MOSFET - farnell.com · Final Data Sheet Rev. 2.0, 2016-07-05 PG-TO 220 FP Drain Pin 2, Tab Gate...

1

IPA80R280P7

Rev.2.0,2016-07-05Final Data Sheet

PG-TO220FP

DrainPin 2, Tab

GatePin 1

SourcePin 3

MOSFET800VCoolMOSªP7PowerTransistorThelatest800VCoolMOS™P7seriessetsanewbenchmarkin800Vsuperjunctiontechnologiesandcombinesbest-in-classperformancewithstateoftheartease-of-use,resultingfromInfineon’sover18yearspioneeringsuperjunctiontechnologyinnovation.

Features•Best-in-classFOMRDS(on)*Eoss;reducedQg,Ciss,andCoss•Best-in-classDPAKRDS(on)•Best-in-classV(GS)thof3VandsmallestV(GS)thvariationof±0.5V•IntegratedZenerDiodeESDprotection•Best-in-classCoolMOS™qualityandreliability;qualifiedforindustrialgradeapplicationsaccordingtoJEDEC(J-STD20andJESD22)•Fullyoptimizedportfolio

Benefits•Best-in-classperformance•Enablinghigherpowerdensitydesigns,BOMsavingsandlowerassemblycosts•Easytodriveandtoparallel•BetterproductionyieldbyreducingESDrelatedfailures•Lessproductionissuesandreducedfieldreturns•Easytoselectrightpartsforfinetuningofdesigns

ApplicationsRecommendedforhardandsoftswitchingflybacktopologiesforLEDLighting,lowpowerChargersandAdapters,Audio,AUXpowerandIndustrialpower.AlsosuitableforPFCstageinConsumerapplicationsandSolar.

Pleasenote:ForMOSFETparallelingtheuseofferritebeadsonthegateorseperatetotempolesisgenerallyrecommended.

Table1KeyPerformanceParametersParameter Value UnitVDS @ Tj=25°C 800 V

RDS(on),max 0.28 Ω

Qg,typ 36 nC

ID 17 A

Eoss @ 500V 4 µJ

VGS(th),typ 3 V

ESD class (HBM) 2 -

Type/OrderingCode Package Marking RelatedLinksIPA80R280P7 PG-TO 220 FullPAK 80R280P7 see Appendix A

2

800VCoolMOSªP7PowerTransistorIPA80R280P7


TableofContentsDescription . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

Maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

Thermal characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

Electrical characteristics diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

Test Circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

Package Outlines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

Appendix A . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

Disclaimer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

3



1MaximumratingsatTj=25°C,unlessotherwisespecified

Table2MaximumratingsValues

Min. Typ. Max.Parameter Symbol Unit Note/TestCondition

Continuous drain current1) ID --

--

1710.6 A TC=25°C

TC=100°C

Pulsed drain current2) ID,pulse - - 45 A TC=25°C

Avalanche energy, single pulse EAS - - 43 mJ ID=2.2A; VDD=50V

Avalanche energy, repetitive EAR - - 0.36 mJ ID=2.2A; VDD=50V

Avalanche current, repetitive IAR - - 2.2 A -

MOSFET dv/dt ruggedness dv/dt - - 100 V/ns VDS=0to400V

Gate source voltage VGS-20-30

--

2030 V static;

AC (f>1 Hz)

Power dissipation Ptot - - 30 W TC=25°C

Operating and storage temperature Tj,Tstg -55 - 150 °C -

Mounting torque - - - 50 Ncm M2.5 screw

Continuous diode forward current IS - - 7 A TC=25°C

Diode pulse current2) IS,pulse - - 45 A TC=25°C

Reverse diode dv/dt3) dv/dt - - 1 V/ns VDS=0to400V,ISD<=3.6A,Tj=25°C

Maximum diode commutation speed3) dif/dt - - 50 A/µs VDS=0to400V,ISD<=3.6A,Tj=25°C

Insulation withstand voltage VISO - - 2500 V Vrms,TC=25°C,t=1min

2Thermalcharacteristics

Table3ThermalcharacteristicsValues


Thermal resistance, junction - case RthJC - - 4.1 °C/W -

Thermal resistance, junction - ambient RthJA - - 80 °C/W leaded

Thermal resistance, junction - ambientfor SMD version RthJA - - - °C/W n.a.

