NE2R757GT-P6 - Nichia5312).pdf · 2018-06-17 · NICHIA STS-DA1-5312 NICHIA CORPORATION...

NICHIA STS-DA1-5312 <Cat.No.180604>

NICHIA CORPORATION

SPECIFICATIONS FOR RED LED

NE2R757GT-P6 ● Pb-free Reflow Soldering Application

● RoHS Compliant


1

SPECIFICATIONS

(1) Absolute Maximum Ratings

Item Symbol Absolute Maximum Rating Unit

Forward Current IF 140 mA

Pulse Forward Current IFP 180 mA

Reverse Voltage VR 5 V

Power Dissipation PD 336 mW

Operating Temperature Topr -40~85 °C

Storage Temperature Tstg -40~85 °C

Junction Temperature TJ 120 °C

* Absolute Maximum Ratings at TS=25°C.

* IFP conditions with pulse width ≤10ms and duty cycle ≤10%.

(2) Initial Electrical/Optical Characteristics

Item Symbol Condition Typ Max Unit

Forward Voltage VF IF=100mA 2.13 - V

Reverse Current IR VR=5V - - μA

Luminous Flux Φv IF=100mA 16 - lm

Chromaticity Coordinate x

- IF=100mA 0.695 -

- y IF=100mA 0.305 -

Thermal Resistance RθJS - 14 20 °C/W

* Characteristics at TS=25°C.

* Luminous Flux value as per CIE 127:2007 standard.

* Chromaticity Coordinates as per CIE 1931 Chromaticity Chart.

* RθJS is the thermal resistance from the junction to the TS measurement point. （Test board: FR4 board thickness=1.6mm, copper

layer thickness=0.07mm）


2

RANKS

Item Rank Min Max Unit

Forward Voltage - 1.9 2.4 V

Reverse Current - - 50 μA

Luminous Flux

P8 18.0 21.4

lm P7 15.1 18.0

P6 12.7 15.1

Color Rank

Rank Rmp1

x 0.6874 0.6705 0.6873 0.7049

y 0.2966 0.3135 0.3126 0.2948

* Ranking at TS=25°C.

* Forward Voltage Tolerance: ±0.05V

* Luminous Flux Tolerance: ±10%

* Chromaticity Coordinate Tolerance: ±0.01

* LEDs from the above ranks will be shipped. The rank combination ratio per shipment will be decided by Nichia.


3

CHROMATICITY DIAGRAM

600

605

610

615

620

625

630

635640

650660

670

Rmp1

0.20

0.25

0.30

0.35

0.40

0.60 0.65 0.70 0.75 0.80

y

x


4

OUTLINE DIMENSIONS

STS-DA7-13947

NE2R757G-P6

管理番号 No.

(単位 Unit: mm)

This product complies with RoHS Directive.

本製品はRoHS指令に適合しております。*

(単位 Unit: mm, 公差 Tolerance: ±0.2)The dimension(s) in parentheses are for reference purposes.

括弧で囲まれた寸法は参考値です。*

Dimensions do not include mold flash.バリは寸法に含まないものとします。*

The side with the larger distance is the cathode.Example: a>b, then a is the side that has the cathode.

a>bとなる場合、aがカソード側です。*

Cathode Mark

3

3

（2.6）

（2.6）

0.65

1.42

2.2

7

Cathode Anode

0.48

2.6

a(Cathode)

b(Anode)

項目 Item

パッケージ材質Package Materials

封止樹脂材質Encapsulating Resin

Materials

電極材質Electrodes Materials

質量Weight

内容 Description

耐熱性ポリマーHeat-Resistant Polymer

シリコーン樹脂（拡散剤入り）Silicone Resin(with diffuser)

銅合金+銀メッキAg-plated Copper Alloy

0.018g(TYP)

K A


5

SOLDERING

• Recommended Reflow Soldering Condition(Lead-free Solder)

120sec Max

Pre-heat

180 to 200°C

260°CMax

10sec Max

60sec Max Above 220°C

1 to 5°C per sec

• Recommended Hand Soldering Condition

Temperature 350°C Max

Soldering Time 3sec Max

● Recommended Soldering Pad Pattern ● Recommended Metal Solder Stencil Aperture

(単位 Unit: mm)

0.6 1.45 0.95 0.6

0.85 2.3 0.85

0.4

2 2.3

3.1

5

0.6 1.53

0.69

0.6

0.58

2.3

3.1

5

* This LED is designed to be reflow soldered to a PCB. If dip soldered, Nichia will not guarantee its reliability.

