MEMS FBRICATION METHODS

MADE BY Amit K Parcha Roll No2K13E21Department of Electronic Science Uinversity Of Pune

TABLE OF CONTENTS

Abstract of work undertaken3) Introduction to the problem4) Fabricating MEMS and Nanotechnology a) Deposition Processes b) Lithography c) Etching MEMS and Nanotechnology Applications 6) Current Challenges Reference sites

MEMS MICRO-ELECTRO-MECHANICAL SYSTEMS

COMBINATION OF MECHANICAL FUNCTIONS (SENSINGMOVINGHEATING) AND ELECTRICAL FUNCTIONS (SWITCHING DECIDING) ON THE SAME CHIP USING MICRO FABRICATION TECHNOLOGY

INTRODUCTION TO THE PROBLEM Imagine a machine so small that it is imperceptible to the human

eye Imagine working machines no bigger than a grain of pollen Imagine thousands of these machines batch fabricated on a single piece of silicon for just a few pennies each Imagine a world where gravity and inertia are no longer important but atomic forces and surface science dominate Imagine a silicon chip with thousands of microscopic mirrors working in unison enabling the all optical network and removing the bottlenecks from the global telecommunications infrastructure You are now entering the microdomain a world occupied by an explosive technology known as MEMS A world of challenge and opportunity where traditional engineering concepts are turned upside down and the realm of the possible is totally redefined

FABRICATING MEMS AND NANOTECHNOLOGY MEMS technology is based on a number of tools and

methodologies which are used to form small structures with dimensions in the micrometer scale (one millionth of a meter) Significant parts of the technology has been adopted from integrated circuit (IC) technology For instance almost all devices are build on wafers of silicon like ICs The structures are realized in thin films of materials like ICs They are patterned using photolithographic methods like ICs There are however several processes that are not derived from IC technology and as the technology continues to grow the gap with IC technology also grows

There are three basic building blocks in MEMS technology which are the ability to deposit thin films of material on a substrate to apply a patterned mask on top of the films by photolithograpic imaging and to etch the films selectively to the mask A MEMS process is usually a structured sequence of these operations to form actual devices

DEPOSITION PROCESSES MEMS Thin Film Deposition Processes

One of the basic building blocks in MEMS processing is the ability to deposit thin films of material In this text we assume a thin film to have a thickness anywhere between a few nanometer to about 100 micrometer

MEMS deposition technology can be classified in two groups1 Depositions that happen because of a chemical reaction

a) Chemical Vapor Deposition (CVD) b) Electrodeposition c) Epitaxy d) Thermal oxidation

These processes exploit the creation of solid materials directly from chemical reactions in gas andor liquid compositions or with the substrate material The solid material is usually not the only product formed by the reaction Byproducts can include gases liquids and even other solids

2) Depositions that happen because of a physical reaction a) Physical Vapor Deposition (PVD) b) Casting

LITHOGRAPHY Various steps involved in Lithography1) Pattern Transfer Lithography in the MEMS context is typically the transfer of a pattern to a photosensitive material

by selective exposure to a radiation source such as light A photosensitive material is a material that experiences a change in its physical properties when exposed to a radiation source If we selectively expose a photosensitive material to radiation (eg by masking some of the radiation) the pattern of the radiation on the material is transferred to the material exposed as the properties of the exposed and unexposed regions differs

2) Alignment In order to make useful devices the patterns for different lithography steps that belong to a single

structure must be aligned to one another The first pattern transferred to a wafer usually includes a set of alignment marks which are high precision features that are used as the reference when positioning subsequent patterns to the first pattern

3) Exposure The exposure parameters required in order to achieve accurate pattern transfer from the mask to

the photosensitive layer depend primarily on the wavelength of the radiation source and the dose required to achieve the desired properties change of the photoresist Different photoresists exhibit different sensitivities to different wavelengths The dose required per unit volume of photoresist for good pattern transfer is somewhat constant however the physics of the exposure process may affect the dose actually received For example a highly reflective layer under the photoresist may result in the material experiencing a higher dose than if the underlying layer is absorptive as the photoresist is exposed both by the incident radiation as well as the reflected radiation The dose will also vary with resist thickness

ETCHING PROCESSES

In order to form a functional MEMS structure on a substrate it is necessary to etch the thin films previously deposited andor the substrate itself In general there are two classes of etching processes

1) Wet etching where the material is dissolved when immersed in a chemical solution

2) Dry etching where the material is sputtered or dissolved using reactive ions or a vapor phase etchant

