digital Switching

Features Applications

OX-228

Frequency Stabilities1 ( 5,10 & 20 MHz)

Parameter Min Typical Max Units Conditionvs. operating temperature range (referenced to +25°C)

1 ppb [pk-pk] --40 to +85°C

Initial tolerancevs. supply voltage changevs. load changvs. aging / dayvs. aging / year

-0.2-2-2

-0.15-30

+0.2+2+2

+0.15+30

ppmppbppb ppbppb

at time of shipment, nominal EFCVS ±5% static

Load ±5% static after 7 days of operation (CMOS) after 7days of operation (CMOS)

Holdover/Drift -1,5 +1,5 µsec over 4 hours, temp change during the holdover time: 2.8°C; after 7 days constant

operation

start up time 0.25 2 sec

Warm-up time 5 minutes to ±5ppb of final frequency (1 hour reading) @ +25°C

Performance Specifications

Supply Voltage (Vs)

Parameter Min Typical Max Units ConditionSupply voltage (standard) 3.135 3.3 3.465 VDC

Power consumption4.0 Watts during warm-up

1.35 Watts steady state @ +25°C

CMOS Version

Page 2 of 9

Performance SpecificationsRF OutputSignal [standard] LVHCMOS

Load 15 pF

Signal Level (Vol) 0.4 VDC with Vs=3.3V and 15pF Load

Signal Level (Voh) 2.4 VDC with Vs=3.3V and 15pF Load

rise time 5 ns

fall time 5 ns

Duty Cycle 45 55 % @ (Voh-Vol)/2

Sub Harmonics -40 dBc frequencies >= 10 MHz

Spurious -90 dBc

Frequency Tuning (EFC)Tuning Range Fixed OCXO; No adjust

Additional Parameters

Phase Noise3

-131-140-143-151-152

-125-135-140-150-150

dBc/HzdBc/HzdBc/HzdBc/Hz dBc/Hz

10 Hz100 Hz1 kHz

10 kHz100khz

@ 10MHz

ADEV 55

E-11E-11

10 s tau1000 s tau @ 10MHz

Weight 12 g

Processing & Packing Handling & Processing Note

Absolute Maximum Ratingssupply voltage (Vs) 5.5 V with Vs=3.3 & 5.0 VDC

Output Load 50 pF

Operable Temperature Range -40 +85 °C

Storage Temperature Range -40 +125 °C

Page 3 of 9

Supply Voltage (Vs)

Parameter Min Typical Max Units ConditionSupply voltage (standard) 3.135 3.3 3.465 VDC

Power consumption4.0 Watts during warm-up

1.35 Watts steady state @ +25°C

RF OutputSignal Sinewave

Load 45 50 55 Ohm

Output Power 0 3 6 dBm with Vs=3.3V

Harmonics -30 dBc

Spurious -90 dBc

Frequency Tuning (EFC)Tuning Range Fixed OCXO; No adjust

Additional Parameters

Phase Noise3 (

-100-130-145-152-155-155 -160

-90-125-140-147-150-150-155

dBc/HzdBc/HzdBc/HzdBc/HzdBc/Hz dBc/HzdBc/Hz

1Hz10 Hz

100 Hz1 kHz

10 kHz 100khz1 MHz

@ 10MHz

ADEV 55

E-11E-11

10 s tau1000 s tau @ 10MHz

Weight 12 g

Processing & Packing Handling & Processing Note

Absolute Maximum Ratingssupply voltage (Vs) 5.5 V with Vs=3.3 & 5.0 VDC

Output Load 50 pF

Operable Temperature Range -40 +85 °C

Storage Temperature Range -40 +125 °C

Frequency Stabilities1 ( 10 MHz)

Parameter Min Typical Max Units Conditionvs. operating temperature range (referenced to +25°C)

1 ppb [pk-pk] --40 to +85°C

Initial tolerancevs. supply voltage changevs. load change vs. aging / dayvs. aging / year

-0.2-2-2

-0.2-30

+0.2+2+2

+0.2+30

ppmppbppb ppbppb

at time of shipment, nominal EFCVS ±5% static

Load ±5% static after 7 days of operation (Sinewave) after 7days of operation (Sinewave)

Holdover/Drift -1,5 +1,5 µsec over 4 hours, temp change during the holdover time: 2.8°C; after 7 days constant

operation

start up time 0.25 2 sec

Warm-up time 5 minutes to ±5ppb of final frequency (1 hour reading) @ +25°C

Sinewave Version

Page 4 of 9

4 5 6 7

3 2 1

TopView

H±0,3

7,620,1

17,80,1

220,2

25,4

0,2

23,4

0,1

7,620,1

17,80,1

Padvorschlagland patternrecommendation

G3432,5

2,5

0,1

Dimensions in mm

Outline Drawing / Enclosure

Pin Connections1 I.C (Do not connect)

2 N.C

3 Supply Voltage Input (Vs)

4 RF Output

5 I.C (must remain un connected)

6 I.C (must remain un connected)

7 Ground (Case)

OX-228Height “H” cover material

12.1 metal

Page 5 of 9

Standard Shipping Method (OX-228)

Recommended Reflow Profile

Additional Environmental Conditions

Enclosure Type Tape Width W (mm) Quantity per meter Quantity per reel Dimension P

OX-228 (12.1mm) 44 37.5 100 28

Dimension in mm:

A, B and K are dependent uppon component dimensions

production tolerance complying DIN IEC 286-3

P

W

1.75±0.1

R 0.75

4.0

Position in tapePin1

A

B B

Unwinding direction

0.2

0 ±0.0

5

A

All dimensions in millimeters unless otherwise stated

XXXXX

XXXXX

if W < 32mm only upper hole line existent

A

cross-section B - B

B

K

cross-sectionA - A

Note: All temperatures refer to topside of the package, measured on the package body surface.