* Reflow soldering must not be performed more than twice. Hand soldering must not be performed more than once.

* When cooling the LEDs from the peak temperature a gradual cooling slope is recommended; do not cool the LEDs rapidly.

* During reflow soldering, the heat and atmosphere in the reflow oven may cause the optical characteristics to degrade. In particular,

reflow soldering performed with an air atmosphere may have a greater negative effect on the optical characteristics than if a

nitrogen atmosphere is used; Nichia recommends using a nitrogen reflow atmosphere.

* This LED uses a silicone resin for the encapsulating resin; the silicone resin is soft. If pressure is applied to the silicone resin, it

may cause the resin to be damaged, chipped, delaminated and/or deformed. If the resin is damaged, chipped, delaminated

and/or deformed, it may cause the wire to break causing a catastrophic failure (i.e. the LED not to illuminate) and/or reliability

issues (e.g. the LED to corrode and/or to become dimmer, the color/directivity to change, etc.). Ensure that pressure is not

applied to the encapsulating resin.

* Once the LEDs have been soldered to a PCB, it should not be repaired/reworked. If it must be done, using a double-head soldering

iron is strongly recommended. Ensure that sufficient verification is performed prior to use to ensure that the repair/rework has

not caused the LED characteristics to deteriorate.

* When soldering, do not apply stress to the LED while the LED is hot.

* When using an automatic pick-and-place machine, choose an appropriate nozzle for this LED. Using a pick-and-place nozzle with

a smaller diameter than the size of the LED's emitting surface will cause damage to the emitting surface causing a catastrophic

failure (i.e. the LED not to illuminate).


6

* If the top cover tape is removed right next to where the nozzle picks up the LEDs, regardless of whether the LEDs have been baked

or not, it may cause the LED to be picked up incorrectly; it is recommended to remove the top cover tape further from where the

nozzle picks up the LEDs. Ensure that there are no issues with the conditions when the nozzle picks up the LEDs.

● Recommended Tape Removal Position(Removing the cover tape further from the pick-and-place nozzle)

吸着ノズルPick-and-place nozzle

キャリアテープ引き出し方向Feed Direction of the Carrier Tape

テープ剥離位置Tape Removal Position 製品テープ

Top Cover Tape

● Incorrect Tape Removal Position(Removing the cover tape right next to the pick-and-place nozzle)

製品テープTop Cover Tape

吸着ノズルPick-and-place nozzle

テープ剥離位置Tape Removal Position

キャリアテープ引き出し方向Feed Direction of the Carrier Tape

* Verify the setting conditions when the LEDs are mounted onto a PCB to ensure that the LEDs are mounted onto the PCB with the

correct polarity. If the cathode mark is not able to be easily recognized with a visual inspection, check the back or side of the LED

to determine the polarity.

* The soldering pad pattern above is a general recommendation for LEDs to be mounted without issues; if a high degree of precision

is required for the chosen application (i.e. high-density mounting), ensure that the soldering pad pattern is optimized.

* Consider factors such as the reflow soldering temperature, hand soldering temperature, etc. when choosing the solder.

* When flux is used, it should be a halogen free flux. Ensure that the manufacturing process is not designed in a manner where the

flux will come in contact with the LEDs.

* Ensure that there are no issues with the type and amount of solder that is being used.

* This LED has all the electrodes on the backside; solder connections will not be able to be seen nor confirmed by a normal visual

inspection. Ensure that sufficient verification is performed on the soldering conditions prior to use to ensure that there are no

issues.


