Microsystems Technology in Germany 2012

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MICROSYSTEMS TECHNOLOGY IN GERMANY2012

MIKROSYSTEMTECHNIK IN DEUTSCHLAND

2012

Impressum

Publisher/Herausgebertrias ConsultJohannes LüdersCrellestraße 31D – 10827 BerlinPhone +49 (0)30 - 781 11 52Mail [email protected] www.microsystems-technology-in-germany.de

LayoutUta Eickworth, BerlinMail [email protected] www.designcircle-berlin.de

Printing/DruckGrafi sches Centrum Cuno, Calbe2012, Printed in Germany

ISSN 2191-7183 (Printausgabe)

Picture Credits/Bildnachweis

Title/TitelAquaJelly: An artifi cial jellyfi sh with electric drive unitAquaJelly: Eine künstliche Qualle mit elektrischem AntriebSource/Quelle: Festo AG

Page/Seite

8Electronic packaging for a multifunctional boardAufbautechniken im multifunktionalen BoardSource/Quelle: Fraunhofer IZM/ Bernd Müller

17Optical measurement of placement accuracy and structures for chip embeddingOptische Vermessung von Bestücktoleranzen und Strukturen für das Chip-EmbeddingSource/Quelle: Fraunhofer IZM/ Bernd Müller

43Source/Quelle: VDE/VDI-GMM

64Three metal columns printed with the StarJet systemDrei mit dem StarJet-System gedruckte MetallsäulenSource/Quelle: IMTEK & HSG-IMIT/Bernd Müller

87Magnetoresisitve sensors for path and angle measurementMagnetoresistiver Sensor für Weg- und WinkelmessungSource/Quelle: Sensitec GmbH

117Ultra low power RF module (based on FR4) for MICSUltra low power RF Modul (auf FR4) für MICSSource/Quelle: Micro Systems Engineering GmbH

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Table of Contents

6 Welcoming Address Grußwort Prof. Dr.-Ing. Dr. Sc. techn.

Klaus-Dieter Lang, Fraunhofer IZM

8 Positioning in International Competition

Zur Positionierung im internationalen Wettbewerb

10 Germany Trade and Invest: Germany: Europe’s Key Market and Leading Innovator

12 Volker Nestle, Festo AG & Co.KG: Microsystems Technology in Industrial Applications14 VDE/VDI-GMM: Microsystems Technology Drives Innovation in Leading

Markets Mikrosystemtechnik – Innovationstreiber für Leitmärkte

17 Contributions to Topical Fields of InnovationBeiträge zu aktuellen Innovationsfeldern

18 Klaus-Dieter Lang et al., Fraunhofer IZM: Innovation Driver of the Next Decade: Technology Fol-

lows Application24 Stefan Gurke, ZVEI: Smart System Integration for Cyber-Physical Systems26 Klaus Meder, Robert Bosch GmbH: Smart System Integration

28 Thomas Kilger et al., Infi neon AG: From More Moore to More than Moore:

Integrating Smart Systems in eWLB 30 Susan Anson, Karlsruhe Institute of Technology: Multiplying Potential: Nanotechnology as Enabler

for Microsystems32 Helmut F. Schlaak et al., Technische Universität Darm-

stadt: Micro Nano Integration – Nano enhanced

Microsystems - Nanofi bre bundles for Smart Sensors

34 Arnim Klumpp et al., Fraunhofer EMFT: Heterogeneous System Integration for

Semiconductor Sensors 36 Dominik Kaltenbacher, Jonathan Schächtele,

Fraunhofer IPA: Piezoelectric Micro Actuator for a New Hearing

Aid Implant38 Nils Heininger, LPKF Laser & Electronics AG: Three-dimensional Circuit Boards

for New Products40 Peter Woias, IMTEK: Micro Energy Harvesting: Solving our „Small Scale

Energy Crisis“

43 The German Congress on Microsystem Technologies 2011

Der Deutsche Mikrosystem-technik-Kongress 2011

44 Rolf Slatter, Sensitec GmbH: Magnetic Microsystems in Industrial, Automotive

and Space Applications46 Nils Lass et al., IMTEK: Rapid Prototyping of 3D Microstructures

by Direct Printing of Liquid Metal

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48 Steffen Kurth et al., Fraunhofer ENAS: Tunable Fabry-Pérot Interferometers for Infrared

Spectroscopy50 Matthias Staab et al.,

Technische Universität Darmstadt: Miniaturized Signal Switching Matrix Based

on Bistable Micro Relays 52 Albrecht Urbaszek et al, Biotronik SE & Co. KG: Implantable Pressure Sensor as a Key Element

for New Therapeutic Approaches to Heart Failure – the COMPASS Project

54 Alexander Frey, Ingo Kuehne, Siemens AG: Energy Autonomous Microsystems for Automotive

Applications56 Krystan Marquardt et al., Fraunhofer IZM: Developement of Integrated Micro-scale Buffer

Batteries - Li4Ti5O12 LiMn2O4 Cells with Organic Gel Electrolyte

60 Ole Woitschach et al., University of Bremen: Smart Micropumps – Integration of a Flow Sensor

into a Micropump62 Stefan Vonderschmidt, Jörg Müller,

Technical University of Hamburg: Miniaturized Paramagnetic Oxygen Sensor

64 Results and Portfolios of Research Institutions

Ergebnisse und Leistungen aus Forschungseinrichtungen

66 Fraunhofer IOF: Solutions with Light – Embedded Optical Systems

as Multifunctional Tools68 Karlsruhe Institute of Technology (KIT): User Facilities for Advanced Micro Nano

Technologies

70 Fraunhofer IPMS: Photonic Smart Systems: New Opportunities

for Smart System Integration 71 Ferdinand-Braun-Institut: Hybrid Micro Integration at Ferdinand-Braun-Institut,

Berlin72 Fraunhofer ENAS: Smart Systems for Different Applications from

Fraunhofer ENAS74 Hahn-Schickard-Gesellschaft für angewandte

Forschung e.V. 76 Fraunhofer IAF: Aluminum Nitride – Nanodiamond Transducers

for RF Electronics and Energy Harvesting 78 Institut fuer Mikrotechnik Mainz 80 Fraunhofer ISC: Printable Functional Inks for Microsystems 82 NMI Reutlingen: micro nano bio –Microsystems and Nanotechniques

for Life Science84 Ilmenau University of Technology: IMN MacroNano® A Partner in Research and

Development86 Bayerisches Laserzentrum GmbH: Fiber-optical Sensors for Analysis of Liquids

87 Innovations and Competencies of Companies

Innovationen und Kompetenzen aus Unternehmen

88 First Sensor AG: Optimum Radiation Detection in the OR 90 InfraTec GmbH: Basics and Application of Tuneable Infrared Detectors

with Integrated Micromachined Fabry-Pérot Filter

Table of Contents

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94 X-FAB Semiconductor Foundries AG: Ready-To-Use MEMS – Innovations

at X-FAB 96 UST Umweltsensortechnik GmbH: Energy Savings through Ventilation as Needed 97 Micronas GmbH: Chip-integrated Micro Fuel Cells 98 AppliedSensor GmbH: Micromachined Metal Oxide Semiconductor and Field

Effect Sensors for Automotive, HVAC and Consumer Applications

99 GEMAC – Gesellschaft fuer Mikroelektronikanwendung Chemnitz mbH:

Meeting the Challenges of Modern Production Systems with GEMAC’s MEMS Based Sensor Products

100 Carl Zeiss MicroImaging GmbH: Spectral Sensing Made Easy –

with Compact Spectrometers from Carl Zeiss Spektralsensorik leicht gemacht –

mit Kompaktspektrometern von Carl Zeiss102 LIMO Lissotschenko Mikrooptik GmbH: 20 Years of Expertise in Photonics103 AMO GmbH: Integrated Silicon Nanophotonics 104 Micro-Hybrid Electronic GmbH: Innovative Technologies for Optical Components Innovative Technologien für optische Komponenten105 LPKF Laser & Electronics AG: Producing with Light106 Micro Systems Engineering GmbH: Micro Systems Engineering GmbH – Partner and

Specialist for Advanced Electronics108 Rohwedder Micro Assembly GmbH: Flexible Microsystem Assembly with 6 Variances

in Nano Range109 SENTECH Instruments GmbH: Advanced ICP Plasma Etch and Deposition Systems

in Microsystems Technology for Structuring of Silicon, Quartz and Glass

110 Physik Instrumente (PI) GmbH & Co. KG: 3D Laser Lithography in Biotechnology and

Medical Technology111 Polytec GmbH: Analyzing Ultra-high Frequency Mechanical

Motion of MEMS 112 NanoFocus AG: Reliable Surface Inspection114 YXLON International GmbH: Advantages and Possibilities of X-ray Technology

in inspecting Microsystems Die Vorteile und Möglichkeiten der Röntgentechnik

bei der Prüfung von Mikrosystemen116 Siegert Thinfi lm Technology GmbH: A Highly Sensitive Functional Layer Based

on Nickel Containing Diamond Like Carbon (Ni:a-C:H) Thin Film for very High Pressure Sensors

117 Networks between Research and Industry

Netzwerke zwischen Forschung und Industrie

118 ZVEI – Fachverband Electronic Components and Systems120 VDMA Micro Technology 122 IVAM Fachverband für Mikrotechnik124 AMA Fachverband für Sensorik e. V.126 MicroTEC Südwest128 TSB Innovationsagentur Berlin GmbH 130 MNT Mikro-Nanotechnologie Thüringen e. V.

Inhaltsverzeichnis

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Preface

A world without microsystems is unthink-able these days and its presence in our lives will increase permanently. In the future, more and more products will be fi tted with sensors, which, just like the human senses, record signals from the environment. These signals are processed electronically and relayed to devices for display on monitors such as in navigation devices or to techni-cal processes such as smart metering. However, users should not be able to discern the sophisticated electronics and microsystem technology under-pinning the devices and systems they enjoy. The electronics of tomorrow has to operate reliably and merge with the product in terms of both material and formfactor.

To make this possible, microelectronic and microsystem products have to be extremely versatile, miniaturized,

multifunctional, robust and durable. Another recently emerging aspect must also be considered. Future microsys-tem technology will merge more and more with the application system and their operation environment. The time of stand-alone, retrospectively attached components is changing to completely integrated electronic systems that are adapted specifi cally for the application system in question. Germany’s broad outstanding industry structure and ex-ceptional research environment provide an excellent basis for cross-sector inno-vations (e.g. medical monitoring systems combined with security and identifi cation systems).

Germany’s high tech industry has emerged comparatively unscathed from the 2009 fi nancial crisis. A balanced industry structure was certainly one reason for this. The majority of German

manufacturing takes place in the elec-tronics, mechanical engineering, medical techniques and the automotive indus-tries and it is these sectors that stand to benefi t from the integration of microsys-tems into fi nal products. Examples of the challenges facing German research and industrial development and the solutions to meet these are outlined in the chapter “The Challenge of Application”.

The abundance of know-how offered by Germany’s industry and science are illustrated below by selected presenta-tions from the Microsystem Technology Congress 2011 and by examples of different solutions developed by compa-nies and research institutes.

I hope you’ll fi nd the contributions inspiring and perhaps you’ll obtain ideas or knowledge to improve your own prod-ucts by microsystem technology.

Invisible, yet Indispensible: Micro System Technology

Prof. Dr.-Ing. Dr. sc. techn.

Klaus-Dieter Lang

With best regards

Klaus-Dieter LangDirector of the Institute Fraunhofer IZM

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Grußwort

Mikrosystemtechnik ist aus dem täg-lichen Leben nicht mehr wegzudenken. Und dieser Trend hält ungebrochen an. Immer mehr Produkte werden in Zukunft Sensoren enthalten, die wie die Sinnesorgane Signale aus der Umwelt aufnehmen. Diese Signale werden elektronisch aufbereitet und wie etwa bei Navigationsgeräten dem Menschen grafi sch dargestellt oder an technische Prozesse etwa zur Heizungssteuerung weitergeleitet. Von dieser ausgeklügelten Elektronik und Mikrosystemtechnik darf der Nutzer nichts merken. Zukünftige Elektronik muss zuverlässig funktionie-ren und in Material und Form mit dem Produkt verschmelzen.

Damit dies möglich ist, müssen die Mikrolektronik- und Mikrosystemtechnik-produkte extrem vielseitig und miniatu-risiert sowie multifunktional, robust und langlebig sein. Hinzu kommt ein neuer

Aspekt. Zukünftige Mikrosystem technik wird immer mehr in dem Anwendungs-system aufgehen. Die Zeit der eigen-ständigen, nachträglich montierten Kom-ponenten wird abgelöst von vollständig integrierten und an das Anwendungs-system angepassten Elektroniken. Die breite Branchenstruktur und die ausgezeichnete Forschungsinfrastruktur in Deutschland bieten eine hervorra-gende Grundlage für branchenüber-greifende Innovationen (etwa medizini-sche Überwachungssysteme kombiniert mit Sicherheits- und Identifi kations-systemen).

Der Industriestandort Deutschland hat die Krise 2009 vergleichsweise unbe-schadet überstanden. Zu Gute kam dem Standort dabei die ausgeglichene Branchenstruktur. Unternehmen der Elektrotechnik, des Maschinenbaus und der Fahrzeugtechnik sowie der chemi-

schen Industrie stellen den Großteil der produzierenden Betriebe. In der Zukunft werden eben diese Branchen von der Integration von Mikrosystemtechnik in ihre Produkte profi tieren. Anforderungen und Lösungsansätze der deutschen Forschung und Industrie sind im Kapitel „Herausforderung Anwendung“ exemp-larisch dargestellt.

Welche Fülle an Know-how in Deutsch-lands Industrie und Forschungs-einrichtungen vorliegen, zeigen die ausgewählten Beiträge des Mikrosys-temtechnikkongresses 2011 sowie die Beispiele aus Firmen und Forschungs-einrichtungen.

Ich wünschen dem Leser eine inter-essante Lektüre und hoffentlich viele Anregungen, wie mit Mikrosystemtech-nik die eigenen Produkte verbessert werden können.

Unsichtbar, aber unverzichtbar: Innovative Mikrosystemtechnik

Mit besten Grüßen

Klaus-Dieter LangInstitutsleiter Fraunhofer IZM

Positionierung im internationalen Wettbewerb

Positioning in International

Competition

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Positioning in International Competition

Germany: Europe’s Key Market and Leading Innovator

Germany is all set to enter a new stage in the history of microelectronics. As you will be told by representatives of the industry in this publication, one of the greatest innovation drivers in micro-electronics and microsystems techno-logy (MST) over the next years will be a paradigm called ”More than Moore“. In short, this trend goes beyond the increase of effi ciency in digital electro-nics known as “Moore’s Law”. Instead, it consists of new microsystem ideas such as micro-electro mechanical systems (MEMS), which is the coupling of microelectronic systems with sen-soric and mechanical functionalities. This development is a great chance for Germany, a leading high-tech nation with a long tradition in microelectronics and great innovative strengths. These strengths lead experts to forecast an increase of Germany’s global market share in microsystems technology to an impressive 21% in 2020. The annual CAGR during the coming decade is estimated at 9%, with turnover increas-ing from EUR 100 billion in 2010 to EUR 235 billion in 2020. The number of employees in the industry is expected to increase from 750,000 to over 960,000. The German Federal Ministry of Education and Research (BMBF) currently supports around 500 projects with EUR 184 million worth of funding. This underlines the fact that the German government stands behind this trend and is committed to strengthening Ger-many as a technology location through fi nancial support and other industrial policy measures. International compa-nies are welcome to join in on the path of technological progress.

Market drivers and applicationsMST is a part of our everyday lives. That is why the German government has provided EUR 80 million for MST in 2010 alone under the “Information and Communication Technologies (ICT 2020)” program. Various additional programs for sub-areas are available, following the strategic patterns of the constantly expanding global MST market. One of the main patterns of this sector is its cross-technology nature which translates into an impressively wide range of applica-tions, as the following examples will outline.

MedicalTake medical MST. As Germany is Europe’s most populous country and largest health care market, top German R&D institutes and companies play a leading role in developing ever-smaller therapeutic implant appli cations – examples include cardiac pace makers, or glucose MEMS that pump insulin into the blood stream when needed. In combination with modern “lab on a chip” diagnosis techniques which deliver reliable analyses in no time, these new devices can monitor and prevent diseases without the patient being ad-mitted to a hospital. Drugs specifi cally prescribed according to individually conducted, highly accurate tests could make the treatments of widespread diseases such as Alz heimer’s or cardiovascular diseases far more successful and effi cient. Underlining its long standing as a globally leading industry, Germany’s medical MST community has gener-

ated a turnover of EUR 12.9 billion in 2010, which is expected to double by 2015.

MobilityMST is also revolutionizing mobility, in Ger many and elsewhere. In logistics, innovations such as RFID labels allow data on goods to be transmitted, read and stored through radio signals. Advan ced driver assistance systems avoid collisions on the road, thus saving lives and easing transportation for millions of people. The world-famous German automotive industry and its national and international suppliers are already integrating these systems into their products.Automotive MST has a market volume of EUR 30 billion in Germany today and is forecast to increase by 200% until 2020.


ActiGait, an implantable drop foot stimulator helping stroke patients to regain active movement. Source: Otto Bock Healthcare

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IndustryMachinery and equipment is another important application segment for MST. The meaningfulness of micro-systems technology for processes in this area is not to be underestimated, as turnover will reach EUR 47.1 billion in 2020, compared to EUR 17.2 billion in 2010.

The German MarketGermany’s MST industry consists of a large number of SMEs supported by innovative research institutes such as the Fraunhofer Society. This coopera-tive climate has helped Germany take a globally leading role in microsystems technology. MST products “Made in Germany” benefi t from an excellent international reputation thanks to a long tradition and an ongoing focus on high quality engineering. As a result, the attractiveness of the industry makes Germany the most important target market for European suppliers providing MST parts.The main German MST success story is Silicon Saxony, a technology and busi-

ness powerhouse in the eastern part of Germany. 250 companies with 20,000 employees have contributed to mak-ing Saxony the top semiconductor and microelectronics location in Europe, and one of the top fi ve worldwide.The German government is encouraging companies in innovation and product development by supporting MST app-lication centers: these institutes are created with the intention of building partnerships between science and busi-ness, and provide small and medium-sized companies with access to R&D

and production facilities. Such measures of establishing and supporting open industry clusters, and thus the bundling of essential future topics via long-term strategic cooperation programs, have been one of the strengths of Germany as a technology location for many years. It will be one of the major factors al-lowing national as well as international companies who invest in Germany to become global players of microsystems technology.

Germany Trade & InvestGermany Trade & Invest is the foreign trade and inward investment agency of the Federal Republic of Germany. Our mission is to promote Germany as a location for investments and to advise foreign companies on how to invest in German markets. With our team of industry experts, incentive specialists, and other investment-related services we assist companies in setting up business operations in Germany. At the same time, we also provide information on foreign markets for companies based in Germany, making Germany an ideal location for European headquarters. All investment services are treated with the utmost confi dentiality and provided free of charge.

Jonathan SchooManager Investment ConsultingElectronics & Microtechnology

MST-supported parking assistance systems make cars more comfortable and safer to drive

“More than Moore”: today’s MST chips offer cost-optimized and value-added system solutions for an ever wider range of applications

Germany Trade and Invest GmbHFriedrichstraße 60D – 10117 BerlinPhone +49 (0)30 - 200 099 - 0Fax +49 (0)30 - 200 099 - 111Mail [email protected] www.gtai.com

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In today’s industrial nations, global challenges have an increasing infl uence on societal change and infrastructure. As pointed out in Germany’s HighTech Strategy, these global challenges have to be faced in the fi elds of climate and energy, health and nutrition, mobility, safety and communication. In this envi-ronment, technological solutions and the supply of services play an increasingly important role.However, especially the objectives for new technology development have shifted dramatically in the past decade. The so called “triple bottom line perfor-mance” in terms of economical, ecologi-cal and social sustainability has entered the arena of mere technology deploy-ment for improved performance. This paradigm shift can easily be illustrated with the help of the manufacturing sector which can be held responsible for more than a third of the worldwide primary energy consumption in the developed countries and for this reason is one of the largest global origins of carbon dioxides. Hence, it very well makes sense to have a closer look on the concepts of future factories and the important role of Microsystems Technology in today’s and tomorrow’s industrial setting.To meet the demands of triple bottom line perfor-mance, future factory concepts focus on overall energy and resource ef-fi ciency. Likewise, fl exibility, customer orientation and

cost effi ciency have to be improved. To achieve social sustainability, the role and working environment of human in future production has to be reconsidered and redefi ned.Translating these overall objectives into course of action reveals that enormous efforts in technology advancement have to be realised, making Microsystems Technology the key enabling technology for future factory concepts:

✦ To increase fl exibility in terms of lot size and retooling, future modu-lar factory designs will consist of peripheral and intelligent modules that integrate sensors, actuators and IT to provide a real-time image of the production process and to allow fast adaptation and diagnostic functionality. For this purpose, basic functionalities as well as media and data interfaces have to be realized in

a holistic approach on the micro level in so called “Smart Systems”. As a result, installation time and effort will be reduced, thereby enhancing cus-tomer benefi t. Wireless technologies increase fl exibility for autonomous components, while intelligent energy management systems using micro energy harvester ensure long-term functionality and plant availability.

✦ A responsible consumption of resources in production plants goes along with the reduction of size, volume and mass of the compo-nents and sub-systems in use. Consequently, packing density can be increased considerably. More-over, the installation of lightweight components on moving parts offers more fl exibility in the production process and leads to an overall gain in productivity.

Microsystems Technology in Industrial Applications


Picture 1:Bionic Handling Assistant for Human-Machine-Interaction (Source: Festo)

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✦ Physics is a strong driver for minia-turisation, especially with regards to the implementation of new sen-sor principles. As the emphasis of physical quantities can change signifi cantly with the degree of miniaturisation, the implementation of highly effi cient sensors gets pos-sible. Typical examples can be given with the help of micro mass fl ow and humidity sensors that use surface area based effects and offer high dynamics, measurement accuracy and repeatability.

The synchronisation of societal and technical change will be one of the upcoming key chal-lenges as technology and human population close ranks more and more. The proceeding demo-graphic change is about to create enormous markets for service robotics and assistant systems. Numerous applications will pop up for example in the fi elds of Ambient Assisted Living (AAL), smart buildings, health care or agriculture. To make human-machine-interaction generally possible, service robots need to be smarter and more sensitive and anticipating than today. It is obvious that Microsystems Technology will provide the key know how for this purpose. Like shown for the manufactur-ing sector, the integration of sensors, actuators and IT, wireless communica-tion and energy effi ciency concepts will be essential for a new generation of service robotics to defi ne a new quality in human-machine interaction.

Recent studies predict that Microsys-tems Technologies will signifi cantly drive employment in Germany in the future. However, a broader understanding of these technologies is needed regarding the upcoming challenges of the socio-economical changes discussed above. As a consequence, new possibilities for adding value with Microsystems Technology will arise on the one hand while the related value chains will be-come more complex on the other hand. Accordingly, it will become more and more diffi cult for industrial players to hold

available all required resources along the value chain. Competitiveness will there-fore increasingly depend on the network capabilities and the willingness to open innovation processes. The strong focus of Germany’s HighTech Strategy on the funding of regional innovation networks in sectoral concentrations shows that policy makers have acknowledged this

trend and seriously support its imple-mentation. In such a way, the “Spitzen-cluster MicroTEC Südwest” concen-trates numerous actors of academia and industry along the complex value chains of Microsystems Technology, making each of them more innovative and suc-cessful in the global competition.

For Germany as a location for industry, business and academia, Microsystems Technology will remain the vital driver for innovation to cope with the global chal-lenges that lie ahead.


Dr. Volker Nestle

Dr. Volker NestleHead of MicrosystemsFesto AG & Co. KGRuiter Str. 82D – 73734 EsslingenPhone +49 (0)711 - 347-3774Fax +49 (0)711 - 347 54 3774Mail [email protected] www.festo.com

Picture 2: Modular and fl exible production system for laboratory automation (Source: Festo)

With a worldwide market volume in the triple-digit billion-euro range and double-digit growth rates, microsystems technology (MST) is one of the biggest markets of the future. And the leveraging effect of MST applications – estimated at 25 times that volume – is even more important. All in all, MST ranks as one of the leading cross-disciplinary technolo-gies of the 21st century. This especially applies to sensor systems. The by far strongest impulses the VDE is going to expect from those leading markets which are particularly dependent on the development success of microsystems technology, such as energy effi ciency, smart grids and medical technology.

By now, microsystems technology has penetrated numerous spheres of our daily life, even if users still may not be aware of that fact. Microtech-nical components are long since a mass market, and appear in products such as ink-jet pressure injectors, CD/DVD scanners, deceleration sen-sors for triggering airbags, and laser measurement systems for automation systems, minimally invasive medical procedures and in optics. MST also makes possible new production pro-cesses in nanometer dimensions, and is transforming traditional industries such as high-precision engineering and tool manufacturing for state-of-the-art injec-tion molding. Since a long time, Germany has been the technology leader for integrated systems solutions and, among Euro-pean locations, continues to hold by far an outstanding position in the fi eld

of microelectronics and microtechnol-ogy. Even the future forecasts for the turnover in Germany and abroad as well as for the number of employees are positive about average. Thus, accord-ing to a Prognos-inquiry, in this decade the number of jobs directly or indirectly linked to microsystems technology will increase by more than a fourth from 754,000 in 2011 to 963,000 in 2020. In the same period of time, Germany’s market share of the worldwide turnover in microsystems technology will grow from 19 to 21 percent. Microsystems technology will undoubtedly continue to be a major key to Germany’s success in leading markets of the future. It will act as an engine in such branches of industry which have traditionally been strong in Germany and Europe, but at the same time it opens new potentials

for future markets. The applications of micro systems technology cover such fi elds as automotive, the automation sector, medical technology, they include products from the information and communication technology, products from the consumer industry and Life Sciences as well as newer product developments in the medical-technical and biological domain, but also in aviation and aerospace or in optics. In those branches the percentage of microsystems technology share in the value creation chain is supposed to increase.

To optimally exploit the potential of Ger-man science and build bridges between research and future markets, the Ger-man government’s high-tech strategy has designated microsystems tech-

VDE: Microsystems technology drives economic and technical progress in Germany and Europe

Microsystems Technology Drives Innovation in Leading Markets

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Dipl.-Ing. Dipl. Wirtsch.-Ing. Dirk Friebel,

Vorstandsvorsitzender der VDE/VDI

Gesellschaft GMM;Interim Manager,

Neuss

© Fraunhofer IIS

15


Mikrosystemtechnik – Innovationstreiber

für Leitmärkte

nology as the forerunner for intelligent products. It is orienting its MST program toward meeting important needs in the areas of environment, healthcare and resource effi ciency. The VDE and the Federal Ministry for Education and Research (BMBF) are already partners in many areas, such as the VDE/BMBF Microsystems Technology Congress and in precompetitive networking projects.

The VDE/VDI Society of Microelec-tronics, Microsystems and Precision Engineering (GMM) brings together a broad network of microsystems technol-ogy experts organized in a number of specialist divisions. The GMM serves as a crucial interface for the cross-disciplin-ary exchange of expertise. In doing so, it supports the growth of the “micro-systems cross-section-technology” in Germany with position papers, work-shops, conferences and promotional initiatives.

The optimal focus and fi ne-tuning of innovation policies is especially impor-tant for microsystems technology, since the fi eld also has a major impact on Germany’s competitive position in other key technologies and markets. In order to fully utilize the impressive potential of microsystems technology, one must further develop and expand the knowl-edge network, give highest priority to research needs in innovation fi elds, and tackle hindrances to innovation such as bureaucracy and the shortage of engineers. This is the only way how considerable potential of microsystems technology can fully be realized.

Die Mikrosystemtechnik ist mit einem weltweiten Marktvolumen im dreistelli-gen Milliardenbereich und zweistelligen Wachstumsraten einer der großen Zukunftsmärkte. Von noch größerer Bedeutung ist der bemerkenswerte Hebeleffekt für MST-Anwendungen, der auf das 25-fache geschätzt wird. Damit zählt die Mikrosystemtechnik zu den wichtigsten Querschnittstechnologien des 21. Jahrhunderts. Dies gilt insbe-sondere für das Gebiet der Sensorik. Die weitaus größten Standortimpulse erwartet der VDE in den Leitmärkten, die besonders stark auf Entwicklungserfolge in der Mikrosystemtechnik angewiesen sind: Energieeffi zienz, E Mobility, Smart Grids und Medizintechnik. Die Mikrosystemtechnik hat inzwi-schen viele Bereiche des täglichen Lebens durchdrungen, ohne dass

es den Nutzern bewusst ist. Längst haben mikrotechnische Komponenten einen Massenmarkt geschaffen: z.B. als Tintenstrahl-Druckknöpfe, als CD/DVD-Abtastköpfe, als Beschleunigungs-sensoren zur Auslösung von Airbags, in Lasermesssystemen in der Automation, in der minimal invasiven Medizin oder in der Optik. Darüber hinaus entstehen durch Mikrosystemtechnik auch neue Fertigungs- und Produktionsverfah-ren, die bis in den Nanometerbereich reichen. Diese verändern derzeit traditionelle Branchen wie die Feinwerk-technik oder die Herstellung von Werk-zeugen für den modernen Spritzguss.Deutschland ist seit vielen Jahren Technologieführer bei integrierten Systemlösungen und mit Abstand der bedeutendste europäische Standort für Mikroelektronik und Mikrotechnik.

Dr. Ronald Schnabel, Geschäftsführer, VDE/VDI-Gesellschaft GMM

© Fraunhofer IZM

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Auch die Zukunftspro-gnosen für den Umsatz im In- und Ausland und für die Beschäftigten-zahlen in Deutschland sind überdurchschnittlich positiv. So wird einer Prognos-Umfrage zufolge die Zahl der direkt oder indirekt mit der Mikrosys-temtechnik verbundenen Arbeitsplätze in dieser Dekade um mehr als ein Viertel von 754.000 im Jahr 2011 auf 963.000 im Jahr 2020 steigen. Im gleichen Zeitraum soll der Marktanteil Deutschlands am weltweiten Gesamtumsatz der Mikro-systemtechnik von 19 auf 21 Prozent wachsen.

Ohne Zweifel bleibt die Mikrosystem-technik für Deutschland ein wichtiger Schlüssel zum Erfolg in den Leitmärk-ten der Zukunft. Sie treibt Branchen an, in denen Deutschland und Europa traditionell stark sind, und eröffnet zugleich Potenziale in Zukunftsmärk-ten. Die Anwendungen der Mikro-systemtechnik erstrecken sich auf die Schlüssel branchen Automobil-, Automatisierungs- und Medizintech-nik, Produkte der Informations- und Kommunikations technik, auf Erzeugnisse aus dem Konsumgüterbereich und den Life Sciences sowie auf neuere Produkt-entwicklungen im medizintechnischen und biologischen Bereich, aber auch in der Luft- und Raumfahrt oder in der Optik. In diesen Bereichen wird auch der Anteil der Mikrosystemtechnik an der Wertschöpfung wachsen.

Um das Potenzial der deutschen Wissenschaft optimal zu nutzen und Brücken zwischen Forschung und Zu-kunftsmärkten zu schlagen, hat die Bun-desregierung die Mikrosystemtechnik als Wegbereiter für intelligente Produkte in die Hightech-Strategie aufgenommen und das Technologieprogramm Mik-rosystemtechnik kontinuierlich auf die wichtigen gesellschaftlichen Bedürfnisse in den Bereichen Umwelt, Gesundheit und Ressourceneffi zienz ausgerichtet. In vielen Bereichen arbeiten VDE und BMBF gerade in der Mikrosystemtechnik sehr erfolgreich zusammen, etwa im Rahmen des VDE/BMBF Kongresses Mikrosystemtechnik und in vorwett-bewerblich angesiedelten Netzwerk-Projekten.

Die VDE/VDI-Gesellschaft Mikroelektro-nik, Mikrosystem- und Feinwerktechnik (GMM) vereinigt ein weit verzweigtes Expertennetz auf dem breiten Gebiet der Mikrosystemtechnik, das sich in spezialisierten Fachgremien organisiert hat. Damit erfüllt die GMM eine wichti-

ge Funktion als Plattform für den fachlichen und Schnittstelle für den fachübergreifenden Austausch von Expertenwissen. Auf dieser Basis trägt die GMM mit Positionspapie-ren, Workshops, Tagungen und Initiativen zur Förderpolitik dazu bei, die Querschnittstechnologie Mikrosystemtechnik in Deutschland zu stärken.

Die richtige Fokussierung und Justierung innovationspolitischer Maßnahmen ist gerade in der Mikrosystemtechnik von heraus-

ragender Bedeutung. Denn sie wirkt sich auch auf die Wettbewerbsposition Deutschlands in weiteren Spitzentech-nologien und Leitmärkten aus. Deshalb müssen die Wissensnetzwerke weiter ausgebaut und die Forschungsförderung auf Innovationsfeldern mit höchster Pri-orität versehen werden. Darüber hinaus gilt es, bürokratische Innovationshürden abzubauen und Ingenieurslücken zu schließen. Nur so können die beachtli-chen Potenziale der Mikrosystemtechnik voll ausgeschöpft werden.

VDE/VDI-Gesellschaft Mikroelektronik, Mikrosystem- und Feinwerktechnik (GMM) Dr. Ronald Schnabel Stresemannallee 15 D – 60596 Frankfurt Phone +49 (0)69 - 6308 - 227 / 330 Fax +49 (0)69 - 6308 - 9828 Mail [email protected] Web www.vde.com/gmm

© Robert Bosch GmbH

Contributions to Topical Fields of Innovation

Beiträge zu aktuellen Innovationsfeldern

Innovation Driver of the Next Decade: Technology Follows Application

1 IntroductionThe use of micro--level integration technologies to manufacture high-end systems (such as in microelectronics, microsystem technology and sensor technology) has increased dramati-cally around the world. Little wonder, as their potential for application is almost infi nite. Particularly the automotive and mobile communications industries were advancing development in this area. The trend towards increasing the benefi ts of a product is also leading to a fast growing demand for integration of min-iaturized sensors, autonomous power

supplies and standardized communica-tion functions in other sectors, such as safety and security, energy and medical engineering.

This change is refl ected in national and international technology and product road maps, such as those of the German Electrical and Electronic Manufacturers’ Association (ZVEI) and the US-based IEEE. Such publications repeatedly speak of a fundamental change in the structure of our society. Optimally adapting electronics to the product and its typical application envi-

ronment is a basic requirement in such developments. The electronics should not get in the way of using the prod-uct or disturb the user in any fashion. Further high-tech products are expected from systems that are developed across sectors, such as wireless, miniaturized sensor and transmission systems for medical or living environment monitor-ing that are combined with security and identifi cation systems.In summary, development demands and the market show two main trends help-ing to shape the ongoing development of system integration technologies:

18

Klaus-Dieter Lang1,2, Harald Pötter1, Rolf Aschenbrenner1, Karl-Friedrich Becker1, Lars Boettcher1, Oswin Ehrmann1,2, Martin Wilke1, Michael Toepper1

1 Fraunhofer IZM, 2 Technische Universität Berlin


The future of system integrationToday: Discrete Components

Future: Integrated Systems

Communication Signal Transmission

Sensors Power Electronics

✦ Bogie control by multi sensors ✦ Energy supply of sensor by harvesting

rotation energy ✦ Wireless data transfer to on board unit ✦ Data assessment by on board unit

and transfer of signifi cant data to a service point

GPS Positioning

Intelligent and energy-self-suffi cient sensor system

Figure 1: Future system integration: Embedding of electronics in products, operating procedures and service concepts (based on a graphic of EPoSS – European Platform for Smart System Integration)

19


✦ Firstly, an ongoing increase in the number of functions directly included in a system, which include electrical, optical, mechanical, biological and chemical processes, combined with the demand for higher reliability and longer system lifetime.

✦ Secondly, increasingly seamless merging of products and electron-ics, which necessitates adapting electronics to predefi ned materials, forms and application environments. Only by these means systems sensors and signal processing can be implemented near to the point where signals are occurring. (which are often installed in extremely harsh environments).

2 The Status Quo and Trends in Electronic System Integration

The European semiconductor industry has largely abandoned the develop-ment of CMOS technology. Instead of broad-based applications, European

companies like Infi neon, ST and NXP are now pursuing, with increasing success, the development of customer-specifi c, multifunctional systems with the largest possible lot sizes. The key to such products is integrat-ing customer-specifi c components with various digital functions (such as memories and processors) into extremely small build spaces and/or including non-digital functions such as power electronics, high-frequency electronics or optoelectronics. Using standard CMOS technologies for such tasks would usually be too expensive or risky. Also in some cases it may be technological impossible. Consequently, developers are increasingly turning to heterogeneous and hybrid integration technologies. Heterointegration tech-nology is used to develop customer- specifi c solutions that can also be manufactured cost-effi ciently at medium lot sizes. Particularly SMEs across a wide range of industry sectors stand

to benefi t from this approach to turning ideas into products [1]. However, in the past, heterogeneous integration was too focused on develop-ing stand-alone systems, in which com-ponents are retrospectively integrated into the overall system (such as vehicles and machines). In the future, we can expect seamless merging of multifunc-tional electronics and the overall system (Figure 1).

3 Heterointegration Technologies for Application-Oriented Multifunctional Electronics

It follows that the heterointegration approach to developing application-oriented multifunctional electronics will begin with the end product and its functional requirements. Especially the synergy between application industries and suppliers of electronic functionalities is expected to give rise to great potential for innovation. This is especially the case for Germany’s industry, which strength

Phase 1 (1996-2000)On CMOS Wafer-Level-Redsitribution

Phase 2 (2000-2006)3D WLP with Through-Silicon-Vias

Phase 3 (2006-today)3D WLP with integrates Optics

Figure 2: Development Phases in Wafer-Level-Packaging. Right handed picture courtesy of Awaiba [7]


20

lies in the development of intelligent and customer-specifi c products. Comprehensively implementing this ap-proach necessitates new technologies and changes to the product develop-ment process. (1) In the integration of electronics and microsystems into the product, conventional technologies and processes can no longer meet the demands of extended functionality and expected product price. An increasing number of diffi culties are arising, particu-larly where non-electronic information or optical, mechanical, fl uid or chemi-cal signals have to be processed in often harsh application environments. (2) The merging of the electronics with the overall system will see the traditional system boundaries in research and the development of new products begin to dissolve. This includes a seamless communication along R&D interfaces as well as improved manufacturing logistics between companies throughout the supply chain. To realize this, the applica-tion industry, such as the medical, safety and security or energy sectors, will have to be included at the very beginning.Technologically, the approach includes a wide range of processes for physically integrating electronics into an application or product environment. Both simple components and microsystems can be used as subsystems and can be inte-grated into diverse environments, such as planar build spaces. Another pos-sibility is adapting extremely miniaturized systems to or into high-end products (e.g. aircraft or power plant turbines, medical care systems, systems for mon-itoring bridges and buildings, vehicle and rail drives) for innumerable purposes,

such as securing quality, performance, lifetime, originality.As SMEs often only manufacture such products in small or medium lot sizes, but at the same time want to price the product affordably, all these technolo-gies and manufacturing processes have to be optimized and integrated to meet the specifi cs of each company’s manu-facturing environment and needs. In micro- and nanotechnology, an ef-fi cient and optimized interplay between the material properties and the packag-ing technology is especially needed to meet the various application challenges outlined above. An additional diffi culty is that partial measuring and testing is gen-erally not possible due to the complexity and tight integration of varying system components. Consequently, successful development is generally only possible if the functional system design, mate-

rial and technology optimization and design for reliability are coordinated with each other at the very beginning of the development process. To illustrate these issues, the following discusses two main packaging technology areas set to play key roles in the future: wafer-level packaging and embedding technologies for polymer substrates. 4 Heterogeneous Integration on Wafer

LevelThe term Wafer-Level-Packaging (WLP) is in the broadest sense a synonym for adding layers on active electrical com-ponents like CMOS- or MEMS-Wafers for the next level of interconnect. In the optimal case these packages can be directly used after singulation in the system assembly as it is done since nearly twenty years with Flip Chips. In the case of sensors, front side

Sensor Wafer Process Path Optic Wafer Process Path

Detail Cs Detail Co

D

As Ao

Bs Bo

Cs Co

Figure 3: Manufacturing concept of Wafer Level Cameras

21


illuminated imagers as an example, the FC approach is not possible because the optical active side of the die is the same on which the electrical contacts are located. Flip Chip bonding such a device on an opaque substrate would therefore block the photodiodes from incoming light. Due to that fact image sensors have been wire bonded for a long time, even though FC technology was already commercially available for consumer products. With the development of Through Silicon Via (TSV) technology, it was possible to redistribute the electrical contacts to the backside of the device, making WLP accessible for image sen-sors and they became the fi rst products in which TSVs were industrially applied [5,8]. For the fabrication of a complete camera system the assembly of mul-tiple optical elements such as lenses, and apertures is necessary. Commonly used optics involves the mounting of optical elements in a lens barrel, which is screwed into a mount after the im-

age sensor is electrically connected to the substrate. The optic assembly is therefore a serial process and ongo-ing efforts are heading to a wafer level manufacturing to save manufacturing time and costs. In the following chap-ter the fabrication of camera systems is presented, where all electrical and optical parts are manufactured and inte-grated on wafer level. The development phases of WLP from basic redistribu-tion technology to fully integrated Wafer Level Cameras with TSVs are drafted in Figure 2.