Other Microfabrication Processes1)Soft lithography2)Micro-Imprint Lithography3)Microstereolithography (MSTL

Base material of MEMS1048766 Single crystal wafers- Diameter of 4lsquolsquo to 6lsquolsquo- Thickness 200 μm to 1 mm- Orientation mostly lt110gt and lt100gt

COMPARISON OF MICROELECTRONICS AND MICROSYSTEMS

Fabrication techniques are proven and well documented

Packaging technology is relatively well established

Primarily 2-dimensional structures

Stationary structures

Many microfabrication techniques are used for production but with no standard procedures

Packaging technology is Complex

3-dimensional structure at the infant stage

May involve moving components

Microelectronics Microsystems (silicon based)

ADVANTAGES Less material usageLower power requirementsGreater functionality per unit spaceAccessibility to regions that are forbidden to larger productsIn most cases smaller products should mean lower prices because less material is used

1)Materials are the basic things required to develop micro sensors

2)Metals3)Polymers4)Ceramic materials5)Semiconductors6)Composite materials

MATERIALS FOR MEMS

mems product is always based on siliconwhySilicon has good mechanicalproperties

High strength and elasticity good hardness and relatively low density Techniques to process silicon are well established from processing of ICs

CURRENT CHALLENGES

MEMS and Nanotechnology is currently used in low- or medium-volume applications Some of the obstacles preventing its wider adoption are

1) Limited Options Most companies who wish to explore the potential of MEMS and

Nanotechnology have very limited options for prototyping or manufacturing devices and have no capability or expertise in microfabrication technology Few companies will build their own fabrication facilities because of the high cost A mechanism giving smaller organizations responsive and affordable access to MEMS and Nano fabrication is essential

2) Packaging The packaging of MEMS devices and systems needs to improve considerably from its current primitive state MEMS packaging is more challenging than IC packaging due to the diversity of MEMS devices and the requirement that many of these devices be in contact with their environment Currently almost all MEMS and Nano development efforts must develop a new and specialized package for each new device Most companies find that packaging is the single most expensive and time consuming task in their overall product development program As for the components themselves numerical modeling and simulation tools for MEMS packaging are virtually non-existent Approaches which allow designers to select from a catalog of existing standardized packages for a new MEMS device without compromising performance would be beneficial

3) Fabrication Knowledge Required Currently the designer of a MEMS device requires a high level of fabrication knowledge in order to create a successful design Often the development of even the most mundane MEMS device requires a dedicated research effort to find a suitable process sequence for fabricating it MEMS device design needs to be separated from the complexities of the process sequence

4)CAD Design tool inaccuracies

FUTURE

It has the potential to change our daily life as much as computer As with all emerging technologies the MEMS industry had been predicted to revolutionize technology and our lives

bullMicroorganisms act as tiny machines in future MEMS devices

REFERENCE SITES1) Memxorg

2) Googlecom

Querieshelliphellip

Thank uhelliphelliphellip

TABLE OF CONTENTS

Abstract of work undertaken3) Introduction to the problem4) Fabricating MEMS and Nanotechnology a) Deposition Processes b) Lithography c) Etching MEMS and Nanotechnology Applications 6) Current Challenges Reference sites

MEMS MICRO-ELECTRO-MECHANICAL SYSTEMS

COMBINATION OF MECHANICAL FUNCTIONS (SENSINGMOVINGHEATING) AND ELECTRICAL FUNCTIONS (SWITCHING DECIDING) ON THE SAME CHIP USING MICRO FABRICATION TECHNOLOGY

INTRODUCTION TO THE PROBLEM Imagine a machine so small that it is imperceptible to the human

eye Imagine working machines no bigger than a grain of pollen Imagine thousands of these machines batch fabricated on a single piece of silicon for just a few pennies each Imagine a world where gravity and inertia are no longer important but atomic forces and surface science dominate Imagine a silicon chip with thousands of microscopic mirrors working in unison enabling the all optical network and removing the bottlenecks from the global telecommunications infrastructure You are now entering the microdomain a world occupied by an explosive technology known as MEMS A world of challenge and opportunity where traditional engineering concepts are turned upside down and the realm of the possible is totally redefined

FABRICATING MEMS AND NANOTECHNOLOGY MEMS technology is based on a number of tools and

methodologies which are used to form small structures with dimensions in the micrometer scale (one millionth of a meter) Significant parts of the technology has been adopted from integrated circuit (IC) technology For instance almost all devices are build on wafers of silicon like ICs The structures are realized in thin films of materials like ICs They are patterned using photolithographic methods like ICs There are however several processes that are not derived from IC technology and as the technology continues to grow the gap with IC technology also grows