Soldering temperature, wavesolderingonly allowed at leads Tsold - - 260 °C 1.6 mm (0.063 in.) from case for 10s

1) TO220 equivalent. Limited by Tj max. Maximum duty cycle D=0.52) Pulse width tp limited by Tj,max3)VDClink=400V;VDS,peak<V(BR)DSS;identicallowsideandhighsideswitchwithidenticalRG;tcond<2µs

4



3ElectricalcharacteristicsatTj=25°C,unlessotherwisespecified

Table4StaticcharacteristicsValues


Drain-source breakdown voltage V(BR)DSS 800 - - V VGS=0V,ID=1mA

Gate threshold voltage VGS(th) 2.5 3 3.5 V VDS=VGS,ID=0.36mA

Zero gate voltage drain current IDSS --

-10

1- µA VDS=800V,VGS=0V,Tj=25°C

VDS=800V,VGS=0V,Tj=150°C

Gate-source leakage curent incl. zenerdiode IGSS - - 1 µA VGS=20V,VDS=0V

Drain-source on-state resistance RDS(on)--

0.240.62

0.28- Ω VGS=10V,ID=7.2A,Tj=25°C

VGS=10V,ID=7.2A,Tj=150°C

Gate resistance RG - 1 - Ω f=250kHz,opendrain

Table5DynamiccharacteristicsValues


Input capacitance Ciss - 1200 - pF VGS=0V,VDS=500V,f=250kHz

Output capacitance Coss - 20 - pF VGS=0V,VDS=500V,f=250kHz

Effective output capacitance, energyrelated1) Co(er) - 38 - pF VGS=0V,VDS=0to500V

Effective output capacitance, timerelated2) Co(tr) - 490 - pF ID=constant,VGS=0V,VDS=0to500V

Turn-on delay time td(on) - 10 - ns VDD=400V,VGS=13V,ID=7.2A,RG=4.7Ω

Rise time tr - 6 - ns VDD=400V,VGS=13V,ID=7.2A,RG=4.7Ω

Turn-off delay time td(off) - 40 - ns VDD=400V,VGS=13V,ID=7.2A,RG=4.7Ω

Fall time tf - 5 - ns VDD=400V,VGS=13V,ID=7.2A,RG=4.7Ω

Table6GatechargecharacteristicsValues


Gate to source charge Qgs - 5 - nC VDD=640V,ID=7.2A,VGS=0to10V

Gate to drain charge Qgd - 15 - nC VDD=640V,ID=7.2A,VGS=0to10V

Gate charge total Qg - 36 - nC VDD=640V,ID=7.2A,VGS=0to10V

Gate plateau voltage Vplateau - 4.5 - V VDD=640V,ID=7.2A,VGS=0to10V

1)Co(er)isafixedcapacitancethatgivesthesamestoredenergyasCosswhileVDSisrisingfrom0to500V2)Co(tr)isafixedcapacitancethatgivesthesamechargingtimeasCosswhileVDSisrisingfrom0to500V

5



Table7ReversediodecharacteristicsValues


Diode forward voltage VSD - 0.9 - V VGS=0V,IF=7.2A,Tf=25°C

Reverse recovery time trr - 1200 - ns VR=400V,IF=3.6A,diF/dt=50A/µs

Reverse recovery charge Qrr - 15 - µC VR=400V,IF=3.6A,diF/dt=50A/µs

Peak reverse recovery current Irrm - 24 - A VR=400V,IF=3.6A,diF/dt=50A/µs

6



4Electricalcharacteristicsdiagrams

Diagram1:Powerdissipation

TC[°C]

Ptot[W

]

0 25 50 75 100 125 1500

5

10

15

20

25

30

35

Ptot=f(TC)

Diagram2:Safeoperatingarea

VDS[V]

ID[A

]

100 101 102 10310-3

10-2

10-1

100

101

102

1 µs10 µs100 µs

1 ms

10 ms

DC

ID=f(VDS);TC=25°C;D=0;parameter:tp

Diagram3:Safeoperatingarea

VDS[V]

ID[A

]

