MJD112 Transistot Darlington
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Transcript of MJD112 Transistot Darlington
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©2001 Fairchild Semiconductor Corporation Rev. A2, June 2001
MJD
112
NPN Silicon Darlington TransistorAbsolute Maximum Ratings TC=25°C unless otherwise noted
Electrical Characteristics TC=25°C unless otherwise noted
* Pulse Test: PW≤300µs, Duty Cycle≤2%
Symbol Parameter Value Units VCBO Collector-Base Voltage 100 V VCEO Collector-Emitter Voltage 100 V VEBO Emitter-Base Voltage 5 V IC Collector Current (DC) 2 A ICP Collector Current (Pulse) 4 A IB Base Current 50 mA PC Collector Dissipation (TC=25°C) 20 W
Collector Dissipation (Ta=25°C) 1.75 W TJ Junction Temperature 150 °C TSTG Storage Temperature - 65 ~ 150 °C
Symbol Parameter Test Condition Min. Max. Units VCEO(sus) Collector-Emitter Sustaining Voltage IC = 30mA, IB = 0 100 V ICEO Collector Cut-off Current VCE = 50V, IB = 0 20 µA ICBO Collector Cut-off Current VCB = 100V, IB = 0 20 µA IEBO Emitter Cut-off Current VEB = 5V, IC = 0 2 mA hFE * DC Current Gain VCE = 3V, IC = 0.5A
VCE = 3V, IC = 2A VCE = 3V, IC = 4A
5001000 200
12K
VCE(sat) * Collector-Emitter Saturation Voltage IC = 2A, IB = 8mA IC = 4A, IB = 40mA
2 3
VV
VBE(sat) * Base-Emitter Saturation Voltage IC = 4A, IB = 40mA 4 V VBE(on) * Base-Emitter ON Voltage VCE = 3A, IC = 2A 2.8 V fT Current Gain Bandwidth Product VCE = 10V, IC = 0.75A 25 MHz
Cob Output Capacitance VCB = 10V, IE = 0 f = 0.1MHz
100 pF
MJD112
D-PAK for Surface Mount Applications• High DC Current Gain• Built-in a Damper Diode at E-C• Lead Formed for Surface Mount Applications (No Suffix)• Straight Lead (I-PAK, “ - I “ Suffix)• Electrically Similar to Popular TIP112
1.Base 2.Collector 3.Emitter
R1 10kΩ≅R2 0.6kΩ≅
Equivalent Circuit
B
E
C
R1 R2
D-PAK I-PAK1 1
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©2001 Fairchild Semiconductor Corporation
MJD
112
Rev. A2, June 2001
Typical Characteristics
Figure 1. DC current Gain Figure 2. Base-Emitter Saturation Voltage Collector-Emitter Saturation Voltage
Figure 3. Collector Output Capacitance Figure 4. Turn On Time
Figure 5. Turn Off Time Figure 6. Safe Operating Area
0.01 0.1 1 1010
100
1000
10000
VCE = 3V
h FE,
DC
CU
RR
ENT
GAI
N
IC[A], COLLECTOR CURRENT
0.01 0.1 1 100.01
0.1
1
10
IC = 250 IB
VCE(sat)
VBE(sat)
V BE(s
at),
VC
E(sa
t)[V]
, SAT
UR
ATIO
N V
OLT
AGE
IC[A], COLLECTOR CURRENT
0.1 1 10 1001
10
100
1000
Cob
[pF]
, CAP
ACIT
ANC
E
VCB[V], COLLECTOR-BASE VOLTAGE0.01 0.1 1 10
0.1
1
10
VCC=30VIC=250IB
tD
tR
t R
,t D[µ
s], T
URN
ON
TIM
E
IC[A], COLLECTOR CURRENT
0.01 0.1 1 100.1
1
10
VCC=30VIC=250IB
tF
tSTG
t STG,t F[µ
s], T
URN
OFF
TIM
E
IC[A], COLLECTOR CURRENT
1 10 100 10000.01
0.1
1
10
5ms
100µs1ms
DC
I C[A
], C
OLL
ECTO
R C
UR
REN
T
VCE[V], COLLECTOR-EMITTER VOLTAGE
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©2001 Fairchild Semiconductor Corporation Rev. A2, June 2001
MJD
112Typical Characteristics (Continued)
Figure 7. Power Derating
0 25 50 75 100 125 150 1750
5
10
15
20
25
P C[W
], PO
WER
DIS
SIPA
TIO
N
TC[oC], CASE TEMPERATURE
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Package Demensions
©2001 Fairchild Semiconductor Corporation Rev. A2, June 2001
MJD
112
Dimensions in Millimeters
6.60 ±0.20
2.30 ±0.10
0.50 ±0.10
5.34 ±0.30
0.70
±0.
20
0.60
±0.
200.
80 ±
0.20
9.50
±0.
30
6.10
±0.
20
2.70
±0.
209.
50 ±
0.30
6.10
±0.
20
2.70
±0.
20
MIN
0.55
0.76 ±0.10 0.50 ±0.10
1.02 ±0.20
2.30 ±0.20
6.60 ±0.20
0.76 ±0.10
(5.34)
(1.50)
(2XR0.25)
(5.04)
0.89
±0.
10
(0.1
0)(3
.05)
(1.0
0)
(0.9
0)
(0.7
0)
0.91
±0.
10
2.30TYP[2.30±0.20]
2.30TYP[2.30±0.20]
MAX0.96
(4.34)(0.50) (0.50)
D-PAK
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DISCLAIMERFAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANYPRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANYLIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN;NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORTDEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTORCORPORATION.As used herein:
©2001 Fairchild Semiconductor Corporation Rev. H3
TRADEMARKS
The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is notintended to be an exhaustive list of all such trademarks.
1. Life support devices or systems are devices or systemswhich, (a) are intended for surgical implant into the body,or (b) support or sustain life, or (c) whose failure to performwhen properly used in accordance with instructions for useprovided in the labeling, can be reasonably expected toresult in significant injury to the user.
2. A critical component is any component of a life supportdevice or system whose failure to perform can bereasonably expected to cause the failure of the life supportdevice or system, or to affect its safety or effectiveness.
PRODUCT STATUS DEFINITIONS
Definition of Terms
Datasheet Identification Product Status Definition
Advance Information Formative or In Design
This datasheet contains the design specifications forproduct development. Specifications may change inany manner without notice.
Preliminary First Production This datasheet contains preliminary data, andsupplementary data will be published at a later date.Fairchild Semiconductor reserves the right to makechanges at any time without notice in order to improvedesign.
No Identification Needed Full Production This datasheet contains final specifications. FairchildSemiconductor reserves the right to make changes atany time without notice in order to improve design.
Obsolete Not In Production This datasheet contains specifications on a productthat has been discontinued by Fairchild semiconductor.The datasheet is printed for reference information only.
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STAR*POWER is used under license
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