There are three basic building blocks in MEMS technology which are the ability to deposit thin films of material on a substrate to apply a patterned mask on top of the films by photolithograpic imaging and to etch the films selectively to the mask A MEMS process is usually a structured sequence of these operations to form actual devices

DEPOSITION PROCESSES MEMS Thin Film Deposition Processes

One of the basic building blocks in MEMS processing is the ability to deposit thin films of material In this text we assume a thin film to have a thickness anywhere between a few nanometer to about 100 micrometer

MEMS deposition technology can be classified in two groups1 Depositions that happen because of a chemical reaction

a) Chemical Vapor Deposition (CVD) b) Electrodeposition c) Epitaxy d) Thermal oxidation

These processes exploit the creation of solid materials directly from chemical reactions in gas andor liquid compositions or with the substrate material The solid material is usually not the only product formed by the reaction Byproducts can include gases liquids and even other solids

2) Depositions that happen because of a physical reaction a) Physical Vapor Deposition (PVD) b) Casting

LITHOGRAPHY Various steps involved in Lithography1) Pattern Transfer Lithography in the MEMS context is typically the transfer of a pattern to a photosensitive material

by selective exposure to a radiation source such as light A photosensitive material is a material that experiences a change in its physical properties when exposed to a radiation source If we selectively expose a photosensitive material to radiation (eg by masking some of the radiation) the pattern of the radiation on the material is transferred to the material exposed as the properties of the exposed and unexposed regions differs

2) Alignment In order to make useful devices the patterns for different lithography steps that belong to a single

structure must be aligned to one another The first pattern transferred to a wafer usually includes a set of alignment marks which are high precision features that are used as the reference when positioning subsequent patterns to the first pattern

3) Exposure The exposure parameters required in order to achieve accurate pattern transfer from the mask to

the photosensitive layer depend primarily on the wavelength of the radiation source and the dose required to achieve the desired properties change of the photoresist Different photoresists exhibit different sensitivities to different wavelengths The dose required per unit volume of photoresist for good pattern transfer is somewhat constant however the physics of the exposure process may affect the dose actually received For example a highly reflective layer under the photoresist may result in the material experiencing a higher dose than if the underlying layer is absorptive as the photoresist is exposed both by the incident radiation as well as the reflected radiation The dose will also vary with resist thickness

ETCHING PROCESSES

In order to form a functional MEMS structure on a substrate it is necessary to etch the thin films previously deposited andor the substrate itself In general there are two classes of etching processes

1) Wet etching where the material is dissolved when immersed in a chemical solution

2) Dry etching where the material is sputtered or dissolved using reactive ions or a vapor phase etchant

Other Microfabrication Processes1)Soft lithography2)Micro-Imprint Lithography3)Microstereolithography (MSTL

Base material of MEMS1048766 Single crystal wafers- Diameter of 4lsquolsquo to 6lsquolsquo- Thickness 200 μm to 1 mm- Orientation mostly lt110gt and lt100gt

COMPARISON OF MICROELECTRONICS AND MICROSYSTEMS

Fabrication techniques are proven and well documented

Packaging technology is relatively well established

Primarily 2-dimensional structures

Stationary structures

Many microfabrication techniques are used for production but with no standard procedures

Packaging technology is Complex

3-dimensional structure at the infant stage

May involve moving components

Microelectronics Microsystems (silicon based)

ADVANTAGES Less material usageLower power requirementsGreater functionality per unit spaceAccessibility to regions that are forbidden to larger productsIn most cases smaller products should mean lower prices because less material is used

1)Materials are the basic things required to develop micro sensors

2)Metals3)Polymers4)Ceramic materials5)Semiconductors6)Composite materials

MATERIALS FOR MEMS

mems product is always based on siliconwhySilicon has good mechanicalproperties

High strength and elasticity good hardness and relatively low density Techniques to process silicon are well established from processing of ICs

CURRENT CHALLENGES

MEMS and Nanotechnology is currently used in low- or medium-volume applications Some of the obstacles preventing its wider adoption are

1) Limited Options Most companies who wish to explore the potential of MEMS and

Nanotechnology have very limited options for prototyping or manufacturing devices and have no capability or expertise in microfabrication technology Few companies will build their own fabrication facilities because of the high cost A mechanism giving smaller organizations responsive and affordable access to MEMS and Nano fabrication is essential