Figure 3 shows a process fl ow how Wafer Level Cameras can be manu-factured and integrated. The process is divided into two parts. In the sensor wafer process path the CMOS wafer is permanently bonded to a glass wafer (Figure 3/Bs), which has to be part of the optical design. Subsequently the TSVs, the backside redistribution layer as well as the bumps are formed (Figure 3/CS). The enabling key technology for wafer

level packaging of camera systems based on top-side illuminated imagers are TSVs because these allow a redis-tribution on the backside of the wafer the active side remaining unaffected and being completely usable for the optic assembly. These process steps are discussed in detail by Wilke et al. [2,3].

In the lens process path one or multiple lenses are manufactured on wafer level. In Figure 3 the process fl ow for an opti-cal system with a single imprinted lens is drafted. The wafer level fabrication of the lens components is predominantly based on UV-replication. Here, an array-like tool accommodating the molds of the individual lens surfaces is brought into contact with a liquid polymer which hardens under exposure to UV-radiation. The integration of the optical elements requires aligned wafer bonding. Since the optical elements in the cameras need a tight vertical positioning to one each other, some kind of spacer struc-tures are needed. Depending on the

Figure 4: Packaged and diced lens cube consisting of three lens and one aperture layer with thinned CMOS imager.

Figure 5: Wafer-Level-Camera in

comparison to a USB connector.

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optical design, this requirement can be met with spacer wafers or by microma-chining spacer structures directly in the lens wafer. Figure 4 shows a packaged and diced lens cube with TSVs, Figure 5 the fi nal wafer level camera [2]. The camera can be used for endoscopic and automotive applications having a size of about 1mm x 1mm.

5 Heterogeneous Integration on System in Package Level

Integration on wafer level with a focus on through-silicon-via (TSV) technology is one of the most challenging topics in the packaging market today. However, the technology gap between standard chip interconnection technologies and through-silicon-via interconnects has to meet many requirements posing multiple challenges today. Therefore System in Packages (SiP) are a highly competitive

solution for heterogeneous designs, in which different functions have to be integrated. Because SiPs can rely on standardized processes there are less obstacles to expect on the levels of property issues, yield, testability and especially cost, as costs rise signifi cantly for WLP with higher complexity of the system [7].

Within the SiP approach embedding technologies offer the advantages of improved electrical performance, capa-bility of 3D-stacking, reduced package thickness, and enhanced thermal perfor-mance for components assembled on thermal interfaces and heat sinks. The emergence of embedding packages steadily changes the packaging value chain and consequently sets new roles for all players in the whole packaging value system [4].

The initial value share of substrate sup-pliers for production of FCBGA devices was about 20% but now with embed-ded technologies the substrate suppli-ers can also perform the assembly of components before embedding and thus count for 55% of the embedded package value [5]. However, it should be underlined, that the shift to embed-ding technologies marks also neces-sary adaptations to the supply chain which will potentially burden the value system. For instance, the necessity of RDL layer for chip pitch enlargement that makes chip components compat-ible with existing embedding capabilities

Figure 7: Embedded Power SiP

Figure 8: PCB with embedded MOSFET

Figure 6: Process fl ow for face up power component embedding

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or copper pad deposition should be defi nitely accounted for before the shift in embedded packages. Initial applica-tions for embedded packages will be low cost, low pin counts applications such as analog and power devices (DC/DC converters, Power MOSFETS etc.)[6]. There are forecasts for a half billion dollars extended market by 2015 [5].

The dominating technology for power chip embedding is a face-up technol-ogy (Figure 6). Chips are bonded with their backside (drain contact) to a cop-per substrate using highly conductive adhesive or solder. The combination of two or more embedded dies e.g. MOSFET or diodes, but also control-ler chips, results in embedded Power System-in-Packages (Figure 7). Here the embedding technology offers a variable technology platform for the real-ization of a large variety of packages on the same process line. New developments started toward the realization of complete and more com-plex power systems (Figure 8). The driv-

ers here are the high potential of com-pactness, robustness and high reliability of such systems. In the EU project “HERMES” one project goal aims to realize an embedded “control integrated power system” as an embedded power system. Such systems are used as motor controls for variable speed drives in industrial application such as washing machines and air condition-ers. Figure 9 shows a sketch of such a module. Parts of the system operate at voltages of 600 V and electric currents of 5-50 A, whereas other parts of the circuit operate at the moderate voltages and currents of state-of-the-art CMOS.

6 AcknowledgementsWe would like to thank the Federal Ministry of Education and Research of Germany (13N9416) for the fi nancial support of parts of the wafer level camera project and the European Commission for the fi nancial support of the HERMES (FP7-ICT-224611) project.

Fraunhofer Institute for Reliability and Microintegration (IZM) Prof. Dr.-Ing. Dr. sc. techn. Klaus-Dieter LangGustav-Meyer-Allee 25 D – 13355 BerlinPhone +49 (0)30 - 464 03 -100Fax +49 (0)30 - 464 03 -111Mail [email protected] izm.fraunhofer.de

Figure 9: Power module using DCB and PCB t echnologies

References[1] H. Reichl, R. Aschenbrenner, M. Töpper, H.

Pötter: Heterogeneous Integration; in Zhang, G.Q. (editor):More than Moore : Creating high value micro/nanoelectronics systems, Springer Netherland, Dordrecht 2009

[2] Wilke, M.; Wippermann, F.; Zoschke, K.; Toepper, M.; Ehrmann, O.; Reichl, H.; Lang, K.-D.: Prospects and limits in wafer-level-packaging of image sensors; in Proceedings of IEEE 61st Electronic Components and Technology Conference, ECTC 2011: Lake Buena Vista, Florida, USA, 31 May - 3 June 2011; 2011 proceedings, pp.1901-1907

[3] M.Wilke: 3D Wafer Level Packaging of Micro Camera Devices; Proceedings of 7th International Wafer Level Packaging Confer-ence 2010, Santa Clara, USA, October 2010, pp. 96-102

[4] L. Boettcher, D. Manessis, S. Karasz-kiewicz, T. Loeher and A. Ostmann: Modu-lar System Packaging by Embedding: Tech-nologies, Applications and Perspectives; in Proceedings of SMTA 2011 - International Conference and Exhibition: Fort Worth, Texas, 16.-20. October 2011.

[5] Yole Development report: Embedded Wafer-Level-Packages, 2010

[6] D. Manessis, L. Boettcher, A. Ostmann, K.-D. Lang, Embedded Power Dies for System in Package, in Proceedings of International Workshop on Power Supply On Chip, 13.-15. October, Cork, Ireland

[7] Courtesy of Awaiba. AWAIBA GmbH / Am Wegfeld 30 / 90427 Nürnberg / www.awaiba.de

[8] J. Leib, M. Töpper: New Wafer-Level-Packaging Technology using Silicon-Via-Contacts For Optical And Other Sensor Applications, Proceedings ECTC 2004, June 2004 New Orleans, USA

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In line with Moore’s Law, ongoing ad-vances in very large scale digital circuits integration are producing electronic components that are ever smaller, more powerful and cheaper. As a result, devices and objects can increasingly be equipped with “invisible” embedded systems that are connected directly to the physical world through a range of sensors and actuators, and that, con-sequently, can be deployed in a broad range of applications in ways allowing them to be controlled, monitored and networked. Global networks, such as the Internet connect computers, their data, their services and their applica-tions. At the same time, devices and objects are linked together through software-intensive systems and net-works. The physical world merges seamlessly with cyberspace – the virtual world. Countless devices provide ac-cess to this virtual environment through their human-machine interfaces. New solutions and services are formed “in the cloud”. The results are cyber-physical systems (CPS) that offer revolutionary applications and benefi ts. The innova-tions that can be attained and realized in such systems and their impact extend well beyond anything we can currently imagine [1].

Cyber-physical systems are an emerging trend around the world because of fun-damental technological and economic forces. They are the primary area where disruptive technologies emerge that create new industries and rearrange the status quo in entire industrial sectors. With its expertise and edge in the fi eld of electrical engineering and market leader-

© Rulan Fotolia.com

Smart System Integration for Cyber-Physical Systems

© marrakeshh Fotolia.com

© ThorstenSchmitt Fotolia.com

25


ship in embedded systems, Europe and Germany in particular have the oppor-tunity to become one of the leaders in innovation in cyber-physical systems.

Over 80% of the innovations in automo-tive systems are based on software-intensive systems. In Germany, auto-motive applications turn out to be the largest market segment for electronic components. Since the year 2000, the market for automotive semiconductors in Germany has more than doubled. Another sector, in which these applica-tions are used are the fi elds of aviation and medical technology. Modern aircraft are carefully co-designed and tightly in-tegrated CPS machines. State of the art medical systems also follow this trend. The movement towards an increasing dependency on software is driven by the fact that software enables the delivery of a large number of customized capabili-ties in a product using a relatively small number of physical and computing platforms. It goes without saying that suffi ciently developed smart systems which are also capable of executing cor-responding functions in real-time modus are needed.

However, the co-design of physical plat-forms and embedded software and their tight integration creates a high degree of complexity of interactions within and across these systems that far exceeds the capability of existing system compo-sition technologies. These technologies are of paramount importance to indus-tries that integrate independently-devel-oped parts into their fi nal products. Fur-thermore, even though analytical models

of such systems are currently used to predict different system-level properties they are often developed on a basis by different teams resulting in inconsistent assumptions and conclusions. The system integration time often exceeds 50% of the total development time for non-safety critical applications. In safety critical systems, such as avionics, the system integration and certifi cation time often exceeds 70% of total development time and costs.

Looking ahead, the success of cyber-physical systems demands system-wide standardized architecture design patterns and supporting technologies that can integrate existing components, COTS components (components-of-the-shelf) and co-designed new compo-nents in such a way that properties such as real time, safety, fault tolerance and security can be analyzed and predicted before the systems are actually built. Moreover, it is necessary to have a system-wide composition model that integrates the different analyses into a single consistent semantic framework to avoid confl icting results.

The complexity of the subject in terms of the required technologies and capabili-ties of CPS, as well as the capabilities and competences required to develop, control and create innovative, usable CPS applications, demand fundamental-ly integrated action and multidisciplinarity in research and development, economy and society.

The growing complexity and miniatur-ization of innovative products lead to

the fact that system integration will be getting more and more important for the scientifi c and technical development in the future. The integration of electronic functions and functionality continues and is driven by the semiconductor and control equipment manufacturer. But it will be important to defi ne the responsi-bilities of individual components to such an extent that one can guarantee the functionality of an entire system.

Cyber-physical systems will help to solve the upcoming European economic and social challenges – such as the shape of a future energy system, environmentally friendly transport systems using electric vehicles, or even integrated health care systems. On the other hand, the deep understanding of their design, the inner workings and the application of CPS are of crucial importance for their realization. Therefore, system integration will be a matter of necessity and not choice and should be further stressed in the future.

References[1] acatech, Agenda Cyber Physical Systems, Inter-

mediary Results, 2010

ZVEI - Zentralverband Elektrotechnik- und Elektronikindustrie e. V.Lyoner Straße 9D – 60528 Frankfurt am Main Phone +49 (0)69 - 6302-358Fax +49 (0)69 - 6302-286Mail [email protected] www.zvei.org

Stephan GurkeProjektleiter Kompetenzzentrum Embedded Software & Systems

26


Today micromechanical sensors can be found in nearly every motor vehicle, smartphone or laptop. Due to con-tinuous product innovations, sensors fi nd their way into more and more applications in automotive and consum-er electronics. According to IHS iSuppli, an amount of 4.3 billion micromechani-cal sensors were sold in 2011 with an impressive increase to 9.8 billion sen-sors in 2015 – a growth rate of 23 % per year! These growth rates are only pos-sible with continuous efforts in improving the performance and decreasing the size and costs of the sensors. Major im-provements could and can be achieved by smart system integration concepts.

Automotive Inertial Sensors ESP® systems compare the actual movement of a vehicle – measured with inertial sensors and wheel speed sensors – with the intended movement – measured with a steering angle sensor – and intervene by braking single wheels, if the difference is too large. The inertial

sensors needed for a standard ESP® system are a gyroscope and a sensor for measuring the lateral acceleration.

For driver assistance functions like Hill Hold Control, an additional accelera-tion sensor for measuring the longitudi-nal tilt is used. Because these three iner-tial sensors are always commonly used and are placed at the same location, they are „natural“ candidates for a further integration. Fig. 1a shows the sensor cluster MM3.8 with start of production (SOP) in 2005. In the sensor cluster, three separate sensors (1 gyroscope SMG070 and 2 single-axis acceleration sensors SMB220) are used to per-form the necessary measurements. The fi rst integration step combines the two single-axis acceleration sensors (SMB220) to a dual-axis acceleration sensor (SMB225). Each single-axis acceleration sensor consists of a sens-ing element and an evaluation circuit (ASIC) in a PM12 package. The new dual-axis acceleration sensor consists

also of a (dual-axis) sensing element and an ASIC in a PM12 package. With this fi rst integration step the footprint needed for the acceleration sensors could be halved. Therefore, the sensor cluster MM3.R8 with SOP in 2008 needed only two sensors (1 gyroscope SMG074 and 1 dual-axis acceleration sensors SMB225, see Fig. 1b). In 2010/11 the next integration step was realized. The new sensor cluster MM5.8 (see Fig. 1c) utilizes the combined inertial sensor SMI500, a sensor that now combines the gyroscope, the dual-axis accelera-tion sensor, a CAN transceiver, a µC, and an EEPROM in one PM20 package. Compared to the generation MM3.8, this results in a box volume reduction of 78 % in fi ve years! In parallel to the SMI500 another combined inertial sen-sor was released (SMI540, see Fig. 2). This sensor combines the gyroscope and the dual-axis acceleration in a much smaller SOIC16 mold package – a size reduction of 88 % (with small perfor-mance reductions of the offset perfor-mance of the acceleration sensor). The SMI540 is the world’s smallest com-bined inertial sensor for vehicle dynam-ics control systems.

Smart MEMS Solutions for SmartphonesBesides automotive industry, MEMS based sensors are used in consumer electronics. In mobile handsets such as smartphones, accelerometers sense the device’s orientation for display orientation or step counting, geomag-netic sensors provide the heading with respect to magnetic north in order to rotate maps when navigating. By providing rotation rates for balancing

Smart System Integration

Fig. 1: ESP® inertial sensor generations

27


and aiming, gyroscopes bring fun when playing the latest game on the smartphone. The requirements of consumer electronics drive the development of further package shrink and reduction of power consumption at constantly increasing performance. In densely packed mobile phones, today’s standard – set by Bosch Sensortec – for a three axis accel-erometer is 2×2 mm at less than 1 mm package height. The integration path to a smart sensor starts with the hardware integration to a system in package (SIP). Here, the companies hold-ing the competence in developing and manu-facturing of all MEMS sensor types have an immanent advantage. Bosch Sensortec’s eCompass BMC050 (see Fig. 3) sets new standards again. Housed in 3×3×0.95 mm LGA package, it’s the world’s smallest 6-axis digital com-pass. Its 3-axis geomagnetic sensor is based on Bosch’s proprietary FlipCore techno logy, elevating the device to best-in-class performance regarding signal-to-noise-ratio. The incorporated 10 bit 3-axis accelerometer provides full functionality for applications mentioned

above plus the g-vector for tilt compen-sation of the geomagnetic signal. Hereafter, the sensor software fusion takes place. The eCompass software package compensates the geomagnetic signal for the device’s tilt and provides the spatial orientation information for the applications in an easy-to-use output format like heading, pitch and roll. But

what makes sensors fi nally to smart systems and makes it more than the sum of its components? Bosch Sensortec’s eCompass library turns BMC050 into an in-use self-calibrating, self-monitoring system omitting extensive initial calibration procedures. If BMC050 is disturbed by a strong magnetic fi eld, its calibration monitor will initi-ate internal recalibration. Adaptive fi lters constantly readapt to the sensor’s noise and thus mini-mize angular error. This way the eCompass library turns BMC050 into a smart sensor system which senses, monitors, evaluates, learns and optimizes.Integrating accelerometer, geo-magnetic sensor and gyroscope to a smart sensor system with nine degrees of freedom (9DOF) will enable mobile key applications in location based services, gaming, augmented reality, and pedestrian navigation within the next years.

Robert Bosch GmbHDipl.-Ing. Klaus MederAutomotive Electronics (AE/EE)Postfach 13 42D – 72703 ReutlingenPhone +49 (0)7121 - 35 - 2747Fax +49 (0)711 - 811- 514 - 2747Mail [email protected] www.bosch.com

Klaus Meder,Executive Vice President Engineering Automotive Electronics, Robert Bosch GmbH

Fig. 3: eCompass solution

Fig. 2: World’s smallest combined inertial sensor SMI540 for vehicle dynamics control systems

From the early beginning of the semi-conductor industry a strong focus has been in scaling down the device dimensions in order to decrease cost and increase performance of integrated circuits. The main driver for this devel-opment has been the internet and the PC industry. With the overwhelming success of mobile phones, scaling alone was no longer suffi cient, but the integration of systems on chip (SoC) drew a higher attention, because many functions have to be integrated on very restricted footprint. The trend to more and more features continues and today we see an increasing need to integrate heterogeneous technologies in one single package. We state that until the year 2000 the focus has been on scal-ing, during the last decade complement-ed by the focus of SoC integration. The present decade is the decade of system in package (SiP), the integration of het-erogeneous functions and technologies in one package. Buzzwords like “scaling”, “SoC” and “SiP” have been present at all times, and indeed there exist driving factors which make heterogeneous SiP integration more and more important in the coming years:1. the miniaturization, strongly driven

by the mobile phone industry, with an explosion of functionalities in a mobile “supercomputer” makes it necessary to innovate new packag-ing and integration concepts in order to house all the necessary function-alities on a very limited space.

2. the integration of new elements like sensors, MEMS (micro-electrome-chanical systems), power devices,

or passives makes it necessary to integrate different technologies in a system.

3. SoC solutions might not be ad-equate, when considering the tech-nology nodes below 65nm, since the add-ons, like power devices, do not scale down with the logic shrink factor and therefore can be very uneconomical when integrated in a SoC. Furthermore, add-ons with additional mask layers add process cost and complexity to the entire wafer, even if only a small fraction of the chip is needed for the additional function.

4. the development effort of SoCs is increasing dramatically in the very advanced CMOS technologies. A full offering of a complete platform, including elements like power, RF, or embedded-memories in a standard CMOS process is both very costly and needs a lot of development time, therefore strongly limiting SoC platforms.

5. fl exibility and fast time to market: SiP offers a much higher fl exibility and faster time to market than compa-rable SoC approaches.

Therefore, SiP technologies play already and will further play a key role in the More than Moore world. In the follow-ing we want to highlight one of the very promising SiP technologies, the embedded Wafer Level BGA (eWLB) technology: Recently, Infi neon started production of the eWLB technology for single chip packaging. This new technology com-bines frontend and packaging technolo-gies. Meanwhile more than 130 million devices were produced in Regensburg. Today the eWLB, which has also been licensed to partners, is highly appreci-ated for wireless products, but it also offers outstanding capabilities for system integration where especially advanced functionality is required. These integra-tion capabilities support Infi neon’s strate-gy on topics combining silicon front-end and assembly/packaging technology

28

by T. Kilger, G. Beer, K. Pressel, C. Kutter


From More Moore to More than Moore: Integrating Smart Systems in eWLB

28


Figure 1: Example for Multi-chip side by side eWLB, a spacing of < 150µm between two dice can be reached today.

29


for next generation multi-chip system integration and achievement of customer satisfaction by outstanding performance (e.g. mm-wave system-in-packages).

The eWLB – a Technology Platform for System Integration Today SiP integration is driven by mobile communication. Typically the ball grid array (BGA) package is used. Infi neon demonstrated successfully various types of stacked dice like a fl ipchip/wirebond stack in a BGA. Today BGAs reach limits because of increasing substrate cost caused by miniaturization. The new eWLB technology of Infi neon offers outstanding capabilities for multi-chip system integration. While the eWLB is currently especially running in production for chips in mobile communication and mm-wave applications, this package technology is also discussed for future MEMS and sensor system integration where it can show further advantages compared to other package technolo-gies.

eWLB for 3D System Integration The eWLB technology offers advanced capabilities for side by side chip integra-

tion compared to state-of-the-art pack-aging technologies like BGAs (Figure 1). The eWLB uses neither wire bonding nor fl ip technology. Thus, disturbing ef-fects like tolerances for wire bonding or capacitive parasitics for fl ip chip bonding are avoided.Performance advantages are achieved by the application of a high density thin fi lm technology, which also allows the design e.g. of inductors and antennas on package. For side by side integra-tion effects like substrate coupling are avoided.But furthermore the eWLB technology is presently also investigated for 3D multi-chip stacking. For this thin fi lm redistribu-tion layers (RDL) are applied on top and bottom of the eWLB. Vertical Through Encapsulant Via (TEV) interconnects are used. These set-ups are presently under further investigation for improved performance and reliability (see example in Figure 2).

Chip-package-system co-design allows to improve eWLB performance Since the SiP approach includes higher complexity in the Chip-Package-System, Co-Design is key for designers to use

the new technology. The combined design of chip and package for system-optimization leads to further improve-ments for this new technology.

Where are we?Today multi-chip side by side set-ups up to 1 cm2 are ready for production for many reliability requirements. A design environment with adapted back-end design rules is ready. We are working on 3D multi-chip, sensor and passive inte-gration technologies for the eWLB. This and the attractive potential for mm-wave applications will drive further applications for eWLB package technology.

Thomas Kilger

Gottfried Beer

Klaus Pressel

Christoph Kutter

Figure 2: Example for package stacking using eWLB based on double-sided RDL (see BMBF funded project SIPHA).

Infi neon TechnologiesIFAG OP BE PTI IN IMKlaus Pressel Wernerwerkstrasse 2 D – 93049 RegensburgPhone +49 (0)941- 202 - 1321Fax +49 (0)941- 202 - 921321Mail Klaus.Pressel@infi neon.comWeb www.infi neon.com

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IntroductionNanotechnology has over the last decade attracted much attention and is producing knowledge based results which show relevance to a broad range of application areas and the great societal needs of our time. As such nanotechnology and nanostructured materials are already responsible for products worldwide of $254 billion [1]. However it is also widely recognized that the science is still in its infancy.On the other hand Microsystem technology has proven to be a cross cutting technology with strong relevance in many innovation areas [2]. Indeed microstructured components can be regarded as the “unseen helpers” of our age. Microsystem technology has the potential to build the bridge from nano sized effects, materials and structures to application defi ned systems. Thus, it will be an innovation enabler for nano science and technology.

Innovation PotentialEspecially in the areas of Energy, Information Technologies and Health [3] there is much innovation potential for

the so called Key Enabling Technologies to which micro and nanotechnologies belong.

In particular if one focuses on the areas of health and life sciences the innovation potential of integrating micro and nano technologies becomes clear. Important issues are facing our aging society. These are demands for safer diagnostic techniques additionally there are high expectations put on the shift in health care analyses from remote laboratories to hospitals and doctors surgeries and even to the patient at home. In fact nano diagnostic tools are forecast to become the backbone of clinical medicine by 2010 [4].

Diagnosis: imaging equipmentThere is a challenge to increase the sensitivity of diagnostic imaging equip-ment by many orders of magnitude [4] and as such increase selectivity and multiplexing capability at low cost: for diagnosis and treatment in some cases years earlier than with conventional tools. The advances will enable the detection of early stage changes in

tissue structure; structuring technolo-gies with nanometer precision allow to pattern components for analytic purpose like optical imaging or spectroscopy. As an example of the current forefront of technology, high aspect ratio grating structures enable a reduction in X-Ray dose and at the same time improve resolution and sensitivity of the X-Ray imaging technique. It allows in vivo monitoring of tissue changes as well as for materials characterization down to the submicron range.

Diagnosis Point of care systemsOne of the most commonly promoted areas of potential for nano and mi-cro technology is that of point of care analysis systems (POC). There is a general desire to personalize health care, and thus enable the imme-diate analysis of samples in the doctor’s surgery rather than enforce a stressful wait for the results being sent from a remote laboratory. Even the use of home diagnostic equipment is envisaged. This type of health care requires non-invasive sensors which can for example detect minimal amounts of bio-markers in

Multiplying Potential: Nanotechnology as Enabler for Microsystems


Grating structures with a bare width of 1,2 µm and a period: 2,4 µm with heights up to 125 µm resulting in aspect ratios of more than 100. (image KIT/IMT)

31


breath or saliva, and small portable detector systems.

The detection of substance at the level of individual molecules by a lab- on-chip device [1] is a break through to be strived for in the coming years. Molecular printing techniques such as single protein molecule positioning, or the introduction of molecules capable of selectively sensing particular markers could provide a breakthrough. Dip pen nanolithography can be used to pattern phospholipids with a view to integrating them on a micro resonator or a micro-fl uidic LOC device.

Emerging use of Nanomaterials The use of nanomaterials with tunable properties and Nanocomposite coat-ings with improved mechanical, optical, electrical or magnetic properties will be the next step for higher functionality and system integration and further decrease the size and cost of micro systems [4]. They are already used for some specifi c

purposes and future more widespread applications are to be expected. As such , e.g., material requirements for actuator components for advance robotics may be met. Such components fi nd application e.g. in manipulative tools for minimal invasive surgery or limbs prostheses.

SummaryDuring this decade nano-micro devices have grown in importance as a key source of innovation potential for almost all application fi elds. Devices based on nano materials also have potential for application in other areas such as process monitoring, chemical engineer-ing, or the production of pharmaceuti-cals. Further applications are expected in intelligent household and consumer goods and indeed as rapid throughput systems for nano safety testing.High end technologies and expertise which often lie at the crux of micro-nano integrated components are however not readily accessible to the R&D commu-

nity. Some pioneer actions are taking place to overcome the challenges posed by limited access to equipment and expertise. One such example is FP7 European Research Infrastructure EUMINAfab which coordinates the user access to dedicated installations of nine European national facilities (e.g. KNMF at KIT) and which offers free access to more than 70 technologies including those featured in this article.

Karlsruhe Institute of Technology (KIT)Hermann-von-Helmholtz-Platz 1D – 76344 Eggenstein-LeopoldshafenPhone +49 (0)721 - 608 - 28103Fax +49 (0)721 - 608 - 25579Mail [email protected] www.knmf.kit.edu www.euminafab.eu

Phospholipid functionalization (red) applied by Dip-Pen Nanolithography (DPN) on a resonator microdevice. Scale bar equals 20µm. [5]

References1) Meta-Roadmap nanomaterialien: Zukünftige

Entwicklungen und Anwendungen. ZTC VDI Technologie Consulting 2009

2) Status of Microsystems technology a Meta analysis of International Foresight and Forecast Papers: Kautt et al. Microsystems Technology in Germany 2010

3) Final Report High Level Expert group Key Enabling technologies European Commis-sion June 2011

4) WTEC panel report: nanotechnology research directions for societal needs 2020 Sept 2010

5) Image courtesy of Fuchs group, INT/KIT. DPN was performed at Fuchs group, INT/KIT. Microdevice fabricated by Ionescu group, EPFL Lausanne.

Susan Anson

Micro Nano Integration – Nano enhanced Microsystems

IntroductionThe specifi c use of nanotechnology in microsystem technology is a compul-sory opportunity in innovating micro-systems as nanotechnology empowers microsystems. The Micro Nano Integra-tion (MNI) interfaces the nanoscale to the macro scale application. It joins the key enabling technologies [1] “Nano-technology”, “Micro and Nanoelectron-ics” and “Advanced Manufacturing Systems” and thus focusses innovation towards smart microsystems. MNI com-prises the integration of nano-objects [2] and nanostructures into microsystems. The top-down approach describes the downscaling of microstructures into the nanometer range. In contrast the bottom-up procedure depicts the systematic and regular integration of nano-objects into microsystems. For the latter, the specifi c synthesis of nano-ob-jects on microstructures as well as the self-organization and self-assembly are popular ways for high throughput MNI.Beyond healthcare, there are many applications for smart sensors and actuators. MNI not only increases their performance but it also reduces their footprint and thus opens new fi elds of applications for microsystems.

3-D Nanofi bre Integration for industrial applicationThe MNIs industrial impact is defi ned by highly parallel approaches for high throughput on wafer level [4] as well as process compatibility like low tempera-ture and minimal stress.Nanofi bres with an aspect ratio exceed-ing 50:1 show promising features in a small volume: They are very fl exible and

provide a huge specifi c surface. Bun-dled nanofi bres combine these features with repeatable fabrication methods.Metal nanowires form an important class of nanofi bres. They are electroformed using templates with parallel nanopores. The templates are produced by heavy

ion irradiation and subsequent etch-ing of the ions’ tracks in the template material. The irradiation parameters defi ne the density of tracks per area (e.g. 102-107 per mm²) and they allow the penetration of material thicknesses exceeding 100 µm. The integration of

32

Nanofibre bundles for Smart Sensors


Examples for Micro Nano Integration classifi ed by the dimension of the nano-objects and the domains of application [3].

Process steps for metal nanowire bundle integration: a) lamination of a thermoplastic fi lm onto micro electrodes, b) structured dry etching, c) enforcement of micro electrodes by electroplating, d) lamination of nanoporous template, e) electroplating of nanowires and removal of the template, f) integrated wire bundle [5].

33


these templates onto microstructures enables the dedicated and highly paral-lel syntheses of nanowires for the use in microsystems. Electroforming the nanopores with metal (e.g. copper, gold or platinum) and subsequent etching of the templates delivers nanowire bundles on microstructures. They can serve as minimal footprint suspension elements

for MEMS, highly sensitive gas sensors, low temperature bond interconnects as well as micro newton contact pads.These low temperature MNI processes are highly parallel and low cost.

Another class of MNI nanofi bre bundles are three dimensional CNT block struc-tures that are grown on microstructured wafers. This template free method excels in a large CNT growth rate exceeding 25 µm/min [6]. The technique relies on a controlled deposition technique of transi-tion metal catalyst particles on which isolated CNTs are grown by a chemical vapour deposition process. If the catalyst particles are close enough to each other, the growth can be controlled and highly

aligned vertical arrays of densely grown CNTs are accessible. CNT densities of up to 106 CNT per mm2 with aspect ratios of > 20.000:1 are possible. Such three-dimensional CNT arrays can be grown over several cm2 areas with freely adaptable geometries in the 10 μm size range on a routine basis. This MNI technique has paved the way towards

new heteroge-neous catalysts, unique nanoreactor systems which dis-play minimal areal footprint, as well as chemoresistive gas sensors and tactile mechanical sen-sors. Due to their electrical proper-ties such CNT areas have a huge potential as active elements for cold

cathode fi eld emission e.g. for display applications. ConclusionThe dedicated use of nanotechnology in microsystems enhances the systems’ functionality while the microsystem tech-nology remains safe, clean and reliable.

AcknowledgementPart of this work has been funded by the German Federal Ministry of Education and Research (BMBF) and the Deutsche Forschungsgemeinschaft (DFG).

References[1] Final Report High Level Expert group Key

Enabling technologies European Commis-sion June 2011.

[2] ISO/TS 27687:2008: Nanotechnologies – Terminology and defi nitions for nano-objects.

[3] Micro Nano Integration – Nanotechnology for new Functions in Microsystems: H. F. Schlaak and F. Greiner ISBN 978-3-8007-3155-8 2009.

[4] Micro-Nano-Integration – Nanostructured Interfaces – Silicon Grass and its Use in Microsystems: M. Hoffmann Microsystems Technology in Germany 2010.

[5] In-Situ Generation of structured metallic Mi-cro- and Nanowire Ar-rays in Microsystems: S. Quednau and H. F. Schlaak MikroSys-temTechnik Kongress 2011.

[6] Patterned growth of ultra long carbon nano-tubes. Properties and systematic investiga-tion into their growth process: R. Joshi, J. J. Schneider, O. Yilmazoglu, and D. Pavlidis, J. Mater. Chem., vol. 20, no. 9, pp. 1717-1721, Jan. 2010.

Technische Universität Darmstadt

Institute of Electromechanical Design, Microtechnology and Electromechanical Systems LaboratoryProf. Dr. -Ing. Helmut F. SchlaakDipl.-Ing. Felix GreinerMerckstr. 25D – 64283 DarmstadtPhone +49 (0)6151-16 - 4696Mail [email protected] www.emk.tu-darmstadt.de

Eduard-Zintl-Institut, Inorganic ChemistryProf. Dr. Jörg J. SchneiderPetersenstr. 18D – 64287 DarmstadtPhone +49 (0)6151-16 -3125Mail [email protected]

darmstadt.deWeb www.chemie.tu-darmstadt.de/

schneider/startseite_aks/index.en.jsp

SEM micrographs (a to d) of CNT blocks grown over iron catalyst patterned using a Nylon mesh with different mesh sizes. SEM micrograph of CNTs grown in complex morphologies with sharply defined edge structures (e and f) [6].

Dipl.-Ing. Felix Greiner

Prof. Dr. Jörg J. Schneider

Prof. Dr.-Ing. Helmut F. Schlaak

34


Heterogeneous system integration for semiconductor sensorsThe application areas for semiconduc-tor sensors are increasing continuously and the trend towards microsystem integration of sensor, logic, memory and power components is obvious. How-ever, different applications have different requirements. The sensors for example will be used in harsh environments; the packaging density should be as high as possible or an extremely high sensitivity is required. Heterogeneous system integra-tion is suited to develop an innovative assembly of sensor systems with a cost effective adaption of their properties to the requirements.

Multifunctional On-Top TechnologiesTo push the development in the fi eld of heterogeneous system integration of semiconductor sensors – preferred on wafer level scale – a technology platform called “Multifunctional On-Top Technologies (MOTT)” was established in 2009 at the Fraunhofer EMFT for fast and product specifi c system development. The aspired technology platform allows the modular integration of new and innovative functionalities and components like RF and optical devices (e.g. photo detectors), but also biological and chemical sensors and actuators in exist-ing silicon standard technology. In this context low cost solutions

are achievable for even small and me-dium size companies.

The longstanding Fraunhofer EMFT ex-pertise in three-dimensional (3D) system integration and CMOS technology are the key features of the MOTT concept. The main advantage of 3D integra-tion, by means of “Through Silicon Vias (TSV)”, is the increasing performance

by highly parallel signal processing, minimal wiring lengths and the elimina-tion of speed-limiting chip connections. The combination of CMOS and 3D integration allows system manufactur-ers maximum fl exibility in combining mainstream technologies with new and innovative functionalities. Low parasitic losses reduce the power consumption of the system. Microsystem compo-

nents – produced and tested independently of each other – are vertically integrated in a 3D chip (wafer level 3D system integration) using standard CMOS processes. Some examples are listed below.

Sensors in harsh environment3D integration technologies for miniaturized sensor nodes have been developed for various applications within the EC project e-CUBES. For this purpose the “Through-Silicon-Via (TSV)” technology has been optimized (part of the European technology platform: www.ecubes.org). An automotive demonstra-tor for an ultra-miniaturized “Tire-Pressure-Monitoring System - TPMS (Fig. 1) fo-cused on the heterogeneous wafer level integration of a IC/MEMS chip stack consisting of a pressure sensor, and ASICs for signal evaluation and data transmission was realized.

Armin Klumpp, Lars Nebrich, Ignaz Eisele

Heterogeneous System Integration for Semiconductor Sensors

Fig. 1: Wafer with 3D IC/MEMS stack for automotive applications of Infi neon Technologies.

Fig. 2: Chip stack of MPI trace sensor for high energy physics and correspond-ing read-out circuit integrated by SLID technology

35


Sensors with high packaging densityIn another project, commis-sioned by the Max Planck Institute for Physics in Munich (MPI) as part of the Atlas Pixel Project for CERN, the 3D integration of track sensors for high energy physics with the associated read-out circuit was developed. The project is based on the Fraunhofer EMFT integration technology using tungsten-fi lled vias, the assembly of the two-layer stack by Solid Liquid Interdif-fusion (SLID) principle of the copper/tin alloy. This tech-nique allows to combine func-tional, pre-tested circuits and sensors, which are fabricated by completely different tech-nologies. The sensor matrix chips are produced on 150 mm wafers by MPI-HLL and are allowed only a few process steps so as to avoid metal contamination. The read-out circuit is produced in a foundry on 200 mm wafers using a 0.25 μm technology. The 2,880 individual sensors of a matrix are each connected directly to an elec-tronic circuit and are read-out line by line via output pads. In order to be able to produce sensor chips in the same geometrical dimensions as the read-out circuit in the future, the information from the output pads will be transferred to the upper side via through-contacts. Measurements on assembled systems (Fig. 2) have shown that a 100 percent contacting of all 2,880 matrix cells can be realized using SLID. In addition, the

key parameter of low noise was even improved as compared to assembly with solder bumps.

Sensors with extreme high sensitivityIn a project funded by the Bavarian Min-istry of Economic Affairs, Infrastructure, Transport and Technology, a high-reso-lution spectrometer for the low-energy x-ray range was developed in collabora-tion with KETEK Corp.These radiation detector modules can be used in a wide range of material analysis systems, which operate using X-rays. One example is the EDX (Energy Dispersive X-ray) system in a scanning electron microscope in which a sample under electron bombardment radiates

characteristic X-ray light. X-ray light stimulus can also be used to generate characteristic X-ray fl uo-rescence (XRF) in materials, which is analyzed by the X-ray detector. Examples are handheld devices for on-site material analysis. This technique for instance was able to successfully detect metal contami-nation in toys.The radiation detector modules with silicon drift detectors (SDD) produced by KETEK are improved by developing an extremely low-noise impedance conversion stage with “Junction Field Effect Transistors (JFETs)” in combination with a new bonding technique so as to make use of the low-energy X-ray range with a resolution of 119 eV for spectroscopy (Fig. 3). For this purpose the three discrete components currently used –

transistor stage, temperature sensor and ceramic carrier – are replaced by a single silicon chip (Fig. 4) and attached to the SDD sensor chip by means of a chip-to-chip technology.