7

TAPE AND REEL DIMENSIONS

Reel Size: 5000pcs

STS-DA7-9622

数量は1リールにつき 5000個入りです。*

Nxxx757x

トレーラ部/リーダ部 Trailer and Leader

Top Cover Tape

引き出し方向

LED装着部

リーダ部最小400mm

トレーラ部最小160mm（空部）Trailer 160mm MIN(Empty Pockets) Loaded Pockets

エンボスキャリアテープEmbossed Carrier Tape

トップカバーテープ

FeedDirection

Leader without Top Cover Tape 400mm MIN

引き出し部最小100mm（空部）Leader with Top Cover Tape100mm MIN(Empty Pocket)

The tape packing method complies with JIS C 0806

(Packaging of Electronic Components on Continuous Tapes).

* JIS C 0806電子部品テーピングに準拠しています。

管理番号 No.

(単位 Unit: mm)

リール部 Reel

-0Φ1.5+0.1

テーピング部 Tape

4±0.1

1.7

5±

0.1

4±0.1

2±0.05

3.5

±0.0

5

8+

0.3

-0.1

When the tape is rewound due to work interruptions, no more than 10N should be applied to the embossed carrier tape. The LEDs may stick to the top cover tape.

* 実装作業の中断などでエンボスキャリアテープをリールに巻き取る場合、エンボスキャリアテープを強く(10N以上)締めないで下さい。LEDがカバーテープに貼り付く可能性があります。

3.18±0.1

0.2±0.05

0.8±0.1

3.1

8±

0.1

Cathode Mark

-0Φ1+0.2

Φ60

+1 -0

11.4±1

-09+1

f 13±0.2

f 21 ±0.8

ラベルLabel

Φ21 ±

0.8

Φ13

±0.2

180+0-3


8

PACKAGING - TAPE & REEL

Nichia LED

STS-DA7-4989

Nxxxxxxx

ラベル Label

ラベル Label

管理番号 No.

Reelリール

熱シールSeal

Moisture-proof Bag

アルミ防湿袋

RoHS

Nxxxxxxx

XXXX LED

*******

NICHIA CORPORATION 491 OKA, KAMINAKA, ANAN, TOKUSHIMA, JAPAN

TYPE

LOTQTY.

YMxxxx-RRRPCS

RoHS

Nxxxxxxx

XXXX LED

*******

RRRPCS

TYPE

RANKQTY.

NICHIA CORPORATION491 OKA, KAMINAKA, ANAN, TOKUSHIMA, JAPAN

Reels are shipped with desiccants in heat-sealed moisture-proof bags.

シリカゲルとともにリールをアルミ防湿袋に入れ、熱シールにより封をします。

Desiccants

シリカゲル

Moisture-proof bags are packed in cardboard boxes with corrugated partitions.

アルミ防湿袋を並べて入れ、ダンボールで仕切ります。

ダンボールには防水加工がされておりませんので、梱包箱が水に濡れないよう注意して下さい。*

輸送、運搬に際して弊社よりの梱包状態あるいは同等の梱包を行って下さい。*

取り扱いに際して、落下させたり、強い衝撃を与えたりしますと、製品を損傷させる原因になりますので注意して下さい。*

Using the original package material or equivalent in transit is recommended.

Do not expose to water. The box is not water-resistant.

Do not drop or expose the box to external forces as it may damage the products.

Products shipped on tape and reel are packed in a moisture-proof bag. They are shipped in cardboard boxes to protect them from external forces during transportation.

* 本製品はテーピングしたのち、輸送の衝撃から保護するためダンボールで梱包します。

If not provided, it will not be indicated on the label.******* is the customer part number. 客先型名が設定されていない場合は空白です。

* 客先型名を*******で示します。

参照して下さい。For details, see "LOT NUMBERING CODE"in this document.

* ロット表記方法についてはロット番号の項を

The label does not have the RANK field for un-ranked products.

* ランク分けがない場合はランク表記はありません。


9

LOT NUMBERING CODE

Lot Number is presented by using the following alphanumeric code.