2) Packaging The packaging of MEMS devices and systems needs to improve considerably from its current primitive state MEMS packaging is more challenging than IC packaging due to the diversity of MEMS devices and the requirement that many of these devices be in contact with their environment Currently almost all MEMS and Nano development efforts must develop a new and specialized package for each new device Most companies find that packaging is the single most expensive and time consuming task in their overall product development program As for the components themselves numerical modeling and simulation tools for MEMS packaging are virtually non-existent Approaches which allow designers to select from a catalog of existing standardized packages for a new MEMS device without compromising performance would be beneficial

3) Fabrication Knowledge Required Currently the designer of a MEMS device requires a high level of fabrication knowledge in order to create a successful design Often the development of even the most mundane MEMS device requires a dedicated research effort to find a suitable process sequence for fabricating it MEMS device design needs to be separated from the complexities of the process sequence

4)CAD Design tool inaccuracies

FUTURE

It has the potential to change our daily life as much as computer As with all emerging technologies the MEMS industry had been predicted to revolutionize technology and our lives

bullMicroorganisms act as tiny machines in future MEMS devices

REFERENCE SITES1) Memxorg

2) Googlecom

Querieshelliphellip

Thank uhelliphelliphellip

MEMS MICRO-ELECTRO-MECHANICAL SYSTEMS

COMBINATION OF MECHANICAL FUNCTIONS (SENSINGMOVINGHEATING) AND ELECTRICAL FUNCTIONS (SWITCHING DECIDING) ON THE SAME CHIP USING MICRO FABRICATION TECHNOLOGY

INTRODUCTION TO THE PROBLEM Imagine a machine so small that it is imperceptible to the human

eye Imagine working machines no bigger than a grain of pollen Imagine thousands of these machines batch fabricated on a single piece of silicon for just a few pennies each Imagine a world where gravity and inertia are no longer important but atomic forces and surface science dominate Imagine a silicon chip with thousands of microscopic mirrors working in unison enabling the all optical network and removing the bottlenecks from the global telecommunications infrastructure You are now entering the microdomain a world occupied by an explosive technology known as MEMS A world of challenge and opportunity where traditional engineering concepts are turned upside down and the realm of the possible is totally redefined

FABRICATING MEMS AND NANOTECHNOLOGY MEMS technology is based on a number of tools and

methodologies which are used to form small structures with dimensions in the micrometer scale (one millionth of a meter) Significant parts of the technology has been adopted from integrated circuit (IC) technology For instance almost all devices are build on wafers of silicon like ICs The structures are realized in thin films of materials like ICs They are patterned using photolithographic methods like ICs There are however several processes that are not derived from IC technology and as the technology continues to grow the gap with IC technology also grows

There are three basic building blocks in MEMS technology which are the ability to deposit thin films of material on a substrate to apply a patterned mask on top of the films by photolithograpic imaging and to etch the films selectively to the mask A MEMS process is usually a structured sequence of these operations to form actual devices

DEPOSITION PROCESSES MEMS Thin Film Deposition Processes

One of the basic building blocks in MEMS processing is the ability to deposit thin films of material In this text we assume a thin film to have a thickness anywhere between a few nanometer to about 100 micrometer

MEMS deposition technology can be classified in two groups1 Depositions that happen because of a chemical reaction

a) Chemical Vapor Deposition (CVD) b) Electrodeposition c) Epitaxy d) Thermal oxidation

These processes exploit the creation of solid materials directly from chemical reactions in gas andor liquid compositions or with the substrate material The solid material is usually not the only product formed by the reaction Byproducts can include gases liquids and even other solids

2) Depositions that happen because of a physical reaction a) Physical Vapor Deposition (PVD) b) Casting

LITHOGRAPHY Various steps involved in Lithography1) Pattern Transfer Lithography in the MEMS context is typically the transfer of a pattern to a photosensitive material

by selective exposure to a radiation source such as light A photosensitive material is a material that experiences a change in its physical properties when exposed to a radiation source If we selectively expose a photosensitive material to radiation (eg by masking some of the radiation) the pattern of the radiation on the material is transferred to the material exposed as the properties of the exposed and unexposed regions differs

2) Alignment In order to make useful devices the patterns for different lithography steps that belong to a single

structure must be aligned to one another The first pattern transferred to a wafer usually includes a set of alignment marks which are high precision features that are used as the reference when positioning subsequent patterns to the first pattern

