NeSSI*: Activities Update

CPAC - Seattle, WA - May 5, 2003

NeSSI End-Users Group

CPC

“the best way to predict the future is to create it”

*New Sampling/Sensor Initiative

Agenda

• NeSSI Activities Update– Focus Group - 15

• NeSSI II Commercialization - 10– John Mosher

• DoE Update - 10– Ulrich Bonne

• Open Device Vendor Association and Intrinsically Safe Special Interest Group (ODVA + IS + SIG)– Rick Ales – 20 to 30

• Rest of the Week - 5

“Everyone needs a vision of success…”

NeSSI Vision of Success

• We are able to…– Design...

– Assemble...

– Configure...

...an analytical system on our workbench.

• Lego Like Assembly– No special skills to assemble

– plug and play/self-documenting

• Fully Automated

Time (years)

03 04

NeSSI Roadmap

02

Mechanical Component Availability e.g. filters, valves, etc.

Mechanical Field Installations

ANSI/ISA SP76 Standard Approved

NeSSI/CPAC Vision & Roadmap

2000

Design /Prototype - Gen II Smart/Heating/SAM

Smart Field Installations

MechanicalGen. I

Smart/”Electrified”Gen. II

Analytical & WirelessGen. III

01 0605

Dow Rev. 2, July 2002

uAnalytical Field Installations

Simple Analyzers (H2O, O2, pH, UV/VIS, etc.)

NeSSI Generation Segmentation

Gen III

Gen II

Gen IMechanical Components (mostly)

Electrical Transducers/IS CANbus

Wireless, Advanced Gas & Liq. Sensors

& Platform for microAnalytical Value

Source: PAI Report 7

1999 Projected Useage of Process Analyzers

Petroleaum

ChemicalsPlastics

Electric & Gas Utilities

Other: Food, Pharma, etc.

Industry Segmentation & Market

- Worldwide, it is almost a $5-6 B/yr enterprise.

- Approx. $2.5B/yr is spend on care and maintenance of an installed base valued at $20-25B.

Programmable Substrate Heater

NeSSI “Sandwich” concept

Ethernet LAN

Analyzer

ControllerV

A

P F

SAM

CANbus

PDA

Auxiliary Heating/Cooling

SubstrateT

T

Standard Sampling Interface

dcs

o&muser

Standard Connectivity

Interface

DevelopmentFocus can beon Sensors !

Recent Presentations

• IFPAC 2003

• ISA Analytical Division (Calgary)– Bac Vu (Dow) submitted a paper – Jim Tatera (Tatera & Assoc.) brief update

IFPAC 2003: Wed PM-II Session

"NeSSI: A Sampling Platform for

Micro Physical and

Micro Analytical Sensors"

Session Chair: Peter van Vuuren

ExxonMobil Chemical Company

Engineering

Baytown, Texas

January 22, 2003Scottsdale, AZ

1:101:10 NeSSI: The Good, the Bad and the Ugly -Early Implementations and DirectionsRob Dubois - Dow Chemical Canada Inc., Fort Rob Dubois - Dow Chemical Canada Inc., Fort Saskatchewan, AB, Canada;Saskatchewan, AB, Canada;John Cumbus, ExxonMobil ChemicalJohn Cumbus, ExxonMobil Chemical

1:351:35 NeSSI Generation I - A Solid Foundation Douglas A. Nordstrom, David M. Simko, John J. Douglas A. Nordstrom, David M. Simko, John J.

Wawrowski, Wawrowski, Swagelok Co., Solon, OhioSwagelok Co., Solon, Ohio

2:002:00 Between SAM and the Substrate - A Smart Valve for NeSSI

Richard A. Ales, David M. Simko, Swagelok Co., OhioRichard A. Ales, David M. Simko, Swagelok Co., Ohio

2:252:25Networked Sampling System (NeSSI-Generation II) Developmentand Field Test

J.Mosher, R.Nickels and U.Bonne, Honeywell J.Mosher, R.Nickels and U.Bonne, Honeywell International - ACSInternational - ACS

2:50 - 4:00 :2:50 - 4:00 : Break - Allow attendees to participate in the

Grand Opening of the Exhibition

IFPAC 2003 January 22, 2003Scottsdale, AZ

AGENDAAGENDA"NeSSI: A Sampling Platform for Micro Physical and Micro

Analytical Sensors”Announcement: NeSSI Special Session

4:004:00 Microelectromechanical Systems for Process Analytics Berthold Andres, ABB Automation Products, GermanyBerthold Andres, ABB Automation Products, Germany

4: 254: 25 PHASED, a Faster, Smarter and More Affordable GasAnalysis Device - Update U.Bonne, J.Detry, R.Higashi, K.Newstrom-Peitso, H.Pham, T.Rezacheck U.Bonne, J.Detry, R.Higashi, K.Newstrom-Peitso, H.Pham, T.Rezacheck and S.Swanson Honeywell Labs, Plymouth, MNand S.Swanson Honeywell Labs, Plymouth, MN