Parameter Description

Rapid temperature changes

MIL-883-1010 Cond B 1000 cycles -55/125C

Vibration MIL-STD-883 Meth 2007 Cond A 20G 20-2000Hz 4x in each 3axis 4 min

Shock Mech.Shock MIL-STD-202 Meth 213 Cond.C 100G 6ms 6 shocks in each direction

Solderability J_STD_002C Cond A, Through hole device/ Cond. B, SMD 255C (diving time50,5sec.) Dip+Look with 8h damp pre-treatment: solder wetting >95%

Solvent resistance MIL-STD-883 Meth 2015 Solv. 1,3,4

ESD HBM JESD22-A114-F Class 1C 10* 1000V

Moisture Sensit. Level 1 JESD22-A113-B

RoHS compliance 100% RoHS 6 compliant

Washable washable device

TP: max 260°C (@ solder joint, customer board level) Tp: max: 10…30 sec Additional Information: This SMD oscillator has been designed for pick and place reflow soldering SMD oscillators must be on the top side of the PCB during the reflow process.

Page 6 of 9Rev. 20 May 2020

For Additional Information, Please Contact

Contact Information

USA: 100 Watts Street

Mt Holly Springs, PA 17065Tel: 1.717.486.3411Fax: 1.717.486.5920

Europe:Landstrasse

74924 Neckarbischofsheim Germany

Tel: +49 (0) 7268.801.0Fax: +49 (0) 7268.801.281

Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your reasonability to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATION OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATU-TORY OR OTHERWISE, RELATED TO THE INFORMATION INCLUDING, BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFOR-MANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly, or otherwise, under any Microchip intellectual property rights unless otherwise stated.

TrademarksThe Microchip and Vectron names and logos are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries.

Ordering Information

OX - 228 1 - E A E - 500 0 - 10M0000000

Product FamilyOX: OCXO

PackageSMD version: 228

Height1: 12.1 mm

Supply VoltageE: 3.3V

Stability Code500 1 ppb [pk-pk]

Frequency

Frequency Control0: No Tuning

RF Output CodeA: HCMOSE: sinewave

Temperature RangeE: -40°C to +85°C

Notes:1. Contact factory for improved stabilities or additional product options. Not all options and codes are available at all frequencies.2. Unless other stated all values are valid after warm-up time and refer to typical conditions for supply voltage, frequency control voltage, load, temperature (25°C).3. Phase noise degrades with increasing output frequency.4. Subject to technical modification.5. Contact factory for availability.

Page 7 of 9

typical warm up@ OX-2281-EAE-5000-10M0000000

typical holdover over 4 hour lab condition@ OX-2281-EAE-5000-10M0000000

typical temp stability@ OX-2281-EAE-5000-10M0000000

typical holdover over 8 hour lab condition@ OX-2281-EAE-5000-10M0000000

typical perforamce data

-20

-15

-10

-5

0

5

10

15

20

0 100 200 300 400 500 600 700

Freq

uenc

y De

viat

ion

[ppb

]

Time [sec]-40°C -10°C 25°C 50°C 85°C

Holdover 4 hour (lab condition)

0%

5%

10%

15%

20%

25%

30%

35%

5,551E-17 0,2 0,4 0,6 0,8 1 1,2 1,4 1,5

µsec

Holdover 8hour (lab condition)

0%

5%

10%

15%

20%

25%

30%

35%

0,3 0,7 1,1 1,5 1,9 2,3 2,7 3,1 >3,1

µsec

Page 8 of 9

typical frequeny vs. load change@ OX-2281-EAE-5000-10M0000000

typical Phase Noise

@ OX-2281-EAE-5000-10M0000000

typical frequeny vs. supply voltage@ OX-2281-EAE-5000-10M0000000

typical ADEV@ OX-2281-EAE-5000-10M0000000

typical perforamce data

0,00

2,00

4,00

6,00

8,00

10,00

12,00

14,00

16,00

18,00

-0,6

-0,4

-0,2

0,0

0,2

0,4

0,6

0 100 200 300 400 500 600

Load

[pF]

Freq

uenc

y de

viat

ion

[ppb

]

Time [sec]

0,00

0,50

1,00

1,50

2,00

2,50

3,00

3,50

4,00

-0,6

-0,4

-0,2

0,0

0,2

0,4

0,6

0 100 200 300 400 500 600 700 800 900

Supp

ly v

olta

ge [V

]

Freq

uenc

y de

viat

ion

[ppb

]

Time [sec]

Page 9 of 9

typical aging data@ OX-2281-EAE-5000-10M0000000

typical power consumption vs. operating temperature@ OX-2281-EAE-5000-10M0000000

@ OX-2281-EAE-5000-10M0000000

typical perforamce data

-1,00

0,00

1,00

2,00

3,00

4,00

5,00

6,00

0 10 20 30 40 50 60 70 80

df/f

[ppb

]

Time [d]

0200400600800

10001200140016001800200022002400

-40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 100

Leis

tung

[mW

]

Temperatur [°C]

1

10

100

1000

1 10 100 1000

pow

er o

n tim

e be

fore

fine

adj

ustm

ent [

hour

s ]

storage time [days]

recommended power on time after x days of power off@ OX-2281-EAE-5000-10M0000000

sdf