3) Exposure The exposure parameters required in order to achieve accurate pattern transfer from the mask to

the photosensitive layer depend primarily on the wavelength of the radiation source and the dose required to achieve the desired properties change of the photoresist Different photoresists exhibit different sensitivities to different wavelengths The dose required per unit volume of photoresist for good pattern transfer is somewhat constant however the physics of the exposure process may affect the dose actually received For example a highly reflective layer under the photoresist may result in the material experiencing a higher dose than if the underlying layer is absorptive as the photoresist is exposed both by the incident radiation as well as the reflected radiation The dose will also vary with resist thickness

ETCHING PROCESSES

In order to form a functional MEMS structure on a substrate it is necessary to etch the thin films previously deposited andor the substrate itself In general there are two classes of etching processes

1) Wet etching where the material is dissolved when immersed in a chemical solution

2) Dry etching where the material is sputtered or dissolved using reactive ions or a vapor phase etchant

Other Microfabrication Processes1)Soft lithography2)Micro-Imprint Lithography3)Microstereolithography (MSTL

Base material of MEMS1048766 Single crystal wafers- Diameter of 4lsquolsquo to 6lsquolsquo- Thickness 200 μm to 1 mm- Orientation mostly lt110gt and lt100gt

COMPARISON OF MICROELECTRONICS AND MICROSYSTEMS

Fabrication techniques are proven and well documented

Packaging technology is relatively well established

Primarily 2-dimensional structures

Stationary structures

Many microfabrication techniques are used for production but with no standard procedures

Packaging technology is Complex

3-dimensional structure at the infant stage

May involve moving components

Microelectronics Microsystems (silicon based)

ADVANTAGES Less material usageLower power requirementsGreater functionality per unit spaceAccessibility to regions that are forbidden to larger productsIn most cases smaller products should mean lower prices because less material is used

1)Materials are the basic things required to develop micro sensors

2)Metals3)Polymers4)Ceramic materials5)Semiconductors6)Composite materials

MATERIALS FOR MEMS

mems product is always based on siliconwhySilicon has good mechanicalproperties

High strength and elasticity good hardness and relatively low density Techniques to process silicon are well established from processing of ICs

CURRENT CHALLENGES

MEMS and Nanotechnology is currently used in low- or medium-volume applications Some of the obstacles preventing its wider adoption are

1) Limited Options Most companies who wish to explore the potential of MEMS and

Nanotechnology have very limited options for prototyping or manufacturing devices and have no capability or expertise in microfabrication technology Few companies will build their own fabrication facilities because of the high cost A mechanism giving smaller organizations responsive and affordable access to MEMS and Nano fabrication is essential

2) Packaging The packaging of MEMS devices and systems needs to improve considerably from its current primitive state MEMS packaging is more challenging than IC packaging due to the diversity of MEMS devices and the requirement that many of these devices be in contact with their environment Currently almost all MEMS and Nano development efforts must develop a new and specialized package for each new device Most companies find that packaging is the single most expensive and time consuming task in their overall product development program As for the components themselves numerical modeling and simulation tools for MEMS packaging are virtually non-existent Approaches which allow designers to select from a catalog of existing standardized packages for a new MEMS device without compromising performance would be beneficial

3) Fabrication Knowledge Required Currently the designer of a MEMS device requires a high level of fabrication knowledge in order to create a successful design Often the development of even the most mundane MEMS device requires a dedicated research effort to find a suitable process sequence for fabricating it MEMS device design needs to be separated from the complexities of the process sequence

4)CAD Design tool inaccuracies

FUTURE

It has the potential to change our daily life as much as computer As with all emerging technologies the MEMS industry had been predicted to revolutionize technology and our lives

bullMicroorganisms act as tiny machines in future MEMS devices

REFERENCE SITES1) Memxorg

2) Googlecom

Querieshelliphellip

Thank uhelliphelliphellip

INTRODUCTION TO THE PROBLEM Imagine a machine so small that it is imperceptible to the human

eye Imagine working machines no bigger than a grain of pollen Imagine thousands of these machines batch fabricated on a single piece of silicon for just a few pennies each Imagine a world where gravity and inertia are no longer important but atomic forces and surface science dominate Imagine a silicon chip with thousands of microscopic mirrors working in unison enabling the all optical network and removing the bottlenecks from the global telecommunications infrastructure You are now entering the microdomain a world occupied by an explosive technology known as MEMS A world of challenge and opportunity where traditional engineering concepts are turned upside down and the realm of the possible is totally redefined