4:504:50 Low Water levels in various solvents: on-line monitoring bya Miniature MIR Spectrometer Joseph P Sung and Jim Tatum, Rohm & Haas, Houston, TX, Yael Joseph P Sung and Jim Tatum, Rohm & Haas, Houston, TX, Yael

Barshad and Yoav Barshad, Applied Analytics, Inc., Chestnut Hill, MABarshad and Yoav Barshad, Applied Analytics, Inc., Chestnut Hill, MA

5:155:15 Computational Fluid Dynamic(CFD) Analysis of Gas and Liquid Flow Through a Modular Sample System Tanios Y. Bougebrayel, John J. Wawrowski, Swagelok Co., Solon, OhioTanios Y. Bougebrayel, John J. Wawrowski, Swagelok Co., Solon, Ohio

5:405:40 Surface Mount Technology Update - 2003 Steve Doe, Parker Hannifin Corp., Jacksonville, ALSteve Doe, Parker Hannifin Corp., Jacksonville, AL

6:056:05 AdjournAdjourn

IFPAC 2003 January 22, 2003Scottsdale, AZ

AGENDA (cnt’d)AGENDA (cnt’d)"NeSSI: A Sampling Platform for Micro Physical and Micro

Analytical Sensors”

Some Activities

• Modular Substrate Orientation– 4 systems being evaluated– Substrate Attribute List Generated

• Surface Mount Component Evaluation/Gap– (Plan is to identify and secure missing comp.)

• The NeSSI-box

• Gen III activities in Europe

Substrate Attributes (Gen I)Spec, Function, Cost, Design

• Config. Flexibility

• Parts count

• Unit price

• Materials of const.

• Weight

• Heating capability

• Configurator tool

• Integration capability

• Passivation

• Internet ordering

• Size constraints

• P, T specifications

• ANSI/ISA SP76

• Orientation

• Backplate mounting

• Assembly tools

• Flow path marking

• Tagging/traceability

• Supplier attributes

Surface Mount Component Evaluation (Gen I)

• List of surface mount components tabulated

• Gaps identified & plan to fill

• Experimental test plan developed– Certain lab tests required– NeSSI-box platform for field tests

• Dow has a platform to evaluate components

SP76 Component Wish List (Gen I)

• Permeation drier• Swirling filter• Cartridge filter• Membrane Filter• Atmospheric Ref.• Double Block & Bleed• Aspirator & Pump• Pump (D1&2)• Gauge

• On-substrate cal– function of T, F

• Mass flow (D1&2)• Coriollis flow (D1&2)• Sample Loop valve• 3-way valve

– purge & switch

• Chiller (vortex)• Rotameter

Gen II Specification

• Copyright transfer of the spec from ExxonMobil and Dow to CPAC

• Draft Revision “6” will be mounted on the CPAC/NeSSI web site (by June 1)

• Evergreen vehicle to collect specs for SAM, microClimate enclosure, sensor transducers, valve transducers, applets for SAM

• Eventually segue into Gen III

Programmable Substrate Heater

Honeywell POCA Project- Dow, EMCC

VP

A

F

Ethernet LAN

Analyzer

Controller

SAM

CANbus

PDA

Auxiliary Heating/Cooling

SubstrateT

T

dcs

o&muser

POCA*1 (complete)First interpretation of NeSSI Gen II (alpha)

• Technical Hi-Lites & Possibilities– First “binary” Mini-Sensors (P/T; F/T)– Introducing Absolute Pressure Transmitter

• GC sample loop compensation, BP control

– First “combi-valves” (Enabler for PID control)– Enclosure and Substrate Heater– Early SAM hardware & SAM software– First IS CANbus communication

* On display

Introducing POCA2

• An extension of POCA1 (still alpha)• Collect the weaknesses of POCA1 - correct

• Add the remaining Gen II features

• Minisensors– Miniaturize, make more robust, lower power

• Industrial X-proof SAM, add heat control

• Add PDA, node count

Gen II Commercialization and POCA

• John Mosher

DOE

• Submitted April 16 by Honeywell/U. Bonne on behalf of a user/supplier team assembled at CPAC

• If contract is awarded this will infuse considerable capital into the purchase of modular, miniature systems

• An omnibus “design” has been generated• Covers NeSSI Gen II/III products• Ulrich Bonne

Who in the *#! is ODVA??

• ODVA = Open Devicenet Vendors Assoc.

• A means to provide an “open” platform for connecting transducers– analagous to SP76 on the mechanical side

• It is hugely important to get this Intrinsically Safe (IS) SIG to provide entry to 3rd party entries

Focus and topics this week

• Plan for ODVA for DeviceNet IS SIG (AM)– Rick Ales Swagelok

• SAM hardware and software (this PM)– John Mosher Honeywell

Focus and topics this week

• NeSSI Focus Groups – combiValve

• <2 mA/unit

• Vm = modulating & Vo = on/off

– X-proof substrate heating techniques– intrinsic safety issues– surface mount (GenI) component list– generation III analytical product wish list– Gen II specification feedback