Fraunhofer-Einrichtung für Modulare Festkörper-Technologien EMFTHansastr. 27dD – 80686 MünchenPhone +49 (0)89 - 547 59 - 0 Fax +49 (0)89 - 547 59 - 550 Mail [email protected] www.emft.fraunhofer.de

Fig. 3: SDD sensor with wire bonded signal evaluation chip from Fraunhofer EMFT

Fig. 4: 200 mm wafer of JFET chips for 3D integration with SDD sensors

36


Piezoelectric Micro Actuator for a New Hearing Aid Implant

People suffering from sensorineural hearing loss are usually treated with traditional hearing aids. When there are high levels of hearing loss, traditional systems are limited due to distortion or acoustic feedback. Therefore active middle-ear implants were introduced in hospitals more than 20 years ago. They promise higher sound fi delity, fewer feedback problems and improved robustness, compared to traditional hearing aids. Typically, hearing implants are mechanically coupled to the ossicu-lar chain and amplify its vibration with the help of an electromechanical transducer. The major disadvantage of existing im-plantable hearing aids is the need for a traumatic three-hour surgical procedure. During the surgery a secondary access point to the middle ear, parallel to the ear channel, is created. This secondary access point allows for insertion of the amplifying transducer. This lengthy com-plex surgery is the reason why relatively few patients are treated with implants. In a joint project coordinated by the university hospital of Tübingen, different

partners from academia and industry have investigated a new concept for an active middle-ear implant, the so-called round window implant, shown in Fig. 1. The external part of the hearing system consists of a small case containing a microphone, an audio signal processing unit, a tube, an infrared Light Emitting Diode (LED), and a molded, well vented earpiece that holds the LED in place. The internal part of the hearing system consists of a photodiode, a piezoelectric actuator in front of the round-window membrane, and an isolated cable con-necting them. The LED is the emitter unit of the wireless optical transmission path; the photodiode is the correspond-ing receiver unit. With this setup, signal and energy of the sound signal can be optically transmitted through the ear drum. The receiver unit generates an electrical signal that is transferred to the electromechanical actuator, which in turn provides amplifi ed vibrations to the round window membrane. The concept of wireless signal and power supply simplifi es the implanting procedure so

that it can be reduced to an ambulatory procedure and therefore is suitable for a greater number of patients. One of the key components of the system is the piezoelectric thin layer actuator placed on the round window. The piezoelectric concept was chosen due to its high power density in combi-nation with low actuation voltages and thin layers, its good dynamic behavior as well as its parallel production process in microsystem technology (sputter deposition). In order to achieve high vibration amplitudes for satisfying sound amplifi cation, the piezoelectric actuator is designed as a bending structure in a disc shape, see Fig. 2. Triangular actua-tor elements are arranged in a circle with the largest vibration amplitude at its cen-ter. The triangular elements consist of a passive silicon layer, on which an active piezoelectric layer is deposited. Apply-ing a voltage vertical to the piezoelectric layer induces a length change of the ac-tive layer and thus a bending motion of each element. The mechanical decou-pling of the actuator segments leads to noticeably greater amplitudes than those in a non-slotted membrane. A mathematical model based on the actuator shape has been developed at Fraunhofer IPA in order to predict the dynamic electromechanical behavior of the actuator. The most important parameters of the actuator design are the bending amplitudes and actuator forces in the frequency range of sound (50 Hz to 10 kHz). The aforementioned actuator characteristics depend on the electrical voltage applied to the piezo-

Dominik Kaltenbacher, Jonathan Schächtele Fraunhofer Institut für Produktionstechnik und Automatisierung IPA

Dominik Kaltenbacher

Fig. 1: Components of the round

window implant with external case (1),

ossicular bones (2), cochlea (3), actuator (4),

optical receiver (5), eardrum (6),

LED (7), and external cabel (8).

37


electric layer, on geometric conditions (e.g. layer thickness) as well as on the material properties of the piezoelectric and passive layers. For a prototypical actuator with a diameter of 1,5 mm, layer thicknesses of 5 µm for the pas-sive, and 2 µm for the piezoelectric layer, as well as typical piezoelectric material parameters, the model predicts vibrational amplitudes of 2,5 µmp/Vp, a resonance frequency of 38 kHz and actuator forces of 250 µN/V. With the help of the ceramics laboratory at EPFL Lausanne and the Fraunhofer Institute for Silicon Technology (ISIT) in Itzehoe, prototypes of the actuator have been produced and characterized, see Fig. 3. With a laser Doppler vibrometer bending amplitudes of 1 µmp/Vp up to a frequency of 25 kHz were measured. Actuator forces up to 180 µN/V were measured using an ultra-micro balance. These characteristics of the actuator prototypes are in the predicted range as anticipated by both the mathematical model and the criteria for good sound

amplifi cation. The prototypes now have to be tested in combination with the implantable cable and the opti-cal receiver unit. In pre-clinical trials on human temporal bones, the implant-ing procedure and the coupling to the round window needs to be studied

and optimized. Parallel to these trials the actuator has to be further miniaturized and a stable production process has to be established. Once these tasks have been completed, the fi rst clinical trials of the overall hearing implant can commence.

Jonathan Schächtele

Fig. 2: Concept of the piezoelectric bending actuator

Fraunhofer Institut für Produktionstechnik und Automatisierung IPADominik KaltenbacherNobelstraße 12D – 70569 Stuttgart Phone +49 (0)711- 970 -1193 Fax +49 (0)711- 970 -1005 Mail dominik.kaltenbacher @ipa.fraunhofer.deWeb www.ipa.fraunhofer.de www.medizintechnik- fraunhofer.de

Fig. 3: Actuator prototype glued onto implantable cable

Advantages of laser direct structuringA whole series of factors play a role in the selection of a production process. In many, laser technology is a step ahead:

✦ The layout of the structure is varied by software. Thus the process is suitable for prototyping as well as large and small production runs. The developers can optimize their designs almost until production

38


Flexibility, profi tability, precision – LPKF relies on these three attributes for its pat-ented laser direct structuring (LDS). The impact of three-dimensional circuit boards on new products is growing. Internation-ally well-known companies from a variety of market segments already rely on LDS technology. An overview.Laser direct structuring is an enabling technology. It gives developers the oppor-tunity to establish completely new or bet-ter manufacturing processes for existing products. The jury of the Hermes Award agreed with this assessment, giving LPKF the world’s highest endowed industry in-novation award in 2010. The LDS process transforms simple plastic components into three-dimensional circuit boards. The basic spatial element is formed in single component injection molding from plastic that contains a spe-cial LDS additive. Virtually every manufac-turer now provides LDS-doped plastics.This basic component is three-dimen-sionally structured with a laser. The laser activates the additive and creates a micro-rough surface. A metal coat is depos-ited on these structures in a currentless bath, fi rst copper, then nickel or gold as needed.

Three-dimensional Circuit Boards for New Products

Fig. 1: Circuitry in the third dimension with LPKF-LDS technology

Fig. 2: Left to right: FDM-Prototype, coating of the blank and completed LDS component

starts, and even make changes dur-ing production.

✦ The high precision of the laser pro-cess is impressive. The width of the existing conductor paths is theoreti-cally limited only by the width of the laser focus; in practice, lines with a thickness of 80 µm and more have proven useful.

✦ Along with precision, the LDS pro-cess offers unprecedented three-

39


dimensionality. Thus the process also allows through-connection with-out additional components and work steps. Laser structuring systems can work on components from a variety of positions. In the LPKF Fusion3D 6000, up to four machining heads can be used simultaneously. It can structure the front and back sides in one step.

✦ Laser direct structuring does not require tools, only simple compo-nent seating. No time and expense is necessary for tool manufactur-ing. Thus, an installation made from several laser structuring systems can also cover production demands with high variance: While the major-ity of the systems run the series production, one can be used for the development of the next product generation and others can run ramp-up orders.

✦ The cost effectiveness is also impressive. The LPKF Fusion3D 6000 laser structuring system has up to four laser sources and two workpiece hold-ers, guaranteeing short cycle times. The parallel processing provides up to fi ve times higher through-put, because feeding and positioning are also virtually not required – the lasers are active without interruption. The economic Fusion3D–1000 platform systems are suitable for prototyping and produc-tion. They have a compact

housing on rollers and require only a power connection and dust extrac-tion for operation.

A three-dimensionally designed compo-nent reduces the material and installa-tion expense while functional density is increased. The greatest potential arises not when existing layouts are replaced, but when the three-dimensionality of the products is already taken into account in the planning phase. LPKF provides a free, extensive design guide with examples at www.lpkf.com.

Effi cient prototypingProduct development comes before classic production. In the past, this was precisely the weak point of 3D-MIDs: The development of complex proto-types was very time-consuming and expensive. This changes signifi cantly with a new two-component lacquer. The

base component is generated directly from the layout data in a 3D process (FDM, SLS or SLA). It is then lacquered with LPKF ProtoPaint LDS. This lacquer contains an LDS additive. In practice, two or three coatings are required. The lacquered component is then laser structured and metallized. A prototyping process is available for the metallizing. It requires only one bath and no elaborate lab equipment. The cop-per coating is comparable to standard metallizing.

New developmentsThe prototyping process with LDS lacquer is an interesting addition to product layout. Current developments will contribute further to the success of LDS technology:

✦ The compact Fusion3D series will be expanded by additional systems. The latest member is a laser structur-ing system which structures large components up to 40 centimeters long on two carriages – ideal for antennas for tablets and laptops.

✦ Heat-conducting plastics with an LDS additive are an ideal base for new LED applications.

✦ New colored LDS plastics can be used to provide visible housing parts on the inside of the device with con-ducting paths.

Nils Heininger Vice President Cutting & Structuring Laser of LPKF Laser & Electronics AG

LPKF Laser & Electronics AGOsteriede 7D – 30827 GarbsenPhone +49 (0)5131 - 7095 - 0Fax +49 (0)5131 - 7095 - 90Mail [email protected] www.lpkf.com

Fig. 3: Fast and precise: the LPKF Fusion3D-family stands for economical and safe production

40


Micro energy harvesting is a novel technique to supply embedded systems from energy available in their immediate vicinity. Tapping this resource of ambient energy will provide the required - often small - amount of electrical power with-out today’s enormous energy and material consumption for batteries and power grids. Also, a wealth of novel applications is opened for energy-autonomous embed-ded systems as such.

As the word says a so-called “embed-ded system” will not automatically ap-pear in our line of sight. These systems are virtually “hidden” in our environment, performing their task at many different application sites, often without any ap-pearance to the user. Nevertheless, the number of these “invisible assistants” has steadily increased over the last two decades and will do so in future.Together with this trend a gap appears between our common concepts of energy supply and the need to pro-vide electrical power on a small power level – frequently we do only require 100 µW – for widely distributed embed-ded systems. Today, electrical power grids are one standard technique to achieve this. As an exemplary result, the typical extended wire length of all electri-cal cables in a mid-class passenger car amounts to appr. 3 km today.This combined power-data grid is used for the supply of all electric components and for internal data communication between up to 40 embedded electronic control units. Consequently, recent studies on the world-wide consumption of copper state that approximately 5% of the global copper market is used for

electrical wiring in cars, compared to 3% used in electronic circuit boards or IC housings and 13% used for the global water supply. Finally, a brief calcula-tion shows astonishing numbers on the energy consumption required for cable production of “low-power grids”. Taking a 300 µW low-power tempera-ture sensor as an example, the energy required to produce only one meter of a thin three-conductor power and data line would be suffi cient to supply this embedded system continuously for 30 years. Single-use and rechargeable batteries form our second standard power supply for embedded or mobile systems, with all associated problems. The application of batteries is restricted to systems that either allow an easy access for service or operate at a low-power level that does not compromise the system’s life-time. Moreover, environmental concerns arise from the growing numbers of bat-teries in use. In 2006 alone Germany’s largest battery recollection system has

counted a total sale of approximately 1.4 billion of batteries. Only one third of this number has been recollected and disposed or recycled environmentally friendly in the same year, leaving almost 1 billion of “undetected waste”.Having these problems in mind “Micro Energy Harvesting”, i.e. the conversion of ambient energy for an embedded system‘s supply, has gained consider-able attention recently (see Fig. 1). How-ever, a simple replacement of the battery or the power cord by a local “micro power plant” will not solve the task. First of all, micro energy harvesting requires a thorough design of the whole embed-ded system. Energy converters have to be provided with a size and function compatible to the respective application site and the available ambient energy. The varying availability of input energy may require an effi cient intermediate storage to bridge phases of low supply. An effi cient energy management has to transfer the electrical energy between all subsystems in an optimal way. Finally,

Micro Energy Harvesting:Solving our „Small Scale Energy Crisis“

Fig. 1:Schematic drawing of an energy-autonomousembedded sensor system, powered by micro energy harvesting

41


Prof. Dr.-Ing. Peter Woias, IMTEK,Albert-Ludwigs- University of Freiburg

the energy consumption of the system node itself has to be minimized to a high extent by appropriate design and sys-tem control measures. Within this large variety of research topics, the adaptation of energy harvesting concepts to an envisaged application appears to be a crucial point. Few examples of our re-cent research shall highlight this problem in more detail and point out conceivable solutions. Piezoelectric energy harvesting from vibrations is a promising candidate for mechanical energy harvesting. However, ambient vibrations may show high varia-tions in their frequency spectrum and

amplitude. This calls for generators that either harvest from broadband vibrations or follow the dominant center frequency of a time-variable vibration spectrum. Fig. 2 shows a frequency-tunable piezo-generator designed to fulfi ll the latter requirement. This project has been con-ducted within our DFG-funded research training group “Micro Energy Harvesting”. In this device four cantilever-type piezo-generators are connected via a common piezoactuator, giving the full system the appearance of a British longbow. A change of the actuator’s internal stress,

i.e. the tension of the longbow’s string, will modify the resonance frequency of the generator and hence allow for a continuous frequency adaptation. For this purpose a microcontroller measures the actual resonance frequency and ap-plies an appropriate tuning voltage to the piezoactuator.In comparison to a non-tuned, mono-resonant operation of this harvester, the effective harvesting bandwidth is increased for a factor of 3.5 by turn-ing on the tuning mechanism, with the potential to achieve a 7-fold increase in a redesign. The generator harvests enough energy to supply the tuning

mechanism, which requires at maxi-mum 25 µW in a realistic demonstration scenario and provides at least the same power as a surplus for the operation of an embedded system. This is suffi cient to perform, for instance, a temperature reading and wireless data transmission every 10 seconds.Similar requirements of an application-specifi c adaptation are found for e.g. thermoelectric energy harvesting. Although this is not well recognized today, highly dynamic temperature varia-tions are present in many applications

and are not exploited in an optimal way with common designs of thermoelec-tric generators. We have encountered this problem during the BMBF-funded project AISIS. This project required to harvest energy from temperature gradients between the wall and the ambient air of a traffi c tunnel, in order to supply an embedded monitoring system. It turned out that especially road tunnels generate small and highly dynamic temperature gradi-ents of a few Kelvin only. The optimal solution for this scenario was the devel-opment of an air-generator interface with a small thermal mass while keeping the

surface of this interface as large as pos-sible (Fig. 3). Only such a specifi c design will have a small thermal time constant to follow highly dynamic variations of the air tem-perature and to harvest from a maximal temperature gradient between air and wall.With this harvester the successful oper-ation of an energy-autonomous wireless temperature sensor was demonstrated in a road tunnel with maximal tempera-ture differences between air and wall in the range of 1 to 2 Kelvin only.

Fig. 2:Photograph and schematic drawing of a frequency-tun-able piezogenerator

50 mm

42


Within AISIS we have also realized an energy-autonomous train passage detector harvesting from broadband vi-brations present at the rail sleeper. Such systems are mandatory in the European railway system and are usually supplied via power grids along the rail. An energy-autonomous and wireless system would therefore provide signifi cant advantages concerning deployment and mainte-nance costs.For this device an array of piezogenera-tors has been developed (Fig. 4) that harvests energy simultaneously from ten overlapping frequency bands of vibration present at the rail. A novel low-power start-up switch monitors the available system voltage and turns the embedded system on as soon as enough energy has been harvested from the passage of a single train. Its own power consump-tion is in the nW-range and therefore not

a burden for the system’s internal energy budget. Fig. 4 shows the system voltage during the passage of a freight train and its stepwise decrease and slow increase caused by the subsequent transmission of 5 radio telegrams.These data represent, as far as we know, the fi rst successful demonstration of an energy-autonomous train passage detector.

To conclude this brief introduction into a novel and wide fi eld of “micro energy technology”: One decade ago micro en-ergy harvesting has emerged as a major topic for basic research in micro sys-tems technology. In the meantime, it is obvious that this novel technology offers a large variety of product and business opportunities and will help to reduce our energy and material consumption via

several leverage effects. A large variety of dem-onstrator applications is visible today and several companies have started their commercial activi-ties. It is interesting to see that Germany is playing a major role with several R&D projects fi nanced by the German Science Foundation DFG, the Ministry for Research and Technology BMBF and several federal state ministries, like e.g. the Baden-Wuerttemberg-

Stiftung. It is in our hands to continue this success story with an on-going funding of basic and applied research as well as with increased efforts by industry and academia to transfer the gained knowledge into applications.

Fig. 4: Broadband piezogenerator during a fi eld test in the Loetschberg basis tunnel, Switzerland, lab test of energy harvesting during the simulated passage of a cargo train, using real-life data from vibration measurements in the Loetschberg basis tunnel

Albert-Ludwigs-University Freiburg,Department of Microsystems Energeering(IMTEK)Laboratory for Design of MicrosystemsProf. Dr. Ing. Peter WoiasGeorges-Köhler-Allee 102D – 79110 FreiburgPhone +49 (0)761-203-7490Fax +49 (0)761-203-7492Mail [email protected] www. imtek.de/konstruktion

Fig. 3: Schematic drawing and thermal-electrical equivalence circuit of a thermoelectric generator (TEG) in an air-wall harvesting application

The German Congress on Microsystems Technology 2011

Organization:

A Joint Event of:

44

1 IntroductionMagnetic microsystems in the form of magnetoresistive (MR) sensors are used wherever movement is to be controlled or where angle, linear motion, posi-tion, electrical current or magnetic fi eld strength are to be measured. They are fi rmly established in automobiles, mobile telephones, medical devices or industrial robots: be it for the measure-ment of path, angle or electrical current, or as an electronic compass. Originally developed for data storage applica-tions, the different MR effects open up new measurement possibilities not only in terrestrial applications, but also in space applications. This paper gives an overview of the technology, as well as a description of applications in different branches [1].

2 Basic principles of MR sensorsThe magnetoresistive (MR) effect has been known for more than 150 years. In 1857 the British physicist William Thomson (later known as Lord Kelvin) discovered that the electrical resistance of a conductor changes under the infl u-ence of a magnetic fi eld. The application

of this effect in sensors was however fi rst made possible some 30 years ago by means of the development of thin fi lm technology. The anisotropic MR (AMR) effect, dis-covered by Thomson demonstrated a resistance change of a few per cent and was the fi rst MR technology to be used in the read-heads of disc drives. At the end of the 1980s Professor Grünberg and Professor Fert discovered indepen-dently the so-called giant MR (GMR) effect with resistance changes of more than 50 %.This discovery was rewarded with the Nobel Prize for Physics in 2007. In the meantime the read-heads of disc drives use the tunnel MR (TMR) effect, which exhibits extremely high sensiti vity and low power consumption [2].The different MR effects are not only interesting for applications in data stor-age technology, but also offer important benefi ts in sensor applications. In this fi eld AMR, GMR and TMR are com-plementary technologies, each offering specifi c advantages to the user. AMR and GMR-based sensors are already in series production at Sensitec and the fi rst TMR-based sensors will be intro-

duced into the market in 2012. Fig. 1 compares the basic structure and output characteristics of the so-called “XMR” technologies.

3 Advantages and benefi ts of MR-sensors

The different types of MR-effect have numerous advantages in common, which make MR-based sensor techno-logy the right choice for the applications described later:

✦ High resolution and high accuracy ✦ Highly dynamic with a high band-

width better than 10 MHz ✦ Very robust and largely unaffected

by oil, dirt or very high or very low temperatures

✦ High reliability ✦ Extremely small dimensions ✦ Low power consumption ✦ Wear-free due to the non-contacting

measurement principle.

These advantages offer the users of MR sensors following benefi ts:

✦ Large air gap between sensor and object to be measured. This reduces design and assembly effort.


Magnetic Microsystems in Industrial, Automotive and Space Applications

Fig. 1: Comparison of XMR Technologies

Fig. 2: Brushless DC servo

motor with inte-grated power and

logic electronics (Source:

Dunkermotoren)

45


✦ The high sensitivity allows measure-ment through the housing material and thereby hermetic sealing of the sensor electronics.

✦ Highly precise angle and linear measurement with high resolution for precise measurement with high positioning accuracy.

✦ High bandwidth, to control highly dynamic processes.

✦ Reliability and safety under diffi cult operating conditions.

✦ Compact, lightweight measurement systems which allow measurement in largely inaccessible locations.

✦ Long life due to wear-free operation.

MR sensors therefore offer numerous advantages compared to potentiometri-cal, inductive or optical sensors.

4 Application examples4.1 Industrial automationIn many areas in industrial automation a trend towards decentralized drive technology is underway. Decentralized actuators consist of servo actuators with modular electronics „on-board“. The choice of technology for the motor en-coder to be used in a decentralized ac-tuator is not trivial. The available space is

very limited, the operating temperatures are high and the encoder is exposed to grease and oil. This complex set of requirements led to the use of AMR-based sensors for the integrated motor encoder shown in Fig. 2.

4.2 Automotive The number of sensors providing ac-curate measurement data is increas-ing steadily in the fi eld of automotive electronics. The wheel speed signal is an important input variable for elec-tronic control systems such as ABS (anti-block system) or ESP (electronic stability programme). The wheel speed sensors have an extremely diffi cult oper-ating environment, having to withstand a temperature range from -40 °C to +170 °C under normal operating condi-tions, with peak temperatures of up to +195 °C.

4.3 AerospaceMagnetoresistive sensors are also interesting for aerospace applications because this application fi eld requires components providing low mass, small dimensions, low power consumption and high robustness under extremely diffi cult environmental conditions.

The time-line for space applications of MR sensors from Sensitec goes back more than 10 years. Following the suc-cess of the „Spirit“ and „Opportunity“ Mars Rovers, where 39 sensors were used on each vehicle, AMR sensors were also selected for the Mars Space Laboratory Mission, which started in November 2011. The Mars Rover “Curiosity” uses MR sensors to measure the position of the wheels, suspension bogies, camera, high-gain antenna and robotic arm.

References:[1] Slatter, R.: Magnetic Microsystems in

Industrial, Automotive and Space Applica-tions, Darmstadt, Microsystems Technology Conference 2011

[2] Paul, J. et al: Magnetoresistive Sensors as an example of resource effi ciency, Darm-stadt, Microsystems Technology Confer-ence 2011

Sensitec GmbHDr. Rolf SlatterGeorg-Ohm-Straße 11D – 35633 LahnauPhone +49 (0)6441 - 9788 - 82Mail [email protected] www.sensitec.com

Dr. Rolf Slatter

Fig. 3: Mini Speed wheel speed sensor (Source: Continental)

Fig. 4: Mars Rover “Curiosity”

(Source: NASA/JPL-Caltech)

46

AbstractWe present a novel approach for 3D-prototyping of porous metal struc-tures by direct non-contact liquid metal printing, based on the StarJet techno-logy [1]. The actuator housing allows for operation at temperatures up to Tmax = 500 °C. This enables the ejec-tion of single droplets of metals with higher melting points like for example magnesium-zinc alloys such as ZAMAK. Thereby droplets can be generated with frequencies up to fmax = 4 kHz and diameters between 48 µm and 360 µm. This paper reports on experimental results and presents various 3D metal structures.

IntroductionThe generation of micro droplets of liquid metals is a challenging area in the fi eld of MEMS technologies which can be used for the generation of solder bumps [2], fl ip chip bonding or the rapid proto-typing of electric circuits [3]. However, metal droplet generators can also be used for the rapid prototyping of small

metal structures [4]. Therefore, alike to inkjet printing, structures can be created by deposition of single droplets. These droplets are made of molten metal and the printing is done in three dimensions instead of two. For the generation of small metal droplets different principles have been developed in the past. Basi-cally, these principles can be divided into Drop on Demand (DoD) and capil-lary stream breakup dispensers. In the latter case single droplets are generated out of a stream of molten metal. In con-trast to this, drop on demand systems eject single droplets through a nozzle either by applying actuation pulses to a reservoir, or by opening a valve at the reservoir outlet for a short period of time.The StarJet technology [1] used for the dispensing of liquid metal droplets in the presented work is based on a pneu-matic actuation principle. This principle enables continuous operation like for capillary stream dispensers as well as DoD. The DoD mode is activated, by applying short pneumatic actua-tion pulses while the continuous mode

requires a constant gas fl ow. Additionally, the gas fl ow that works as actuation mecha-nism also prevents from the oxidation of the liquid metal in the reservoir as well as the dispensed metal droplets in fl ight. Since no moving parts are involved in this mecha-nism, the only limita-tion for the maximum operating temperature

is the melting point of the actuator mate-rial itself. In consequence the StarJet technology should be suitable for gener-ating liquid metal droplets of all kinds of metals with high melting points.

Fabrication and experimental setupThe StarJet actuator used in this work (see fi g.1) is made of brass and has an outer diameter of 22 mm and a height of 70 mm. The electrical heater for melting the material is mounted in the upper part of the device and can be released from the reservoir by a bayonet cap, enabling a quick refi ll. At the lower end of the res-ervoir the star shaped nozzle chip (see fi g.2) is mounted. Through a gas inlet inert gas can be applied to the reservoir and the bypass channels of the nozzle chip. Through this gas fl ow, the metal is pushed into the reservoir outlet and a gas fl ow through the bypass channels occurs. Thus, the molten metal is simul-taneously actuated and protected from oxidation. A detailed explanation of the working principle can be found in [1].The setup for the experiments presented in this paper consists of the StarJet actuator mounted above a rotating substrate. The distance between the nozzle and the substrate was constant at 20 mm, while the rotation speed of the substrate has been varied between 25 – 35 rpm. Depending on the droplet size, dispensing frequency and rotation speed different 3D-structures could be printed.

ExperimentsThe printhead was operated us-ing materials with melting points of Tm = 210 °C (Sn95Ag4Cu1) and

N. Lass1, A. Tropmann1, A. Ernst2, R. Zengerle1and P. Koltay1,2

1 Laboratory for MEMS Applications, IMTEK, University of Freiburg, Germany2 BioFluidix GmbH, Georges Köhler Allee 106, 79110 Freiburg Germany


Rapid Prototyping of 3D Microstructures by Direct Printing of Liquid Metal

Figure 1: Sketch of the StarJet actuator used for experiments

47


Tm = 420 °C (Zn96Al4). Monodispers single metal droplets were gener-ated applying dispensing-frequencies up to fmax = 50 Hz in DoD-mode by controlling the valve timing. The self-regulating continuous-mode allows adjustable dispensing-frequencies between fmin = 100 Hz and fmax = 4 kHz by varying the actuation pressure. Hereby, the frequency depends on the actuation pressure and the nozzle geometry (Fig. 3), whereas the drop-let diameter is defi ned mainly by the nozzle size (ddrop = 48 µm to 360 µm available through various designs). The high directional accuracy of the droplets enables to print 3D-structures at a constant distance from nozzle to substrate of h = 20 mm. A nozzle chip, generating droplets of ddrop = 120 µm, was used to dispense single droplets onto a turning substrate to generate porous tube-shaped metal structures (Fig. 4). The adaptation of the printing frequency and the rotation speed of the substrate to different geometrical settings enabled to print homogeneous structures of different diameters (Fig.5(r)). Increased sample temperatures and dispensing frequencies led to merging of the drop-lets on the substrate, entailing a coil-like structure without porosity (Fig.5(l)).

ConclusionThe described experiments show that the StarJet technology can be suc-cessfully applied for the 3D-prototyping of metal structures. The quality of the droplet generation in terms of printing frequency (fmax = 4 kHz) and straight-ness of the droplet trajectory could

be increased in comparison to former work. The presented tube shaped structures demonstrate that depending on the droplet and substrate temperature – and other printing parameters – the porosity of the printed structures can be varied considerably.

AcknowledgementsThe work was done within the Project Micro Master Printer funded by the Federal Ministry of Education and Research Germany (FKZ 02PO2872).

[1] T. Metz, G. Birkle, R. Zengerle, P. Koltay, “StarJet: Pneumatic Dispensing of Nano- to picoliter Droplets of liquid metal” IEEE MEMS 2009, pp.43-46

[2] D. Schuhmacher et al. „Erzeu- gung von Mikrotropfen aus fl üssi-

gem Lötzinn mittels einer hochparal-lelen und kontaktlosen Drucktech-nik“ IEEE MEMS 2007, pp. 357-360

[3] M. Ession, D.M. Keicher, W.D. Miller, „Manufacturing electronic components in a direct-write pro-cess using precision spraying and laser irradiation”, Patent, 2000

[4 Wenbin Cao, Miyamoto, Yoshinari, “Freeform fabrication of aluminum parts by direct deposition of

molten aluminum” Journal of Materials Processing 173 (2006) 209–212

IMTEK - University of Freiburg Laboratory for MEMS ApplicationsDipl.-Ing. Nils LassGeorges-Koehler-Allee 106D – 79110 FreiburgPhone +49 (0)761- 203 -7148Fax +49 (0)761- 203 -7539Mail [email protected] www.imtek.de

Nils Lass

Figure 2: a) Photo of StarJet nozzle chip b) cross section of the star shaped nozzle.

Figure 3: Measurement of break-off frequency and droplet diameter in relation to actuation pressure (183 µm Inner nozzle diameter, Number of fi ngers 12)

Figure 4: SEM image of a printed micro tube (Sn95Ag-4Cu1) with 315 µm wall thickness. The close-up view shows the morphology of the porous surface.

Figure 5: Coil-like structure (left) and porous tube (right)

Tunable Fabry-Pérot Interferometers for Infrared Spectroscopy

IntroductionThe analysis and control of gases and gas mixtures are important tasks in many engineering fi elds, as well as in medical, safety, food processing and security applications. Many of these applications demand for measuring devices, that are considerably less costly then high precision laboratory instruments and analysis methods. Even the measurement range of these laboratory instruments is very often used only to a small percentage. The demand is for highly specialized and low cost gas measurement devices for the mass market. Microspectrometers for gas analysis are a recently emerging solu-tion. Especially the infrared transmittance spectrum contains all information about the contents of gases (wavelength of absorption bands) as well as its concen-tration (absorbance) in a mixture. In all spectrometers the wavelengths have to be separated by an optical component, which can be based on interference, diffraction or refraction of optical waves. The Fraunhofer ENAS and the Zentrum für Mikrotechnologien is working at the fi eld of tunable optical interference fi lters

since several years. Today different opti-cal fi lter structures are available, covering the whole wavelength range from 3 µm to 11 µm. The latest development is a tunable dual-band infrared fi lter, for the spectral range from 8 µm to 10.5 µm and from 4 µm to 5 µm. The fi lter can be included in a spectrometer module together with pyroelectric detectors and additional optical components.

Design and technologyThe infrared fi lters are based on the principle of the Fabry-Pérot interfer-ometer (FPI). Two fl at and very smooth refl ectors with high refl ectance are aligned in parallel, building an optical cavity in between (Fig. 1). Light which enters the cavity resonates between the refl ectors and interferes. Only light of those wavelengths can transmit through the FPI, which fulfi lls the condition of constructive interference. The typical transmittance spectrum of a FPI shows narrow pass-bands at the different inter-ference orders. Between them are large spectral ranges, where nearly all incident light is blocked. Because of this unique characteristic, the FPI is highly suitable

as band-pass fi lter in spectroscopic applications. Furthermore, by varying the distance between the refl ectors, the pass-band of the FPI can be shifted considerably.Refl ectors with high refl ectance can be made of stacked dielectric thin fi lms. In these optical coatings, a defi ned number of layers of dielectric thin fi lms are deposited in interchanging order of the refractive index of the material. The thickness of the layers and the sequence of the refractive indices in the stack are optimized for maximum refl ectance over the desired wavelength range.

The FPI with stacked dielectric thin fi lms is ideally suited for fabrication in a micro-mechanical batch process (Fig. 2). Many identical chips are structured parallel on silicon wafers. The FPIs are made of two silicon wafers that are fi xed together by silicon fusion bonding. A single chip measures 8.5 mm x 8.5 mm x 0.6 mm. The refl ectors are deposited on mov-able carriers, which are suspended by four equally shaped springs on the chip frame (Fig. 1). The refl ector carrier’s footprint is rectangular shaped. Upper and lower refl ector carriers are aligned

48

Steffen Kurth 1, Karla Hiller 2, Marco Meinig 1, Thomas Gessner 1,2

1 Fraunhofer ENAS2 Zentrum für Mikrotechnologien, TU Chemnitz


Fig. 1: a) CAD model of the FPI showing an exploded view of the upper and the lower substrate and b) Photograph of a fabricated FPI showing top and bottom side

Fig. 2: Photograph of FPIs on wafer level after dicing

49


perpendicular with an overlapping part in the middle, where the refl ectors are de-posited. The outer parts of the refl ector carriers overlap with the opposite chip frame. The chip frames carry electrodes of aluminum on these overlapping parts forming electrostatic drives with the refl ector carriers. The electrodes are isolated from the silicon substrate with layers of silicon dioxide. By applying a potential difference between the elec-trodes and the substrate of the opposite refl ector carrier, they move towards each other and the length of the optical cavity and hence the central wavelength of the FPI’s pass-bands is varied as a consequence. The FPIs are fabricated by a combination of wet and dry etch processes, followed by the deposition of the aluminum electrodes and the layers of the dielectric thin fi lms. The upper and the lower substrate are isolated by silicon dioxide. The chip design shows several advantages. The deposition of the dielectric thin fi lms on thick silicon carriers effectively prevents warping of the mirrors through stress in the thin fi lms. This allows the fabrication of a large aperture of 2 mm x 2 mm.

The independently controllable elec-trodes allow a large wavelength tuning range and the control of the tilt of the refl ector carriers. Booth refl ector carriers are of equal size and mass. As a result, they are defl ected nearly equally by ac-celeration forces, e.g. the gravitational force, which minimizes their infl uence on the optical cavity length and the central wavelength.

Results and ApplicationsThe FPIs show a wavelength tun-ing range of 2500 nm in the fi rst spectral range from 10.5 µm to 8 µm (fi rst interference order) and of 1000 nm in the second spectral range from 5 µm to 4 µm (second interference order). The full width at half maximum of the fi rst pass-band is between 195 nm and 116 nm and of the second pass-band between 81 nm and 57 nm. The peak transmittance is more than 65 % in the fi rst spectral range and more than 70 % in the second spectral range. The maxi-mum tuning range was achieved with a control voltage of 58 V. A typical trans-mittance spectrum is shown in Fig. 3.The mechanical robustness of the FPIs

was tested with a level drop tester. Shocks according to Mil-Std-883G, method 2002.4, test condition B were used, which corresponds to a peak amplitude of 1500 g and a pulse duration of 0.5 ms. Random sample devices were tested with three succeeding shocks

in every direction and passed without failure.The FPIs are integrated in miniaturized spectrometer modules. A typical module is shown in Fig. 4. It consist of an infrared emitter, a sample cell (cuvette), a tunable dual-band FPI, a beam-splitter and two pyroelectric detectors, with blocking fi lters for the respective spectral range. The spectrometer is operated by a microcontroller based smart system and can be coupled with a standard PC for data visualization, analysis and stor-age. With such a miniaturized infrared spectrometer many different applications can be addressed.FPIs are available as single-band and dual-band versions for the spectral range from 3 µm to 11 µm. The analysis of breathing gas is one possible applica-tion. Many medical gases like haloge-nated ethers, nitrous oxide and carbon dioxide can be covered by this spectral range. Another interesting application is the analysis of hydrocarbons or mixtures of hydrocarbons with other gases. The ripening of fruits e.g. is coupled with the production of ethylene, which can be detected by infrared spectroscopy in the wavelength range from 3 µm to 4 µm. Further applications are the analysis of biogas, of ethanol in breathing gas or carbon dioxide in beverages.

Fraunhofer ENASTechnologie-Campus 3D – 09126 ChemnitzPhone +49 (0)371- 45001- 255Fax +49 (0)371- 45001- 355Mail [email protected] www.enas.fraunhofer.de

Fig. 3: Measured spectral transmittance of a tunable dual-band FPI

Fig. 4: Photograph of a dual-

channel microspec-trometer based on

a tunable dual-band FPI and a sample cell

(cuvette)

Miniaturized Signal Switching Matrix Based on Bistable Micro Relays

IntroductionDespite the continuing expansion of optical fi ber networks in the telecom-munications industry, copper wires will make “the last mile” to the customers in predictable future, mainly due to the high conversion costs.Automated distribution frames can ensure that the existing copper architec-ture meets the growing requirements in service, speed and cost. The installation of an automated system at major trans-fer points, such as a main distribution frame or a street cabinet, enables the reconnection of copper lines between service providers and customers by remote access. Like this line tests can be carried out, replacements for broken cables can be established and network providers can be changed in a more cost-effective way. Due to the limited space available in a street cabinet and the large number of relays (10000 units at 50 participants), the use of miniatur-ized switches is necessary. The heart of an automated control system and the topic of this article is a micro relay based signal switching matrix (see Figure 1).In the literature there are dozens of micro relay concepts available [1], but due to the unavailability of commercial MEMS relays and taken into account the drawbacks of current approaches, an electro thermally actuated magneto-static bistable micro relay is developed [2] (see Figure 2) and used within the switch-ing matrix.

Signal switching matrixThe system overview (Figure 3) shows the location of the relay matrix within a street cabinet. Using gas discharge tubes overvoltage is intercepted while maintaining the galvanic isolation. Min-iature fuses in the feed cables provide over-current protection. The matrix is controlled remotely via a computer, which sends the commands via a bus to the control logic. The data is processed

and the chosen micro relay is switched by MOSFET-based power electronics. By choosing a fi xed voltage instead of a current, the risk of damage to the heat-ing layer of the electro thermal actua-tors is minimized, because an increase in temperature leads to an increasing resistance and therefore to a decreasing power consumption.The manufacturing process of the micro relay matrix is optimized for robustness

and cost, and corresponds to the process of a single relay [2]. As substrate inexpensive Al2O3 ceramic or PCB material is used, all conductors consist of pure nickel and the electro thermal actuators are made of the nega-tive photoresist SU-8. Processes such as wire bonding or lapping and polishing are not used within the manufacturing. The matrix can be packaged as a complete system, which means housing the single relays is not neces-sary.

50

Matthias Staab, Christoph Büttgen, Darina Riemer and Helmut F. SchlaakTechnische Universität Darmstadt, Institute of Electromechanical Design


Table 1: Measured properties of the 4x4 signal switching matrix demonstrator

Property Value

Switchable load > 110 VDC @ 100 mA

Contact force ca. 12 mN

Contact travel ca. 100 µm

Contact resistance ca. 34 mOhm

Passage resistance 123 – 468 mOhm

Response time < 220 ms

Switching time < 8 ms

Control power ca. 200 mW

Dielectric strength > 330 VAC

Figure 1: Demonstrator of a miniaturized 4x4 signal switching matrix based on bistable micro relays

Matthias Staab

51


System characterizationThe developed 4x4 signal matrix demonstrator has been electri-cally and mechanically charac-terized. It shows a footprint of 25.9 x 35.4 mm² including the surrounding connecting pads (see Figure 1). Measurements of over 10000 warm switching cycles (5 VDC @ 100 mA) per relay without signifi cant change in the contact resistance are done. So far all failures of the micro relay are caused by the fracture of the heating structures within the micro actuators. This can be improved by a thinner heating layer reducing the stiffness. The high heat capacity of the electro thermal actuators causes a relay response time of 220 ms. The switching process itself takes less than 8 ms. Due to the matrix arrangement differ-ent lengths of signal paths exist, which lead to passage resistances (input to output) between 123 and 468 mOhm. The measured proper-ties of the MEMS matrix are shown in Table 1. Conclusion and outlook

The applicability of the presented switching matrix for the use in main distribution frames and street cabi-nets has been shown. The automated switching system is distinguished by its low electrical resistance, high voltage and current switching capabil-ity, galvanic isolation, overcurrent and overvoltage protection, small footprint, high effi ciency, high operating frequency range and its current direction indepen-dence. The response time of 220 ms is no drawback for the presented applica-

tion. Furthermore the matrix can be used for other signal switching applications, e.g. in selector switches or in digital audio mixing.

Figure 2: Schematic diagram of the electro thermally actuated magnetically bistable micro relay [2]

Figure 3: Application scenario in a street cabinet as a switch be-tween network providers and customers

Technische Universität DarmstadtInstitute of Electromechanical DesignMerckstraße 25D – 64283 DarmstadtPhone +49 (0)6151 - 16 - 3496Fax +49 (0)6151 - 16 - 4096Mail [email protected] www.institut-emk.de

Figure 4: Contact resistance and control power while switching a load of 1000 mA @ 5 VDC

References[1] E. Thielicke, “Design und Realisierung

eines elektrostatischen Mikrorelais in Oberfl ächen-Mikromechanik”, Elektro-technik und Informatik, Technischen Universität Berlin, Berlin, 2004.

[2] M. Staab, H. F. Schlaak, “Novel elec-trothermally actuated magnetostatic bi-stable microrelay for telecommunication applications”, Micro Electro Mechanical Systems (MEMS), 2011 IEEE 24th International Conference on, 2011, pp. 1261-1264.