100 101 102 10310-3

10-2

10-1

100

101

102

1 µs

10 µs100 µs

1 ms

10 ms

DC

ID=f(VDS);TC=80°C;D=0;parameter:tp

Diagram4:Max.transientthermalimpedance

tp[s]

ZthJC[K

/W]

10-5 10-4 10-3 10-2 10-1 10010-2

10-1

100

101

0.5

0.2

0.1

0.05

0.02

0.01

single pulse

ZthJC=f(tP);parameter:D=tp/T

7



Diagram5:Typ.outputcharacteristics

VDS[V]

ID[A

]

0 5 10 15 200

10

20

30

40

50

6020 V

10 V

8 V

7 V

6 V

5.5 V

5 V

4.5 V

ID=f(VDS);Tj=25°C;parameter:VGS

Diagram6:Typ.outputcharacteristics

VDS[V]

ID[A

]

0 5 10 15 200

5

10

15

20

25

30

3520 V10 V

8 V

7 V

6 V

5.5 V

5 V

4.5 V

ID=f(VDS);Tj=125°C;parameter:VGS

Diagram7:Typ.drain-sourceon-stateresistance

ID[A]

RDS(on

) [Ω]

0 10 20 30 400.40

0.50

0.60

0.70

0.80

0.90

1.00

5 V 5.5 V

6 V

6.5 V

7 V

10 V

RDS(on)=f(ID);Tj=125°C;parameter:VGS

Diagram8:Drain-sourceon-stateresistance

Tj[°C]

RDS(on

) [Ω]

-50 -25 0 25 50 75 100 125 1500.10

0.20

0.30

0.40

0.50

0.60

0.70

0.80

98%

typ

RDS(on)=f(Tj);ID=7.2A;VGS=10V

8



Diagram9:Typ.transfercharacteristics

VGS[V]

ID[A

]

0 2 4 6 8 10 120

5

10

15

20

25

30

35

40

45

50

25 °C

150 °C

ID=f(VGS);VDS=20V;parameter:Tj

Diagram10:Typ.gatecharge

Qgate[nC]

VGS [V]

0 10 20 30 400

1

2

3

4

5

6

7

8

9

10

120 V640 V

VGS=f(Qgate);ID=7.2Apulsed;parameter:VDD

Diagram11:Forwardcharacteristicsofreversediode

VSD[V]

IF [A]

0.0 0.5 1.0 1.5 2.010-1

100

101

102

25 °C125 °C

IF=f(VSD);parameter:Tj

Diagram12:Avalancheenergy

Tj[°C]

EAS [mJ]

25 50 75 100 125 1500

5

10

15

20

25

30

35

40

45

50

EAS=f(Tj);ID=2.2A;VDD=50V

9



Diagram13:Drain-sourcebreakdownvoltage

Tj[°C]

VBR(DSS

) [V]

-75 -50 -25 0 25 50 75 100 125 150 175700

750

800

850

900

950

VBR(DSS)=f(Tj);ID=1mA

Diagram14:Typ.capacitances

VDS[V]

C[p

F]

0 100 200 300 400 50010-1

100

101

102

103

104

Ciss

Coss

Crss

C=f(VDS);VGS=0V;f=250kHz

Diagram15:Typ.Cossstoredenergy

VDS[V]

Eoss[µ

J]

0 100 200 300 400 500 600 700 8000

1

2

3

4

5

6

7

8

Eoss=f(VDS)

10



5TestCircuits

Table8DiodecharacteristicsTest circuit for diode characteristics Diode recovery waveform

t

V ,I

Irrm

IF

VDS

10 %Irrm

trrtF tS

QF QS

dIF / dt

dIrr / dt

VDS(peak)

Qrr = QF +QS

trr =tF +tS

VDS

IF

VDS

IF

Rg1

Rg 2

Rg1 = Rg 2

Table9SwitchingtimesSwitching times test circuit for inductive load Switching times waveform

VDS

VGS

td(on) td(off)tr

ton

tf

toff

10%

90%

VDS

VGS

Table10UnclampedinductiveloadUnclamped inductive load test circuit Unclamped inductive waveform

VDS

V(BR)DS

IDVDS

VDSID

11



6PackageOutlines

A2

H

b

D

c

b2

E

e1

e

L

Q

øP

L1

N

D1

A

DIM

A1

DOCUMENT NO.