FABRICATING MEMS AND NANOTECHNOLOGY MEMS technology is based on a number of tools and

methodologies which are used to form small structures with dimensions in the micrometer scale (one millionth of a meter) Significant parts of the technology has been adopted from integrated circuit (IC) technology For instance almost all devices are build on wafers of silicon like ICs The structures are realized in thin films of materials like ICs They are patterned using photolithographic methods like ICs There are however several processes that are not derived from IC technology and as the technology continues to grow the gap with IC technology also grows

There are three basic building blocks in MEMS technology which are the ability to deposit thin films of material on a substrate to apply a patterned mask on top of the films by photolithograpic imaging and to etch the films selectively to the mask A MEMS process is usually a structured sequence of these operations to form actual devices

DEPOSITION PROCESSES MEMS Thin Film Deposition Processes

One of the basic building blocks in MEMS processing is the ability to deposit thin films of material In this text we assume a thin film to have a thickness anywhere between a few nanometer to about 100 micrometer

MEMS deposition technology can be classified in two groups1 Depositions that happen because of a chemical reaction

a) Chemical Vapor Deposition (CVD) b) Electrodeposition c) Epitaxy d) Thermal oxidation

These processes exploit the creation of solid materials directly from chemical reactions in gas andor liquid compositions or with the substrate material The solid material is usually not the only product formed by the reaction Byproducts can include gases liquids and even other solids

2) Depositions that happen because of a physical reaction a) Physical Vapor Deposition (PVD) b) Casting

LITHOGRAPHY Various steps involved in Lithography1) Pattern Transfer Lithography in the MEMS context is typically the transfer of a pattern to a photosensitive material

by selective exposure to a radiation source such as light A photosensitive material is a material that experiences a change in its physical properties when exposed to a radiation source If we selectively expose a photosensitive material to radiation (eg by masking some of the radiation) the pattern of the radiation on the material is transferred to the material exposed as the properties of the exposed and unexposed regions differs

2) Alignment In order to make useful devices the patterns for different lithography steps that belong to a single

structure must be aligned to one another The first pattern transferred to a wafer usually includes a set of alignment marks which are high precision features that are used as the reference when positioning subsequent patterns to the first pattern

3) Exposure The exposure parameters required in order to achieve accurate pattern transfer from the mask to

the photosensitive layer depend primarily on the wavelength of the radiation source and the dose required to achieve the desired properties change of the photoresist Different photoresists exhibit different sensitivities to different wavelengths The dose required per unit volume of photoresist for good pattern transfer is somewhat constant however the physics of the exposure process may affect the dose actually received For example a highly reflective layer under the photoresist may result in the material experiencing a higher dose than if the underlying layer is absorptive as the photoresist is exposed both by the incident radiation as well as the reflected radiation The dose will also vary with resist thickness

ETCHING PROCESSES

In order to form a functional MEMS structure on a substrate it is necessary to etch the thin films previously deposited andor the substrate itself In general there are two classes of etching processes

1) Wet etching where the material is dissolved when immersed in a chemical solution

2) Dry etching where the material is sputtered or dissolved using reactive ions or a vapor phase etchant

Other Microfabrication Processes1)Soft lithography2)Micro-Imprint Lithography3)Microstereolithography (MSTL

Base material of MEMS1048766 Single crystal wafers- Diameter of 4lsquolsquo to 6lsquolsquo- Thickness 200 μm to 1 mm- Orientation mostly lt110gt and lt100gt

COMPARISON OF MICROELECTRONICS AND MICROSYSTEMS

Fabrication techniques are proven and well documented

Packaging technology is relatively well established

Primarily 2-dimensional structures

Stationary structures

Many microfabrication techniques are used for production but with no standard procedures

Packaging technology is Complex

3-dimensional structure at the infant stage

May involve moving components

Microelectronics Microsystems (silicon based)

ADVANTAGES Less material usageLower power requirementsGreater functionality per unit spaceAccessibility to regions that are forbidden to larger productsIn most cases smaller products should mean lower prices because less material is used

1)Materials are the basic things required to develop micro sensors

2)Metals3)Polymers4)Ceramic materials5)Semiconductors6)Composite materials

MATERIALS FOR MEMS

mems product is always based on siliconwhySilicon has good mechanicalproperties

High strength and elasticity good hardness and relatively low density Techniques to process silicon are well established from processing of ICs