Abstract The high and further growing prevalence of heart failure, being responsible for one of the highest expense fac-tors both in national and international healthcare systems, requires new approaches to diagnosis and therapy. Early detec-tion of cardiac decom-pensation by continuous remote monitoring of pul-monary artery pressure is one such approach. Funded by the BMBF, the COMPASS Project aims at the development and in-vivo evaluation of an implantable pressure monitoring system. A miniatur-ized capacitive pressure sensor as key element is implanted in the pulmonary artery and is connected to a subcuta-neous RF capsule, which contains the RF telemetry unit and the battery. The Biotronik Home Monitoring Network pro-vides further data transmission. In the fu-ture, the system will allow the attending physician to take early notice of increas-ing pulmonary artery pressure in order to adjust the therapy, e.g., medication, to avoid a hospitalization of the patient.

Heart Failure – Clinical BackgroundHeart failure has not only a dramatic impact on the affected patients, but also on the national health care systems. Since 2006 heart failure is the most frequent reason for hospitalisation, and is, moreover, one of the most cost-inten-sive chronic diseases, being responsible

for about 1% to 2% of healthcare costs in industrialised countries.The largest part of the costs results from the hospitalisation; a fact that strongly drives the research for early detection methods of cardiac decompensation that precedes a hospitalisation by tele-monitoring.

Implantable Pressure MonitorFunded by the Federal Ministry of Education and Research (Bundesmin-isterium für Bildung und Forschung, BMBF), an implantable pressure sensor system is developed for continuous monitoring of the pulmonary artery pressure. This will allow to detect early signs of cardiac decompensation before fi rst symptoms occur. Pulmonary arte-rial pressure is of high predictive value since decreasing pumping effi ciency as a result of heart failure will soon lead to blood congestion in the pulmonary ves-

sel bed and conse-quently to a signifi -cant pressure rise [1]. A miniaturised pres-sure sensor capsule as the key element of the monitoring system is positioned in the pulmonary artery; it is connected to a subcutaneous implant containing the battery and an elec-tronic module for data readout and telemetry (Fig. 1). The battery was developed by Litronik Batterietech-nologie GmbH, Pirna,

based on battery technology for implant-able stimulators, and was optimised for the required measurement and telemetry regime. The system is completed by the Biotronik CardioMessenger as an external patient device, which is able to receive the sensor data from the implant and to transmit the data to the Biotronik Home Monitoring Service Center. More-over, it was enhanced with an additional pressure sensor to allow compensation of barometric pressure changes.The implantable pressure probe con-tains an integrated pressure sensor ASIC with capacitive sensing elements, developed and manufactured by the Fraunhofer Institute for Microelectronic Circuits and Systems (IMS), Duisburg. It is directly connected to a postprocess-ing chip for further signal processing, A/D conversion and transmission. Both chips are mounted on a chip carrier together with further components and

Implantable Pressure Sensor as a Key Element for New Therapeutic Approaches to Heart Failure – the COMPASS Project

52


Albrecht Urbaszek, Biotronik SE & Co. KG

Fig. 1: COMPASS pressure monitoring system, consisting of a pressure sensor (1) implanted in the pulmonary artery, which is connected to a subcutaneous implant (2) with a sensor cable, and an external patient device (3).

53


are contacted to a feedthrough. The assembly was developed by the Institute of Materials in Electrical Engineering 1 (IWE 1), RWTH Aachen. [2]. Finally, the sensor electronics are packaged in a hermetically sealed housing.In a fi rst series of in-vivo tests, the mechanical sensor design, mate-rial and surface properties as well as the implantation technique have been investigated with dummy sensor probes in 5 acute and 5 chronic animal tests. The animal tests have been coordinated and performed by the Institute of Applied Medical Engineering, RWTH Aachen. As a result, a special introducer system was designed, built and tested that enables a secure and reproducible implantation of the sensor in the pulmonary artery. The position of the sensor has shown to be stable over the whole chronic investigation period of 3 and 6 months, respectively.

Currently, sensor prototypes are being investigated in acute animal tests. First acute pressure recordings show the general feasibility of pulmonary pressure measurement with the cur-rent sensor design (Fig. 3). Chronic investigations are currently prepared to investigate long-term performance of the monitoring system.

OutlookIn a next step, the implantable pressure monitor will be integrated in the Bio-tronik Home Monitoring system, which provides a well-established infrastruc-ture to notify the physician early about a worsening heart failure condition of the patient. This will give the physician the opportunity to stabilise the patient’s status, e.g. by adapting medication, and will help to avoid hospitalisation.

References[1] Bode S, Trieu H-K, Traulsen T, Mokwa W,

Schmitz-Rode T: MST am Herz: Implanti-erbarer Sensor zur Bestimmung wichtiger Parameter zur Diagnose und Therapie von Herzinsuffi zienz (COMPASS). Mikrosystem-technik Kongress 2009, Berlin Offenbach: VDE Verlag GmbH; 2009 p. 74-5.

[2] Müntjes J, Meine S, Flach E, Görtz M, Schmitz-Rode T, Trieu H-K, Mokwa W: Monitoring intravascular pressure with a pulmonary artery pressure sensor system - assembly aspects. Smart Systems Integration, Como (I), 23-24 March 2010, Berlin Offenbach: VDE Verlag GmbH; 2010 p. 81-5.

Albrecht Urbaszek, Biotronik SE & Co. KG, ErlangenHoc Khiem Trieu, Fraunhofer IMS, DuisburgTim Traulsen, LITRONIK Batterietechnologie GmbH, PirnaWilfried Mokwa, RWTH Aachen University, Institute of Materials in Electrical Engineering 1 (IWE 1)Thomas Schmitz-Rode , RWTH Aachen University, Institute of Applied Medical Engineering

Fig. 2: COMPASS sensor capsule, containing a pressure sensing ASIC, a signal postprocessing chip and SMD components, assembled on a chip carrier.

Fig. 3: In-vivo recording of the pulmonary pressure with the COMPASS sensor (upper trace), compared to a Millar catheter measurement (lower trace) for reference (sheep animal model).

Biotronik SE & Co. KGCenter for Technology and ServiceDr. Albrecht UrbaszekHartmannstraße 65D – 91052 ErlangenPhone +49 (0)9131- 8924-7650Mail [email protected] www.biotronik.com

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IntroductionEnergy autonomous sensor nodes are powered by environmental energy. Dedi-cated harvester devices extract electrical energy from this source. Usually, the harvested energy has to be processed by an interface circuitry to enable sensor node operation. Various energy sources can be exploited for a number of ap-plication scenarios. There are eight main application fi elds in different states of maturity [1]:

✦ Research: medical, environment, consumer electronic.

✦ Development: automotive, industrial, military, aerospace.

✦ Production: building & home auto-mation.

Fig. 1 summarizes the predicted mar-ket launch and volume [1] for energy autonomous main application fi elds. Regarding the automotive sector the tire pressure monitoring system (TPMS) is a high volume key application.In general, an energy autonomous system can be implemented by a mac-roscopic approach or it can be miniatur-ized by using MEMS technology. The

choice of implementation for a specifi c application depends on the technical and commercial boundary conditions.This paper gives an overview of energy autonomous sensors for automotive applications. Potential energy sources within the automotive environment are addressed. TPMS is discussed as a key application example. A MEMS based piezoelectric power module is consid-ered and a realized system is reported.

Energy autonomous automotive sensors A comprehensive review of state of the art automotive sensors is given in [2]. Sensors are utilized for power train, safety and comfort functions. A medi-um-sized vehicle is typically equipped with about 60 different sensors. In the future this number will be signifi cantly increased by additional innovative func-tionality. Current sensor systems are ei-ther cable powered by the car battery or locally powered by an individual battery. Replacing these conventional solutions with an energy autonomous approach provides several advantages:

✦ Increased functionality. ✦ Increased assembly fl exibility.

✦ Environmental friendly. ✦ Reduced upgrade costs. ✦ Increased service intervals.

The proof of principle for the energy autonomous approach has to be dem-onstrated by suitable applications. First show case applications are expected in the area of comfort sensors. Wireless switches and controls are considered to be feasible. An attractive example would be an energy autonomous stop request bottom in a bus. TPMS is a further very promising example because of the addressed market volume and will be discussed in detail in the Microsystems section below.

Energy sources in the automotive environmentA fi rst relevant source is thermal energy provided by the combustion engine. With a typical motor effi ciency of about 30% this energy is highly available. In the vicinity of the engine, the cooler and the exhaust tract the energy can be utilized by Peltier thermo harvesters.A second important energy source is solar based. Depending on weather

Alexander Frey and Ingo Kuehne

Energy Autonomous Microsystems for Automotive Applications

Alexander Frey Ingo Kuehne

Fig. 1: Market launch and market volume for energy autonomous main applications [1].

Fig. 2: TPMS mounting options:

at the rim or on the inner liner of the tire [3].

55


conditions it is available on the outside of a car body but also in the interior. So-lar cells allow for easy use of this energy. Companies like Daimler and Toyota have already demonstrated the assembly of solar cells at the car roof. The harvested energy is used to power the aerator and control the indoor climate during parking. Cooling is enabled in case of sunny weather conditions, which could be otherwise powered only very limited by the car battery.

A third energy source is of mechani-cal origin. It comes in different variants: rotating, vibrating and fl owing. Rotational energy can be utilized for example within the tire but also at the power train. For the moving car, vibrations are found in many places. Flow energy is available for example in the exhaust tract but also at the car body or the intake system.

MicrosystemsConventional TPMS are powered by battery and are mounted on the wheel rim as shown in Fig. 2. An alterna-tive assembly on the inner liner of the tire would allow for the detection of a number of additional parameters. Infor-mation about tire temperature, friction, wearout and side slip could be used to optimize tracking and engine control. However, the innovative approach requires a completely different sys-tem design. For example a substantial constraint is set by the system mass. In order to avoid tire unbalance the overall mass must not exceed several grams. The mass of batteries which enable a minimum life time of eight years are by itself already in this range.

An advantage of a microsystem ap-proach is obvious in that context.The system components of a piezo-electric power module are shown in Fig. 3. A conventional cantilever de-sign [4] with a seismic mass in the gram range is critical because of the tire acceleration. In [5,6,7] an innova-tive microsystem design is reported. The MEMS generator consists of a piezoelectric thin fi lm on a carrier layer (cf. Fig 4). Because of the mass in the microgram range the design is robust against high accelerations.Tire related forces during the period of tread shuffl e passage are to be used for a pulsed excitation of the generator. Thereby, the cantilever starts oscillating and electric energy can be extracted by the interface circuit (cf. Fig 4).

Conclusion and OutlookEnergy autonomous sensors have a high potential for automotive applica-tions. This assessment is based on the expected advantages as cost reduction, environmental benefi t and improved functionality. A microsystem approach enables properties as required by a tire based TPMS. System components for a miniaturized power module were designed and successfully tested in a laboratory experimental setup.

AcknowledgementThis work is supported by the Federal Ministry of Education and Research, Germany, and contributes to the project „ASYMOF - Autarke Mikrosysteme mit mechanischen Energiewandlern für mobile Sicherheitsfunktionen“ (reference 16SV3336).

References[1] Yole Report: EmergingMEMS 2010, March

2010.[2] Reif, K: Sensoren im Kraftfahrzeug, Bosch

Fachinformation Automobil, Vieweg + Teubner Verlag, Wiesbaden, 2010.

[3] Wagner, D.: Enabling Energy Harvesting Powered Sensors for Intelligent Tire Monitoring, Energy Harvesting For Wireless Automation, Germany, 2010.

[4] Just, E. et al.: Elektromechanischer µ Genera-tor basierend auf der Piezo-Polymer-Komposit Technologie, GMM-Fachbericht Bd. 51, 21-24, 2006.

[5] Frey, A. et al.: System design of a MEMS-based energy harvesting module for power autonomous applications, 6. GMM-Workshop - Energieautarke Sensorik, 2010.

[6] Kuehne, I. et al.: Optimum design of a piezo-electric MEMS generator for fl uid-actuated energy harvesting, Proc. of MEMS 2011, Cancun, Mexico, 1317-1320, January 2011.

[7] Frey, A. et al.: Piezoelectric MEMS energy harvesting module based on non-resonant excitation, Proc. of Transducers 2011, Peking, China, 683-686, June 2011.

Dr. Ingo KuehneSiemens AGCorporate TechnologyCorporate Research and TechnologiesCT T DE HW1Otto-Hahn-Ring 6D – 81739 MünchenPhone +49 (0)89 - 636 - 41603 Fax +49 (0)89 - 636 - 48555 Mail [email protected] Web www.siemens.com

Fig. 3: System com-ponents of the piezoelectric energy harvesting module. The generated electri-cal energy We is provided through the interface cir-cuit as load power PL [5].

Fig. 4: Realized energy

harvesting module.

Prof. Dr. Alexander FreyHochschule AugsburgFakultät ElektrotechnikAn der Hochschule 1D – 86161 AugsburgPhone +49 (0)821 - 5586 - 3615Fax +49 (0)821 - 5586 - 3360Mail [email protected] www.hs-augsburg.de

Developement of Integrated Micro-scale Buffer Batteries – Li4Ti5O12 LiMn2O4 Cells with Organic Gel Electrolyte

AbstractSelf-suffi cient electrical micro-sys-tems rely on energy-harvesting of the surroundings to cover their en-ergy consumption. In these systems, rechargeable batteries are needed as energy buffers and lithium-ion batteries, especially integrated micro batteries, are best suited due to their high power- and energy densities.

Since the battery’s power density is dependent on the electrode thickness, the battery must be optimized to fi t the current-profi le of that particular micro-system. In this study, the discharge ca-pacity as a function of discharge current for different electrode thicknesses of (Li4Ti5O12 / LiMn2O4) battery electrodes was electrochemically investigated by measurements in Swagelok®-cells.The practical area capacities of the elec-trodes investigated was between 0.75 and 3.5 mAh/cm² and it was shown that the load capacity decreases substan-tially with increased electrode thickness.The presented integrated micro-battery design consists of an anode, separa-tor and cathode which are placed in a substrate cavity. The electrodes and separator are bonded together by gelling a mixture of electrolyte (EC/DEC/LiPF6) and monomers through polymerization.The ionic conductivity of the electrolyte after gelling was also investigated by measurements. The measurements on the modifi ed electrolytes showed a slight reduction in conductivity due to the gelling. The manufacture of dry battery laminates based on gel with organic solvents for use in micro-batteries is thus possible.

1 IntroductionMiniaturized autarkic electronic systems such as sensor nodes for process con-trol can be powered by ambient energy. Energy harvesting devices need a re-chargeable electric buffer [1, 2]. Lithium ion secondary batteries are well suited for this due to high volumetric energy density and a fl at discharge curve. New assembling concepts for the electrical buffers are necessary for device minia-turization. The most important requests are increasing the volumetric energy

density by reducing the amount of pas-sive materials and integrating the cell into micro devices. For this reason, the assembling concept of integrated buffer batteries differs dramatically in compari-son to the cell design of bigger batteries like pouch cells for mobile phones.Miniaturized batteries can be realized by 3D integration technology [3-6]. Another approach for realization of small batter-ies for energy harvesting applications is the thin fi lm battery concept [7-9]. These

solid state batteries have high cycle stability, high rate capacity and a wide working temperature range. On the other hand, manufacturing costs are very high due to expensive vacuum- and thin fi lm processes.

An alternative, promising assembly concept is the integrable micro battery [10]. In this concept, conventional ac-tive materials from lithium polymer pouch cells, slightly adapted, are combined with a micro packaging technology.

2 Micro batteries as bufferUsing conventional laminated electrode foils is the key benefi t of the in [10] described micro batteries which allows low production costs. Furthermore, many micro battery substrates can be processed on one wafer at the same time. A silicon substrate or a glass metal package can be used for quasi hermetic encapsulation which is crucial for a long time stability of the battery. A schematic setup is shown in fi gure 1; a fi nal micro

56

K. Marquardt1, M. Thunman2, T. Stolle1, M. Blechert2, R. Hahn1, 1Fraunhofer Institut Zuverlässigkeit und Mikrointegration Berlin; 2Technische Universität Berlin


Figure 1: Sketch of an integrable micro battery [10]

57


battery is shown in fi gure 2. Integra-tion of battery laminates into cavities is challenging. The laminates will not be compressed by a pouch foil and thus need to be strength durable. Battery laminates will be fully soaked with elec-trolyte before integrating into the cavity. Liquid electrolyte can be jelled to keep it in the laminate while cell assembling. We have chosen an acrylate matrix to make this gel. The electrochemical sta-bility was proved. Also the infl uence of the jelling process to the ion conductivity was measured. The ion conductivity is not affected because of the low amount of acrylate monomers (< 5 % grav.).The rate capacity is determined by the cell design. Especially electrode thickness and electrolyte ion conduc-tivity have impact to the high current discharge capacities. Thus, battery laminate receipts have to be adapted to the current profi le of the application to be powered. Autarkic wireless sensor nodes have a highly dynamic power profi le. Battery life time can be calcu-lated based upon the application power profi le and the battery discharge char-acteristic. Determining of the discharge capacities for different discharge current densities is important for the design of micro batteries.

3 ExperimentMeasuring of the electrolyte ion con-ductivity (liquid, jelled) have been done. Furthermore, the electrical performance of battery laminates was measured by means of electrical charge / discharge tests. Battery materials used for the experiments are shown in table 1.Platinum glass electrodes by Eifel

Euskirchen and an impedance meter type 3560 (1 kHz) from HIOKI were used for measuring the electrolyte ion con-ductivity. The samples were tempered with help of a water bench. Polymeriza-tion of the gel matrix was started by exceeding the peroxide determination temperature. Water content was mea-sured by Karl-Fischer-Titration (Metrohm KFC 831). For all samples, the water content remains below 80 ppm.

Various electrode thick-nesses realized by laminating single electrodes together. Thus, the capacity per area increases analogical.

Test cells, made of Swagelok® ele-ments (fi gure 3) were used for electrical measurements of laminates. The active electrode area is 1.09 cm². A series 4000 Maccor battery tester was used for charge / discharge measurements.

Figure 2: Final encap-sulated micro battery [10]

Table 1: Battery materi-als used for experiments.

Figure 3: Swagelog®-Test cell

58


3.1 Gel electrolyteA gel electrolyte was made based on a liquid electrolyte. To make this gel, acry-late monomers were added and polym-erized to get a matrix which generates a structure freezing the liquid solvents of the electrolyte.

3.1.1 Making gel electrolyteThe gel electrolyte was made by using the base electrolyte, di- and trifunctional acrylate monomers and peroxide (table 1). All ingredients were mixed in a glove box under dry argon atmosphere. So, the water content of the monomers was reduced down to 40 ppm by adding molecular sieve for 2 days. The perox-ide was added right before jellifi cation for avoiding unintended spontaneous polymerization. Rheological and wetting properties were optimized by varying the fractions of ingredients.

3.1.2 Measuring ion conductivityElectrolyte ion conductivity was mea-sured with a 4 wire impedance setup. Test tubes with a sample volume of 50 ml each were used. The temperature of the electrolyte sample was cooled down to -16.5°C, followed by increas-ing the temperature up to 78°C with a change rate of approx. 1 K/min. The po-lymerization of the monomers starts with the peroxide decomposition tempera-ture of 68°C. With devolving to the gel phase, the impedance of the electrolyte increases slightly (fi gure 4). The impedance of the jelled electrolyte remains in the range of the liquid phase impedance. So, batteries made with liquid and jelled electrolyte should show the same rate capacities.

3.2 Infl uence of electrode thickness to rate

Electrical measurements have been done at climate controlled lab at 22°C. The cells were charged with constant current / constant voltage (C/10; 2.9 V; cutoff C/100). The end of discharge voltage was defi ned to 1.5 V.

Battery laminates with 5 different elec-trode thicknesses and liquid electrolyte were tested. The measured capacity densities can be seen in fi gure 5 for various discharge currents. For low discharge currents, the full discharge capacities were found for all batteries, irrespective of the electrode thickness.

Figure 4: Ionic conduc tivity of electrolyte during heating.

Figure 5: Discharge capacity of cells with various electrode thicknesses versa discharge current density, liquid electrolyte.

Figure 6: Discharge capacities of battery using liquid (black) and gel (red) electrolyte.

59


The measured discharge capacities are 0.75 and 3.5 mAh/cm² for 1-layer and 5-layer cells, respectively. Thin cells show nearly constant discharge capacities for currents up to 5C. Thick electrode cells show lower discharge capacities for higher currents. For 3C discharge, the useable capacity of the thin batteries is highest. The thicker the electrodes, the lower are the useable capacity for high currents. Over potentials due to electronic losses within the electrodes can be neglected (Li4Ti5O12, 3% carbon black: 0.1 S/cm for). Obviously, the maximal discharge current is kinetic-limited by the elec-trodes. The end of discharge voltage will be reached faster for thick electrode batteries than for thin electrode cells. For high currents, a nameable charge remains not useable in the thick elec-trodes. Thus, high power cells need to be designed with thin electrodes to keep the ionic path short.

3.3 Battery performance with liquid / jelled organic electrolyte

Batteries, made with both types of electrolyte, liquid and jelled, have been tested in Swagelok®-cells. The stabil-ity of the gel electrolyte was proofed in preliminary tests by cyclic voltammetry for potentials up to 2.9 V against lithium.The wetting quality of the monomer-containing electrolyte is worse, com-pared to that without any additives for jellifi cation. So, soaking the electrodes with monomer-containing electrolyte takes signifi cant longer fi lling time. Thus, vacuum supported electrolyte fi lling is recommended. The reachable dis-charge capacities are nearly the same

for both kinds of cells, whether or not they contain gel components (fi gure 6) also for high current densities.

4 Conclusion and outlookInvestigations have been done for the usability of organic gel electrolyte in mi-cro batteries. For this, ion conductivity of the electrolyte has been measured. Full cell measurements were done to deter-mining rate capacity. The applicability of jelled electrolyte for use in battery cells was shown without limitations in battery performance. The relation between electrode thick-ness and rate capacity was determined by test cell measurements which are highly important for dimensioning for micro battery cells.Next tests will be done regarding cycle stability and durability of the micro batteries. For proceeding in miniaturiza-tion of buffer batteries, new assembly concepts are necessary. For this, con-ventional slurries from lithium polymer pouch cells, slightly modifi ed, could be deposited directly into the substrate cavities to get low cost small size battery electrodes. The requirements for these modifi ed electrode slurries must be formulated from micro system design aspects. For example, the process tem-perature tolerance should be increased to allow high temperature hermetic sealing processes.This work reported her was partly funded by the BMBF, VDI Düsseldorf, support code: 13N10599.

Literature[1] Belleville, M. et al. Energy autonomous sen-

sor systems: Towards a ubiquitous sensor technology. Microelectronics Journal, Band 41, #11 (2010) Seiten 740–745.

[2] Hahn, R. Autonomous energy supply for electronic grains and wireless sensors, Frequenz, no. 3-4, pp. 87 – 91, 2 2004

[3] Dunn, B., J. W. LONG und D. R. ROLISON. Rethinking multifunction in three dimensions for miniaturizing electrical energy storage. The Electrochemical Society Interface (2008) Seiten 49–52.

[4] Nathan, M. et al. Three dimensional (3D) thin film microbatteries. DTIP of MEMS & MOEMS (2005) Seiten 1–4.

[5] Hart, R. W. et al. 3-D Microbatteries. Elec-trochemistry Communications, Band 5, #2 (2003) Seiten 120–123.

[6] Min, H.-S. et al. Fabrication and properties of a carbon/polypyrrole three-dimensional microbattery. Journal of Power Sources, Band 178, #2 (2008) Seiten795–800.

[7] Bates, J. et al. Thin-film lithium and lithium-ion batteries. Solid State Ionics, Band 135, #1-4 (2000) Seiten 33–45. ISSN 0167-2738.

[8] Neudecker, B., R. A. Zuhr und J. B. Bates. Lithium silicon tin oxyni-tride (LiySiTON): high-performance anode in thin-film lithium-ion batteries for microelectronics. Journal of Power Sources, Band 81-82 (1999) Seiten 27–32. ISSN 0378-7753.

[9] Singh, D. et al. Challenges in making of thin films for LixMnyO4 rechargeable lithium bat-teries for MEMS. Journal of Power Sources, Band 97-98 (2001) Seiten 826–831.

[10] Marquardt, K. et al. Development of near hermetic silicon/glass cavities for packaging of integrated lithium micro batteries. Micro-system Technologies, Band 16, #7 (2009) Seiten 1119–1129.

Fraunhofer Institute for Reliability and Microintegration (IZM) High Density and Wafer Level Package (HDI/WLP) Krystan MarquardtGustav-Meyer-Allee 25 D – 13355 BerlinPhone + 49 (0)30 - 464 03 - 611Fax + 49 (0)30 - 464 03 - 123Mail krystan.marquardt@ izm.fraunhofer.deWeb izm.fraunhofer.de

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IntroductionExact dosing of liquids is increasingly important for the biomedical industry [1]. State of the art systems, which are able to deliver a regulated fl ow rate, are quite large and expensive. Micropumps, which are available on the market today, are quite small but they only work in a controlled, not in a regulated mode. A regulating system consisting of a micro-pump with an integrated thermal fl ow sensor with small dimensions has been developed to open the door to new ap-plications in the biomedical industry.

Device Design The complete system consists of three components: the micropump, the fl owsensor and the superior control loop. The micropump is already available but works only in a controlled mode. Therefore an extrinsic disturbance will lead into a failure of dosage. This can be compensated by a controlled-loop sys-tem. Therefore a thermal fl owsensor was integrated directly into the path of fl ow to measure the actual fl owrate. The supe-rior control loop is responsible to remain the desired fl owrate by evaluating the set point in compari-son to the actual fl ow value. If the set point differs from the actual value, the control loop will adjust the pumping parameters to reach the set point again.The micropump is a small membrane pump manufactured by Bartels Mikrotech-nik GmbH and its

maximum fl ow rate is about 6 ml/min. It is agitated by a control voltage which drives the piezo actuator membranes. Increasing voltage increases the result-ing fl ow rate. The micropump withstands a backpressure up to 550 mbar.

Sensor FabricationThermal fl ow sensors using thermopiles on a membrane of SiN4 were used. The sensors were build with the typical silicon processes (Fig. 2) [2]. First a SiO2 and a SiN4 layer were deposited to build the membrane of the fl ow sensor. The SiN4 layer was done by a LPCVD pro-cess at 700 °C. As a second step the thermopiles and the heater were depos-ited on the membrane material. To form the thermopiles two different conductive material must be brought into contact to generate the Seebeck effect. The used materials are p-doped poly silicon and WTi. The heater is also made of WTi. To protect the structures a second SiN4 layer was deposited. Because of the high temperature of the LPCVD process migration of the WTi into the poly silicon is initiated. This has been avoided by a 60 nm thick TiN diffusion barrier, which

was deposited between the poly silicon and the WTi [3]. To bare the SiN4 mem-brane the silicon was etched from the backside with a DRIE process. Now the membrane is thermally decoupled.

CharacterizationThe sensor concept is based on the thermal electric principle (Fig. 1). A heating element induces thermal energy which affects the down- and upstream arranged thermopiles. The heating ele-ment is driven in a constant temperature mode. This offers advantages concern-ing a bigger sensor range but makes also temperature compensation neces-sary. The electrical signal of the thermo-piles is evaluated in a differential mode. If the fl ow is equal to zero the heat dis-sipation on the membrane is symmetric and therefore the difference is zero. By increasing the fl ow rate the upstream thermopile becomes colder than the downstream one. This leads to a differ-ence of the thermopile signals which is equivalent to its corresponding fl ow rate. The correlation between fl ow rate and sensor signal is nonlinear. Because of the thin membrane of 600 nm the sensor

Ole Woitschach, Walter Lang, IMSAS Universität BremenSeverin Dahms, Bartels Mikrotechnik GmbH, Dortmund

Smart Micropumps – Integration of a Flow Sensor into a Micropump

Fig.1: Schematic of the fl ow sensor Fig.2: Main process steps

61


has a very short response time of 2 ms. So the sensor is able to measure very fast changes of the fl uid fl ow.To understand how the micro pump and the fl ow sensor work together the system was set up in a hybrid assembly. The sensor was integrated into a PCB. A channel was attached to drive the fl uid over the sensor. The fl uid was driven by the micro pump. To evaluate the amount of fl ow in a certain time a balance was used.

Integration and EvaluationTo build an encapsulated system the sensor was directly integrated into the fl uidic path of the micro pump (Fig. 3). A special damper housing was developed to embed the sensor and to smooth the pulsating fl ow. The sensor calibration data were transferred to a look up table. A MCU is responsible for the control of the sensor actor system. To evaluate the system behavior concerning extrinsic disturbances the test rig was marginally changed. These disturbances occur in form of backpressure e.g. a bended

tube or change of reservoir level. To simulate those disturbances a pressure controller was connected to the fl uidic system to build up a pressure against the fl ow direction. If the sensor actor system runs only in the controlled mode the backpressure will lead to a reduc-tion of the fl ow rate. In the worst case the rate is equal to zero. The system integrity is not warranted.If the mode is switched to the regulated mode the MCU notices the change of the fl ow and changes the pump-ing parameters to reach the desired fl owrate again (Fig. 4). Therefore a stable operating condition is secured. With these gained advantages the intelligent micropump offers a new solution to fulfi ll diverse tasks in medical and biological industries.

AcknowledgementThe IMSAS and Bartels Mikrotechnik would like to acknowledge the Arbeits-gemeinschaft industrieller Forschungs-vereinigungen “Otto von Guericke” e.V. (AiF) for research funding.

References[1] A. Al-Salaymeh, J. Jovanovic, F. Durst, “Bi-

directional fl ow sensor with a wide dynamic range for medical applications,” Medical Engineering & Physics, 26 (2004), S. 623-637.

[2] R. Buchner, C. Sosna, M. Maiwald, W. Be-necke, and W. Lang, “A high-temperature thermopile fabrication process for thermal fl ow sensors,” Sens. Actuators A Phys., vol. 130-131, pp. 262-266, August 2006.

[3] R. Buchner, C. Sosna, W.Lang, “Tem-perature Stability Improvement of Thin-Film Thermopiles by Implementation of a Diffu-sion Barrier of TiN,” IEEE SENSORS 2009 Conference, Christchurch, New Zealand, 25.-28. Oktober 2009

Fig.3: Half section and complete view of the assembled system Fig.4: System response of the regulated system when several backpressures are applied

University of Bremen Dept. 1: Physics / Electrical EngineeringInstitute for Microsensors, -actuators and -systems (IMSAS)Ole WoitschachOtto-Hahn-Allee, Build. NW 1Room N 2200D – 28359 BremenPhone +49 (0)421 - 218 - 62582Fax +49 (0)421 - 218 - 4774Mail owoitschach@imsas. uni-bremen.deWeb www.imsas.uni-bremen.de

Ole Woitschach

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To know the oxygen concentration is essential in a variety of industrial, medical or domestic applications e.g. in combustion and reaction processes, air control, during artifi cial ventilation in medicine or in diving. Sensors to monitor the oxygen concentration rely on various chemical and physical principles, such as electro chemistry, solid state ion conduction, chemisorption induced electron conduction, and ChemFETs. Because of their high reliability, long term stability, selectivity, and sensitivity in critical applications mostly paramagnetic oxygen sensors are used, which detect the rather weak but, compared to all other gases, rather unique paramagnetic property of oxygen. Due to their present construction these paramagnetic oxygen sensors are rather sensitive to mechani-cal vibration and clumsy. To avoid these shortcomings, a novel paramagnetic oxygen sensor in micro system technol-ogy was developed, which, due to small

size and lack of moving parts, allows even mobile applications.

System Design and FunctionalityThe novel oxygen sensor is a micro fl uidic system, fabricated in an anodi-cally bonded silicon-glass- sandwich. According to fi g. 1 the gas passes a narrow gas inlet and fl ows into a wide channel, where its velocity is low. A strong permanent magnet placed sideways of this channel generates a magnetic fi eld with a strong gradient, which defl ects this fl ow by at-tracting oxygen molecules. The gas fl ow is then split into three channels, a main centre channel, a measurement channel close to the magnet and a reference channel on the opposite side. Thermo anemometers monitor the fl ow veloci-ties of the gas. They are located in the measurement and reference channel. The gas leaves the sensor through an exhaust.A non magnetic or diamagnetic gas like nitrogen is hardly affected by the inhomogeneous fi eld in the channels, and the gas fl ow will be directed through the centre channel (fl ow 1 in fi gure 1), while the fl ows in the adjacent channels are small.A paramagnetic gas like oxygen, how-ever, will be defl ected by the inhomo-geneous fi eld into the measurement channel (fl ow 2 in fi gure 1). This in-creases the fl ow in that channel whereas the fl ows in reference and main channel are decreased. By comparing the fl ows

in measurement and reference channel the oxygen concentration is determined.Fig. 2 shows a SEM picture of the fabri-cated device, fi g 3 the complete system including the applied magnet in relation to a 10 €c coin.Advantages of the Novel DeviceThere have been various approaches to miniaturize paramagnetic oxygen sensors, e.g. detection of the “thermo-magnetic wind” which is generated by a combination of a permanent magnet and a heater. Another approach is to minia-turize the conventional bar-bell sensor principle. Compared to these, the novel principle presented here has several advantages:

✦ The permanent magnet magnetic fi eld has not to be concentrated to a small region of a single small chan-nel, instead the magnet is positioned at the side of the oxygen sensor, which also allows to chose the size and geometry of this magnet freely, especially stronger magnets, which increase the force on the paramag-netic gas and thus the sensitivity of the sensor.

Stefan Vonderschmidt, Jörg Müller,Institute of Microsystems Technology, Technical University of Hamburg

Miniaturized Paramagnetic Oxygen Sensor


Figure 1: Schematic of the oxygen sensor

Figure 2: SEM micrograph

63


✦ By using the inhomogeneous fi eld only to defl ect the gas instead of to propel it - as it is done in other sensor principles - the required force on the gas to induce a measurable effect is comparatively small.

✦ The combination of a fl uidic bridge with an electric bridge arrangement, made of thermo anemometers, reduces cross sensitivity to pressure and temperature. Yet, the main func-tion of the fl uidic bridge is to reduce the fl ow velocities in measurement

and reference channel in case of a diamagnetic gas, which allows to measure small changes in the fl uid velocity by the electric bridge in case of an oxygen containing paramag-netic gas.

MeasurementsFigure 4 depicts the response of the oxygen sensor to oxygen-nitrogen mix-tures of varying concentrations with (red) and without (black) applied magnetic fi eld. The oxygen content of the sample

gas was increased from 10% to 90% of oxygen in steps of 5%. These steps can clearly be detected. Presently the sen-sor is able to resolve changes in oxygen concentration to 1%. The output signal of the sensor is linear over the whole measured range.The black line depicts a reference measurement without magnetic fi eld as a proof of the functionality of the sensor. Exposing the sensor to identical oxygen concentrations changes the output signal only slightly. This small change is due to a change in thermal conductivity of the gas, which affects the thermo an-emometers, and not due to the defl ec-tion of the gas by the magnetic fi eld.

Conclusion and OutlookA novel paramagnetic oxygen sensor in micro system technology is presented. Its resolution of the oxygen concen-tration down to 1% demonstrates its potential for industrial applicability.Its small cross sensitivity to the thermal conductivity of the gas via the thermo anemometers will be diminished by integrating additional thermal conduc-tivity detectors and correct the sensor response by appropriate algorithms.This work was funded by Deutsche Forschungsgemeinschaft (DFG)

Technische Universität Hamburg-HarburgProf. Dr.-Ing. habil Jörg MüllerInstitut für MikrosystemtechnikEißendorferstraße 42D – 21073 HamburgPhone +49 (0)40 - 42878 - 3029Fax +49 (0)40 - 42878 - 2396Mail [email protected] www.tu-harburg.de/mst

Stefan Vonderschmidt

Figure 3: Size of the

oxygen sensor

Figure 4: Response to

the oxygen concentration

in an nitrogen-oxygen mixture

(10% to 90% oxygen in 5% steps)

Ergebnisse und Leistungen aus Forschungseinrichtungen

Results and Portfolios of Research Institutions

66


Ultra-slim array projectorThe market of miniaturized projectors is a fast growing market. In all current systems of pocket projectors, a single imaging channel is used. This means a minimal size for the projector is a given – and smaller will not work. The novel optics scheme of the array projector enables extremely slim but laterally extended projection systems with large fl ux. The array projector consists of a regular array of individual projecting channels which form a super-posed image on a screen.

The combination of the new projection technology with an appropriate digital microdisplay enables bright projections and a super-slim system form factor with software controlled refocusing. Thanks to the many channels, the construc-tion length of the entire system can be clearly reduced to 3 mm for fi xed-pattern projectors, without impeding luminosity. High-performance LEDs are used as the light source.

Ultra-thin array microscopeThe microscope is an universal inspec-tion tool for small structures which are invisible to the naked human eye. The conventional construction is unsuited for applications such as point-of-care medical analysis due to its bulky design using a tube length of 160 mm and its limited object fi eld size. This is especially the case if instantaneous imaging of an extended object fi eld is crucial and the available built-in space is small. In contrast, the ultra-thin microscope is characterized by a multitude of adjacent-ly-placed compact imaging channels each transmitting a part of the overall object with unity magnifi cation. The multi aperture setup can be scaled together with the lateral image sensor size while maintaining a constant thickness of e.g. 5.3 mm so that a portable system is created and an extended object fi eld of e.g. 36 x 24 mm2 is captured in a single shot. The microlens arrays can be fabricated at low cost by wafer-level technology.

Solderjet BumpingWhile adhesive bonding is the most common technology in micro optical system integration polymer based adhesives in some applications are forbidden due to outgassing and degradation phenomena. An alterna-tive is required that uses a non-organic joining media while being as fl exible and as fast as placing an adhesive droplet and curing it. Solderjet Bumping is a versatile technology that places liquid droplets of molten soft solder alloys at the interface between two optical components to be joined – of course the surfaces there have to be metal-lized in order for the solder to wet and form intermetallic phases. But with the solderjet capillary being fl exibly handled the solder can be placed at various 3D geometries with the resulting assem-bly accuracy being in the micron and submicron range. Furthermore solder-ing can provide joints that permit for processing in steam autoclaves as an alternative to polymeric adhesives.

Solutions with Light – Embedded Optical Systems as Multifunctional Tools

Ultra-slim array projector with collimated LED illumination.

Demonstrator of the ultra-thin array microscope in comparison to a conventional microscope objective.

Solderjet Bumping: Mounting an opti-cal element on a metallic platform.

67

Smart adaptive-optical micro systemsModern optical micro systems require working with changing optical input pa-rameters by an adaption of the system to the new input. The actuation for the adaption is often realized by mechanical movement of optical components that results in position changes, deforma-tions or stress. Deformable mirrors that compensate for wave front aberration are an example for adaptive systems. Here the deformation of the refl ec-tive membrane is accomplished by piezoelectric actuators (manufactured in cooperation with Fraunhofer IKTS) that are screen printed on the mirror rear. The mirror surface is fi nished by diamond turning with optical quality. The mirror becomes smart when inte-grating not only the actuator pattern, but also sensors that detect temperatures or strains within the mirror membrane. The integrated sensors allow control of the piezoelectric actuators using ad-ditional information for optimal system performance.

Inkjet-printed electro-active polymer actuators Electro-active polymers are promising materials for actuators. They are able to undergo large defl ections due to e.g. piezoelectric strain when an electric fi eld is applied. Such actuators can be used to realize membrane pumps and valves. A potential application are optofl uidic chips in which a test fl uid is analyzed by different chemical and optical detectors. Pumps and valves are crucial components in such sys-tems to ensure the correct distribution of the fl uids on the chip. Digital printing processes like drop-on-demand inkjet can be used to deposit the electroactive polymers and electrodes onto polymer substrates. Inkjet printing is a maskless and non-contact printing technique, which makes it fl exible and cost-effective compared to conventional lithographic patterning. Using inkjet printing, pumps and valves can be integrated directly into low-cost polymer-based optofl uidic chips.