YMxxxx - RRR

Y - Year

Year Y

2017 H

2018 I

2019 J

2020 K

2021 L

2022 M

M - Month

Month M Month M

1 1 7 7

2 2 8 8

3 3 9 9

4 4 10 A

5 5 11 B

6 6 12 C

xxxx-Nichia's Product Number

RRR-Ranking by Color Coordinates, Ranking by Luminous Flux


10

DERATING CHARACTERISTICS

NE2R757G-P6

管理番号 No. STS-DA7-13948

0

30

60

90

120

150

0 20 40 60 80 100 120

Derating1

(72, 140)

(85, 100)

0

30

60

90

120

150

0 20 40 60 80 100 120

Derating2

(85, 140)

10

100

1000

1 10 100

Duty

140180

許容順電流

Allow

able

Forw

ard

Curr

ent(

mA)

はんだ接合部温度(カソード側)-許容順電流特性

Solder Temperature(Cathode Side) vs

Allowable Forward Current

周囲温度-許容順電流特性

Ambient Temperature vs


許容順電流

Allow

able

Forw

ard

Curr

ent(

mA)

許容順電流

Allow

able

Forw

ard

Curr

ent(

mA)

はんだ接合部温度(カソード側)

Solder Temperature(Cathode Side)(°C)

周囲温度

Ambient Temperature(°C)

デューティー比

Duty Ratio(%)

デューティー比-許容順電流特性

Duty Ratio vs


85°C/WθJAR =

TA=25°C


11

OPTICAL CHARACTERISTICS

NE2R757G-P6

管理番号 No. STS-DA7-13949

0.0

0.2

0.4

0.6

0.8

1.0

450 500 550 600 650 700 750

Spectrum

相対照度

Relative Illuminance(a.u.)

90°

80°

70°

60°

50°

40°

30°

20°

10°0°

-10°-20°

-30°

-40°

-50°

-60°

-70°

-80°

-90°

Directivity1

発光スペクトル

Spectrum

相対発光強度

Rela

tive E

mis

sio

n I

nte

nsity(a

.u.)

波長

Wavelength(nm)

指向特性

Directivity

放射角度

Radia

tion A

ngle

1 0.5 0 0.5 1

100mAIFP=T

A=25°C

100mAIFP=T

A=25°C

* 本特性は参考です。All characteristics shown are for reference only and are not guaranteed.


12

FORWARD CURRENT CHARACTERISTICS / TEMPERATURE CHARACTERISTICS

NE2R757G-P6管理番号 No. STS-DA7-13950

1.5

2.0

2.5

3.0

-60 -40 -20 0 20 40 60 80 100 120

TaVf

0.4

0.6

0.8

1.0

1.2

1.4

1.6

-60 -40 -20 0 20 40 60 80 100 120

TaIv

10

100

1000

1.5 2.0 2.5 3.0

VfIf

180

相対光束

Rela

tive L

um

inous F

lux(a

.u.)

周囲温度-相対光束特性


Relative Luminous Flux

順電流

Forw

ard

Curr

ent(

mA)

0.0

0.5

1.0

1.5

2.0

2.5

0 50 100 150 200 250

IfIv

相対光束

Rela

tive L

um

inous F

lux(a

.u.)

順電流-相対光束特性

Forward Current vs

Relative Luminous Flux

順電流

Forward Current(mA)

順電圧-順電流特性

Forward Voltage vs

Forward Current

周囲温度-順電圧特性


Forward Voltage

順電圧

Forward Voltage(V)

順電圧

Forw

ard

Voltage(V

)

周囲温度


周囲温度



=25°CTA

IFP=100mA

IFP=100mA

TA

=25°C


13

FORWARD CURRENT CHARACTERISTICS / TEMPERATURE CHARACTERISTICS

NE2R757G-P6管理番号 No. STS-DA7-13951

0.29

0.30

0.31

0.32

0.33

0.34

0.67 0.68 0.69 0.70 0.71 0.72

Taxy

-40˚C(617nm)

0˚C(620nm)

25˚C(622nm)

85˚C(625nm)

613

616

619

622

625

628

631

10 100 1000

IfλD

613

616

619

622

625

628

631

-60 -40 -20 0 20 40 60 80 100 120

TaλD 100mAIFP=

順電流-主波長特性Forward Current vs

Dominant Wavelength

順電流

Forward Current(mA)

周囲温度-主波長特性


Dominant Wavelength

Dom

inant

Wavele

ngth

(nm

)

主波長

Dom

inant

Wavele

ngth

(nm

)