CURRENT CHALLENGES

MEMS and Nanotechnology is currently used in low- or medium-volume applications Some of the obstacles preventing its wider adoption are

1) Limited Options Most companies who wish to explore the potential of MEMS and

Nanotechnology have very limited options for prototyping or manufacturing devices and have no capability or expertise in microfabrication technology Few companies will build their own fabrication facilities because of the high cost A mechanism giving smaller organizations responsive and affordable access to MEMS and Nano fabrication is essential

2) Packaging The packaging of MEMS devices and systems needs to improve considerably from its current primitive state MEMS packaging is more challenging than IC packaging due to the diversity of MEMS devices and the requirement that many of these devices be in contact with their environment Currently almost all MEMS and Nano development efforts must develop a new and specialized package for each new device Most companies find that packaging is the single most expensive and time consuming task in their overall product development program As for the components themselves numerical modeling and simulation tools for MEMS packaging are virtually non-existent Approaches which allow designers to select from a catalog of existing standardized packages for a new MEMS device without compromising performance would be beneficial

3) Fabrication Knowledge Required Currently the designer of a MEMS device requires a high level of fabrication knowledge in order to create a successful design Often the development of even the most mundane MEMS device requires a dedicated research effort to find a suitable process sequence for fabricating it MEMS device design needs to be separated from the complexities of the process sequence

4)CAD Design tool inaccuracies

FUTURE

It has the potential to change our daily life as much as computer As with all emerging technologies the MEMS industry had been predicted to revolutionize technology and our lives

bullMicroorganisms act as tiny machines in future MEMS devices

REFERENCE SITES1) Memxorg

2) Googlecom

Querieshelliphellip

Thank uhelliphelliphellip

FABRICATING MEMS AND NANOTECHNOLOGY MEMS technology is based on a number of tools and

methodologies which are used to form small structures with dimensions in the micrometer scale (one millionth of a meter) Significant parts of the technology has been adopted from integrated circuit (IC) technology For instance almost all devices are build on wafers of silicon like ICs The structures are realized in thin films of materials like ICs They are patterned using photolithographic methods like ICs There are however several processes that are not derived from IC technology and as the technology continues to grow the gap with IC technology also grows

There are three basic building blocks in MEMS technology which are the ability to deposit thin films of material on a substrate to apply a patterned mask on top of the films by photolithograpic imaging and to etch the films selectively to the mask A MEMS process is usually a structured sequence of these operations to form actual devices

DEPOSITION PROCESSES MEMS Thin Film Deposition Processes

One of the basic building blocks in MEMS processing is the ability to deposit thin films of material In this text we assume a thin film to have a thickness anywhere between a few nanometer to about 100 micrometer

MEMS deposition technology can be classified in two groups1 Depositions that happen because of a chemical reaction

a) Chemical Vapor Deposition (CVD) b) Electrodeposition c) Epitaxy d) Thermal oxidation

These processes exploit the creation of solid materials directly from chemical reactions in gas andor liquid compositions or with the substrate material The solid material is usually not the only product formed by the reaction Byproducts can include gases liquids and even other solids

2) Depositions that happen because of a physical reaction a) Physical Vapor Deposition (PVD) b) Casting

LITHOGRAPHY Various steps involved in Lithography1) Pattern Transfer Lithography in the MEMS context is typically the transfer of a pattern to a photosensitive material

by selective exposure to a radiation source such as light A photosensitive material is a material that experiences a change in its physical properties when exposed to a radiation source If we selectively expose a photosensitive material to radiation (eg by masking some of the radiation) the pattern of the radiation on the material is transferred to the material exposed as the properties of the exposed and unexposed regions differs

2) Alignment In order to make useful devices the patterns for different lithography steps that belong to a single

structure must be aligned to one another The first pattern transferred to a wafer usually includes a set of alignment marks which are high precision features that are used as the reference when positioning subsequent patterns to the first pattern

3) Exposure The exposure parameters required in order to achieve accurate pattern transfer from the mask to

the photosensitive layer depend primarily on the wavelength of the radiation source and the dose required to achieve the desired properties change of the photoresist Different photoresists exhibit different sensitivities to different wavelengths The dose required per unit volume of photoresist for good pattern transfer is somewhat constant however the physics of the exposure process may affect the dose actually received For example a highly reflective layer under the photoresist may result in the material experiencing a higher dose than if the underlying layer is absorptive as the photoresist is exposed both by the incident radiation as well as the reflected radiation The dose will also vary with resist thickness