The Fraunhofer IOF conducts application oriented research in the fi eld of optical systems engineering on behalf of its clients from industry and within publicly-funded collaborative projects. The objective is to develop innovative optical systems for applications in the cutting-edge fi elds of energy, environment, information, health and safety. For creation of innovative micro-opto-electronic solutions (MOEMS) the amos Application Center for Micro-Optical Systems, supported by the BMBF, com-bines the outstanding infrastructures of Fraunhofer IOF with the skills of the CiS Research Institute for a close linking of microoptics and sensor technology.


Printed structure of electrodes for microfl uidic applications. Deformable mirror membrane: Smart micro system with integrated actuators, sensors and thermal sources.

Fraunhofer Institute for Applied Optics and Precision Engineering IOFDr. Oliver MauronerAlbert-Einstein-Str. 7D – 07745 Jena Phone +49 (0)3641- 807 - 371Mail [email protected] www.iof.fraunhofer.de

KNMF and EUMINAfab

68


The Karlsruhe Institute of Technology (KIT) is operating the large-scale user facil-ity KNMF and coordinating the European research infrastructure EUMINAfab. Both are offering free-of-cost access to a dedi-cated set of multimaterial technologies for structuring and characterising a multitude of functional materials at the micro- and nanoscale. Such facilities will leverage the development of innovative materials, components and systems in a sustainable way.

Karlsruhe Nano Micro Facility (KNMF)KNMF offers a dedicated set of state-of-the-art technologies for structuring and characterising a multitude of functional materials at the micro- and nanoscale. The facility provides users from industry and academia open and in case of public work free-of-cost access. It is the unique technology portfolio and

leading expertise that stimulates the users’ current needs and expectations to create new scientifi c knowledge. Currently, KNMF unifi es more than 25 technology clusters and 39 scientists managing the following three labora-tories:

KNMF Laboratory for Micro- and Nanostructuring combines an impressive set of cons-tructive bottom up and ablative top down struc turing and replication technologies, e.g.

✦ Electron beam lithography ✦ Deep X-ray lithography ✦ Dip-pen nanolithography ✦ Focused ion beam ✦ Laser material processing ✦ Injection moulding ✦ Hot embossing ✦ Thin fi lm technologies ✦ Dry etching cluster

KNMF Laboratory for Microscopy and Spectroscopy stimulates the current and future trends for high energy characterisation, e.g.

✦ Scanning electron microscopy ✦ Transmission electron microscopy ✦ Atomic force microscopy ✦ Auger electron microscopy ✦ X-ray photoelectron spectroscopy ✦ Bulk and trace analysis of

nano materials ✦ Electron micro probe analysis ✦ Laser ablation ICPMS ✦ Thin fi lm characterisation

KNMF Laboratory for Synchrotron Characterisation enables the next generation of micro nano technologies at synchrotron light sources, e.g.

✦ Soft X-ray spectroscopy, micros-copy, and spectromicroscopy

✦ Cluster for in-situ synthesis, processing and characterisation of thin fi lms and nanostructured interfaces and surfaces

✦ Hard X-ray microscopy and 3D tomo graphic imaging

✦ High resolution synchrotron small angle X-ray scattering

✦ Infrared micro nano spectroscopy ✦ In-situ powder diffraction ✦ Laboratory diffractometry under

non-ambient conditions

With an additional investment budget of 23.3 Mio. Euro, allocated by the Helmholtz Association for 2010-2013, regular updates are subject to a continuous improvement of both, the value of the facility and the welfare of its users. Besides its technologies, KNMF offers access to the application-oriented expertise of its leading scientists.

User Facilities for Advanced Micro Nano Technologies

Visualization of the 3D distribution of metal

nanoparticles inside a mesoporous medium

by electron tomography (C. Kübel, A. Roth,

Z. Zhao-Krager, H. Hahn, INT, KIT).

69


One stop shopApplying for access to the installations is done online (www.knmf.kit.edu). In case of free-of-cost work, the user is advised to discuss the proposed experiments with the responsible experts before submission. After a techni-cal feasibility check, the proposals will be evalu-ated by an independent peer review board. Pro-posals must be received by the annual submission deadlines January, 15 or June, 30. Particularly urgent cases with high scientifi c ambition or vital economic interest can be applied via a fast track procedure having no deadline restric-tions. Proprietary work is based on full cost recovery. In this case, proposals can be submitted to any time and will not be peer reviewed.

European Micro Nano Fabrication ( EUMINAfab)EUMINAfab is the fi rst European research infrastructure for micro nano fabrication of functional structures and devices out of a knowledge-based mul-timaterials’ repertoire. The facility offers no fee access to a unique set of installa-tions covering the following topics:

Micro Nano Patterning unifi es a wide variety of machining and structuring equipments:

✦ Electron beam lithography ✦ Direct X-ray lithography ✦ Ion beam nanolithography ✦ Dip-pen nanolithography

✦ Laser technologies ✦ Freeform mechanical micro-

machining ✦ Mastermaking ✦ Photopolymerisation ✦ Dry etching

Thin Film Deposition for fabricating single and multi-layers with thicknesses in the nanometer range:

✦ PVD technologies ✦ Organic PVD ✦ CVD ✦ Self-assembly ✦ Screen printing ✦ Electroforming ✦ Optical coatings

Replication with high geometric accuracies and small tolerances of various materials:

✦ Micro injection moulding ✦ Micro hot embossing ✦ Thermal imprinting ✦ Nano imprint lithography ✦ Dry & wet etching

Characterisation for a broad range of materials and struc-tures, also for electro-optical characteri-sation of particles and surfaces:

✦ HRTEM ✦ XPEEM ✦ Auger nanoprobe ✦ In-situ synchrotron X-ray

diffractometry ✦ AFM ✦ Conductive AFM ✦ Spectrophotometry/ -radiometry ✦ Profi lometry ✦ X-ray tomography

Access to EUMINAfab’s installations is by online proposal submission (www.euminafab.eu). Public proposals will be evaluated in an independent peer review process. Further conditions for no fee access can be found on the web page. Proprietary proposals will not be peer reviewed but will be subject to full cost recovery.

Karlsruhe Institute of Technology (KIT)Hermann-von-Helmholtz-Platz 1D – 76344 Eggenstein-LeopoldshafenPhone +49 (0)721 - 608 - 25578Fax +49 (0)721 - 608 - 25579Mail [email protected] www.knmf.kit.edu www.euminafab.eu

ZrO2 gear wheel (Ø 2,9 mm) on Al2O3 axle by two component injection moulding (before sintering)/(A. Ruh, V. Piotter, K. Plewa, H.-J. Ritzhaupt-Kleissl, J. Hausselt, IMF-III, KIT).

70

Michael Scholles

Projection displays for mobile comput-ers and smartphones, Head-Mounted displays for Augmented Reality, laser cameras integrated into an endoscope tip, systems used in ophthalmology for diagnosis and treatment, mask writ-ing tools in semiconductor industry, miniaturized spectrometers to be used for gas detection systems and mobile bar code readers: this is just a short list of photonic smart systems that have become possible over the last couple of years by integration of microelectronics, micro mechanics and optics. They all rely on special micro-electro-mechanical systems (MEMS) and micro-opto-electro-mechanical systems (MOEMS) developed and manufactured at Fraun-hofer Institute for Photonic Microsystems (Fraunhofer IPMS).

The Fraunhofer IPMS and its 220 em-ployees turn over an annual research volume of nearly 26 million Euros. The focus of our development and produc-tion services lies in the practical indus-trial application of unique technological know-how in the fi elds of MEMS and MOEMS on the one hand, and organic electronics [OLED, organic photovolta-ics] on the other. Fraunhofer IMPS com-bines scientifi c know-how, application experience and customer contacts from both research branches in its centres for expertise “Microsystems technology” and “COMEDD” – Center for Organic Materials and Electronic Devices Dresden with independent clean room infrastructure and personnel resources. Fraunhofer IPMS covers a broad spec-trum of industrial applications, ranging

from communications, con-sumer electronics, automo-tive, semiconductor industry, manufacturing and robotics to medical technologies.

The Fraunhofer IPMS offers its customers complete service in developing technologies for MEMS and MOEMS. Our services range from technological feasibility studies to the development of complete production technologies, including their characteriza-tion and qualifi cation. At the request of our customers, we not only successfully develop, but also carry out pilot pro-duction and support the

technology transfer. Apart from de-veloping and producing entire MEMS technologies, we also provide foundry services for entire devices, for technol-ogy modules and for individual steps in the process.

Our work is founded on applica-tion know-how in our major fi elds of research micro scanning mirrors, spatial light modulators, sensor and actuator systems and wireless microsystems as well as on extensive technological competencies in the fi eld of surface and bulk micromechanics. The combination of these technolo-gies and the Fraunhofer IPMS’ CMOS process is utilized for the development of monolithically integrated systems, with sensors or actuators fabricated along with the electronics by means of a single wafer process. The development of technologies and the pilot production take place at two clean rooms of the Fraunhofer IPMS and its state-of-the-art facilities.


Photonic Smart Systems: New Opportunities for Smart System Integration

Fraunhofer Institute for Photonic Micro-systems Dr. Michael Scholles Maria-Reiche-Str. 2D – 01109 DresdenPhone +49 (0)351- 88 23 - 201Fax +49 (0)351- 88 23 - 266Mail michael.scholles@ipms. fraunhofer.deWeb www.ipms.fraunhofer.de

71

The Ferdinand-Braun-Institut, Leibniz-Institut fuer Hoechstfrequenztechnik (FBH) researches electronic and optical components, modules and systems based on compound semiconductors. These devices are key enablers that address the needs of today’s society in fi elds like communications, energy, health and mobility. In the fi eld of optoelectronics, FBH develops light sources from the visible to the ultra-violet spectral range: high-power diode lasers with excellent beam quality, UV light sources and hybrid laser systems. Applications range from medical technology, display applications, high-precision metrology, and sensors to optical communications in space.

Hybrid micro integration Scientists at FBH have developed a compact modular assembly. As advanced platform for hybrid micro integration, this unit is the base for a variety of laser systems. The modular, however robust design enables fl exible hybrid integration of different components on a micro-optical bench (MiOB). Due to the high-precision (< 1 µm) mounting technology, using a fl ip-chip bonder or a nano translation stage, prototypes up to small series can be fabricated.

Laser systems for the visible spectral rangeCompact lasers providing light in the visible spectral range are required for applica-tions such as in display technology and medical engineering as well as for non-contact mea-surements.FBH successfully dem-onstrated laser modules with an output power up to 1 W for the wave-lengths 488 nm, 532 nm, and 635 nm. While the red laser sources base on direct emitting diode lasers, blue and green laser light is ob-tained by frequency conversion of diode lasers from the infrared spectral range. Here, the modular design enables to implement a diode laser, micro optics, and a second harmonic crystal onto the micro-optical bench (Pic. 1).

Laser systems for high-precision atomic spectroscopyIn the fi eld of laser metrology, the hybrid integration technology allows to imple-ment different solutions for compact narrow linewidth (< 100 kHz) laser systems on a MiOB. Such laser systems are suitable for high-precision atomic spectroscopy, as for example precision tests of the equivalence principle, ac-cording to which all bodies experience the same acceleration by the earth’s gravitation. As these high-precision experiments are only possible in space, the laser systems are designed to sur-vive a rocket take-off and to work reliably

under extreme conditions. Pic. 2 depicts an example for such a Master Oscillator Power Amplifi er laser system emitting at 780 nm (rubidium). Here, a laser with a narrow linewidth (< 100 kHz, 100 mW) is amplifi ed by a power amplifi er to 1 W without altering the linewidth. The robust design of these modules already with-stood shaker tests with vibration loads of 29 g (RMS) as well as a pyro shock test (1000 g).

K. Paschke, C. Fiebig, G. Blume, A. Sahm, S. Spiessberger, A. Wicht


Hybrid Micro Integration at Ferdinand-Braun-Institut, Berlin

Ferdinand-Braun-Institut, Leibniz-Institut fuer HoechstfrequenztechnikDr. Katrin PaschkeBusiness Area Diode LasersGustav-Kirchhoff-Straße 4D – 12489 BerlinPhone +49 (0)30 - 6392 - 3955Fax +49 (0)30 - 6392 - 2642Mail [email protected] www.fbh-berlin.de

Pic 2: Laser system for high-precision atomic spectroscopy; Photo: schurian.com, [M] FBH

Pic 1: Laser system for the visible spectrale range; Photo: FBH

Master Oscillator– low optical power 100 mW– narrow linewidth (< 100 kHz)

micro isolator– suppression of optical feedback

micro lenses– space qualifi ed

Power Amplifi er– high output power (1 W)– unaltered linewidth (< 100 kHz)

The Fraunhofer Institute for Electronic Nano Systems ENAS focuses on research and development in the fi eld of smart systems integration by using micro and nano technologies. The product and service portfolio of Fraunhofer ENAS covers high-precision sensors for industrial applications, sen-sor and actuator systems with control units and evaluation electronics, printed functionalities like antennas and bat-teries as well as material and reliability research for micro electronics and micro system technology. The development, the design and the test of silicon-based and polymer-based MEMS/

NEMS, methods and technologies for their encapsulation and integration with electronics as well as metallization and interconnect systems for micro and nano electronics and 3D integration are especially in the focus of the work. Special attention is paid to security and reliability of components and systems. Application areas are semiconductor industry, medical engineering, mechani-

cal engineering, automotive industry, logistics as well as aeronautics.The institute offers a holistic and con-tinuous research and development ser-vices from the idea to tested prototypes.

In the case of smart systems single components as well as complete systems have to be developed. Often microelectronic devices and MEMS are being packaged closely together as part of system integration. This leads to more and more problems during manufac-turing process, because high joining pressures and differences in tempera-ture can damage very sensitive devices.

Researchers at Fraunhofer ENAS have found different suitable solutions for wafer to wafer as well as chip to wafer or chip to package bonding, based on reactive nano layers, on plasma pretreat-ment of wafers or bonding with different intermediate layers, Figure 1.

Local heating of the joining parts is a very promising method of working at

low processing temperatures. This new technology, which uses an internal heat source for joining, is known as “reactive bonding.” It is based on the use of reac-tive multilayer systems. The heat needed for the joining process is generated by a self-propagating chemical reaction within the system. To initiate the reaction, all that is needed is a single low-energy impulse. The most important advantage of this technology is that the heat gener-ated is limited to the bonding interface. This ensures that the components are not exposed to high temperatures over a large area. The technology also offers new ways of joining temperature-

sensitive materials with different thermal expansion coeffi cients, such as metals and polymers, without causing thermal damage. The components are joined at room temperature and, if necessary, a hermetically sealed joint can be pro-duced – temperature problems in joining processes have become a thing of the past. The researchers have succeeded in joining different MEMS and in de-

Smart Systems for Different Applications from Fraunhofer ENAS

72

Vogel, M.; Braeuer, J.; Wiemer, M.; Nestler, J.; Kurth, S.; Otto, T.; Gessner, T.Fraunhofer Institute for Electronic Nano Systems ENAS


Figure 1: Joined example, optical silicone grid on ceramic Figure 2: Sensor node mounted at the power line, measured data included

73


positing layered systems with individual layer thicknesses in the range of a few nanometers directly onto wafers. Researches from Fraunhofer ENAS have developed an autonomous sensor net-work for power line monitoring, Figure 2, together with partners from Fraunhofer IZM, industry and energy providers. The so-called ASTROSE system allows decentralized monitoring of high- volt-age transmission networks using autonomously working sensors. Every 500 meters, sensor nodes need to be installed at the power line. An ultra low power micro controller collects the data

from sensors for temperature, current, and inclination, and controls the radio transceiver for the wireless communica-tion in the 2.5 GHz ISM frequency band. All components are arranged in a PUR (Polyurethan) housing. For measuring the sag and vibration, a high precision MEMS inclination sensor from Fraun-hofer ENAS is used. The collected date are transmitted wirelessly from sensor

node to sensor node and fed into the central monitoring and control system at the electric power transformer substa-tion. The sensors are powered by the current of the electrical fringing fi eld that surrounds the conductor wires. Since the late eighties, microfl uidic sys-tems are available on a broad scale of commodity products like inkjet printers. In the past years special emphasis is given to develop point of care diagnostic systems based on microfl uidic devices. In a joint project, researchers from seven Fraunhofer Institutes have developed a modular platform technology for in vitro

diagnostics which al-lows for various types of bioanalyses – of blood and saliva for example – at patients’ bedside. The modular design of the ivD-plat-form is so fl exible that it can be used for a great variety of bioanalytical tasks.The core of the Fraun-hofer ivD Platform is a self-contained, active, microfl uidic cartridge developed by Fraun-

hofer ENAS. Such a cartridge holds an electrochemical or optical biosensor, reagents as well as integrated microfl u-idic actuators (pumps). Together with a readout instrument it can run a bioas-say in a fully automated way without any fl uidic interfaces to the instrument. The cartridge is produced by low-cost injection-moulding and bonding pro-cesses.

The microfl uidic cartridge, Figure 3, consists of two main parts. The bottom part provides the integrated micropumps together with an electrical interface to the instrument. The injection-moulded top part of the cartridge incorporates the reservoirs and the microfl uidic chan-nel system. The reservoirs can be fi lled from the top through fi lling holes. The cartridge design is fl exible, contains up to eight reservoirs with different volumes, two sensor areas and a waste reservoir. It has the size of a credit card enabling the application as point-of-care prod-uct. To avoid any fl uidic interface to the instrument, reagents are stored directly in the reservoirs and transported through the microchannel system by means of low-cost pumps.Currently scientists from Fraunhofer ENAS are working together with sci-entists from seven European and fi ve Brazilian research facilities and compa-nies to develop a small low-cost detec-tion system that can identify the tropical disease Chagas. An important part of developing such a complex system is in-tegrating low-cost microfl uidic actuators to control the reaction processes. The entire test, including sample preparation, is to be integrated in a system of about the size of a cell phone.

Fraunhofer ENASTechnologie-Campus 3D – 09126 ChemnitzPhone +49 (0)371- 45001- 0Fax +49 (0)371- 45001- 101Mail [email protected] www.enas.fraunhofer.de

Figure 3: Photography of a microfl uidic ivD-cartridge with fi lled reservoirs

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The Hahn-Schickard-Institute for Micro Assembly Technology (HSG-IMAT) is specialized in assembly and packag-ing technologies for microsystems and miniaturized systems based on plastic devices, particularly in Molded Intercon-nect Devices (MID).

The Institute offers a professional range of services such as construction, simu-lation, tool making, injection molding, laser structuring, metal coating, as-sembling, testing and the infrastructure according to the industrial requirements. Therefore HSG-IMAT can offer holistic and continuous research and develop-ment services from the idea to tested prototypes and small series. HSG-IMAT is certifi ed after the new process orient-ed management system ISO 9001:2008.Areas of operationPlastic components for micro devices

✦ Precision tool making ✦ Micro injection molding ✦ Two shot injection molding ✦ Film assisted transfer molding ✦ Ultra precision machining ✦ Micro optical and micro fl uidic

devices

MID Technologies ✦ Hot embossing MID technology ✦ Laser MID technology ✦ Electroless plating ✦ Printing technology

Chip and SMD Assembly ✦ Wire bonding ✦ Flip chip techniques ✦ Lead free SMD assembly

(soldering, bonding)

Institut für Mikroaufbautechnik der Hahn-Schickard-Gesellschaft für angewandte Forschung e.V.

HSG-IMATAllmandring 9 BD – 70569 StuttgartPhone +49 (0)711- 685 - 83712Fax +49 (0)711- 685 - 83705Mail [email protected] www.hsg-imat.de

Sensors and Actuators ✦ Inclination sensors ✦ Rotary encoders ✦ Touch sensors ✦ Microvalves ✦ Micropumps

Braille Module

Printed Sensor Structure

Injection Molded Micro Needles

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The Hahn-Schickard-Institut für Mikro- und Informationstechnik (HSG-IMIT) belongs to the leading R&D partners in Microsystems Technology. Core compe-tencies are the areas of sensors, microfl u-idics, information technology and defi ned production process. In trustworthy cooperation with industry we implement innovative products and technologies.

Several laboratories and a 600 sqm cleanroom are equipped with an exten-sive infrastructure needed to develop and fabricate Microsystems. The service centre provides specifi c consult-ing, advanced training, technological services, feasibility studies, prototyping, small scale production as well as serial production in cooperation with industrial companies. HSG-IMIT is certifi ed after the new process oriented management system ISO 9001:2008.

Areas of operationSensors

✦ Flow ✦ Humidity ✦ Differential Pressure ✦ Properties of Gases ✦ Angular Rate ✦ Acceleration ✦ Inclination ✦ Force

Microfl uidics ✦ Lab-on-a-Chip Systems

• Microfl uidic Design • Prototyping • Assay Implementation • Characterization

✦ Microdosage • Pumps • Valves • Dispensers

Energy Autonomous Systems ✦ Energy Harvesters ✦ Sensors and Actuators ✦ Wireless Communication ✦ Low-Power Electronics

Micro Medical Technology ✦ Drug Delivery ✦ Motion Monitoring ✦ Bioimpedance Spectroscopy ✦ Blood Analysis

System Solutions ✦ Dosage Systems ✦ Telemetric Data Logger ✦ Navigation and Positioning ✦ Sensor Networks

Prototyping & Production ✦ Silicon micromachining

• CVD: Poly-Si, Si3N4, SiO2

• Dry Etching: RIE, Si-DRIE • Wet Etching • Wafer Bonding • Prototypes and Small-Scale

Production ✦ Polymer micromachining

• Micro Mould Design and Fabrication

• Hot Embossing • Foil Based Microsystems

✦ Packaging • Wafer Level Packaging • Hybrid Integration • Application-Specifi c

Solutions ✦ Laser technology

• Cutting and Welding of Foils • Customized Soldering

Solutions

Engineering Services ✦ Measurement Automation ✦ Failure Analysis ✦ Modelling & Design (FEA)

Analog / Digital Electronics ✦ Circuit Design ✦ Microelectronics ✦ Technical Software

Institut für Mikro- und Informationstechnik der Hahn-Schickard-Gesellschaft für angewandte Forschung e.V.

HSG-IMITWilhelm-Schickard-Str 10D – 78052 Villingen-SchwenningenPhone +49 (0)7721- 943 - 0Fax +49 (0)7721- 943 - 210Mail [email protected] www.hsg-imit.de

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Non-silicon MEMSModern microelectromechanical systems (MEMS) are fabricated primarily from silicon due to well-developed micro-machining technology. Future genera-tions of MEMS, however, require new advanced materials with signifi cantly improved mechanical and chemical properties. Nanodiamond (ND) and aluminium nitride (AlN) thin fi lms have recently attracted much attention due to their applicability in radio-frequency (RF) and bio-medical transducer applications. AlN/ND- based microstuctures show a very good coupling effi ciency, offer-ing an essential advantage over Pb- and Li-containing solutions due to the simplicity of microfabrication, chemical inertness, long life and the ability to operate in bio- and harsh environments. A further advantage is their technologi-cal compatibility with conven-tional electronic drivers.

The piezoelectricity of AlN combined with the advanced elasticity of thin diamond fi lms allows for the realization of unique integrated MEMS devices, e.g. ultrasensitive robust sensors, RF switches and fi lters as well as strain-engineered optical MEMS. RF MEMS operating at GHz frequencies and implantable energy harvesters based on micromechanical resona-tors, are of rapidly growing importance for the foreseen technical development.

The Fraunhofer Institute for Applied Solid State Physics (IAF) develops novel MEMS based on AlN/ND heterostruc-tures for various applications in com-munication, medicine and microoptic fi elds. In particular, adjustable micro-lenses, RF-switches and implantable piezo-generators have recently been developed and tested in the lab environ-ment for next-generation mobile and health-monitoring systems.

AlN/Diamond MEMS at IAFMicrowave chemical vapour deposition (CVD) and diamond-polishing facili-ties developed at IAF allow the growth and post-growth treatment of up to 4” diameter ND wafers on silicon sub-strates. Ultra high nucleation densities

realized with mono disperse ND colloidal solutions allow for growth of doped and intrinsic diamond fi lms as thin as 20 nm. Piezoelectric AlN textured layers are deposited on polished ND surfaces us-ing reactive sputtering. As a result of the outstanding chemical and mechanical stability of these materials, dry etching techniques, i.e. an inductive coupled plasma reactive ion etching, are involved to perform 3D patterning of the micro-structures. Fig. 1 shows some of the devices microfabricated at Fraunhofer IAF. Due to the outstanding elastic properties of the diamond layer (E ~ 1100 GPa), such microstructures can approach qual-ity factors and resonant frequencies of Q = 104 and f = 10 GHz, respectively.

In addition, due to AlN piezo-actuators monolithically inte-grated into unimorph MEMS, the operational frequency and moving force is signifi cantly improved in comparison with conventional electrostatic devices.

RF MEMS switchesDynamic RF switches actuat-ed by nanosecond pulses are very rarely investigated, due to the necessary nanoscale size and the fast degradation of the switch that realizes billions of contacts per second. There-fore, new actuation and trans-mission principles for such advanced RF devices are in demand. Recently, novel RF Complementary Unimorph Beam (RF-CUBE) switches

Aluminum Nitride – Nanodiamond Transducers for RF Electronics and Energy Harvesting

Figure 1: MEMS devices microfabricated at IAF: (a) energy harvester chip based on various microresonator arrays, e.g. (b) doubly clamped tensile resonators; (c) complementary cantilever pair separated by a nanogap designed for mechanical RF switch and adjustable fi lter devices; (d) AlN/ND piezo-membrane-based tuneable lens with attached fl uidic channels.

77


based on AlN/ND MEMS technologies have been developed at IAF. These devices operate in “non-contact” mode realized via fi eld emission/tunnelling across a nano-gap between two canti-lever tips made of a low electron affi nity diamond layer. This kind of mode allows for long-life functioning with no stiction or abrasion and lower parasitic effects.“Triggering” of the switch is realized through the mechanical out-of-plane defl ection of AlN/ND unimorph cantile-vers, which are electrostatically coupled with each other. The coupled oscilla-tions allow for precise synchronization and tuning of operational frequency of the device. In Fig. 2a, frequency spectra for a coupled RF-CUBE device is shown. The graph demonstrates a tremendous shift in the resonant frequency ω1 of the fi rst “normal” mode upon variation in electrostatic force between the cantilevers.

Piezo-HarvestersPiezoelectrical harvest-ing from the environmental sources in the frequency range well below 1 kHz is a challenging issue due to low electromechanical coupling, typical for conventional microsystems operating out-of-resonance. Therefore, our development focuses on non-resonant piezoelectrical devices, e.g. corrugated AlN/ND unimorph mem-branes and bridges (Fig. 2b) designed and optimized to respond quite effectively

on either low frequency or aperiodic mechanical impact. Through precise strain control, the har-vesting systems can be confi gured for bi-stable operations to be switched by mechanical impulses between two ener-getically equivalent steady states. In this case, the electromechanical coupling reaches their optimal value. A peak gen-erated power of ~ 10 µW @ 10 kΩ per micro-assembly have been obtained by using a 3 x 4 corrugated membrane array connected in series. The devices shown in Fig. 2b have been fabricated using a deep reactive ion etching technique. Such membranes with radii ranging from 250 – 1500 µm show extreme elastic-ity and pressure tolerance suitable for harvesting at high acceleration of > 10 g.

Fraunhofer Institute for Applied Solid State Physics (IAF)Tullastraße 72 D – 79108 FreiburgDr. Vadim LebedevPhone +49 (0)761- 5159 - 507Fax +49 (0)761- 5159 - 71507Mail [email protected]

Dr. Christoph NebelPhone +49 (0)761- 5159 - 304Fax +49 (0)761- 5159 - 71304Mail [email protected] www.iaf.fraunhofer.de

Dr. Vadim Lebedev Dr. Christoph Nebel

Figure. 2: (a) Vibration resonant curves of electrostatically coupled cantilevers measured by laser vibrometry together with the analysis of selectively excited ω1 mode. (b) Generated power of the membrane-based harvesters with a varied load resistance. The red points correspond to a 3 x 4 corrugated membrane array excited by rectangular pulses at 70 Hz repetition rate. The static (left) and dynamic (right) images of the corrugated membrane measured by white light interferometry and by laser vibrometry, respectively are shown at the bottom.

78


Institut fuer Mikrotechnik Mainz

Selection of current R&D projects (EU 7th Framework Program)

Energy Technology ✦ “Development of an internal reforming

alcohol high temperature PEM fuel cell stack”; IRAFC

✦ “Sustainable products from economic processing of biomass in highly integ-rated biorefi neries”; SUPRABIO

Biomedical Diagnostics ✦ “Remote Accessibility to Diabetes

Management and Therapy in Operat-ional Healthcare Networks”; REACTION

✦ “An Integrated Platform Enabling Theranostic Applications at the Point of Primary Care”; TheraEDGE

✦ “Magnetic Isolation and Molecular Analysis of Single Circulating and Disseminated Tumour Cells on Chip”; MIRACLE

Medical Technology ✦ “Neuroprostethic interface systems for

restoring motor functions”; NEUWalk

Chemical Process Engineering ✦ “Combining Process Intensifi cation-

driven Manufacture of Microstructured Reactors and Process Design regarding to Industrial Dimensions and Environ-ment”; CoPIRIDE

✦ “Continuous Annular Electro-Chroma-tography”, CAEC

For more than 20 years the Institut fuer Mikrotechnik Mainz GmbH (IMM) is committed to build bridges between successful research and development in microsystem technology and industrial applications of innovative products. Its work ranges from systems for environ-ment-friendly and effi cient generation of electrical power, security of technical installations, chemical process engineer-ing, industrial analytics, public safety and hazard control, (bio)-medical diagnostics to medical technology. Anyway, the main focus of all projects is on saving of resources, ecologically as well as economically spoken.

Energy TechnologyMicrosystem technology allows the real-ization of more effi cient and sustainable energy systems. While achieving a minimum loss of heat in a performance range from 100 W to 100 kW and even more, the use of catalysts and plate heat exchanger technology guaran-tees compact systems. Besides the development of single components (such as micro heat exchangers, gas phase reactors, evaporators, condens-ers, electrical heaters) and complete reformer systems for conventional and regenerative fuels, IMM also deals with catalyst development, liquid hydro-gen technology, exhaust gas treat-ment systems and biofuel synthesis processes. IMM’s Hydrogen technol-ogy projects aim at power engines and electric power supply (mobile applica-tions), hydrogen stations (medium sized stationary applications), home energy and emergency power supply (small stationary systems) as well as battery

and generator substitutes (portable ap-plications).

(Bio)-Medical DiagnosticsEffi cient biomedical diagnostic systems (lab-on-a-chip or micro total analysis systems) minimizing the number of work steps, requiring smaller quanti-ties of materials (e.g. reagents) and, at the same time, providing reliable results can be based on microsystem technology. Such a miniaturized system

allows a real-time analysis in terms of biological organisms (cells, bacteria, viruses, parasites), their building blocks or metabolites (proteins, nucleic acids, metabolites, toxins, etc.) on-site at the point of care or point of use. Besides fl uidic or actuator components electro-chemical (structured glass carrier arrays) or optical (transmission, fl uorescence, chemiluminescence) functional units for the detection of biomolecules are imple-mented. Macroscopic techniques like PCR, NA purifi cation, magnetic beads separation, plasma generation and lysis could already be transferred into a microchip system. IMM’s biomedical diagnostic projects aim at the on-chip isolation and analysis of germs from solid and liquid samples, the separa-tion of eukaryotic cells such as human tumour vs. normal cells, the identifi cation and discrimination of viral, bacterial or eukaryotic organisms, the isolation and amplifi cation of nucleic acids in general or RNA especially and the purifi cation of single proteins or protein mixtures of pro- or eukaryotes.

Medical TechnologyMulti-channel micro electrode probes allow improving minimally-invasive brain surgery on a diagnostic level by local-izing (neuronal signal recording) as well as on a therapeutic level by stimulating brain regions being affected by Par-kinson’s disease. Meanwhile various electrode alignments have been realized by IMM as rigid or fl exible polyimide based probes. Beyond neurodegenera-tive diseases spinal cord injuries are of utmost therapeutic interest. At present, there are no proven effi cacious treat-

79


ments to improve the functional capaci-ties of severely paralyzed people. Next generation therapy requires a brain spinal neuroprosthetic interface system combining fl exible multi electrode arrays, wireless powering and signal transmis-sion as well as highly developed neural stimulation.

Chemical Process EngineeringSustainability and energy effi ciency, improved heat and mass transfer, elimination of unwanted side reactions, increase of operational throughput and optimization of product quality are IMM’s guiding principles when developing components and plants to optimize cus-tomer specifi c production processes. Core competence is the development and realization of micro structured components such as heat exchangers,

micro mixers or micro reactors providing throughput from 1 l/h in lab scale, 100 l/h in pilot scale up to 1000 l/h or more in production scale. IMM technology is mainly used in fi ne and specialty chem-istry. Pharmaceutics, consumer goods, bulk and petro chemistry as well as the production of emulsions, smart and functional materials (such as pigments or dyes), encapsulated agents or OLED materials complete the portfolio.

Quality Control and SecurityTechnical fl uids such as lubricants, generator or transformer oils gradually undergo degradation or are exposed to contamination processes. For instance, the amount of water, sulphates, oxi-dants or soot is of interest. Microsystem technology based detection methods comprise IR, VIS and fl uorescence

spectroscopy. Due to the reduced size ratio of micro structured components radiation sources, detectors and fl ow through units can easily be integrated in compact devices for online monitoring of the respective spectral regions. A similar concept of integrating fl uidic elements with various sensors for detection can be applied in a variety of biochemi-cal security applications such as germ identifi cation and critical infrastructure surveillance.

IMM – Institut für Mikrotechnik Mainz GmbHCarl-Zeiss-Strasse 18-20D – 55129 MainzPhone +49 (0)6131- 990 - 0Fax +49 (0)6131- 990 - 205Mail [email protected] www.imm-mainz.de

Chip for cancer diagnostics with an integrated electrochemical ELISA assay1

Laser welding process during the manufacture of components for energy technology

Modular microreactor2

The projects 1smartHEALTH and 2 IMPULSE were partly funded by the European Commission (6th Framework Programme)

80


Printed microsystems are very attrac-tive to realize simple low-cost devices or to build up boards which are to be produced of minor amounts. Moreover processing costs decrease by avoiding expensive mask technology. As demon-strated by the Fraunhofer ISC inks and pastes are available which are reliable and non-toxic in terms of process-ing and usage – a prerequisite for the printing of microsystems and electrical boards.

There are numerous efforts to realize microsystems by printing technologies. However, regardless of the targeted application, the commercialization is hindered generally by three challenges which will remain a subject of investiga-tion even in the future:

✦ How to increase the yield in production

✦ How to measure the functionality of the components inline at high speed

✦ How to increase the lifetime and reliability of printed microsystems

It is evident that these diffi culties in-crease along with the complexity of the device. This is the reason why indus-tries, which try to print functions, do so on a very low level of complexity.

Materials as a key for complex printable microsystems If the complexity increases, valuable contributions can be performed by pro-viding materials which possess a high tolerance for the process requirements. Moreover, multifunctional materials can be used to decrease the number of different materials required and, thereby,

the number of sources of defect. The Fraunhofer ISC works on two different approaches:1. The formulation of screen-printable

piezo- or pyroelectric paste2. The development of ink-jet printable

interlayer and high-k dielectrics

Formulation of screen-printable piezo- and pyroelectric pasteThe objective of recent projects was to realize all-printed pressure and thermal sensitive sensors. These sensors, fea-tured by arbitrarily shaped active sensor areas and arrays, were produced by printing technologies only. They can be used to detect thermal sources and may operate as a human-machine interface exploiting the human body radiation. The sensor itself is made up of a simple capacitive structure using a top and bottom electrode and as active material a ferroelectric polymer. The ferroelec-tric polymer has to be applied in the right conformation to perform piezo- or pyroelectric behaviour. In order to achieve the requested beta-phase upon crystallization from solution, chemical groups are incorporated which force the polymer chains into the right conformation. This copolymer is soluble in solvents such as cylcohexane and similar diluters which are labelled as toxic which prevents their use in most of the production processes. By a proper choice of solvents and solution pro-cesses the polymer paste formulated by Fraunhofer ISC contains non-toxic sol-vents. In cooperation with Acreo (S) and Joanneum (AT) this sensor element was combined with electrochemical transis-tors and an electrochromic display [1].

These three components are produced by 5 inks / pastes only and are making process optimization easier by reducing the number of materials used.

Development of ink-jet printable interlayer and high-k dielectricsSince inorganic-organic hybrid polymers provide an excellent dielectric behav-iour with respect to resistivity, dielectric strength and tuneable dielectric permit-tivities, these materials are employed as insulators. Aside from a direct patterning process (UV lithography) they can be printed and cured by UV light or ther-mally (curing temperatures ~ 150 °C). In addition, hybrid polymers feature a high chemical and thermal stability (up to 400 °C).

In order to realize multilayer structures for electrical boards printing techniques are useful for small amounts of products to be manufactured. This holds also true for interlayer dielectrics which provide vertical interconnect access (VIA). For these layers, full areas with VIAs (size 50 – 200 µm) which have to be left open can be appropriately generated by ink-jet printing. Additionally, embedded passives can be printed, thus reducing the number of assembly steps.To formulate a hybrid polymer for ink-jet printing, the viscosity and surface tension of the ink have to be fi tted to the requirements of the printing head and simultaneously to the surface energy of the substrate, the conducting lines and electrodes. As hybrid polymers can be diluted and formulated by a vast number of solvents and additives it is possible to tune the ink as needed. Additionally

Gerhard Domann, Uta Helbig, Fraunhofer ISC

Printable Functional Inks for Microsystems

81


solvents with a low boiling point can be used to vary the behaviour after coming out of the printing nozzle. Therefore, the properties of the ink can be adjusted to the printing process in various ways. Thicknesses of dried layers are in the range of 0.5 – 20 µm as single or multi-layer. In dependence of the hybrid polymer used, dielectric permittivities

below 4.5 (down to 2.5 at 1 MHz) can be achieved.In order to realize embedded capacitors, it is also possible to introduce high per-mittivity particles (e.g. Barium-Titanate) into the ink. The particles have to be functionalized in order to avoid ag-glomeration. A volume concentration of 30 % BaTiO3 could be established for a

high-k ink using a hybrid polymer as matrix material. The dielectric permittivity of this nanocomposite ink was mea-sured to be around 30 at 1 MHz.The high thermal stability of the polymer based dielectric provides some freedom with respect to subsequent thermal process steps needed to perform a low-temperature annealing of conducting silver-based inks (~ 200 °C).

AcknowledgementsThe research leading to these results has received funding from theEuropean Community’s Seventh Frame-work Programme (FP7/2007-2013) under grant agreement no.: 215036 (3Plast). The authors thank J. Bahr for support and many stimulating discussions.

[1] Zirkl, M., Sawatdee, A., Helbig, U., Krause, M., Scheipl, G., Kraker, E., Ersman, P. A., Nilsson, D., Platt, D., Bodö, P., Bauer, S., Domann, G. and Stadlober, B. (2011), An All-Printed Ferroelectric Active Matrix Sensor Network Based on Only Five Functional Materials Forming a Touchless Control Inter-face. Advanced Materials, 23: 2069–2074.

Fig. 1: All printed

sensor array (© Joanneum

Research)

Fig. 2: Non-

metallized printed

VIA with underlying conductor (© Fraun-hofer ISC)

Fraunhofer-Institut für SilicatforschungOptics and ElectronicsGerhard DomannNeunerplatz 2D – 97082 WürzburgPhone +49 (0)931 - 4100 - 551Fax +49 (0)931 - 4100 - 559Mail [email protected] www.isc.fraunhofer.de

Fig. 3:High-k

dieletric (εr = 30

at 1 MHz) applied

by ink-Jet printing

to realise printed

capacitors on a test

demonstra-tor.

(© Fraun-hofer ISC)

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NMI is a non-profi t foundation that per-forms application-oriented research and development at the interface of life and material science in the business areas pharma / biotechnology, biomedical en-gineering and interface technology, with strong emphasis on technology transfer and industrial collaborations. NMI has extensive experience in the development and fabrication of

microsystems (neurochips, micro fl uidic chips, biosensors, microelectronic implants), nanoprobes (nanopatterned microelectrodes, NSOM/TERS probes), and in development and application of nanoanalytical techniques (SEM, (Cryo) FIB/SEM, TEM, SIMS). The MST activities at NMI cover the entire value added chain – from the idea to standardized small series production.