主波長

周囲温度


x

y

周囲温度-色度(主波長)特性Ambient Temperature vs

Chromaticity Coordinate (λd)


TA=25°C

100mAIFP=


14

RELIABILITY

(1) Tests and Results

Test Reference

Standard Test Conditions

Test

Duration

Failure

Criteria

#

Units

Failed/Tested

Resistance to

Soldering Heat

(Reflow Soldering)

JEITA ED-4701

300 301

Tsld=260°C, 10sec, 2reflows,

Precondition: 30°C, 70%RH, 168hr #1 0/22

Solderability

(Reflow Soldering)

JEITA ED-4701

303 303A

Tsld=245±5°C, 5sec,

Lead-free Solder(Sn-3.0Ag-0.5Cu) #2 0/22

Temperature Cycle JEITA ED-4701

100 105

-40°C(30min)~25°C(5min)~

85°C(30min)~25°C(5min) 100cycles #1 0/50

Moisture Resistance

(Cyclic)

JEITA ED-4701

200 203

25°C~65°C~-10°C, 90%RH,

24hr per cycle 10cycles #1 0/22

High Temperature

Storage

JEITA ED-4701

200 201 TA=85°C 1000hours #1 0/22

Temperature Humidity

Storage

JEITA ED-4701

100 103 TA=60°C, RH=90% 1000hours #1 0/22

Low Temperature

Storage

JEITA ED-4701

200 202 TA=-40°C 1000hours #1 0/22

Room Temperature

Operating Life

Condition 1

TA=25°C, IF=100mA

Test board: See NOTES below 1000hours #1 0/22

Room Temperature

Operating Life

Condition 2

TA=25°C, IF=140mA


High Temperature

Operating Life

TA=85°C, IF=100mA


Temperature Humidity

Operating Life

60°C, RH=90%, IF=100mA


Low Temperature

Operating Life

TA=-40°C, IF=100mA


Vibration JEITA ED-4701

400 403

200m/s2, 100~2000~100Hz,

4cycles, 4min, each X, Y, Z 48minutes #1 0/22

Electrostatic Discharges HBM, 1kV, 1.5kΩ, 100pF, 1pulses,

alternately positive or negative #1 0/22

Board Bending 1bend to a deflection of 2mm

for 5±1sec #3 0/22

Soldering Joint Shear

Strength

JEITA ED-4702B

002 3 5N, 10±1sec #1 0/22

NOTES:

1) Test board: FR4 board thickness=1.6mm, copper layer thickness=0.07mm, RθJA≈85°C/W

The Board Bending is performed using an exclusive test board.

2) Measurements are performed after allowing the LEDs to return to room temperature.

(2) Failure Criteria

Criteria # Items Conditions Failure Criteria

#1

Forward Voltage(VF) IF=100mA >U.S.L.×1.1

Luminous Flux(ΦV) IF=100mA <L.S.L.×0.7

Reverse Current(IR) VR=5V >U.S.L.×2.0

#2 Solderability - Less than 95% solder coverage

#3 Appearance - The light emission is abnormal

U.S.L. : Upper Specification Limit L.S.L. : Lower Specification Limit


15

CAUTIONS

(1) Storage

Conditions Temperature Humidity Time

Storage Before Opening Aluminum Bag ≤30°C ≤90%RH Within 1 Year from Delivery Date

After Opening Aluminum Bag ≤30°C ≤70%RH ≤168hours

Baking 65±5°C - ≥24hours

● The storage/packaging requirements for this LED are comparable to JEDEC Moisture Sensitivity Level (MSL) 3 or equivalent.

Nichia used IPC/JEDEC STD-020 as a reference to rate the MSL of this LED.

● This LED uses a package that could absorb moisture; if the package absorbs moisture and is exposed to heat during soldering, it

may cause the moisture to vaporize and the package to expand and the resulting pressure may cause internal delamination. This

may cause the optical characteristics to degrade. To minimize moisture absorption in storage/transit, moisture-proof aluminum

bags are used for the LEDs with a silica gel packet to absorb any air moisture in the bag. The silica gel beads turn blue to red as

they absorb moisture.