Z8B00003319

2.5

REVISION

06

18-03-2016

ISSUE DATE

EUROPEAN PROJECTION

1.130

0.177

MIN

0.095

0.026

0.016

0.617

0.037

0.092

0.394

0.503

0.116

0.124

0.111

0.353

2.862.42

2.54 (BSC)

5.08

28.70

0.95

15.67

0.40

0.65

10.00

2.83

3.15

2.95

12.78

8.97

3

29.75

0.90

0.63

1.51

16.15

3.50

3.38

3.45

13.75

10.65

9.83

MILLIMETERS

MIN

4.50

2.34

MAX

4.90

2.85

0.113

0.100 (BSC)

0.200

3

1.171

0.059

0.636

0.025

0.035

0.419

0.136

0.133

0.138

0.541

0.387

0

INCHES

0.193

MAX

0.112

SCALE

5mm

0

2.5

b1 0.0370.95 1.38 0.054

b4 0.0260.65 1.51 0.059

b3 0.0260.65 1.38 0.054

DIMENSIONS DO NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.

Figure1OutlinePG-TO220FullPAK,dimensionsinmm/inches

12



7AppendixA

Table11RelatedLinks

• IFXCoolMOSWebpage:www.infineon.com

• IFXDesigntools:www.infineon.com

http://www.infineon.com/cms/en/product/promopages/designtools/index.html

http://www.infineon.com/p7

13



RevisionHistoryIPA80R280P7

Revision:2016-07-05,Rev.2.0

Previous Revision

Revision Date Subjects (major changes since last revision)

2.0 2016-07-05 Release of final version

TrademarksofInfineonTechnologiesAG

AURIX™,C166™,CanPAK™,CIPOS™,CoolGaN™,CoolMOS™,CoolSET™,CoolSiC™,CORECONTROL™,CROSSAVE™,DAVE™,DI-POL™,DrBlade™,EasyPIM™,EconoBRIDGE™,EconoDUAL™,EconoPACK™,EconoPIM™,EiceDRIVER™,eupec™,FCOS™,HITFET™,HybridPACK™,Infineon™,ISOFACE™,IsoPACK™,i-Wafer™,MIPAQ™,ModSTACK™,my-d™,NovalithIC™,OmniTune™,OPTIGA™,OptiMOS™,ORIGA™,POWERCODE™,PRIMARION™,PrimePACK™,PrimeSTACK™,PROFET™,PRO-SIL™,RASIC™,REAL3™,ReverSave™,SatRIC™,SIEGET™,SIPMOS™,SmartLEWIS™,SOLIDFLASH™,SPOC™,TEMPFET™,thinQ™,TRENCHSTOP™,TriCore™.

TrademarksupdatedAugust2015

OtherTrademarks

Allreferencedproductorservicenamesandtrademarksarethepropertyoftheirrespectiveowners.

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WarningsDuetotechnicalrequirements,componentsmaycontaindangeroussubstances.Forinformationonthetypesinquestion,pleasecontactthenearestInfineonTechnologiesOffice.TheInfineonTechnologiescomponentdescribedinthisDataSheetmaybeusedinlife-supportdevicesorsystemsand/orautomotive,aviationandaerospaceapplicationsorsystemsonlywiththeexpresswrittenapprovalofInfineonTechnologies,ifafailureofsuchcomponentscanreasonablybeexpectedtocausethefailureofthatlife-support,automotive,aviationandaerospacedeviceorsystemortoaffectthesafetyoreffectivenessofthatdeviceorsystem.Lifesupportdevicesorsystemsareintendedtobeimplantedinthehumanbodyortosupportand/ormaintainandsustainand/orprotecthumanlife.Iftheyfail,itisreasonabletoassumethatthehealthoftheuserorotherpersonsmaybeendangered.

MOSFET - farnell.com · Final Data Sheet Rev. 2.0, 2016-07-05 PG-TO 220 FP Drain Pin 2, Tab Gate...

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Transcript of MOSFET - farnell.com · Final Data Sheet Rev. 2.0, 2016-07-05 PG-TO 220 FP Drain Pin 2, Tab Gate...