Design, modelling and rapid prototypingA comprehensive set of software tools is employed for the design, modelling and numerical simulation of a variety of phenomena in microsystems. A micro-milling facility allows rapid prototyping of functional samples prior to fabrication of expensive injection moulds. Thus, de-signs may be optimized for the desired function even before the fi rst prototype is

micro nano bio – Microsystems and Nanotechniques for Life Science


Left: Carbon nanotube microelectrode (diameter: 30 µm) on a quartz substrate. Center: high-density TiN electrode array (electrode distance 30 µm, electrode diameter 8 µm). Right: Brain slice on a microelectrode array

HepaChip – artifi cial micro organ on a chip. Left: Multi-physics simulation of particle trajectories in a microfl uidic cell chamber under the infl uence of electrical and hydro-dynamic forces. Center: Microfl uidic cell chamber injection moulded from COP with integrated electrodes (scale bar 1000 µm), manufactured by our partner microfl uidic ChipShop GmbH. Right: Cell chamber with human liver cell culture (green: hepatocytes, red: endothelial cells, scale bar 200 µm).

cell culture gaps

electrodeselectrodeselectrodeselectrodes

83


made, providing signifi cant savings of time and cost during the devel-opment phase.

Micro- and NanofabricationThe availability of state of the art thin fi lm, nanopatterning and microfabrication facilities in combi-nation with unconventional fabrica-tion methods which are particu-larly well suited for biocompatible, often polymeric materials enables researchers at the NMI to develop and fabricate microsystems for in vitro and in vivo applications.Encapsulation of active microim-plants with long-term biostable and biocompatible materials is a key prerequisite for all „intelligent implants“ currently under develop-ment and a main focus of the R&D work performed at the NMI.

Application-oriented research and developmentThe close interdisciplinary interac-tion of scientists and engineers with a variety of backgrounds in life and material sciences provides for application-specifi c microsystems solutions as well as for development and test of assays and applications under conditions of use. Microsys-tems currently under development at the NMI address a variety of applica-tions such as BioMEMS-based test sys-tems for drug screening, safety pharma-cology, neurobiology and cardiovascular research, Lab-on-a-Chip and intelligent implants, ultrafi ltration membranes, sam-ple preparation for proteomics research and biomaterial screening.

Small series productionOnce proof of principle for a certain microsystem application has been achieved, microsystems can be fab-ricated in prototype or small volume series. The NMI thus fi lls in the gap between pure R&D work and large scale production.

Microstructure analysis at the interface material / biologyThe NMI also specializes in micro- and nano-analytical techniques particularly well suited for the investigation of the interface between biological tissues and techni-cal materials. This includes methods for chemical fi xation, cryo-preparation and embed-ding as well as preparation of single cross-sections or of entire tomography data sets by FIB (focused ion beam) milling and SEM (scanning electron microscope) imaging at room temperature or at cryo conditions and elemental analysis by secondary ion mass spectrometry.

FIB-SEM tomography: Retinal tissue in contact with a microelectrode of a retinal implant (volume size 47,1µm x 33,8µm x 32,6µm, voxel size 59,7nm x 59.4nm x 60.0nm)

Screening of biomaterial/tissue interactions by continuous monitoring of oxygen concentration, pH and electrical impedance using an implantable microsensor device

Naturwissenschaftliches und Medizinisches Institutan der Universität TübingenNatural and Medical Sciences Instituteat the University of TuebingenDr. Martin Stelzle Dr. Claus BurkhardtMarkwiesenstr. 55D – 72770 ReutlingenPhone +49 (0)7121- 51530 - 0Mail [email protected] [email protected] www.nmi.de

84


The Institute of Micro- and Nanotech-nologies (IMN MacroNano®) is a multi-disciplinary scientifi c institute situated at the Ilmenau University of Technology. It was founded in 2006 as a result of the growing requirements of interdisciplin-ary research in the fi elds of micro- and nanotechnologies promoted substan-tially by the formation of the Centre for Innovation Competence MacroNano®

by the Federal Ministry of Education and Research (BMBF) in the same year.Today, the IMN MacroNano® comprises nearly 40 departments and research groups with competences from basic physics and material sciences up to system integration. A total of about 120 scientists who belong to the faculties Electrical Engineering and Information Technology, Computer Science and

Automation, Mechanical Engineering as well as Mathematics and Natural Sciences work without structural barriers using multi-purpose technologies for deposition/coating, structuring and surface treatment of silicon, group III nitrides, metal oxides, glasses, ceramics and polymers at the Centre for Micro- and Nanotechnologies, which acts as an operation unit and runs the technical platform of the Institute.

Research StrategyThe focus on basic and applied research of the IMN MacroNano® is directed to the cross-over disciplines of micro- and nanotechnologies in the fi elds of application:

✦ Life Sciences, ✦ Energy Effi ciency, ✦ Photonics.

However, whereas microsystems technology is already sophisticated and application-oriented, nanotechnology is still attached to basic research. The fre-quently quoted potential for the industrial application of nanotechnology may be realised if it is systematically joined with microsystems technology. Such way the properties of nanostructures can open up to the macroscopic world.

Nano goes MacroThe interconnection of these cross-over technologies is crucial for all ranges of application in order to realise new system concepts. So, numerous re search projects at the IMN Macro Nano® in the fi elds mentioned above have already dealt with various subdo-mains of the macro -nano integration. To answer questions such as, how

IMN MacroNano®

A Partner in Research and Development

Fig.1Wet

chemical etching process

Fig.2Energy

harvester structure (project

AlNTEN)

85


three- dimensional nano structures can be applied in microsystems with high reproducibility and manufacturability, a new junior research group will be estab-lished to develop 3D nano structuring technology.Intense networking with top-class re-search institutions and industrial partners around the world is important as well as strategic planning of prospective projects and related investments for the needed equipment to maintain the posi-tion of the IMN MacroNano® in the top fl ight of international research.

EducationCutting-edge research and innovation are based on the high level of education attained by qualifi ed young scientists and engineers. Consequently, the multidisciplinary approach of the institute is also refl ected in the lectures and practical courses offered to students. In the cross-faculty master’s degree programmes in Micro- and Nanotech-

nologies and Miniaturised Biotech-nology e.g., students from different undergraduate disciplines can extend their qualifi cations within the scope of the IMN MacroNano®. Postgraduate education was strengthened with the establishment of the graduate research programme Optical Microsystems Tech-nology (OMITEC) in 2009.

Industrial PartnershipsThe multi-disciplinary research and de-velopment within the IMN MacroNano® offers various opportunities for industrial cooperation with small and medium sized enterprises as well as international companies. Among these are long term collaboration projects in consortia or projects with a single industrial partner, just as short term services. The internal project management and controlling enables to fi t complex requirements with contributions from many different departments of the institute. E.g. the BMBF-funded project OptiMi (Triangle of

Expertise Optical Microsystems) pools activities from eight departments inside the University and further scientifi c part-ners from Erfurt and Jena at two system demonstrators. The transfer of technology development and research results into the market is promoted by MicroNano-Broker.EU, a transfer concept, which makes it pos-sible for companies of all branches to get straightforward access to scientifi c know-how in the fi eld of microsystems technology and nanotechnologies. On its website www.micronano-broker.eu the broker provides quick connections for companies and research partners who are looking for or offer approaches to scientifi c or technical solutions.

Ilmenau University of TechnologyIMN MacroNano®

Gustav-Kirchhoff-Straße 7D – 98693 Ilmenau Phone +49 (0)3677- 69 - 3402Fax: +49 (0)3677- 69 - 3499Mail: [email protected]: www.macronano.de

Fig.3Thermomechanical actuators

Fig.4Pyramidal structure of aluminium nitride

Fig.5Molecular

beam epitaxy

Fiber-optical Sensors for Analysis of Liquids

The Bavarian La-ser Centre (blz) is a research company under private law with the objective to open up new areas of ap-plication for optical technologies through research, development and effi cient knowledge transfer. The blz sees itself as the connective link between funda-mental research and industrial application. As engineering partner the blz develops its own solutions for industry and qualifi es photonic technologies for a vari-ety of application areas. The research area laser assisted metal process-ing covers various tasks in the micro and macro sphere. This includes for example different micro joining processes for bonding elec-tronic and mechatronic components, but also laser micro structuring and processing of body parts for automotive applica-tions. In the fi eld of non-metal materials processing the focus lies on glass and plastic welding as well as processing of fi ber-reinforced plastics. Since several years the blz also works in the fi eld of design and implementation of micro and fi ber optical systems and the develop-ment, production and precision assem-bly of micro-technological devices.

In cooperation with the Canadian Institut National d’Optique (INO) a fi ber optical sensor for analysis of mixture of liquids by taking advantage of the Raman effect is developed. This is done using special micro-structured hollow-core fi bers developed and manufactured by the partner. Advantage of this new fi ber architectures lies in expanding the diversity and reducing the quantity of substances to be analyzed.

Due to the large interaction length, which is achieved through the hollow core fi bers, even the smallest traces of substances can be detected. In addition, fi ber-optic sensors offer the advantage of being robust in harsh environmental conditions (corrosive media, high temperatures) and are insensitive to electromagnetic fi elds. Figure 1 shows an example of the result of an analysis us-ing the fi ber sensor for the examination of liquids (fi gure 2). The fi ber was fi lled with water or ethanol, following analysis by a commercial spectrometer. The diagram shows the Raman spectrum measured. Based on the characteristic fi ngerprint region the

fi lled substance can be determined exactly. Potential applications include analysis in food and chemical industry.

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Figure 1: Analysed Raman spectrum of ethanol and water

Figure 2: Experimental setup with solid state laser radiation

Bayerisches Laserzentrum GmbHKonrad-Zuse-Str. 2-6 D – 91052 ErlangenPhone +49 (0)9131- 97790 - 0Mail [email protected] www.blz.org

Innovations and Competencies of Companies

Innovationen und Kompetenzen aus Unternehmen

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Positron emission tomography (PET) scanners are often used for imaging procedures in cancer diagnosis. Radio-actively labelled tracers are injected and become more highly concentrated in damaged tissue than in healthy tis-sue. This enables the scans to give a good image of the position of tumors and metastases in the body. In order to locate the affected tissue with millimetric precision during an operation, however, a hand-held probe which detects PET nu-clides is extremely useful to the surgeon.

Standard PET probes designed to detect 511keV γ radiation in tissue are able to locate the radiation source to within approximately 10mm. These probes require a very heavy collimator to shield the γ-radiation. This is due to the high energy of the annihilation radia-tion of over 0.5 MeV. In comparison, for imaging x-rays, much thinner shields are suffi cient to absorb radiation. The PET probes are therefore much more bulky,

making guidance more diffi cult and reducing their responsivity.

However, if β+ radiation could be de-tected directly, improved spatial resolu-tion would be possible. β+ radiation has a range of only a few millimeters in tissue, before the positrons meet electrons and are transformed into gamma radiation. Conventional sensors however cannot detect β+ radiation. A

positron detector also offers other advantages, such as a much smaller probe circumference. Only a thin collimator is necessary for β+ radiation, which improves both detector size and spa-tial resolution.

Combined with an additional γ channel, rough location and fi ne detection can actu-ally be carried out simultane-ously with the same probe.

This makes it possible to carry out both more precise and quicker localization than with the PET probes currently avail-able.A probe with two detectors (γ und β+) can carry out rough detection using the measured γ radiation values while simultaneously the upstream second detector precisely locates the affected tissue with the β+ radiation which only travels a few millimeters. The γ radiation is detected with a spatial resolution of full width at half maximum of 13 mm.

The spatial resolution for β+ radiation is much smaller, namely 7mm. Conven-tional PET probes are often extremely susceptible to interference and give distorted data, particularly when they are used in conjunction with HF scal-pels and other electronic devices. This high susceptibility to interference entails risks during an operation, which are eliminated with First Sensor’s new PET probe.The positrons are collected by the silicon detector located directly in the head of the probe and the signal is

Tumor and metastasis detection with high precision

Optimum Radiation Detection in the OR

Fig.1: PIN-Diode optimized for β+ radiation

Fig.2: Reduced dark current for improved detection

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passed into the microcontroller via the charge sensitive preamplifi er and fi lter amplifi er. The silicon photodiode is optimized with optimum guard ring technology for very low dark cur-rent and very low capacitance, giv-ing particularly high spatial resolution and so improved sensitivity (Fig. 1). The γ annihilation radiation passes through the upstream photodiode without being detected there and is converted into visible light in a Csl pho-todiode scintillator. The second Si PIN photodiode detects this scintillator radiation. This diode is also optimized for very low dark current and very low capacitance, in order to achieve optimum sensitivity for gamma radiation detection.The best dark current values of con-ventional Si PIN radiation detectors are approx. 1nA per cm² of detector area. These levels have been reduced by a factor of 10 to 0.1nA for the diode which has been developed specifi cally for the PET probe (Fig. 2). This considerably reduces the ambient noise, resulting in

very good γ and β spectral properties of the detector. This produces good location selectivity combined with high sensitivity. The photodiodes are de-signed so that they only require a very thin wolfram collimator. For this reason the probe head design is particularly compact; its 18mm diameter makes it ideal for intraoperative applications and it is much less bulky than conventional probes, which are 30 mm in diameter. (Fig. 3)

The electrical pulse collected by the γ sensor is passed via the analog front-end electronics, consisting of a charge amplifi er, fi lter amplifi er and impulse discriminator, to the digital control, evaluation and transmission electronics, which operate using a microcontroller and a Bluetooth module. Particular at-tention was paid to the electromagnetic compatibility (EMC) of the PET probe. Both measurement values are given in counts per second. The values are easy to read on a 12” panel PC. One of the two channels may be set to give acous-

tic signals. The user may select between a traditional Geiger counter mode and a specially programmed modulated tone mode.

First Sensor AG has over 20 years’ experience in the development and manufacture of light and radiation detec-tors and has applied its competence in sensor manufacture to optimizing PET probes. The particular requirements of nuclear medicine to locate affected tissue with millimetric precision has inspired the company to develop an optimised β+ and γ detector with a thin collimator and perfected analog and digital electronics.

First Sensor AGPeter-Behrens-Straße 15D – 12459 BerlinPhone +49 (0)30 - 639923 - 743Fax +49 (0)30 - 639923 - 752Mail simone.burkhardt@fi rst-sensor.comWeb www.fi rst-sensor.com

Fig.3: PET-Probe and construction diagram

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The key element of InfraTec’s vari-able color products is a silicon micro machined tunable narrow bandpass fi lter, which is fully integrated inside the detector housing. Applying a control voltage to the fi lter allows it to freely select the wavelength within a cer-tain spectral range or to sequentially measure a continuous spectrum. This design is very different from detec-tors with fi xed fi lter characteristics and enables the customer to realize a low cost spectrometer already at component level.The variable color product group includes the LFP-3041L-337, the LFP-3950L-337 and the LFP-80105-337 which differ in the wavelength range they each cover. The pyroelectric detector used is similar to the standard LME-337 device.

1 Fabry-Perot fi lter (FPF)The fi lter-detector assembly (see fi gure 1) is based on the well-known Fabry- Perot Interferometer (FPI). Two

fl at and partially transmitting mirrors with refl ectance R are arranged in parallel at a distance d, forming an optical gap. Multiple-beam interference is created inside the gap and thus only radiation can be transmitted, which satisfi es the resonance condition according to the equation below.One of the mirrors is suspended by springs so that the distance d can be decreased by applying a control voltage. As the resonance condition changes so does the wavelength of the transmitted radiation.

2 Optical ConsiderationsThe mirrors of the FPI are made from dielectric layer stacks (Bragg refl ec-tors). This limits the width of the refl ec-tive band and thus the usable spectral tuning range to about 1.3 µm (2.5 µm for the LFP-80105-337). An inclined but collimated beam results in a nega-tive drift of the CWL (see fi gure 2 left). The most common case is an uncol-limated beam with a certain angle of divergence and intensity profi le. The resulting transmittance spectrum can be seen as the superposition of collimated

ray-beams with different angles of incidence and intensities. The superim-posed spectrum has a broader HPBW and the CWL at slightly lower wave-lengths (see fi gure 2 right).

Beam diver-gence can be minimized by

Basics and Application of Tuneable Infrared Detectors with Integrated Micromachined Fabry-Pérot Filter

Fig 1: Confi guration and operation

principle of the FPF with an inte-grated pyroelectric detector

n refractive index inside the gap

ß angle of incidence (ß=0 in fi g 19)

m interference orderd optical gap

λ m = m2 n d cos ß

Fig 2: Infl uence of angle shift and divergence angle on bandwidth and peak transmittance of a FPF

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using a light source with collimated output or by means of an additional prefi xed aperture (see fi gure 3 left). If the desire is to maximize the optical throughput, then focusing optics can be used, but larger divergence angles will be a side effect (see fi gure 3 right).

The performance of such a system strongly depends on the optical conditions. A compromise between spectral resolution and signal-to-noise ratio (SNR) for the particular applica-tion needs to be found. This principle is in fact valid for all spectrometric ap-plications.

Figure 4 shows the cor-relation of the achievable SNR with a given spectral resolution, measured with two tested measure-ment set ups according to fi gure 3. Please note that a parallel beam ø1 mm offers the highest spectral resolution but only 3 % of the intensity and thus the resulting low detector signal volt-age compared to an illumination using f/1.4 optics.

Tuning the CWL of the FPF results in a variation of the HPBW and the peak transmission within certain limits, too. The additionally implemented broad band pass and the pyroelectric detec-tor element also show some spectral characteristics. The spectral response

of the detector is therefore a superposi-tion of different fractions, but has to be considered as a whole in the applica-tion. It is stated as the relative spectral response, referring to a ‘black’ reference detector with a fl at spectral response (see fi gure 5).

Fig 3: Possible optimizations for the optical design of a microspectrometer with FPF detector left set up: corresponds with an illumination by a parallel beam; right set up: corresponds with a high angle of incidence (AOI)

FP-Detector

Aperture

IR-sourcecollimated output

Sample cell

FP-DetectorFocusing optic

IR-sourceSample cell

High SNRHigh Resolution

Fig 4: Measurements of the SNR vs. spectral resolution LFP-3041-337 with a modulated IR source at Hz,left end point: Illumination at high angle of incidence (AOI) using f/1.4 optics right end point: Illumination with a parallel beam ø 1 mm

Fig 5: Relative spectral response of a FPF detector LFP-3041L-337 at several tuning voltages

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3 Filter operationThe fi lter is activated electrostatically.The driving electrode is arranged at the fi xed refl ector carrier, the movable refl ector carrier acts as an electrode with the fi xed reference potential. Applying a tuning voltage results in an electrosta tic force decreasing the electrode gap. With this the drive capacitance is increased from ≈50 pF in passive state (Vc=0 V) to ≈65 pF at maximum modula tion. Additionally a parasitic parallel capa city of 1 nF needs to be considered. In the case of steady state, a typical non-linear characteristic curve is received (see fi gure 6).

4 Operation modes and measurement methods

The capabilities of LFP (so called vari-able color) detectors are numerous. De-pending on the measurement task and operation mode, different advantages compared to conventional single or multi channel detectors with fi xed NBP fi lters can be found. Hereafter three different operation

modes will be explained in detail:

Sequence of channelsIn the simplest case several fi xed detec-tor channels shall be substituted by a

tunable detector. The fi lter is sequentially adjusted to the individual spectral chan-nels. Besides the obvious advantage of the fl exibility and expandability in the channel choice additional advantages may be achieved:

✦ Simple multi channel detectors have separated apertures, which yield to the well known issues regarding non-uniform illumination, long-term stability, source drifting, pollution, etc. The variable color detectors don’t show these problems due to their principal design and singular light path.

✦ Detectors with an internal beamsplit-ter also have a common aperture, but each channel is getting only a fraction of the whole radiant power. Applying the sequential measure-ment we can always use the whole incident radiant power. For four different channels and comparable conditions regarding aperture size and fi lter bandwidth theoretically a duplication of the SNR can be reached.

Step scanThe method described above can still be ex-panded in such a way that continu-ous spectra can be obtained. The required acquisition time for the mapping of a spectrum depends on the following facts:

Fig 6: Typical steady-state

control characteristic for LFP-3041L-337

Fig 7: Measurement

example for the step scan mode

(Polystyrene foil) LFP-3041L-337:

spectral resolutionR=65; SNR≈1000:1;

100 data points; acquisition time 10 s

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1. Number of measuring points (wave-length range, step size): To get a continuous spectrum it must be scanned at minimum with a step size which corresponds to the half fi lter bandwidth (sampling theorem). Moderate oversampling can be use-ful. The reasonable step size is in the range (10 … 50) nm.

2. Recordings of the measuring points (modulation frequency, integration time): These parameters defi ne the SNR. Beside the detector properties and the applied analysis methods, the radiant power, modulation depth of the IR source and the design of the measuring section are crucial.

3. Settling time of the fi lter: The actual settling time of the fi lter depends on the wavelength as described earlier. It should therefore be implemented variably to achieve an optimum of speed.

Continuous scan (Sweep mode)By using a pyroelectric detector only modulated radiation can be analyzed. Normally this is realized by mechanical chopping or electrical modulation of the IR source. If the fi lter is however continu-ously scanned the spectral information can be used directly for the modulation. The fi lter is actuated dynamically in this

case. This particular operation mode has principally the potential to accelerate the recordings of spectra remarkably. The earlier mentioned non-linear effects during dynamic operation however need to be considered separately. In most cases it is not possible to con-sider the fi lter as a linear system with a simple low pass behavior even in a limited operation range.Figure 8 gives an example for the dynamic operation. The IR source is working in DC operation, while the fi lter goes through the desired wavelength range. Except for the DC-portion, the whole spectral information is contained

in the generated detector signal. The actuation and analysis has to include both the dynamic properties of the fi lter and the detector.

5 SummaryWith the extension of our product range by variable color detectors ad-ditional technologies are available for our customers. All types of our multispec-tral detectors are complementing one another:

✦ Conventional dual and quad channel detectors can be used in competi-tive volume applications

✦ Our dual and quad channel beam-splitter detectors with one aperture are used as long term stable and very accurate measuring modules for different spectral channels

✦ Variable color detectors with a high SNR allow a more fl exible operation of the analyzer enabling for example the detection of adjoining or over-lapping absorption bands. They are also of interest for applications, where more than 4 spectral chan-nels shall be scanned within a short time frame.

Fig 8: InfraTec’s latest developments are dual band Fabry-Pérot detectors and detectors with a tuning range from 8.0 μm to 10.5 μm

InfraTec GmbHInfrarotsensorik und MesstechnikStephan BraunGostritzer Str. 61 - 63D – 01217 DresdenPhone +49 (0)351- 871- 8896Fax: +49 (0)351- 871- 8727Mail [email protected] Internet : www.InfraTec.de

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Ready-To-Use MEMS – Innovations at X-FABSophia Dempwolf, Roy Knechtel, Uwe Schwarz

More than MooreMoore’s law has been a strong infl u-ence on mainstream microelectronics over the past few decades, where the trends of decreasing feature size and increasing transistor count have driven the semiconductor industry forward. This philosophy has worked very well for memories and microprocessors in the digital world. Additional analog functions, by interfacing with the physical world, enable cost-optimized and value-added system solutions. These upgraded technologies are understood as “More than Moore”. For more information, please go to: www.more-than-moore.com.In the past, the dominant MEMS market has been driven by automotive applica-tions, but recently, this has changed rapidly, and MEMS has entered the spotlight of consumer and mobile ap-plications. Today, half of all cell phones and laptops use MEMS acceleration sensors (e.g. for switching of the device screen between landscape and portrait views, depending on the way it is held, and for free-fall protection of laptops).Recently, some MEMS devices have only just begun to realize their market potential. The MEMS market is rapidly growing and evolving, and there will be exciting opportunities for established manufacturers.X-FAB has quickly recognized the importance of MEMS, and consequently many processes have already been es-tablished, which today provide the basis for X-FAB’s future MEMS business.X-FAB offers CUSP (customer specifi c) and COT (customer owned tooling) processes.

The latter are foundry, open-platform processes, which are completely developed and supplied to the custom-ers. These are known as ready-to-use processes. Based on design rule and process specifi cations, the process can be applied to each customer-specifi c design.

Ready-To-Use MEMS By transferring the CMOS foundry business model into the MEMS world, X-FAB offers its customers a range of state-of-the-art surface micromachining platform technologies. Typical applica-tions are inertial sensors and pressure sensors.For discrete absolute pressure sen-sors, the membrane is fabricated by wafer bonding and thinning. Following this, piezoresistive sensor elements, which act as mechanical-electrical signal converters, are created on the surface of the membrane. A vacuum is enclosed within the cavity located beneath the membrane, which ultimately enables the measurement of absolute pressure. This process is primarily intended for automo-tive, industrial and medical applications.For bulk micromachined relative pres-sure sensors, the piezoresistive sen-

sor elements are fabricated during a pre-CMOS process followed by the fabrication of the membrane through backside KOH etching. Optionally a pre-structured glass wafer is bonded onto the backside of the silicon wafer. Usually this can be done to achieve high mechanical stability of the sensor die.In response to the growing market of different acceleration/gyroscope applica-tions, a COT technology for surface-mi-cromachined inertial sensors has been developed and established. The tiny mechanical structures (2 µm wide) are made from a single crystalline device layer of a special SOI substrate. Trenches and holes (seismic mass, comb drives, read-out capacitors) are etched anisotropically into the device layer down to the buried oxide, in order to realize the complex mechanical struc-tures. Following this, the sidewalls of the structures are passivated and the me-chanical areas are released by isotropic etching into the handle wafer. Next, any remaining oxide is removed by vapour etching, so that the mechanical struc-tures consist of only pure single crystal-line silicon. Finally, the sensor structure is sealed with a specially-prepared top capping wafer. Special features, for ex-ample isolation trenches, enable metal wire crossing and the minimization of parasitic capacities.This MEMS foundry process is ready-to-use and suitable for each customer specifi c design. The technology is very well described by the process and design rule specifi ca-tion. The process specifi cation defi nes all process-related information required during the design and assembly pro-Bulk micromachined relative pressure sensors

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cess. Structural and geometrical, as well as electrical and parasitic parameters are specifi ed. The design rule manual refers to all process layers and their relationships to each other. The rules, such as minimum and maximum widths, spacings, overlaps and enclosures for layers, are described and clearly repre-sented with the aid of drawings. While the foundry process is completely developed and provided by the MEMS foundry, another focus is based on the chip design. In order to also support the customer in this respect, intellectual property core blocks (IP) for acceleration sensors have been developed, pro-cessed and characterized. Thus, IP blocks for three sensor elements were designed, based on X-FAB’s inertial sensor foundry technol-ogy. Consequently, the three designs conform completely to the related design rules.The layouts of the acceleration sensor IP blocks were based on calculations and simulations by Matlab and fi nite element method (FEM). These three sensors of 2G, 10G and 100G (G – gravity acceleration) cover the entire range of potential consumer and automotive applications. In order to characterize the

mechanical acceleration movements, the sensor dies were examined using a 3-axis turntable and shaker system at different temperatures. The results showed that all parameter requirements specifi ed during the design phase were fulfi lled.The acceleration sensor IP blocks allow customer-specifi c modifi cations (e.g. bond pads) and are ready-to-use for implementation in specifi c solutions. With this project, the next stage of MEMS standardization has been completed, and the use of customized inertial sensors simplifi ed.

First MEMS DRC for Inertial SensorsDuring the physical verifi cation of a de-sign, a design rule check (DRC) is a ma-jor step for achieving a high overall yield and reliability of the design. If the design rules are violated, the design may not be manufacturable. This could have seri-ous consequences for the production schedule. Hence, before transferring the customer specifi c design onto silicon, a DRC should be done to verify the design with respect to all defi ned rules. Since MEMS has different requirements than standard CMOS, such as the capabil-ity of checking round structures (arcs, curves, and circles), the implementation of a DRC is a considerable challenge compared to normal CMOS design processes. However, in cooperation with the MEMS process development team, our design support experts have recently developed an automatic DRC runset for the X-FAB surface microma-chining process. This has enabled the fi rst MEMS design rule check runset to be implemented into X-FAB’s standard

procedures. The design rule check runset is ready-to-use and available for customers. Therefore customers now have the possibility to download the tool and evaluate their designs throughout the complete design phase.

Plans and outlookCurrently, consumer electronic compa-nies are continuously searching for new product functionalities in order to distin-guish them from their competitors, with the result that inertial sensors have now been adopted in gaming, digital camera and fi tness equipment products.Here, they are effectively combined in order to overcome the individual limitations of common sensor types. Currently, X-FAB’s state-of-the-art pro-cess is suitable for two-way (x, y axis) inertial sensors. To keep pace with modern applications and opportunities, it is planned to add a third axis to the standard process in the near future. By inserting only a few additional mask lay-ers and changing the standard process slightly, X-FAB’s foundry process can be extended to achieve the new 3-axis functionality with a ready-to-use MEMS technology. Consequently, this new pro-cess will open entirely new possibilities for emerging applications.

X-FAB Semiconductor Foundries AGDr. Herwig DoellefeldHaarbergstrasse 67D – 99097 ErfurtPhone +49 (0)361 - 427 - 6639Fax +49 (0)361 - 427 - 6631Mail [email protected] www.xfab.com www.more-than-more.comInertial sensor with opened cap

Typical values of acceleration sensor IP blocks Acceleration sensor IP dies

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The UST Air Quality Moni-tor is an innovation of UST Umweltsensortechnik GmbH that detects relevant param-eters of indoor air like

✦ concentration of carbon dioxide (CO2) as the primary indicator of air quality in living rooms, offi ce rooms etc.

✦ concentration of par-ticular VOC-markers (VOC…Volatile Organic Compound) as the pri-mary indicator in produc-tion areas etc.

✦ ambient temperature and humidity.

Employed as input parameters to air conditioning and ventilation systems, effi cient indoor ventilation on individual needs depending on air quality can be accomplished. The focus on air quality-based control of the change of air offers a great chance towards an energy-effi cient operation of air condition and ventilation systems.The key component is an innova-tive sensor system comprising of a photo-acoustic and a MOX gas sensor (UST Triplesensor®) for the detection of CO2 and particular VOC markers (Patent DE 10 2010 003 966 B3).

Technical features of the UST Air Quality Monitor

✦ modular designed system – scalable and adaptable to application and customer needs

✦ photo-acoustic gas sensor systemfor the detection of CO2 in ambient air

✦ semi-conductor gas sensor system for the detection of • indicators specifi c to indoor and

ambient climate (particular VOC-markers)

• (depending on confi guration) dangerous situation like e.g. smol-dering or cable fi res, chemical accidents

✦ measurement of ambient tempera-ture (-20°C up to +70°C ± 0,1K)

✦ measurement of humidity (0% up to 100% rH)

✦ data input/output interface, visualiza-tion and control of all functions by an embedded touch panel or an external control system

✦ application-specifi c interface to con-nect to air condition and ventilation systems

UST Umweltsensortechnik GmbH is recognised internationally as a leading company for market-driven develop-ment and production of ceramic sensor technology for gas and temperature

measurement together with innovative measur-ing instruments for gas detection.Innovative manufacturing technologies enable the production of custom- designed sensors and instruments with high-est quality and reliability in small as well as large production runs. The annual output amounts several million gas sensors and temperature sen-sors as well as several

thousand gas detection devices, which are sold to more than 1.200 customers worldwide. Our sensors are used by our customers for example in car fl ap control systems, temperature and exhaust gas control systems, systems for the detection of smouldering fi re in lignite power plants and subways, air quality measure-ment systems as well as high and low temperature applications in industrial manufacturing processes.

Innovative sensor systems for indoor air quality monitoring

Energy Savings through Ventilation as Needed

UST Umweltsensortechnik GmbHDr. Olaf KiesewetterDieselstr. 2D – 98716 GeschwendaPhone +49 (0)36205 - 713 - 0Fax +49 (0)36205 - 713 - 10Mail [email protected] www.umweltsensortechnik.de

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The ongoing trend towards autonomous microsystems for sensing and actuation applications with wireless communica-tion requires the development of new energy storage technologies. Since hydrogen, stored as palladium hydride, has a high volumetric energy density of 2.12 Ah/cm³, the combination of micro fuel cell technology and the low power consumption of modern CMOS electronics provide a new opportunity to further downscale those systems. Hence, micro fuel cells have a promising future as power supply for low power

applications where only limited space is available.The chip-integrated fuel cell technology was developed in cooperation with the department of microsystems engineer-ing at the university of Freiburg (IMTEK). Based on standard CMOS processes, the micro fuel cells can be produced by adding only a few fabrication steps. Therefore, it is possible to integrate the fuel cell and a wide range of electronic functionality onto one substrate.

The developed self-breathing polymer-electrolyte micro fuel cells deliver a maximum output power of 2.5 mW/cm². The integrated electronic control circuitry of the demonstration system consists of a LDO (low-dropout volt-age regulator) and a core system comprising an on-chip oscillator and a programmable timing network. The core system consumes an average power of 620 nW. The LDO system reaches a current effi ciency of up to 92% and pro-vides free confi gurable output voltages between 1.2 and 3.3 V.

An actual collaborative research project within the framework of the MicroTEC Südwest cluster addresses the develop-ment of rechargeable fuel cells to set up a so called fuel cell accumulator system. This system combines an electrolyser and micro fuel cells with integrated palladium hydrogen storage. Outstand-ing advantages of this assembly are the fuel cell with integrated hydrogen storage itself, the possibility of refuelling it by electrolysis and the opportunity of

simply refi lling the electrolyte by adding water. By applying an electrical current, the electrolyser produces hydrogen, which is absorbed by the palladium layer and stored on the device as palladium hydride. While operating the fuel cell to generate electricity, the hydrogen cross-es the polymer-electrolyte-membrane and reacts at the cathode with oxygen to water. This concept for a fuel cell accumulator provides effi cient energy storage for a long-lasting autonomous operation of a smart microsystem.

Chip-integrated Micro Fuel Cells

Micronas GmbHDominik ZimmermannIngo FreundHans-Bunte-Str. 19D – 79108 FreiburgPhone +49 (0)761 - 517 - 0Mail [email protected] www.micronas.com

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Micromachined Metal Oxide Semiconductor and Field Effect Sensors for Automotive, HVAC and Consumer Applications

Intelligent sensors for comfort and safety applications in buildings and vehicles are considered as the key to energy-effi ciency and a high standard of living. In the recent past, different sensor technologies experienced tremendous technological progress and distribution in commercial products.

AppliedSensor as a manufacturer of micromachined gas sensing elements is an international supplier of gas sensing solutions for air quality, comfort, control and safety applications for automo-tive, HVAC and consumer industries. Improved reproducibility and long-term stability together with low cost potential of micromachined gas sensors led to application-driven developments for industrial and commercial products in everyday life.

AppliedSensor developed plug-and-play metal oxide semiconductor gas sensor modules with integrated electronics and intelligence for recir-culating air fl ap control in vehicles, demand-controlled ventilation, intel-ligent window and cooker hood control,

building monitoring, air cleaners and air fresh-eners. Specifi c control algorithms for the indi-vidual appliances have been developed and the sensing elements have been optimized for the detection of exhaust emissions, human bio-effl uents, cooking odors, smoke, fumes and cleaning supplies.

Recirculating air fl ap control in vehicles is realized with two micromachined metal oxide sensing elements for reliable detection of exhaust reducing gases (e.g. CO, hydrocarbons) and oxidizing gases (e.g. NO2). The sensor module controls the amount of fresh air enter-ing the vehicle cabin by signaling the HVAC system to close/open the air inlet according to defi ned threshold levels for target gases, resulting in consistent, good cabin air. Indoor air quality mod-ules based on a single micromachined metal oxide sensing element have been developed for demand-controlled

ventilation with the aim to improve comfort in buildings while minimizing the energy consumption at the same time. The implemented algo-rithm correlates the amount of detected indoor volatile organic compounds with the human CO2 production for prediction of indoor CO2 levels. For hydrogen gas leak detection in hydrogen-powered vehicles, fuel cell

effi ciency and exhaust gas monitoring applications, a highly selective, fast-responding hydrogen fi eld effect sensor module has been developed.

The sensor modules provide product performance for mass-market applica-tions and offer new dimensions for the end-user in terms of comfort, safety and energy-effi ciency. Increased miniaturiza-tion of micromachined sensor sub-strates, fl exible sensor packaging and housing as well as further developments in sensor operation modes will lead to an even broader application range with focus on battery operated devices and wireless sensor networks.

AppliedSensor GmbHGerhard-Kindler-Strasse 8D – 72770 ReutlingenPhone +49 (0)7121 - 514 86 - 0Fax +49 (0)7121 - 514 86 - 29Mail [email protected] www.appliedsensor.com

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Production technologies are becom-ing more and more complex. Due to just-in-time production the demands on the reliability of the complex production systems are increasing permanently. For measuring and monitoring purposes (e.g. in condition monitoring) sensors are playing more and more a key role. However these applications result in demands on miniaturizing the sensors and improving their technical parameters such as higher measuring ranges, reso-lutions and accuracies combined with lower prices.

The only way to meet these require-ments are sensor developments based on MEMS technology. With its MEMS sensors for acceleration, inclination and vibration GEMAC supports users in nearly all industrial sectors to develop competitive products. Serial production of the fi rst MEMS sensor has already started in 1999. Based on this long time competences and a staff of more than 40 R&D engi-neers GEMAC can offer highly sophis-ticated sensor products with numerous USPs to the market.

In 2011 GEMAC launched a new family of inclination and acceleration sensors characterized by high resolutions of 0.01° and other features like:

✦ Measurement range ±90° and 360° ✦ Compensated cross sensitivity ✦ Programmable vibration suppression ✦ CAN-Bus-interface or freely pro-

grammable current or voltage interface

✦ Robust UV resistant impact strength plastic housing

GEMAC’s vibration sensors complete its family of acceleration sensors. These MEMS based vibration sensors working on a capacitive principle show better performances than piezo-electric or -resistive sensors and can be used in a wide frequency spectrum from static signals up to more than 10 kHz. They are highly sensitive and able to resolve movements of the seismic mass down to picometer range. Using these sen-sors smallest oscillation amplitudes or position changes can be measured. With these parameters they meet the requirements to be used in sophisti-

cated condition monitoring systems. Potential application areas are for instance device and plant engineering as well as medical engineering.

For the practical use of MEMS based sensors a reliable, robust and high quality assembly and packaging technologies are required in order to compensate environmental infl uences on the sensor functionality. Such effects are e.g. caused by the different thermal expansion coeffi cients of the sensor and packaging materials. Also in this fi eld GEMAC has long time know-how. So GEMAC’s sensors are qualifi ed to be used in applications with high demands on resolution, accuracy and a wide temperature range.

Meanwhile, customers from all over the world trust in GEMAC’s sensor products. Main application fi elds of GEMAC’s sensors are:

✦ Construction machinery ✦ Solar thermal and photo-voltaic

systems ✦ Agricultural and forestry machinery ✦ Cranes and conveyors

Meeting the Challenges of Modern Production Systems

with GEMAC’s MEMS Based Sensor Products

GEMAC - Gesellschaft fuer Mikro-elektronikanwendung Chemnitz mbHZwickauer Straße 227D – 09116 ChemnitzPhone +49 (0)371 - 3377 - 0Fax +49 (0)371 - 3377 - 272Mail [email protected] http://www.gemac-chemnitz.de

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Spectral sensors play an increasingly important role in present-day produc-tion processes and analysis techniques, since they enable non-contact and non-destructive measurements of a wide variety of physical and chemical param-eters. The determination of ingredients and concentrations in the chemical and food industry or the measurement of material properties such as colour, layer thickness, and composition are only a few examples.The implementation of such measure concepts in often demanding industrial environments requires a compact and robust design of the spectral sensors without sacrifi cing their optical perfor-mance. The latest generation of com-pact grating spectrometers (CGS, Fig. 1) from Carl Zeiss MicroImaging GmbH was specifi cally developed to cope with this balancing act. The CGS covers the whole wavelength range from 190 nm to 1000 nm and is therefore suitable for applications in the UV as well as near infrared. Due to the absence of movable components it is extremely insusceptible to external conditions, yet provides a spectral resolution of ≈2 nm (half width at tenth of maximum with 50 µm slit width) in the entire spectral range de-spite of its compact design (Fig. 2).This has become possible by employing back-thinned CCD line detectors with a large number of pixels (2048) as well as a special correction mirror, which signifi -cantly improves the imaging properties of the optical system. The holographic concave grating was optimized for high diffraction effi ciency in the UV range, in which typically only weak light input is available. In combination with the high

Spectral Sensing Made Easy – with Compact Spectrometers from Carl Zeiss

Michael Barth, Lutz Freytag

Fig. 1:Compact grating spectrometer (CGS)Kompakt-Gitter-Spektrometer

photosensitivity of the CCD this results in excellent detection effi ciency through-out the entire spectrum.