● Once the moisture-proof aluminum bag is open, ensure that the LED is soldered to a PCB within the range of the conditions above.

To store any remaining unused LEDs, use a hermetically sealed container with silica gel desiccants. Nichia recommends placing

them back to the original moisture-proof bag and reseal it.

● If the “After Opening” storage time has been exceeded or any pink silica gel beads are found, ensure that the LED are baked before

use. Baking should only be done once.

● This LED has silver-plated parts both inside and outside of the package. If the LEDs are exposed to a corrosive environment, it may

cause the plated surface to tarnish causing issues (i.e. solderability, optical characteristics). Ensure that when storing LEDs, a

hermetically sealed container is used. Nichia recommends placing them back to the original moisture-proof bag and reseal it.

● Ensure that when designing, there are no issues with the parts/materials used with the LEDs. The following must be taken into

consideration:

- After soldering LEDs to a PCB and/or installing them in a system, it is possible that the LEDs will be exposed to corrosive

gases released from parts/materials used with the LEDs in the same assembly/system (e.g. rubber materials, cardboard

boxes) and/or gases entering from the outside; the plated surface may tarnish depending on the gas component.

- Small amounts of corrosive gas may be found in the air.

- Resin materials may contain substances (e.g. halogens) that affect the plated surfaces of the LEDs.

● To prevent substances/gases from affecting the plated surface, ensure that the parts/materials used with the LEDs in the same

assembly/system do not contain sulfur (e.g. gasket/seal, adhesive, etc.). If the plating becomes extremely corroded or

contaminated, it may cause issues (e.g. electrical connection failures). If a gasket/seal is used, silicone rubber gaskets/seals are

recommended; ensure that this use of silicone does not result in issues (e.g. electrical connection failures) caused by low

molecular weight volatile siloxane.

● To avoid condensation, the LEDs must not be stored in areas where temperature and humidity fluctuate greatly.

● Do not store the LEDs in a dusty environment.

● Do not expose the LEDs to direct sunlight and/or an environment over a long period of time where the temperature is higher than

normal room temperature.


16

(2) Directions for Use

● The circuit must be designed to ensure that the Absolute Maximum Ratings are not exceeded for each LED. The LEDs should be

operated at a constant current per LED. In the case of operating at a constant voltage, Circuit B is recommended. If Circuit A is

used, it may cause the currents flowing through the LEDs to vary due to the variation in the forward voltage characteristics of the

LEDs on the circuit.

(A)

...

(B)

...

● This LED is designed to be operated at a forward current. Ensure that no voltage is applied to the LED in the forward/reverse

direction while the LED is off. If the LEDs are used in an environment where reverse voltages are applied to the LED continuously,

it may cause electrochemical migration to occur causing the LED to be damaged. When not in use for a long period of time, the

system’s power should be turned off to ensure that there are no issues/damage.

● To stabilize the LED characteristics while in use, Nichia recommends that the LEDs are operated at currents ≥ 10% of the sorting

current.

● If LEDs are arranged into rows and columns in a grid circuit (i.e. LED matrix circuit) and operated, ensure that when using a pulsed

mode to operate the LEDs in a matrix circuit, the reverse voltage for any of the LEDs does not exceed the Absolute Maximum

Rating while the LED is off.

● Ensure that transient excessive voltages (e.g. lighting surge) are not applied to the LEDs.

● If the LEDs are used for outdoor applications, ensure that necessary measures are taken (e.g. protecting the LEDs from water/salt

damage and high humidity).

(3) Handling Precautions

● Do not handle the LEDs with bare hands:

- this may contaminate the LED surface and have an effect on the optical characteristics,

- this may cause the LED to deform and/or the wire to break causing a catastrophic failure (i.e. the LED not to illuminate).

● Ensure that when handling the LEDs with tweezers, excessive force is not applied to the LED. Otherwise, it may cause damage to

the resin (e.g. cut, scratch, chip, crack, delamination and deformation) and the wire to break causing a catastrophic failure (i.e.

the LED not to illuminate).

● Dropping may cause damage to the LED (e.g. deformation).