One common drawback of the small volume of compact spectrometers is the increased susceptibility to stray light, which can seriously affect the optical performance of the system, especially when dealing with weak signals. There-fore, in the design process of the CGS we particularly focused on the suppres-sion of unwanted back refl ections and higher order diffraction. Furthermore, a special coating is employed to minimize

diffuse scattering at the inner surfaces. In this way, nearly fl awless spectral imaging with an extremely low diffuse background is achieved.The CGS is therefore well suited for recording spectra of high quality even under demanding environmental condi-tions, as they often occur in production processes. In addition, the ratio between light throughput and spectral resolu-tion can be adapted to the needs of the corresponding application through appropriate choice of the entrance slit. Spectral sensing has never been easier and more reliable.

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Spektralsensorik leicht gemacht – mit Kompaktspektrometern von Carl Zeiss

Carl Zeiss MicroImaging GmbHOptical Sensor SystemsCarl-Zeiss-Promenade 10D-07745 JenaPhone +49 (0)3641 - 64 2838Fax +49 (0)3641 - 64 2485Mail [email protected] http://www.zeiss.de/spektral

Spektralsensoren spielen in modernen Produktionsprozessen und Analysever-fahren eine zunehmend wichtige Rolle, da sich mit ihrer Hilfe berührungs- und zerstörungsfreie Messungen einer Vielzahl physikalischer und chemi-scher Parameter realisieren lassen. Die Bestimmung von Inhaltsstoffen und Konzentrationen in der Chemie- und Lebensmittelindustrie oder die Messung von Materialeigenschaften wie Farbe, Schichtdicke und Zusammensetzung sind nur einige Beispiele.Die Umsetzung solcher Messkonzepte in teils anspruchsvollen industriellen Um-gebungen erfordert eine kompakte und robuste Bauweise bei gleichzeitig hoher Leistungsstärke der Spektralsensoren. Die neueste Generation von Kompakt-Gitter-Spektrometern (kurz CGS, Fig. 1) der Carl Zeiss MicroImaging GmbH wurde speziell entwickelt, um diesen Spagat zu meistern. Das CGS deckt den gesamten Wellenlängenbereich von 190 nm bis 1000 nm ab und eignet sich

damit sowohl für Anwendungen im UV als auch im nahen Infrarot. Aufgrund feh-lender beweglicher Teile ist es äußerst unempfi ndlich gegenüber Umweltein-fl üssen, erzielt aber trotz seiner kom-pakten Bauart (Fig. 2) im kompletten Spektralbereich eine Aufl ösung von ≈2 nm (halbe Zehntelwertsbreite bei 50 µm Spaltbreite).Ermöglicht wird dies einerseits durch die Verwendung rückseitengeätzter CCD-Zeilendetektoren mit großer Pixel-zahl (2048), andererseits durch einen speziellen Korrekturspiegel, der die Abbildungseigenschaften des Systems deutlich verbessert. Das holographische Konkavgitter wurde für eine möglichst hohe Beugungseffi zienz im UV-Bereich optimiert, da hier anwendungsbedingt oftmals nur geringe Lichtleistungen zur Verfügung stehen. In Kombination mit der hohen Lichtempfi ndlichkeit der CCD-Zeile ergibt sich auf diese Weise eine hervorragende Detektionseffi zienz über das gesamte Spektrum.

Ein Nachteil der geringen Baugröße von Kompaktspektrometern ist oftmals die erhöhte Anfälligkeit für Streu- und Falschlicht, welches sich insbesondere bei schwachen Signalen negativ auf die Leistungsfähigkeit des Systems auswirken kann. Aus diesem Grund wurde beim Design des CGS besonde-res Augenmerk auf die Unter drückung unerwünschter Refl exionen und höherer Beugungsordnungen gelegt. Zudem wird eine spezielle Beschichtung eingesetzt, um die diffuse Streuung an den inneren Oberfl ächen zu minimieren. Dadurch ist es gelungen, eine nahezu artefaktfreie spektrale Wiedergabe mit extrem geringem diffusem Untergrund zu realisieren.Das CGS eignet sich somit für die Messung von qualitativ hochwerti-gen Spektren auch unter schwierigen Umweltbedingungen, wie sie häufi g in Produktionsprozessen auftreten. Durch entsprechende Wahl des Eintrittsspalts lässt sich zudem das Verhältnis von Lichtdurchsatz und Aufl ösungsvermö-gen optimal auf die Erfordernisse der jeweiligen Anwendung abstimmen. Nie war Spektralsensorik einfacher und zuverlässiger.

Fig. 2:Components and beam path in the

spectrometer module

Komponenten und Strahlen gang im

Spektro metermodul

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20 years of LIMO have been 20 years of innovative application solutions. With our refractive micro-optics we earned a worldwide reputation. Soon afterwards, we added the development of diode laser systems to the portfolio. Today, we are one of the very few international companies who combine micro-optics and diode laser systems under one roof.This makes us an important partner for companies in various industries. We accompany our customers from the initial idea to the implementation. This applies to our micro-optics as well as to the high-power diode lasers for medical applications or for materials processing, such as, for example, in the automotive industry. Each one of our 300 patents stands for a unique customer-specifi c solution.The award “Innovationspreis der deutschen Wirtschaft 2007 für Strahlfor-mungssysteme mit Freiform-Mikrolinsen“ has been an important milestone in our company's history. Today, we dedicate a large part of our research and de-velopment efforts to customer-specifi c beam shaping optics and beam shaping systems.

Facts: ✦ 220 employees from 24 nations ✦ Headquarters in Dortmund, Germany ✦ Founded 1992

Our Product Portfolio:Micro-Optics & Optical SystemsWe develop and produce wafer-based optical components and systems, suit-able for cost-effective mass production of premium lenses and customized beam shaping solutions. Our patented manufacturing process uses only high-quality glass and crystals for a long lifetime.

Diode Lasers & Industrial Laser SystemsLIMO diode lasers (e.g. fi ber-coupled, line lasers) impress with highest bright-ness and a robust industrial design. All high-effi cient and long-lasting laser modules are also available as complete systems. Our in-house produced refractive micro-optics ensure high effi ciency for customized beam shaping. That guarantees lower failure rates, lower electricity consumption, reduced cooling requirements and a longer life time.

Service & ConsultingFor the various fi elds of applications of laser materials processing, we have installed an Applications Center in that we demonstrate our solutions “live” in a suitable environment. Altogether we offer full service in every way: Whether you need process devel-opment, customized assembly, technical service or feasibility study, LIMO is able to provide exactly what you require.

We offer our solutions for following industries: ✦ Flat panel display production ✦ Laser pumping ✦ Medical technologies ✦ Metal & plastics processing (e.g.

automotive) ✦ Optical solutions for lasers ✦ Photovoltaic production ✦ Semiconductor production

20 Years of Expertise in Photonics

LIMO Lissotschenko Mikrooptik GmbHBookenburgweg 4-8D – 44319 DortmundPhone +49 (0)231 - 22241- 0Fax +49 (0)231 - 22241- 140Mail [email protected] www.limo.de

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Video-on-demand, HDTV, mobile com-munication, high-performance comput-ing – clients and service providers are driving an ever-growing demand of bandwidth for data transfer. The band-width of electronic communication is physically limited as a result of hamper-ing interference effects, in particular at highest frequencies (electromag-netic compatibility). Long-haul communication has now already been exploiting the optical domain with low-loss fi ber technology for decades while for short distances op-tics and photonics are just at the beginning to replace elec-tronic data communication. The reasons for this delay are the extremely challenging requirements and constraints for high-speed data transfer on shortest distances: low power consumption, scalabil-ity in speed and integration density, maturity level and cost effi ciency in manufactur-ing. Here, integrated photon-ics – and especially silicon nanophotonics – give the best solutions at hand.Integrated silicon nano-photonics is a technology based on processes used for CMOS electronics. Light guiding in the near infrared is achieved by different refractive indices of silicon and silica in the silicon-on-insulator (SOI) substrate and additional lateral structuring in the submicron scale. Typical

silicon waveguide cross-sections are in the range of 0.1µm² embedded in silica. This material system features strong light confi nement which enables very small bend radii of few microns and therefore ultra-compact devices and systems. Furthermore, one single waveguide can carry several different channels consist-ing of different wavelengths without

impeding each other. This opens the door to increase the aggregated optical bandwidth into the terabit-per-second1 range.For the time being data processing will persist in the electronics domain. As a consequence converters from the electronics to the optics and vice versa are requested. In silicon nanophotonics the former is performed by modulators succeeding a continuous laser source, the latter by optical detectors. Both are key components for enabling optical data transfer. Regarding achievable data rates electro-optical modulators in silicon photonics are superior to many other technologies which are restricted to inherent dynamics.AMO has strong experience in CMOS processes and operates its own facility. In ongoing research activities AMO adapts and develops adequate processes for the needs in photonics. This way, single components and small integrated nanophotonic systems have been demonstrated successfully. AMO as a SME offers this service for proto-typing and small-scale production to customers from ICT and sensor market which is unique in Europe.

1 Tb/s corresponds approx. to data of 25 DVDs transferred in 1 second.

Integrated Silicon Nanophotonics

IMG1 – SOI wafer handled in the clean room during photonic integrated circuit fabrication

IMG2 – micrograph of a free standing silicon waveguide and a photonic crystal membrane

AMO GmbHOtto-Blumenthal-Str. 25D – 52074 AachenPhone +49 (0)241 - 8867 - 200Fax +49 (0)241 - 8867 - 560Mail [email protected] www.amo.de

104


Die Micro-Hybrid Electronic GmbH entwickelt und produziert moderne elek-tronische und sensorische Komponenten und Systeme. Unsere Dienstleistung umfasst die Neu- und Weiterentwick-lung von Technologien, Verfahren und Komponenten der Mikrosystemtech-nik, Mikrooptik und Elektronik mit dem Kunden. Das Ziel eines jeden Entwick-lungsprozesses ist die Lösung einer Kundenaufgabe bzw. die Realisierung eines neuen Produkts. Der Kunde wird in jeden Schritt der Entwicklung integriert. Die Fertigung komplexer Systeme unter dem Dach der Micro-Hybrid bietet dem Kunden eine umfassende All-in-One-Lösung, alle das Projekt betreffenden Aufgaben werden von der Micro-Hybrid gelenkt und bearbeitet. Zusätzlich bietet das direkte Feedback aus der Produktion neue innovative Ansätze in der Entwick-lung. Durch die breite Palette anwen-

dungsbereiter Technologien sind wir in der Lage, innovative Komponenten und Baugruppen zu entwickeln und zu pro-duzieren. Dazu gehören beispielsweise autoklavierbare LEDs für die Medizintech-nik, Infrarotdetektoren für die Gasanalyse bis hin zur kompletten Gasmesszelle und Spezialbauelemente für optische Analy-sesysteme. So sind im Bereich der IR-Spektroskopie durch zahlreiche Erfahrun-gen auf dem Gebiet der Dünnfi lm- und der Aufbau- und Verbindungstechnologie MEMS basierter Chips, Fertigungs- und Prüfverfahren entstanden, die es ermögli-chen, Strahlungsquelle und Messwertauf-nehmer aus einer Hand zu liefern.Besonders hervorzuheben sind die elek-tronischen und sensorischen Baugrup-pen, die für Betriebstemperaturen bis zu 250°C geeignet sind. Kundenspezifi sche Produktvariationen sind durch die intensi-ve Zusammenarbeit zwischen Entwickler-

team und Kunden die Grundlage unseres sich stets erweiternden Infrarot-Portfolios.Zu den Kunden der Micro-Hybrid Electronic GmbH gehören bspw. Markt-führer aus den Bereichen Medizintechnik, Automotive, Messtechnik sowie Luft- und Raumfahrt. Die Micro-Hybrid Electronic GmbH ist nach ISO9001:2008 und TS16949:2009 zertifi ziert.

Innovative Technologien für optische Komponenten

Innovative Technologies for Optical Components

The Micro-Hybrid Electronic GmbH develops and manufactures modern electronic and sensory components and systems. Our service comprises new and further development of technolo-gies, processes and components of micro systems technology and electron-ics. Our development process aims the customer solution orientated, individu-ally designed product. The customer is integrated into every step of the devel-opment. Production of complex systems of Micro-Hybrid Electronic GmbH offers each customer an easy all-in-one solu-tion. All project tasks are controlled and processed by us. In addition, the direct

feedback from our production depart-ment offers new innovative approaches in development. By the wide range of our technologies we are able to develop and produce innovative components and systems. For instance LEDs appro-priate to autoclave for medical applica-tions, infrared detectors for gas monitor-ing or gas measuring cells and special components for analytical systems belong to our products. We developed a highly specialized skill set in Thin-fi lm technology, setup and interconnection of MEMS base which enables us to supply high quality IR-Emitter and detector from one source. Particularly interesting is our

ability to produce electronic and sensory components for operating temperatures up to 482°F. Customised variations of our detectors are the base for our permanent expanding IR-portfolio. Customers of Micro-Hybrid belong to market leaders in medicine, automotive, measurement systems and aerospace. Micro-Hybrid Electronic GmbH is ISO 9001:2008 and TS16949:2009 certifi ed.

Micro-Hybrid Electronic GmbHHeinrich-Hertz-Straße 8D – 07629 HermsdorfPhone +49 (0)36601 - 592 - 100Fax +49 (0)36601 - 592 - 110Mail [email protected] Web www.micro-hybrid.de

105


LPKF is an international specialist in micro material processing with laser sys-tems. With locations and distributors in 79 countries, 570 in-house employees and 24/7 service, LPKF offers techno-logical leadership, extensive technical knowledge and outstanding service quality.LPKF Laser & Electronics AG produces machines and laser systems used in electronics manufacturing, medical technology, the automotive industry and the manufacture of solar cells. After more than 15 years of intense work with laser systems, laser technology is as fascinating as ever. During this time, LPKF has achieved a leading position in the industry.The expertise in laser micro material processing, optics, laser, control and drive technology results in systems that enable especially economical production processes and new products.

The scope of products and services includes:

✦ Electronics development equipment ✦ Electronics production equipment ✦ Other production equipment

Examples of capabilities: ✦ The LPKF ProtoLaser U3 is the

world’s only UV laser system for structuring laminated printed circuit boards – with unrivaled precision even in the ultra-fi ne line range. This and the ability to process ceramic substrates, TCO coatings or LTCC structuring lead to new production forms.

✦ The systems of the LPKF Allegro se-ries structure thin fi lm solar cells on an industrial scale. LPKF laser tech-nology increases the effectiveness of this innovative solar technology.

✦ LPKF stencil lasers in the Gantry class are considered the most pro-ductive and precise systems on the market. They achieve high cutting quality without requiring extra time.

✦ With high-performance systems for patented laser direct structuring (LDS), LPKF paves the way for the mass production of three-dimension-al 3D-MID circuit boards. In addition, LPKF offers a process and systems for the prototyping of 3D circuit boards. The laser specialist benefi ts from ever more complex and com-

pact product layouts by upgrading already existing mechanical compo-nents with electronic functions.

✦ Specialists are developing new systems and processes for plastic welding. They produce the fi nest welds in a wide variety of material combinations. A completely new welding technology allows the safe and hygienic manufacturing of large bodies which must meet high quality and visual demands.

Excellent technical performance has earned LPKF a reputation for quality. A new development center in Garbsen, Germany promises further innovations in micro material laser processing.

LPKF Laser & Electronics AGOsteriede 7D – 30827 GarbsenPhone +49 (0)5131 - 7095 - 0Fax +49 (0)5131 - 7095 - 90Mail [email protected] Web www.lpkf.com

Producing with Light

106


Founded in 1984 as a supplier of electronic modules for active medical implants (pacemakers), Micro Systems Engineering GmbH located in Berg/Ba-varia is now as part of the MST group an important partner and specialist for the international electronics industry, provid-ing sophisticated solutions for advanced electronics at the highest quality level.

Today MSE is the European market leader for LTCC (Low Temperature Co-fi red Ceramic). LTCC is characterized by a multilayer structure of a combination of single ceramic tapes in a 3D design. LTCC technology offers a variety of benefi cial features such as:

✦ High density of interconnects and wiring, combined with low resistance and superior RF and Microwave properties due to metallization like Au, Ag, or AgPd and low dielectric losses

✦ Cavities and channels

✦ Embedded passive compo-nents (resistors, capacitors, and inductors)

✦ Robust and heat-proof structures (up to 400 °C)

✦ Hermetic pack-ages and heat sinks

✦ Very high reliability

In addition to the extensive know-how in the fi eld of ceramic multilayer substrates, MSE is also a leader in advanced packaging technology. The development and production capabilities of MSE for assembly, packaging, and test cover the full portfolio from design to the fi nished module. MSE has a broad range of ex-perience with processes like die attach, wire bonding, and fl ip-chip assembly. CSP and standard SMT processes using solder paste or adhesives as well as proprietary packaging technologies are important parts of our expertise.Key processes used in serial production at MSE include, but are not limited to:

✦ High precision die bonding (solder-ing, gluing, thermo compression)

✦ Wire bonding (ball-wedge and wedge-wedge) using all bonding wire materials available on the market

✦ Automated SMT processes on organic and ceramic board materials

including assembly of 01005 com-ponents

✦ Flip-Chip assembly of dies with sol-der bumps down to 30 µm diameter

✦ Chip protection (glob top, junc-tion coating, underfi ll, and hermetic packaging)

✦ BGA packaging including transfer molding and dicing

Beyond the know-how in advanced packaging technologies, MSE specializ-es in the subsequent integration of elec-tronic modules as well. Serial products include Systems in Package (SiP), complex micro systems, and devices that include high precision mechanical and optical assembly. In many cases these systems need - besides electrical interconnects - sensors for radiation, pressure, temperature, or acceleration.Supported by its own design service team, MSE transfers the customer design input and requirements to manufacturable and reliable products. Life tests and material analysis are conducive to highest reliability levels. In that way, MSE covers the full range from design over substrate manufacturing to advanced assembly and packaging under control of a strict quality manage-ment system. MSE has been certifi ed according to DIN EN ISO 9001 and EN ISO 13485.Over time, a huge variety of substrates, components, and modules has been successfully developed and manufac-tured. Based on a rich experience, MSE with its more than 230 highly skilled employees will continue to strengthen its position by working with demanding customers on challenging products.

Micro Systems Engineering GmbH –Partner and Specialist for Advanced Electronics

Pacemaker circuit on fl exHerzschrittmacherelektronik

auf Flex

107


Das Unternehmen Micro Systems Engineering GmbH in Berg/Oberfran-ken wurde im Jahr 1984 als Hersteller für a ktive medizinische Implantate (Herzschritt macher) gegründet. Seit mehr als 25 Jahren ist MSE Spezialist für kundenspezifi sche elektronische Bau-gruppen. Das Portfolio von MSE – Mitglied der MST-Gruppe – wurde auf die Bereiche Mehrlagenkeramik (LTCC) sowie auf modernste Aufbau- und Verbindungs-technik ausgedehnt.

Heute ist MSE im Bereich von LTCC (Low Temperature Co-fi red Ceramic) europäischer Kompetenz- und Markt-führer. LTCC ist eine Technologie, bei der das Substrat aus einzelnen kerami-schen Tapes aufgebaut, verpresst und gesintert wird.

Die LTCC-Technologie bietet unter anderem folgende Vorteile:

✦ Hohe Verdrahtungsdichte ✦ Exzellente HF- und Mikrowellen-

eigenschaften ✦ Realisierbarkeit von Kavitäten und

Kanälen ✦ Integrierte passive Komponenten ✦ Hohe Temperaturbeständigkeit ✦ Hermetizität ✦ Höchste Zuverlässigkeit

Neben der umfassenden Expertise im Bereich keramischer Verdrahtungs-träger ist MSE führend auf dem Gebiet modernster Aufbau- und Verbin-dungstechnik. Die Kernkompetenzen umfassen das vollständige Portfolio von der Chipmontage über das komplette Modul bis zu Zuverlässigkeitstests und werkstoffwissenschaftlichen Analysen.

Neben Prozessen wie Drahtbonden, Diebonden und Flip-Chip-Assembly sowie BGA-Packaging, CSP- und SMT-Montage kommen spezielle proprietäre Prozesse zum Einsatz.MSE besitzt auch in der Integration der gefertigten Komponenten fundiertes Know-how. Das Spektrum reicht von SiP (System in Package) über komplexe Mikrosysteme bis zu kompletten Geräten mit hochpräzisen mechanischen oder optischen Aufbauten. Häufi g erfordern diese Systeme neben elektrischen Verbindungen Sensoren für Strahlung,

Druck, Temperatur oder Beschleuni-gung.In der Designabteilung werden Design-vorgaben und spezielle Anforderungen der Kunden in herstellbare und hochzu-verlässige Produkte umgesetzt. MSE bietet mit seinen mehr als 230 hochqualifi zierten Mitarbeitern dem Kunden die gesamte Wertschöpfungs-kette vom Design über Substratferti-gung, Aufbau- und Verbindungstechnik

und Zuverlässigkeitstests unter Kontrolle eines strikten Qualitätsmanagement-systems. MSE ist nach DIN EN ISO 9001 und EN ISO 13485 zertifi ziert.Im Laufe der Zeit wurde eine Viel-zahl von Substraten, Komponenten und Geräten mit unterschiedlichen Integrationsniveaus erfolgreich bei MSE entwickelt und gefertigt. Basie-rend auf diesen reichen Erfahrungen wird das Unternehmen auch in Zukunft seine Position als Spezialist für an-spruchsvolle elektronische Produkte weiter ausbauen.

Micro Systems Engineering GmbHSchlegelweg 17D – 95180 Berg/Ofr.Phone +49 (0)9293 - 78 - 0Fax +49 (0)9293 - 78 - 41Mail [email protected] www.mst.com/msegmbh

LTCC moduleLTCC-Modul

Lotbump LTCC

108


Flexible Microsystem Assembly with 6 Variances in Nano Range

Rohwedder Micro Assembly GmbH expands their applications portfolio of MicRohCell® compact, which has already been successful for a number of years in the marketplace.The newly developed micro manipula-tor Commander6, specially designed and suitable for ultra precise six-axle adjustment for optic or laser fi ttings, expands and enhances the range of the MicRohCell® compact.

The MicRohCell® compact sets itself apart through its high level of fl exibil-ity. It is equipped with a highly precise xyz-granite axle system that can be expanded with a second z-axle, an innovative image analysis concept and a self contained control system. The basic machine is extended and/or adapted with an accordingly equipped modular exchangeable MicRohFlex® assembly plate, depending on the specifi c application and customer request.

The MicRohFlex® interchangeable assembly plates, which can be ex-changed within just a few minutes, allow diverse modules like the Micro Jet, Torque test, or Resistance welding modules to be quickly installed, which permits various levels of applications to be executed.

Highest precision and resolution:The top precision of the original ma-chine, which easily offers process-stable equipment and problem-free accu-racy of <2 µm in its 3 main axes, has been improved with the Commander6. It can carry out micro adjustments from <0,05 µm and has an extremely high exactness of repetition of up to <0,15 µm. The Commander6 micro manipulator was developed particularly for automat-ed adjustment with the highest precision and movement resolution in six vari-ances. Translational increments within

the double-digit nanometer range and angular steps of just a few micro de-grees make it possible to automate work on precise assembly and adjustments within the optics and micro optics. Application instances of the MicRohCell® compact can be found, among oth-ers, during the assembly of mechanical clock movements or the manufacturing of miniaturized solar cells. Through the expansion of the Commander6, its use during the assembly of beam-shaping and collimation optics and the adjust-ment of laser resonators is now pos-sible. The Commander6 can also be used for lens assembly and many other applications.

Rohwedder Micro Assembly GmbHRohwedder Micro Assembly is one of the leading systems solutions and standard products providers in the micro assembly engineering fi eld. Rohwed-der automation systems solutions are used chiefl y in the automotive supplier, telecommunications, electronics and medical equipment industries.

Rohwedder Micro Assembly GmbHRené FathOpelstr. 168789 St. Leon-RotPhone +49 (0)6227 - 3412 - 317Fax +49 (0)6227 - 3412 - 995Mail [email protected] www.rohwedder.de

Fig.1: MicRohCell® compact with easy tosetup MicRohFlex® assembly plate

Fig.2: The all new Commander6Micromanipulator

109


SENTECH develops, manufactures and sells advanced quality instrumentation for Plasma Process Technology espe-cially ICP based deposition and etching systems in MEMS and Nanostructuring and Thin Film Metrology Tools using spectroscopic ellipsometry.The SENTECH ICP Etcher represent the leading edge for inductive coupled plasma (ICP) processing in research and production. It is based on the SENTECH proprietary PTSA (planar triple spiral an-tenna) plasma source, on the dynamic temperature controlled substrate elec-trode and advanced SENTECH control software in combination with real time remote fi eld bus technology and a very user-friendly general user interface (GUI) for operating the SI 500 under produc-tion environment.

ICP plasma source PTSA 200The homogeneous, high density plasma of the PTSA (planar triple spiral antenna) source is characterized by high ion density, low ion energy and a small mono energetic energy distribu-tion. It features high coupling effi ciency and very good ignition behavior for

processing of a large variety of mate-rials and structures. The low ion energy provides low damage surfaces and the high density plasma has ideal properties in deep structuring of silicon or quartz as needed in microsystems manufactur-ing.

Dynamic temperature controlSubstrate temperature setting and stability during etch processing are demanding criteria for high quality etching. The substrate electrode with dynamic temperature control in com-bination with He backside cooling and substrate backside temperature sensing provides excellent process conditions over a wide temperature range from -150°C to + 400°C.

Examples of applications: ✦ High rate etching of silicon for MEMS with high aspect ratio is easily performed either using room temperature alternating processes or cryogenic processes for smooth side walls.

✦ Etching of quartz and glass for binary micro optics or lenses.

✦ Etching of holographic gratings for space application.

✦ Low damage etching for nano-structuring due to the low ion energy and small energy distribution.

The world wide user group of SENTECH Plasma Process Technology equipment is supported by the SENTECH appli-cations laboratory in Berlin-Adlershof, by our world wide operating service organization and by a world wide system of sales partners.

Advanced ICP Plasma Etch and Deposition Systems in Microsystems Technology for Structuring

of Silicon, Quartz and Glass

Spectroscopic Transmission Grating for the Gaia gratingSource: IAP FSU Jena, Fraunhofer IOF Jena

Microstructure in Si

SENTECH Instruments GmbHSchwarzschildstraße 2D – 12489 Berlin-AdlershofPhone +49 (0)30 - 6392 - 5520Fax +49 (0)30 - 6392 - 5522Mail [email protected] www.sentech.de

SENTECH Gesellschaft für Sensortechnik mbHKonrad-Zuse-Bogen 13D – 82152 KraillingPhone +49 (0)89 - 8979607- 0Fax +49 (0)89 - 8979607- 22Mail [email protected] www.sentech-sales.de

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3D Laser Lithography in Biotechnology and Medical Technology

Nanoscribe GmbH, located in Eggen-stein-Leopoldshafen near Karlsruhe, Germany, has developed a laser lithog-raphy system that can be used to realize complex three-dimensional structures (3D) in a fully automatic and reproducible way with a previously unavailable design fl exibility on submicrometer scales with structure sizes up to 1 mm. Today, this already benefi ts numerous applications, e.g. microstructures can be created via “laser writing” for small pumps and needles or surfaces can be equipped with particular biomimetic character-istics. Other areas of application for 3D laser lithography are the creation of three-dimensional structures for cell biology, the manufacturing of micro-optic components, photonic crystals and metamaterials or the rapid prototyping of micro- and nanostructures, for example fl uid channels.

“Writing” with a Laser PenThe fabrication of structures is a result of strongly focusing ultrashort laser pulses into the photosensitive and biologi-cally compatible polymer, the polymer is exposed to light in the focus through

a nonlinear process. Comparable to a pen, the laser beam writes on the material along any desired paths. Line widths from several micrometers down to 150 nm are achieved in this way. During the writing process, the laser and focus remain fi xed and the workpiece has to be moved according to the three-dimensional writing task. The path is just as important as the target here, and the application therefore also requires a precise path control.

Precise Positioning of the Laser FocusOne of the key components of the laser lithography device is the system used for sample positioning, a system from PI (Physik Instrumente) com-pany, Karlsruhe, Germany. PI offers the world’s largest selection of high-dynamics and high-resolution piezo nanopositioning systems for scientifi c and industrial applications. The multi-axis stage P-563 is set on a usual microscope XY scanner stage, which allows a writing and positioning range of the piezo writing volume on an area of up to 100 x 100 mm². It works with travel ranges up to 300 x 300 x 300 µm³,

whereby the repeatability is in the nano-meter range. Piezo actuators are the driving force behind this nanopositioning system and provide the nanometer resolution and several-kilohertz dynamics. Integrated highly linear capacitive sensors make for the precise direct value acquisition that is necessary to move the sample precisely and repeatably in relation to the laser focus. The construction of the stage as a parallel kinematics multi-axis system makes it possible to achieve an identical dynamic behavior for all motion axes and also benefi ts path accuracy and reproducibility. This is especially ad-vantageous in 3D lithography since the objects can have any type of structure. A “slower” axis would have an adverse effect here.

High-Precision, Piezo-Based Nanopositioning Systems Advance Technology:

Physik Instrumente (PI) GmbH & Co. KGAuf der Roemerstrasse 1D – 76228 KarlsruhePhone +49 (0)721 - 48 46 - 0Fax +49 (0)721 - 48 46 - 1019Mail [email protected] www.pi.ws

Areas of application for three-dimen-sional »laser writing« also include e.g. the rapid prototyping of microstruc-tures: Brandenburg Gate (photo: Nanoscribe).

New laser lithography system of Nanoscribe GmbH, which can be used to produce complex three-di-mensional micro- and nanostructures in photosensitive materials for the fi rst time. The structure data can be cre-ated with conventional CAD software. (photo: Nanoscribe)

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The characterization of the dynamics of micro-devices like MEMS becomes more and more important for develop-ment departments as well as for routine measurements on wafer level. Laser Doppler Vibrometry as a non-contact optical measurement technique has been established as an essential tool for such measurements, because the complete frequency spectrum is ob-tained reaction-free and phase-resolved within real time. Thus periodic motions as well as transients or relaxations can be investigated in an easy way. Until recently the frequency bandwidth was limited to about 30 MHz and the vibration velocity to 10 m/s which meets requirements of typical MEMS applications as pressure sensors, electrostatic actuators or micro mir-rors. However, a growing number of RF-devices operate at higher frequen-cies whereas high energy ultrasonic transducers show velocities signifi -cantly above 10 m/s. These demanding application areas are now addressed by Polytec’s UHF-120 Ultra High Frequency

Vibrometer. The innovative vibrometer design pushes the boundaries of mea-surement technology to its “hard” limits set by physics. Based on a heterodyne interferometer setup, the shot-noise limited detector signal and sophisticated digital decoder technology make for the analysis of vibration spectra with picometer resolu-tion and below for broad bandwidth measurements. In addition, full-fi eld measurements are possible with the UHF-120-SV Ultra High Frequency Scanning Vibrometer

which is a scanning system for analysis of defl ection shapes of microsystems. As a typical example fi g. 2 visualizes the surface motion of an SAW fi lter with broadband exci-tation in the 260 MHz range. Vibration ampli-tudes are below 5 pm in this measurement. The UHF-120 is designed for optional

integration into a probe-station for semi-automated or fully automated testing of MEMS on wafer level. Special long-distance objectives are available for measurements on a vacuum prober where the glass of the prober is being compensated by the objective design. The innovative solution opens com-pletely new possibilities for the devel-opment and testing of high frequency devices: So leakages in SAW fi lters were detected and the performance of objec-tives for ultrasound microscopes could be improved signifi cantly; other typical applications for the UHF-120 Ultra High Frequency Vibrometer include ultrasonic material testing and the investigation of the dynamics of small HF cantilevers.

Analyzing Ultra-high Frequency Mechanical Motion of MEMS

Fig.2: Frequency spectrum and defl ection shape of a broadband excited SAW fi lter

Polytec GmbHElmar UhlitzschPolytec-Platz 1-7D – 76337 WaldbronnPhone +49 (0)7234 - 604 - 0Mail [email protected] Web http://www.polytec.com/mems

Fig.1: The UHF-120 Ultra High Fre-quency Scanning Vibrometer from Polytec The system is designed for high accuracy measurements of devices with frequencies starting from about 1 kHz up to 1.2 GHz and velocities up to 150 m/s. The small laser spot-size of below 1 µm translates directly into a high lateral resolution, which is essential for the accurate characterization of devices with acoustical wave-lengths of only a few micrometers or the motions of tiny specimen.

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In medical technology highly stringent requirements are imposed on the quality of products and components. Aspects like functional reliability, lifetime and biocompatibility, in addition to require-ments relating to material and design, play an important role. In many cases, the surface quality of a product is the decisive factor for therapeutic effective-ness and commercial success. The 3D optical metrology systems of NanoFo-cus AG from Oberhausen, Germany, are the ideal tool for surface inspection and quality assurance in medical technology.

For a wide spectrum of measuring tasks in medical technology, NanoFocus offers high-precision measurement solutions for laboratory and production environ-ments. The company offers three lines of optical 3D measurement systems: the μsurf 3D metrology systems, the μscan 2D/3D profi lometers and the μsprint 3D in-line sensors – all based on the confocal principle. One of the main

advantages of the confocal technol-ogy in comparison to other metrology methods applied in medical technol-ogy, such as SEM, tactile systems, and even other optical techniques, is its speed. NanoFocus technologies enable non-destructive analyses of nearly all materials without requiring any previous sample preparation or leveling. Even with diffi cult sample surface geometries, such as steep edges, these systems deliver exact and repeatable 3D measurements in just a few seconds.

ImplantsManufacturers give the surfaces of prostheses and implants special treat-ments in order to optimize the healing process, the biological acceptance, and the cellular growth. For example, dental implants must have a certain roughness to achieve optimal attachment to the jawbone. For this purpose, methods such as abrasive blasting and etching are used to produce textures extend-

ing to the nanometer range. In other implants, such as artifi cial hip joints, the ball-socket surfaces must be precisely polished for implant functionality; a process in which duration and pressure are decisive factors. Excessive surface roughness or the formation of carbides may arise during the polishing process. These defects can lead to reduced implant lifetime or infl ammations in the patient’s body. The measuring systems in the µsurf product-line are ideally suited to mea-sure roughness and surface defects areally. The inspection systems enable roughness measurements in accor-dance with DIN EN ISO norms, analyses of 3D structures, layer thickness, and geometry measurements beyond the sub-micrometer level. Data is delivered as Cartesian coordinates (x,y,z), which translates to real 3D data. The µsurf technology is based on the patented multi-pinhole-disc. An image from a con-ventional optical microscope contains sharp and blurred detail. In contrast, with a confocal image, the blurred detail, which is out of focus, is fi ltered out by the operation of the multi-pinhole disc. This results in resolutions in the nano-meter range.

Microfl uidic systemsMicrofl uidic systems are a further example of measuring tasks in medi-cal technology. These components are employed in lab-on-a-chip applications that are increasingly used for analyses. In extremely small spaces, a micro fl uidic system transports, mixes and separates liquids such as blood, electrolytes, and gasses. The micro structure of the

Optical 3D metrology systems enable optimal quality assurance of surfaces in medical technology

Reliable Surface Inspection

3D measure-ment of screw thread of a dental implant

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surface is critical in providing an opti-mum transporting of cells, gasses and liquids at precise fl ow rates. To reliably judge the quality of the injection-molded parts, the valves and channels must be inspected with regard to their cross-sec-tional area, height, width, and volume, as well as surface roughness, which all contribute to the device's overall fl uid dynamic function.A μscan 3D scanning profi lometer is often the chosen solution. These measurement systems capture relatively large surfaces because of their ability to scan quickly and offer high resolu-

tion data. The confocal point and line sensors capture the topography in a line pattern. Various sensors are available with a particularly high vertical resolution of a few nanometers and a vertical mea-suring range of more than 1 millimeter.

StentsStents are micro-patterned medical devices used to open narrowed blood vessels. The small, often metallic scaf-folds are usually laser cut from a small stainless steel tube. In addition, stents are frequently covered with a bioac-tive coating in order to increase medi-

cal tolerance. Sharp edges or surface defects could damage the arteries and lead to life-threatening embolisms or blood clots. NanoFocus’ µsprint technology is employed by leading stent manufactur-ers for quality assurance and production control. Since confocal technologies are inherently not infl uenced by refl ections, the inside and the outside of the stent can easily be measured simultaneously by µsprint sensors. Structural defects, cracks, and the profi le geometry, can be determined in the nanometer range. Furthermore, with more than one million measurements per second, μsprint is the fastest confocal sensor worldwide. The ultra-fast, highly accurate scan-ning of surfaces is made possible by the combination of a laser with up to 128 channels and a vertically oscillating tuning fork.

Applying NanoFocus technology in research and production of medical de-vices results in reliable quality assurance and shorter development phases. Most importantly, however, high-precision surface analysis of medical devices supports the development of better products that improve the life quality of patients.

Extract of a measurement report for a microfl uidic device

Height and intensity data of stent measure-ment

NanoFocus AGClaudia DeltoTechnical editorLindnerstraße 98D – 46149 OberhausenPhone +49 (0)208 - 62 000 - 0Fax +49 (0)208 - 62 000 - 99Mail [email protected] www.nanofocus.de

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Uwe Adamczak, Jonina Banach

Non-destructive testing using X-rays is among the oldest known methods of inspection that leave inspected items intact. The X-ray radiation penetrates these objects and is absorbed to differ-ent degrees by materials displaying dif-ferent thicknesses. The well-known 2D radiographic images arise as a result. In the case of computed tomography, the inspection item is rotated during beam projection and a 3D model of the inspection item is computed on the ba-sis of the 2D radiographic images. This so-called scanning is completed in the course of a few minutes using modern Y.QuickScan® technology. All informa-tion pertaining to volume can be viewed, assessed, edited and processed with the help of a software program. Slices can be looked at within the software, the same way this is made possible using microsections, or the volume can be observed in its entirety. Information about the whole scanned area can be viewed through this type of inspection. However, when microsection images are prepared the sample is unable to be used afterward. Y.QuickScan® technol-

ogy delivers comparable results without destroying the sample. This enables further analyses to be conducted, for example the infl uences of aging on a sample.

As a result of FeinFocus X-ray technol-ogy, radiation sources can be produced that have a focal spot smaller than one micron. This X-ray technology together with Y.QuickScan® technology supplies a detail detectability within volumes only a few micrometers large, thus making it the ideal inspection technology for assuring quality in microsystems during production. During development this technology is a fast method for making internal structures visible and for re-searching the potential causes of fl aws.The YXLON X-ray systems Y.Cheetah and Y.Cougar from the FeinFocus product family are able to create 2D radiographic images of inspection items as well as 3D models. They include FeinFocus X-ray technology, and can include Y.QuickScan® technology on an optional basis. These unit systems are deployed in the electronics industry for

quality assurance, process control and rapid inspection in R&D.

X-ray images and 3D models of con-ventional commercial components were created in order to demonstrate the performance capability of these unit sys-tems. The two-dimensional radiographic image of a conventional headphone is shown in Figure 1. Plastics displaying various thicknesses are identifi able in the image. Figure 2 shows the volumetric model of an acceleration sensor. The structures on the semiconductor have been colored green. The 3D image of a conventional ultrasonic sensor with opened wire-mesh grid is shown in Figure 3. The view of this sensor from above without wire-mesh grid is shown in Figure 4.