● Do not stack assembled PCBs together. Otherwise, it may cause damage to the resin (e.g. cut, scratch, chip, crack, delamination

and deformation) and the wire to break causing a catastrophic failure (i.e. the LED not to illuminate).

(4) Design Consideration

● If the LEDs are soldered to a PCB and the PCB assembly is bent (e.g. PCB depaneling process), it may cause the LED package to

break. The PCB layout should be designed to minimize the mechanical stress on the LEDs when the PCB assembly is bent/warped.

● The amount of mechanical stress exerted on the LED from depaneling may vary depending on the LED position/orientation on the

PCB assembly (e.g. especially in areas near V-groove scores). The PCB layout should be designed to minimize the mechanical

stress on the LEDs when the PCB is separated into individual PCB assemblies.

● To separate a PCB populated with the LEDs, use a specially designed tool. Do not break the PCB by hand.

● Volatile organic compounds that have been released from materials present around the LEDs (e.g. housing, gasket/seal, adhesive,

secondary lens, lens cover, etc.) may penetrate the LED lens and/or encapsulating resin. If the LEDs are being used in a

hermetically sealed environment, these volatile compounds can discolor after being exposed to heat and/or photon energy and

it may greatly reduce the LED light output and/or color shift. In this case, ventilating the environment may improve the reduction

in light output and/or color shift. Perform a light-up test of the chosen application for optical evaluation to ensure that there are

no issues, especially if the LEDs are planned to be used in a hermetically sealed environment.


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(5) Thermal Management

● The Absolute Maximum Junction Temperature (TJ) must not be exceeded under any circumstances. The increase in the

temperature of an LED while in operation may vary depending on the PCB thermal resistance and the density of LEDs on the PCB

assembly. Ensure that when using the LEDs for the chosen application, heat is not concentrated in an area and properly managed

in the system/assembly.

● The operating current should be determined by considering the temperature conditions surrounding the LED (i.e. TA). Ensure that

when operating the LED, proper measures are taken to dissipate the heat.

● The following two equations can be used to calculate the LED junction temperature:

1) TJ=TA+RθJA･W 2) TJ=TS+RθJS･W

*TJ=LED Junction Temperature: °C

TA=Ambient Temperature: °C

TS=Soldering Temperature (Cathode Side): °C

RθJA=Thermal Resistance from Junction to Ambient: °C/W

RθJS=Thermal Resistance from Junction to TS Measurement Point: °C/W

W=Input Power(IF×VF): W

TS Measurement Point

(6) Cleaning

● Do not wipe/clean the LEDs with a damp cloth soaked in water or solvents (e.g. benzine, thinner, etc.).

● If required, use isopropyl alcohol (IPA). If water or other solvent is used, it may cause issues. Before using the solvent, ensure that

sufficient verification is performed to ensure that the solvent does not adversely affect the LEDs. In addition, the use of CFCs such

as Freon is heavily regulated.

● When a foreign substance (e.g. dust, debris, loose materials, etc.) adheres to the LEDs, wipe it off with a damp well-squeezed

cloth that was soaked only in isopropyl alcohol (IPA).

● Do not wipe the emitting surface. Otherwise, it may result in excessive pressure to the emitting surface causing issues (e.g. wire

to deform, the encapsulating resin to become damaged, the color to change, etc.). If wiping the emitting surface is necessary,

ensure that sufficient preliminary verification is performed to ensure that there are no issues; wipe the emitting surface at the

customer’s risk.

● Do not clean the LEDs with an ultrasonic cleaner. If cleaning must be done, ensure that sufficient verification is performed by using

a finished assembly with LEDs to determine cleaning conditions (e.g. ultrasonic power, LED position on the PCB assembly) that do

not cause an issue.

(7) Eye Safety

● There may be two important international specifications that should be noted for safe use of the LEDs: IEC 62471:2006

Photobiological safety of lamps and lamp systems and IEC 60825-1:2001 (i.e. Edition 1.2) Safety of Laser Products - Part 1:

Equipment Classification and Requirements. Ensure that when using the LEDs, there are no issues with the following points:

- LEDs have been removed from the scope of IEC 60825-1 since IEC 60825-1:2007 (i.e. Edition 2.0) was published. However,

depending on the country/region, there are cases where the requirements of the IEC 60825-1:2001 specifications or

equivalent must be adhered to.