Advantages and Possibilities of X-ray Technology in inspecting Microsystems

YXLON International GmbHEssener Bogen 15D – 22419 HamburgPhone +49 (0)40 - 52729 - 101Fax +49 (0)40 - 52729 - 170Mail [email protected] www.yxlon.com

Fig.1: Headphone Fig.2: Acceleration Sensor 3D

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Die zerstörungsfreie Prüfung mit Röntgenstrahlung zählt zu den ältesten bekannten zerstörungsfreien Prüfverfah-ren. Die Röntgenstrahlung durchdringt die Objekte und wird von Materialien unterschiedlicher Dicke unterschiedlich stark absorbiert. Dadurch entstehen die bekannten 2D-Röntgenbilder. Bei der Computertomographie wird das Prüfteil im Strahlengang gedreht und aus den 2D-Röntgenbildern wird ein 3D-Modell des Prüfteils berechnet. Dieser Scanvor-gang ist durch moderne Y.QuickScan®-Technologie in wenigen Minuten erledigt. Alle Informationen des Volumens können mit Hilfe einer Software ange-sehen, beurteilt und bearbeitet werden. Innerhalb der Software können Schnitte betrachtet werden, wie es bei Schliff-bildern möglich ist oder das Volumen im Ganzen kann betrachtet werden. Durch diese Art der Inspektion kön-nen Informationen über den gesamten gescannten Bereich angesehen werden.

Durch das Anfertigen von Schliffbildern ist die Probe hinterher unbrauchbar. Die Y.QuickScan®-Technologie liefert vergleichbare Ergebnisse ohne die Pro-be zu zerstören. Dadurch können z.B. Alterungseinfl üsse einer Probe analysiert werden.Durch FeinFocus-Röntgentechnologie sind Strahlenquellen realisierbar, die ei nen Brennfl eck kleiner als einen Mikro-meter haben. Diese Röntgentechnologie mit der Y.QuickScan®-Technologie lie fert eine Detailerkennbarkeit im Volumen von wenigen Mikrometern und ist damit die ideale Prüftechnik, um die Qualität bei Mikrosystemen in der Produktion sicher-zustellen. In der Entwicklung ist diese Technologie eine schnelle Methode in-terne Strukturen sichtbar zu machen und mögliche Fehlerursachen zu erforschen.

Die YXLON Röntgensysteme Y.Cougar und Y.Cheetah der FeinFocus-Produkt-familie sind in der Lage 2D-Röntgenbil-

der und 3D-Modelle von Prüfteilen zu erstellen. Sie enthalten die FeinFocus-Röntgentechnologie sowie optional Y.QuickScan®-Technologie. Diese Geräte werden in der Elektronikindustrie zur Qualitätssicherung, Prozesskontrolle und schnellen Inspektion innerhalb der Entwicklung eingesetzt.

Um die Leistungsfähigkeit dieser Geräte zu demonstrieren, wurden von handels-üblichen Bauteilen Röntgenaufnahmen und 3D-Modelle erstellt. Das zweidimensionale Röntgenbild eines handelsüblichen Kopfhörers zeigt Bild 1. Im Bild sind Kunststoffe unterschied-licher Dichte erkennbar. Bild 2 zeigt das Volumenmodell eines Beschleuni-gungssensors. Die Strukturen auf dem Halbleiter wurden grün eingefärbt. Bild 3 zeigt das 3D-Bild eines handelsüblichen Ultraschallsensors mit aufgeklapptem Drahtgitter. Die Draufsicht dieses Sen-sors ohne Drahtgitter zeigt Bild 4.

Die Vorteile und Möglichkeiten der Röntgentechnik bei der Prüfung von Mikrosystemen

Fig.4: Ultrasonic Sensor 3d (view from above)Fig.3: Ultrasonic Sensor 3D (with open grid)

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Diamond like carbon thin fi lms are well established for various applications such as wear protection layers. The electri-cal properties of these fi lms have been investigated intensively in recent years. The conductivity of these fi lms can be adjusted over a huge range by adding a metallic component to the partly amor-phous carbon matrix. Metal containing diamond like carbon thin fi lms show piezoresistive properties and an adjust-able temperature coeffi cient of resistance (TCR), thus opening new applications in the fi eld of strain gauge sensors.

A functional layer named Ni:a-C:H was developed in collaboration of Siegert-TFT and the University of Applied Sciences (HTW Saarbrücken, Prof. Dr. G. Schultes, Institute of Mechatronics and Sensor Technology). These thin fi lms show a high strain sensitivity (gauge factor up to 30) in combination with an adjustable temperature coeffi cient. TCR values of approximately 0 ± 25 ppm/K can be achieved by variation of the fi lm composition. Based on the increased sensitivity the important pressure range of below 10 bar is opened up for steel

membrane pressure sen-sors without the need of a sophisticated technical effort.A fi rst series of pressure sensors with Ni:a-C:H functional layers were realized in order to dem-onstrate the high potential of this material (Fig. 1). The enlarged sensitiv-ity of the fi lm leads to a complex re-development of the microsystem “pressure sensor” in order to take advantage of the high linearity, low hysteresis, high overload protection and stability. Due to the high sensitivity, it is possible to produce sensors with signifi cantly increased stability values in the overload region. Using the same output voltage range as usual with NiCr sensors, the overload capability of the

sensors with the new functional layer is about twenty times the characteristic value of NiCr sensors. On the other hand, the low pressure range is opened up since the membrane needs to be deformed only one tenth of its usual value. Because of this low stress the load cycle stability increases accord-ingly.Another feature of the Ni:a-C:H func-tional layer is the dependence of the electrical resistance on hydrostatic pres-sure. Initial tests showed a decrease in resistance of 1% to 2% per 1000 bar (see Fig. 2). This property enables the production of membrane-free pressure sensors for the high pressure range. Thus, in a recent project, pressure sen-sors for hydraulic systems up to 25 kbar were designed for the application e.g. in radial expansion systems for injec-tion systems. These very high pressure sensors were realized by using high strength ceramics as a carrier for the functional layers in form of a connected through plug. The results of our investigations dem-onstrate the high potential of the new Ni:a-C:H functional layer for both the low and very high pressure range.


A Highly Sensitive Functional Layer Based on Nickel Containing Diamond Like Carbon (Ni:a-C:H) Thin Film for very High Pressure Sensors

Siegert Thinfi lm Technology GmbHRobert-Friese-Straße 3D – 07629 HermsdorfPhone +49 (0)36601 - 858 - 63Fax +49 (0)36601 - 858 - 11Mail [email protected] http://www.siegert-tft.de

Fig. 1: Comparison of the output voltage of Ni:a-C:H-pressure sensors and a NiCr reference sensor, produced on similar steel membranes.

Fig. 2: Change in resistance of a Ni:a-C:H layer vs. hydrostatic pressure between 0 bar and 3500 bar.

Networks between Research and Industry

Netzwerke zwischen Forschung und Industrie

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Micro electric mechanical systems (MEMS) are intelligent miniature products combining materials, components and functions. They are used for process-ing data and are also connected to their natural environment through sensors and actuators. Germany has a leading position in the MEMS world market. Control and automation requirements of industrial and automotive customers are steadily increasing and the intensifi ed use of MEMS in medical technology will further foster this development. MEMS contribute signifi cantly to the competitiveness of the German industry and enable and secure future-oriented jobs in Germany. The MEMS companies within the ZVEI - German Electrical and Electronic Manufacturers Association confi rm the positive outlook. The group of com-panies represents leading automotive suppliers, semiconductor manufactur-ers, MEMS suppliers and small and medium sized companies.

The group activities of the ZVEI mem-bership focus on the development of basic technologies and tools represent-

ing key drivers for innovation. The aim of these activities is to further strengthen microsystem technology in Germany and to facilitate a sustainable growth of this young technology by partnering in the pre-competitive phase.The ZVEI - Electronic Compo-nents and Systems Association hosts an own industry group for MEMS technology which is an ideal platform for the represen-tatives of the branch to share experience and to be kept up to date with the latest develop-ments. Furthermore the group develops position papers in order to advise involved deci-sion makers about the position of the industry. The effi ciency of the ZVEI in this respect is indeed a valuable asset. The partner organisations AMA Association for Sensor Technology and IVAM Microtechnology Network further strengthen the cooperation of all companies related to MEMS.

Furthermore, this makes it possible to transport nationally generated content in a larger, international context through the pro-active input of our member-ship on European level.The many success stories underline the strong activities of the association for and together with the member companies and show the great impor-tance of the association for the industry.

ZVEI - German Electrical and Electronic Manufacturers´Association

Source: Infi neon Technologies AG Source: First Sensor Technology GmbH

119


ZVEI - Zentralverband Elektrotechnik- und Elektronikindustrie e.V.

Die Mikrosystemtechnik verknüpft Materialien, Komponenten und Funktionen zu intelligenten miniaturisierten Gesamt-systemen. Diese dienen der Informations-verarbeitung und sind zudem über Sensoren und Aktoren mit der natürlichen Umgebung verbunden.Deutschland hat im Bereich der Mikro-systeme eine führende Position auf dem Weltmarkt. Der zunehmende Rege-lungs- und Automatisierungsbedarf der Industrie- und der Automobiltechnik so-wie der vermehrte Einsatz von Mikrosys-temen in der Medizintechnik wird diese Stellung weiter fördern.

Die Mikrosystemtechnik leistet somit ei-nen wichtigen Beitrag zur Wettbewerbs-fähigkeit der deutschen Industrie und ermöglicht die Schaffung und Sicherung zukunftsorientierter Arbeitsplätze in Deutschland.Dieses positive Bild bestätigen die im ZVEI - Zentralverband Elektrotechnik- und Elektronikindustrie e. V. organisier-ten Mikrosystemtechnikunternehmen. Hierzu gehören neben großen Kfz- Zulieferern und Halbleiterunternehmen auch industrielle Mikrosystemtechnik-Anbieter bis hin zu hoch spezialisierten

Klein- und Mittelstandsunternehmen (KMU). Im Vordergrund des Verbandsenga-gements steht das Ziel, die Basistech-nologien und Werkzeuge gemeinsam weiterzuent wickeln sowie Innovation zu unterstützen. Ziel ist es, eine weitere Stärkung der Mikrosystemtechnik in Deutschland und das langfristige Wachstum dieser noch jungen Technik im vorwettbewerblichen Umfeld partner-schaftlich zu fördern.Der ZVEI bietet hierzu mit der Fachgrup-pe Mikrosystemtechnik im Fachverband Electronic Components and Systems eine geeignete Plattform, die den Vertretern der Branche einen intensiven Erfahrungsaustausch ermöglicht. Hier werden Positionspapiere erarbeitet,

die wirkungsvoll bei politischen Entschei-dungsträgern platziert werden. Hierbei konnte sich der ZVEI als Vertreter der Branche bewähren. Durch die Partner „AMA Fachverband für Sensorik e.V.“ und „IVAM e.V. Fachverband für Mikro-technik“ wird die Zusammenarbeit aller in Deutschland an der Mikrosystemtech-nik interessierten Unternehmen weiter gestärkt.

Darüber hinaus können national erarbei-tete Verbandsthemen auch im interna-tionalen Kontext durch die Aktivität der Mitgliedsfi rmen auf europäischer Ebene verfolgt werden.Die Erfolge engagierter Verbandsar-beit, welche zusammen mit und für die Mitgliedsunternehmen erzielt wurden, zeigen die Attraktivität der Verbandsakti-vität für die Industrie.

ZVEI - Zentralverband Elektrotechnik- und Elektronikindustrie e.V. Fachverband Electronic Components and Systems Christoph Stoppok, Geschäftsführer Lyoner Straße 9 D – 60528 Frankfurt am Main Phone +49 (0)69 - 6302 - 276 Fax +49 (0)69 - 6302 - 407 Mail [email protected] Web www.zvei.orgSource: Sensitec GmbH Source: NXP Semiconductors Germany GmbH

Source: HARTING AG

120

VDMA – The German Engineering Federation

The modern world is expanded by micro technologies which pave the way to new-hence unknown-realms of feasibility. Altogether new applications of existing products become possible in the capital goods, pharmaceutical, life science and automotive and electrical industries, to name only a few.

Yet, the wide-ranging usage of these components and subsystems in the different fi elds of the engineering sector, and this is true for many others technol-ogy sectors are growing.The German Engineering Federation (VDMA) represents more then 3000 companies most of them small and me-dium sized companies. These compa-nies employed 923.000 people (2011, August) in Germany and generated a turnover about 173 billions € (2010). The German machinery industries employ-ees the most people and are one of the leading industry branches in Germany.

The activities of the VDMA Micro Tech-nology members focus on marketing and innovation. The aim of these activi-

ties is to further strengthen and develop and support the micro technologies. The member companies analyse markets of specifi c importance, tap them jointly and use the VDMA network as a forum for a mutually benefi cial dialogue between the players of the industry.

Next to the dialog as partners with other industry sectors stands the dialog with new scientifi c areas and the science community. The aim of all these activities and meetings of experts from the indus-try is to further support and strengthen the growth of micro technologies and to facilitate sustainable growth by partner-ing in the pre-competitive phase.

Micro technologies are character-ized by innovations. The VDMA Micro Technology is supporting research in the pre-competitive phase and fostering cooperation between research institutes and member companies.

The member companies’ activities extend to the various micro product markets and the specifi c markets for

micro production engineering. The VDMA Micro Technology is promoting the potentials and the opportunities of these young micro technologies in the public and towards politicians. Without micro and microsystems technologies fundamental questions and challenges of our future cannot be solved.

Furthermore the nationally generated content of VDMA Micro Technology can be transfered via the VDMA network on the European level. The European and international activities of our member companies are supported by VDMA offi ces located for example in Japan, China, India and Russia.


VDMA Micro TechnologyKlaus ZimmerLyoner Str. 18D-60528 FrankfurtPhone +49 (0)69 - 6603 - 1315Fax +49 (0)69 - 6603 - 2315Mail [email protected] vdma.org/microtechology

Source/Quelle: Wittmann Battenfeld GmbHMicro injection moulding Mikrospritzgießen

Source/Quelle: Wittmann Battenfeld GmbH Micro injection moulded part Mikrospritzgußteil

Source/Quelle: HNP Mikrosysteme GmbH Roadshow Microfl uidic

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Die moderne Welt ist durch die Mikrotech-niken und die Mikrosystemtechnik, die unsere bisherigen Grenzen des Machbar-en durchbrochen haben, größer geworden. Das ermöglichst völlig neue Anwendun-gen in zahlreichen Industriebranchen: Maschinen- und Anlagenbau, Chemie, Pharmazie, Life-Science-Industrien, Auto-mobil, Elektrotechnik, Elektronik, um nur einige zu nennen.

Die breitgefächerte Nutzung der Mi-krotechniken in vielen verschiedenen Technologiefeldern der Investitionsgü-terindustrie hat an Fahrt und Gewicht zugenommen. Der Verband Deutscher Maschinen- und Anlagenbau (VDMA) vertritt über 3.000 Unternehmen des mittelständisch ge-prägten Maschinen- und Anlagenbaus. Mit aktuell rund 923.000 Beschäftigten (August 2011) im Inland und einem Umsatz von ca. 173 Milliarden Euro (2010) ist die Branche größter industriel-ler Arbeitgeber und einer der führenden deutschen Industriezweige insgesamt.Sowohl der VDMA, als auch die im Fachverband VDMA Micro Technology

organisierten Unternehmen der Mikro-technik-Industrien sind vom enormen Potenzial der Mikrotechniken und der Mikrosystemtechnik überzeugt.

Im Mittelpunkt des Verbandsengage-ments der Mitglieder des VDMA Micro Technology stehen die Themen Mar-keting und Innovationen, die es gilt, gemeinsam weiterzuentwickeln und zu unterstützen. Daraus entstehen Aktivitä-ten, um gezielte Märkte zu analysieren, gemeinsam zu erschließen und das Netzwerk VDMA im Sinne eines sich gegenseitig befruchtenden Branchendi-alogs zu nutzen.

Neben dem partnerschaftlichen Ge-spräch mit anderen Industriebranchen steht der Dialog mit neuen Wissensge-bieten und den Wissenschaften. Ziel der Fachgespräche zu ganz konkreten Fragestellungen ist es, das langfristige Wachstum der Mikrotechnologien im vorwettbewerblichen Umfeld zu fördern und zu stärken.Mikrotechniken sind ein durch Innova-tionen geprägtes Thema. Der VDMA

Micro Technology setzt sich dafür ein, Forschung im vorwettbewerblichen Umfeld zu fördern und Kooperationen mit entsprechenden Forschungsstellen zu pfl egen.

Die Mitgliedsunternehmen sind in den vielfältigen Märkten für die Mikrokompo-nenten und den speziellen Märkten für Mikroproduktionsanlagen und -maschi-nen tätig. Für den VDMA Micro Tech-nology gilt es, diese Potenziale immer wieder in das öffentliche Bewusstsein und die Politik zu bringen, da ohne die Mikrotechniken und die Mikrosys-temtechnik grundlegende Fragen und Problem unser aller Zukunft nicht gelöst werden können.

Darüber hinaus werden national erarbei-tete Themen des VDMA Micro Techno-logy im Rahmen des VDMA Netzwerks auf die europäische Ebene zur Sprache gebracht und die europäischen wie internationalen Aktivitäten der Mitglieds-unternehmen durch eigene Büros des VDMA unter anderem in Japan, China, Indien und Russland unterstützt.

VDMA – Verband DeutscherMaschinen- und Anlagenbau e.V.

Source/Quelle: HNP Mikrosysteme GmbHMicro pump assembly Mikropumpenmontage

Source/Quelle: Micromotion GmbHMicro gear Mikrogetriebe

Source/Quelle: Ehrfeld Mikrotechnik BTS GmbH Modular Microreaction System

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IVAM Microtechnology NetworkMicrosystems technology offers a tremendous bandwidth of application opportunities in fi elds such as medical technology, automotive industry, and consumer goods. Companies and institutes meet the challenge to bring such complex high-tech innovations to market day by day. They are supported by organizations like the IVAM Micro-technology Network.

IVAM consolidates about 300 mem-bers from the fi elds of microtechnol-ogy, nanotechnology and advanced materials. As a communicative “bridge” IVAM accelerates the transfer from in-novative ideas into profi table products. Besides technology marketing, IVAM’s activities include lobbying and opening up international markets.

Publications and economic data As editor of the high-tech magazine »inno« and the E-mail newsletters MikroMedia and NeMa-News, IVAM presents the latest products from microtechnology, nanotechnology and the materials’ sector. The IVAM directory contains profi les and contact details from all the mem-bers, and is used as a data base by potential customers and partners. Also in the IVAM directory online at www.ivam.de interested persons can select by industries and technolo-gies. Anybody looking for the latest economic data and trends will fi nd it under www.ivam-research.com. Here, the market research division of IVAM provides studies on micro and nano-technology.

Trade shows and events IVAM organizes the Prod-uct Market “Micro, Nano & Materials” at the HANNOVER MESSE, worlds largest indus-trial trade fair. The IVAM joint pavilion “High-tech for Medical Devices” at COMPAMED presents innovative solutions for medical technology. It has become an international lead-ing trade fair for the supplier market of medical manufac-turing. Organizing business workshops in Japan, Korea and China , IVAM also initiates contacts to Asia.

IVAM Microtechnology Network


Awarding of the IVAM Marketing Prize

Experts discuss within working groups

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Die Mikrosystemtechnik bietet eine ungeheure Bandbreite an Anwen-dungsmöglichkeiten – von der Medi-zintechnik über den Automobilbereich bis hin zu Konsumgütern. Tagtäglich stellen sich Unternehmen und Institute der Herausforderung, ihre komplexen Hightech-Produkte zu vermarkten. Unterstützung erhalten sie dabei durch Netzwerke wie den IVAM Fachverband für Mikrotechnik.

Unter dem Dach von IVAM sind derzeit rund 300 Mitglieder aus den Bereichen Mikrotechnik, Nanotechnik und Neue Materialien organisiert. Als kommunika-tive „Brücke“ zwischen Technologiean-bietern und -anwendern beschleunigt IVAM die Umsetzung innovativer Ideen in marktfähige Produkte. Neben dem Technologiemarketing gehören Lobbyar-beit, Marktanalysen und die Erschließung internationaler Märkte zu den wichtigsten Aktivitäten des Verbandes.

Publikationen und WirtschaftsdatenAls Herausgeber des Hightech-Maga-zins »inno« und der E-Mail-Newsletter MikroMedia und NeMa-News stellt IVAM neue Produkte aus der Mikro-, Nano- und Werkstofftechnikbranche vor. Das IVAM directory enthält Pro-fi le und Kontaktdaten aller Mitglieder und wird von potenziellen Kunden und Partnern als Datenbank genutzt. Auch im IVAM directory online unter www.ivam.de können Interessenten gezielt nach Branchen und Technologien suchen. Wer hingegen nach aktuellen Wirtschafts daten und Trends sucht, wird unter www.ivam-research.de fündig. Hier bietet der Marktforschungsbereich von IVAM Studien zum Thema Mikro- und Nanotechnik an.

Messen und Events Im Rahmen der weltweit größten Industrie-Messe, der HANNOVER MESSE, organisiert IVAM den Pro-

duktmarkt „Mikro, Nano, Materialien“, auf dem Unternehmen und Institute neue Produkte und marktorientierte Forschungs ergebnisse vorstellen. High-tech-Lösungen für die Medizintechnik-branche fi nden Fachbesucher auf dem IVAM-Gemeinschaftsstand „High-tech for Medical Devices“ im Rahmen der COMPAMED in Düsseldorf. Die Messe und hat sich in den vergangenen Jahren zum international führenden Marktplatz für Zulieferer der medizinischen Ferti-gung entwickelt. Um Kontaktaufbau in Asien zu erleichtern, organisiert IVAM z.B. Business-Workshops und Vortrags-reihen auf Messen und Veranstaltungen in Japan, Korea und China.

IVAM Fachverband für Mikrotechnik – Netzwerk für Nano und Mikro

IVAM Fachverband für MikrotechnikJoseph-von-Fraunhofer-Straße 13D – 44227 DortmundPhone +49 (0)231 - 9472 - 168Mail [email protected] www.ivam.de

IVAM Product Market “Hightech for Medical Devices” at COMPAMED 2011 Networking with IVAM

Sensor and Measuring Technology: Key Technology for Technological Innovation

Higher, faster, further, safer and more predictable: Sensor and measuring technology makes cars safer, helps trip tsunami alerts, allows industrial and space robots to work effi ciently, and lets amputees walk again. There is hardly a day on which we do not hear about new developments made possible by sensor and measuring technology.That is why experts see sensor and measuring technology as a key for tech-nological innovations. There is no branch of industry whose technical advance is not linked to more effi cient sensor and measuring technology.Sensors “made in Germany” are worldwide renown premium products. About 2,500 German institutes and enterprises are active in this high-tech area, from suppliers to dealers, from engineering consultants to specialized service providers, from universities to the Fraunhofer Instituts. The generally

small and medium-sized sensor and measuring technology manufacturers practically fulfi lls one third of the world-wide demand for sensor products and thus make Germany to a global market leader. Last, but not least, this is why the AMA Association holds the most important forum for sensor, measuring, and testing technology worldwide, the SENSOR+TEST trade fair and confer-ences in Nuremberg.

The AMA Association for Sensor Technology (AMA) was founded in 1980 as the AMA Working Group for Transducers (“Arbeitsgemeinschaft Messwertaufnehmer”). Today, AMA is the biggest association in the sensor industry worldwide, bringing together about 390 enterprises and 70 institutes. Among its core tasks are linking up and informing its member enterprises, research institutes, and users. Besides

the renown SENSOR+TEST, the AMA offers its members inexpensive commu-nity stands in Germany and abroad. The AMA Science Board meets twice a year to discuss a current topic and publishes the “Sensor Trends” study. The As-sociation confers the AMA Innovation Award every year. The 10,000-Euro award is granted to innovative develop-ers for highly market-relevant projects. The AMA Association also publishes an industry directory that provides a fast, simple, and structured overview of the services and products of its members. Beyond that, the Association offers comprehensive training opportunities as well as three top sensor conferences: the SENSOR, the OPTO, and the IRS2.The AMA considers itself a communica-tion center for all groups participating in the process. The AMA links up innova-tors and represents the interests of the sensor industry.

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AMA Fachverband für Sensorik e. V.Sophie-Charlotten-Str. 15D – 14059 BerlinPhone +49 (0)30 - 2219 0362-0Mail [email protected] www.ama-sensorik.deSource/Quelle: TWK-ELEKTRONIK GmbH

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Höher, schneller, weiter, sicherer und berechenba-rer: Sensorik und Mess-technik macht Automobile sicherer, hilft vor Tsunamis zu warnen, Industrie- und Raumfahrt-Roboter präzise arbeiten und Amputierte wieder gehen zu lassen. Kaum ein Tag, an dem wir nicht von neuen Entwicklun-gen erfahren, die erst durch Sensorik und Messtechni-ken möglich werden. Experten betrachten die Sensorik und Messtechnik daher als Schlüsseltech-nologie für Innovationen der Technik. Es gibt keinen Industriezweig, der seinen technischen Fortschritt nicht immer mit leistungsfähigerer Sensorik und Messtechnik verknüpft.Sensoren „Made in Germa-ny“ sind weltweit anerkannte Premiumprodukte. Rund 2.500 deutsche Institute und Firmen sind auf diesem High-Tech Gebiet tätig, vom Hersteller zum Wiederver-käufer, vom Ingenieurbüro bis zum spezialisierten Dienstleister, vom Hochschul- bis zum Fraunhofer Insti-tut. Die vorwiegend mittelständischen Sensor- und Messtechnik-Hersteller decken annähernd 1/3 des Bedarfs an Sensorik-Produkten weltweit ab und machen Deutschland damit zu einem globalen Marktführer. Nicht zuletzt deshalb richtet der AMA Fachverband für Sensorik alljährlich die wichtigste

Messe für Sensorik sowie Mess- und Prüf technik, die SENSOR+TEST, in Nürnberg aus.Der AMA Fachverband für Senso-rik (AMA) wurde als „Arbeitskreis Messwertaufnehmer“ vor mehr als 30 Jahren gegründet. Heute ist der AMA Fachverband der größte Verband dieser Branche weltweit und verbindet rund 390 Unternehmen und 70 Institute. Zu

seinen Kernaufgaben zählen die Vernetzung und Information von Mitgliedsunterneh-men, Forschungs-instituten und An-wendern. Neben der bereits erwähnten SENSOR+TEST, bietet AMA allen Mitgliedern günstige Gemein-schaftsmessestände im In- und Ausland an. Der AMA Wissen-schaftsrat tagt zweimal jährlich zu aktuellen Themen und gibt die Studie „SENSOR-TRENDS“ heraus. Einmal jährlich lobt der Verband den AMA Innovationspreis aus. Der mit 10.000 Euro dotierte Preis wird an innovative Entwickler mit hoher Markt-relevanz verliehen. Darüber hinaus gibt der Verband ein Branchen-verzeichnis heraus, das einen schnellen, einfachen und struk-

turierten Überblick über die Leistungen und Produkte der AMA-Mitglieder gibt. Zudem bietet AMA umfangreiche Weiterbildungsangebote an sowie drei hochkarätige Sensor-Fachkongresse: SENSOR, OPTO, IRS2. AMA versteht sich als Kommunika tions-zentrum aller am Prozess beteiligten Gruppen. AMA vernetzt Innovatoren und vertritt die Interessen der Branche.

Sensorik und Messtechnik: Schlüsseltechnologie für Innovationen der Technik

Source/Quelle: TWK-ELEKTRONIK GmbH

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Micro electric mechanical systems (MEMS) are a fascinating technology of-fering great economic opportunities due to its applicability to different sectors. The German technology cluster MicroTEC Südwest (Southwest) is marked by its four regions and linchpins Karlsruhe, Stuttgart, Villingen-Schwen-ningen and Freiburg.It is located in Baden-Württemberg in the Southwest of Germany, one of Europe’s high-performance areas of science and industry: Baden-Württemberg stands for a wealth of ideas, perfection, and high competence in system integration. This tradition strengthens our local economy and contributes to innovation projects by MicroTEC Südwest application-oriented and in close cooperation between research and industry.MicroTEC Südwest holds a worldwide leading-edge position in microsystem solutions. The continuous value-added process chain ensures marketing in-novations through cluster partners.

Large companies in the cluster can build up global leading markets and hence support market access for medium-sized fi rms as well.Since January 2010, MicroTEC Südwest has been a selected winner of the Spitzencluster (leading-edge cluster) competition launched by the German Federal Ministry of Research and Educa-tion (BMBF). The BMBF sponsors half the amount of the total project volume of about 80 million euros. The state of Baden-Württemberg supports the infra-structural measures to strengthen the cluster and its management. Detailed strategic project plans were submitted by March 2010. From July 2010 on the different projects were started operatively. A lot has happened since then. Within the last 18 months, MicroTEC Südwest has commenced and established its projects of the initial funding period.Of those future fi elds defi ned in the frame of the High-Tech Strategy of the

German Federal Ministry of Research and Education and the Science and Industry Research Union, MicroTEC Südwest is focusing on “mobility” and ”health”. Both fi elds have special potentials for microsystems technol-ogy and high potentials with regard to world markets and innovation. Hence, MicroTEC Südwest concentrates its strengths on to focal points “robust and effi cient sensors” with the international market leader Robert Bosch and “in-vitro diagnostics” with the international market leader Roche Diagnostics:

✦ In the fi eld of “robust and effi cient sensors”, innovative sensor ap-plications for the car industry are developed. These high-performance sensors have become indispensable for the development of clean and resource-saving drive technology and the early recognition of human beings in driver assistant systems. The sensors make a major contribu-

MicroTEC SüdwestThe Cluster for Smart Solutions

Facts and Figures: The cluster region Strategy and organization of the cluster

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tion to reducing energy consumption and emissions. And they increase safety in road traffi c.

✦ “In-vitro diagnostics” (IVD) is becom-ing more and more important due to an improvement of the quality of life of patients, medical quality and cost effectiveness. It is estimated that a 1% increase in expenses for in-vitro diagnostic leads to savings of about 5% in the healthcare system. In Germany, this could save more than 10 billion euros per year.

Both focal points are accompanied by two further main themes and joint projects: “Integration Platform SSI” and “Production Platform PRONTO”. The cross-functional platforms help medium-sized fi rms and start-ups to develop intelligent microsystem solutions and introduce them into the market with an eye to cost effectiveness. New beacons of technology may also arise in addi-tional lead markets.

Moreover the cluster has implemented projects focusing on the cluster develop-ment on a regional, national and also on an international base. With them, the strategic alignment of MicroTEC Südwest is secure and guaran-tees sustainability and success.

The cluster management, MST BW (Mikrosystemtechnik Baden-Württem-berg e.V.), implements the strategy developed with the cluster partners, vigorously promotes the projects, and assists in networking the stakeholders. This approach strengthens Germany as a base for high technology, cre-ates future jobs, and addresses global challenges. It therefore enjoys the full support of German policymakers.

The cluster managementMST BW (Mikrosystemtechnik Baden-Württemberg e.V). was founded in 2005 in cooperation with the Ministry of Eco-nomic Affairs of Baden-Württemberg, Germany. It represents the interests of industry, research establishments, universities and institutions in Baden-Württemberg in the area of miniaturiza-tion – especially in the fi eld of micro technologies and related areas.The association is responsible for the management of the Spitzencluster (lead-ing-edge cluster) MicroTEC Südwest. It is the offi cial press offi ce of the cluster and coordinates the activities

of MicroTEC Südwest. MST BW aims to boost the strengths and economic success of Baden-Württemberg. The members of MST BW (and so-called “premium players” of MicroTEC Südwest) form an important bundle of competences and guarantee a long-lasting continuity and quality with refer-ence to the development of technology in Baden-Württemberg. With their help, innovative aims can be formulated and converted into action.

CLUSTERMANAGEMENTMST BW - MikrosystemtechnikBaden-Württemberg e.V.Emmy-Noether-Sraße 2D – 79110 FreiburgPhone +49 (0)761- 386909 - 0Fax +49 (0)761- 386909 - 10Mail offi [email protected] www.mstbw.de www.microtec-suedwest.com

Enhancing the strengths for a sustainable future

Implantable electrode array © IMTEK/Bernd Mueller

Thin chip © IMS CHIPS

New Market Place for Micro Optics and Microoptical Systems in Berlin

From 2002 to 2010 the microsystems technology branch in the region Berlin-Brandenburg created over 2000 new jobs and this trend is expected to keep going in the near future. Despite the on-going fi nancial crisis microsystems com-panies in Berlin-Brandenburg together with the closely related optical technolo-gies expect almost 15% increase in revenues for 2011. The microsys berlin – trade show and congress for microsystems technology – is expected to underline this develop-ment. Starting in 2012 the microsys berlin will be taking place under one roof with the Laser Optics Berlin, focus-sing on micro optics and microoptical systems. This will be the fi rst business platform among German trade fairs to mirror the products and services of both the optical technology and microsystem technology industries.

Prof. Dr. Klaus-Dieter Lang, Director of the Fraunhofer Institute for Reliability and Microintegration (IZM) and chairman of the microsys berlin congress: “Combin-ing microsys and Laser Optics Berlin means that in future we will be able to offer visitors a concentrated display of the industry’s capabilities in the optical technologies and systems sector, which has always been well-established in this region. This will include lasers, LED systems, micro optics and key optical microsystem technologies, which will enable visitors to take an in-depth look at the entire manufacturing and value added chain. Exhibitors will be able to benefi t from the presence of trade visi-tors both from Germany and abroad.

Visitors will also fi nd numerous examples of new developments in measurement systems, illumination and information technology being put to use.”

The international Congress at Laser Optics Berlin will be organized by the prestigious Optical Society of America (OSA) for the fi rst time. Experts from all over the world will discuss trends from the fi elds of „High-Intensity Lasers and

High Field Phenomena“, „Ultrafast Struc-tural Dynamics“ and „Quantum Informa-tion and Measurement (QIM)“.

Besides the exhibition and the congress an international brokerage event, an educational session and several the-matic workshops will take place.

For further information please visit www.laser-optics-berlin.de.

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Neuer Marktplatz für Mikrooptik und mikrooptische Systeme in Berlin

Über 2.000 neue Arbeitsplätze sind in der Mikrosystemtechnik-branche Berlin-Branden-burgs zwischen 2002 und 2010 entstanden und der Trend setzt sich fort. Die Berlin-Branden-burger Unternehmen der Mikrosystemtechnik und der eng verwandten optischen Technologien erwarten 2011 trotz anhaltender Finanzkrise ein Umsatzwachstum von fast 15%.

Die microsys berlin – Kongressmesse für Mikrosystemtechnik - soll diesen Entwicklungstrend unterstreichen. Als Kombination aus Ausstellung und Vor-tragsprogramm geht die microsys berlin inhaltlich und strukturell neue Wege: Sie fi ndet künftig parallel zur Laser Optics Berlin statt. Ihr neuer Schwerpunkt liegt auf Mikrooptik und mikrooptischen Systemen. Damit gibt es in der deut-schen Messelandschaft erstmalig eine Businessplattform, auf der die Schnitt-stellen zwischen optischen Technologien und Mikrosystemtechnik repräsentativ abgebildet werden.

Prof. Dr. Klaus-Dieter Lang, Direktor des Fraunhofer Instituts für Zuverläs-sigkeit und Mikrointegration (IZM) und Vorsitzender des Programmkomitees der microsys berlin: „Mit der Zusam-menführung von microsys und Laser Optics Berlin werden dem Besucher zukünftig die in der Region traditionell starken Kompetenzen im Bereich der

optischen Technologien und Systeme gebündelt präsentiert: Vom Laser über LED-Systeme und Mikrooptiken bis hin zu den Schlüsseltechnologien der opti-schen Mikrosysteme erhalten Teilnehmer einen detaillierten Einblick in die gesamte Prozess- und Wertschöpfungskette. Aussteller profi tieren von einem nationa-len und internationalen Fachpublikum. Interessierte Besucher fi nden darüber hinaus zahlreiche Beispiele für die An-wendung derartiger Entwicklungen, so in der Messtechnik, Beleuchtung oder Informationstechnik.”

Den Internationalen Kongress der Laser Optics Berlin wird im März 2012 erst-mals die renommierte Optical Society of America (OSA) ausrichten. Weltweit renommierte Experten werden in drei Schwerpunkten aktuelle Trends aus den Bereichen „High-Intensity Lasers and High Field Phenomena“, „Ultrafast Struc-tural Dynamics“ und „Quantum Informati-on and Measurement (QIM)“ diskutieren.

Begleitend zu Ausstellung und Kongress werden eine internationale Kooperations-börse, ein Bildungsforum und zahlreiche Workshops stattfi nden.

Weitere Informationen fi nden Sie unter www.laser-optics-berlin.de.


TSB Innovationsagentur Berlin GmbHProf. Dr. Eberhard StensFasanenstr. 85D – 10623 BerlinPhone +49 (0)30 - 46302 - 440Mail [email protected] Web www.tsb-optik.de


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Today Great Chances lie in the Smallest

Our daily life without the use of micro-technology and nanotechnology is hardly imaginable. Even after decades of re-search and exercise microtechnology and nanotechnology are considered the most infl uential cross-sectional technologies in the future. MNT Mikro-Nanotechnologie Thüringen e.V., a cluster initiative of currently 45 members (including 14 scientifi c and educational institutions) in Thuringia, Germany, combines and represents various actors along the technological process chain of micro- and nanotech-

nology. As an interface of its members the MNT is the fi rst contact person for requests of high quality solutions from specialists of this future-oriented branch. The MNT bundles competences of research institutes and technology com-panies ranging from raw materials, new materials, ultra high precision processing as well as design and manufacturing of microsystem technology products in the meaning of smart systems integration. Micro- and nanotechnology offer crucial and recognized potentials to allow prod-ucts and components to become more

power, energy and resource effi cient at lower costs. They increasingly ensure innovative capability and commercial success for a variety of industries, like automobile, medical technology and optics. The intention of the MNT e.V. is to strengthen the competitiveness of its members and the entire sector in terms of professional, staff and organizational support and hence to push the broad and long-term connection of these key technologies with a variety of economi-cal sectors in the future.

Die Mikro-Nanotechnologie ist heute aus dem Alltag nicht mehr wegzuden-ken. Auch noch nach jahrzehntelanger Erforschung und Anwendung gehört die Mikro-Nanotechnologie zu einer der ein-fl ussreichsten Querschnittstechnologien der Zukunft. Der MNT Mikro-Nanotechnologie Thüringen e. V., eine Clusterinitiative aus 45 Thüringer wissenschaftlichen Instituten und Technologieunternehmen, vereint und repräsentiert die verschie-denen Akteure entlang der techno-logischen Wertschöpfungskette der Zukunfts branchen Mikrosystemtechnik,

Nanotechnologie und neu der Kunststoffver-arbeitungstechnologie und eröffnet als erster Ansprechpartner für Anfragen den schnel-len Zugang zu den Spezialisten. Das MNT-

Netzwerk bündelt die Kompetenzen der Forschungsinstitute und Technologieun-ternehmen: Diese reichen vom Einsatz von Rohstof-fen, über neue Materialien und deren ultrapräziser Bearbeitung bis zum Design und der Fertigung mikrosystemtech-nischer Produkte und Komponenten (Smart System Integration - SSI). Mikro-technik und Nanotechnologien besitzen als ausgewiesene Querschnittstechno-logien entscheidende und anerkannte Potenziale, um Produkte und Kompo-nenten leistungsfähiger, energie- und ressourceneffi zienter oder preisgünstiger

zu gestalten. Sie sichern zunehmend Innovationsfähigkeit und Markterfolg für eine Vielzahl an Anwenderbranchen, wie Automobil, Medizintechnik, Automatisie-rungstechnik und Optik.Die Zielstellung des Industrie- und Forschungsverbundes ist die Wett-bewerbsfähigkeit seiner Mitglieder und der gesamten Branche fachlich, personell und organisatorisch weiter zu stärken und so die breite und nachhal-tige Vernetzung der Schlüsseltechnolo-gien mit vielen Bereichen der Wirtschaft auch in der Zukunft maßgeblich voran-zutreiben.

MNT Mikro-Nanotechnologie Thüringen e. V.Leutragraben 1 (JenTower)D – 07743 JenaPhone +49 (0)3641- 573 3900Fax +49 (0)3641- 573 3909Mail [email protected] www.mikronanotechnik.de

Mikro-Nano-Thuringia bundles growth potentials of the future

Große Chancen liegen heute im KleinenMikro-Nano-Thüringen bündelt Wachstumspotenziale der Zukunft

Source: Micro-Hybrid Electronic GmbH

Kapitelüberschrift

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ISSN 2191-7183 (Printausgabe)

Microsystems Technology in Germany 2012

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