- LEDs have been included in the scope of IEC 62471:2006 since the release of the specification in 2006.

- Most Nichia LEDs will be classified as the Exempt Group or Risk Group 1 according to IEC 62471:2006. However, in the case

of high-power LEDs containing blue wavelengths in the emission spectrum, there are LEDs that will be classified as Risk

Group 2 depending on the characteristics (e.g. radiation flux, emission spectrum, directivity, etc.)

- If the LED is used in a manner that produces an increased output or with an optic to collimate the light from the LED, it may

cause damage to the human eye.

● If an LED is operated in a manner that emits a flashing light, it may cause health issues (e.g. visual stimuli causing eye discomfort).

The system should be designed to ensure that there are no harmful effects on the human body.


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(8) Miscellaneous

● Nichia warrants that the discrete LEDs will meet the requirements/criteria as detailed in the Reliability section within this

specification. If the LEDs are used under conditions/environments deviating from or inconsistent with those described in this

specification, the resulting damage and/or injuries will not be covered by this warranty.

● Nichia warrants that the discrete LEDs manufactured and/or supplied by Nichia will meet the requirements/criteria as detailed in

the Reliability section within this specification; it is the customer’s responsibility to perform sufficient verification prior to use to

ensure that the lifetime and other quality characteristics required for the intended use are met.

● The applicable warranty period is one year from the date that the LED is delivered. In the case of any incident that appears to be

in breach of this warranty, the local Nichia sales representative should be notified to discuss instructions on how to proceed while

ensuring that the LED in question is not disassembled or removed from the PCB if it has been attached to the PCB. If a breach of

this warranty is proved, Nichia will provide the replacement for the non-conforming LED or an equivalent item at Nichia’s

discretion. FOREGOING ARE THE EXCLUSIVE REMEDIES AVAILABLE TO THE CUSTOMER IN RESPECT OF THE BREACH OF THE

WARRANTY CONTAINED HEREIN, AND IN NO EVENT SHALL NICHIA BE RESPONSIBLE FOR ANY INDRECT, INCIDENTAL OR

CONSEQUENTIAL LOSSES AND/OR EXPENSES (INCLUDING LOSS OF PROFIT) THAT MAY BE SUFFERED BY THE CUSTOMER

ARISING OUT OF A BREACH OF THE WARRANTY.

● NICHIA DISCLAIMS ALL OTHER WARRANTIES, EXPRESS OR IMPLIED, INCLUDING THE IMPLIED WARRANTIES OF

MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE.

● This LED is intended to be used for general lighting, household appliances, electronic devices (e.g. mobile communication

devices); it is not designed or manufactured for use in applications that require safety critical functions (e.g. aircraft, automobiles,

combustion equipment, life support systems, nuclear reactor control system, safety devices, spacecraft, submarine repeaters,

traffic control equipment, trains, vessels, etc.). If the LEDs are planned to be used for these applications, unless otherwise

detailed in the specification, Nichia will neither guarantee that the LED is fit for that purpose nor be responsible for any resulting

property damage, injuries and/or loss of life/health. This LED does not comply with ISO/TS 16949 and is not intended for

automotive applications.

● The customer will not reverse engineer, disassemble or otherwise attempt to extract knowledge/design information from the LED.

● All copyrights and other intellectual property rights in this specification in any form are reserved by Nichia or the right holders who

have granted Nichia permission to use the content. Without prior written permission from Nichia, no part of this specification may

be reproduced in any form or by any means.

● Both the customer and Nichia will agree on the official specifications for the supplied LEDs before any programs are officially

launched. Without this agreement in writing (i.e. Customer Specific Specification), changes to the content of this specification

may occur without notice (e.g. changes to the foregoing specifications and appearance, discontinuation of the LEDs, etc.).

NE2R757GT-P6 - Nichia5312).pdf · 2018-06-17 · NICHIA STS-DA1-5312 NICHIA CORPORATION...

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Transcript of NE2R757GT-P6 - Nichia5312).pdf · 2018-06-17 · NICHIA STS-DA1-5312 NICHIA CORPORATION...