ETCHING PROCESSES

In order to form a functional MEMS structure on a substrate it is necessary to etch the thin films previously deposited andor the substrate itself In general there are two classes of etching processes

1) Wet etching where the material is dissolved when immersed in a chemical solution

2) Dry etching where the material is sputtered or dissolved using reactive ions or a vapor phase etchant

Other Microfabrication Processes1)Soft lithography2)Micro-Imprint Lithography3)Microstereolithography (MSTL

Base material of MEMS1048766 Single crystal wafers- Diameter of 4lsquolsquo to 6lsquolsquo- Thickness 200 μm to 1 mm- Orientation mostly lt110gt and lt100gt

COMPARISON OF MICROELECTRONICS AND MICROSYSTEMS

Fabrication techniques are proven and well documented

Packaging technology is relatively well established

Primarily 2-dimensional structures

Stationary structures

Many microfabrication techniques are used for production but with no standard procedures

Packaging technology is Complex

3-dimensional structure at the infant stage

May involve moving components

Microelectronics Microsystems (silicon based)

ADVANTAGES Less material usageLower power requirementsGreater functionality per unit spaceAccessibility to regions that are forbidden to larger productsIn most cases smaller products should mean lower prices because less material is used

1)Materials are the basic things required to develop micro sensors

2)Metals3)Polymers4)Ceramic materials5)Semiconductors6)Composite materials

MATERIALS FOR MEMS

mems product is always based on siliconwhySilicon has good mechanicalproperties

High strength and elasticity good hardness and relatively low density Techniques to process silicon are well established from processing of ICs

CURRENT CHALLENGES

MEMS and Nanotechnology is currently used in low- or medium-volume applications Some of the obstacles preventing its wider adoption are

1) Limited Options Most companies who wish to explore the potential of MEMS and

Nanotechnology have very limited options for prototyping or manufacturing devices and have no capability or expertise in microfabrication technology Few companies will build their own fabrication facilities because of the high cost A mechanism giving smaller organizations responsive and affordable access to MEMS and Nano fabrication is essential

2) Packaging The packaging of MEMS devices and systems needs to improve considerably from its current primitive state MEMS packaging is more challenging than IC packaging due to the diversity of MEMS devices and the requirement that many of these devices be in contact with their environment Currently almost all MEMS and Nano development efforts must develop a new and specialized package for each new device Most companies find that packaging is the single most expensive and time consuming task in their overall product development program As for the components themselves numerical modeling and simulation tools for MEMS packaging are virtually non-existent Approaches which allow designers to select from a catalog of existing standardized packages for a new MEMS device without compromising performance would be beneficial

3) Fabrication Knowledge Required Currently the designer of a MEMS device requires a high level of fabrication knowledge in order to create a successful design Often the development of even the most mundane MEMS device requires a dedicated research effort to find a suitable process sequence for fabricating it MEMS device design needs to be separated from the complexities of the process sequence

4)CAD Design tool inaccuracies

FUTURE

It has the potential to change our daily life as much as computer As with all emerging technologies the MEMS industry had been predicted to revolutionize technology and our lives

bullMicroorganisms act as tiny machines in future MEMS devices

REFERENCE SITES1) Memxorg

2) Googlecom

Querieshelliphellip

Thank uhelliphelliphellip

DEPOSITION PROCESSES MEMS Thin Film Deposition Processes

One of the basic building blocks in MEMS processing is the ability to deposit thin films of material In this text we assume a thin film to have a thickness anywhere between a few nanometer to about 100 micrometer

MEMS deposition technology can be classified in two groups1 Depositions that happen because of a chemical reaction

a) Chemical Vapor Deposition (CVD) b) Electrodeposition c) Epitaxy d) Thermal oxidation

These processes exploit the creation of solid materials directly from chemical reactions in gas andor liquid compositions or with the substrate material The solid material is usually not the only product formed by the reaction Byproducts can include gases liquids and even other solids

2) Depositions that happen because of a physical reaction a) Physical Vapor Deposition (PVD) b) Casting

LITHOGRAPHY Various steps involved in Lithography1) Pattern Transfer Lithography in the MEMS context is typically the transfer of a pattern to a photosensitive material

by selective exposure to a radiation source such as light A photosensitive material is a material that experiences a change in its physical properties when exposed to a radiation source If we selectively expose a photosensitive material to radiation (eg by masking some of the radiation) the pattern of the radiation on the material is transferred to the material exposed as the properties of the exposed and unexposed regions differs

2) Alignment In order to make useful devices the patterns for different lithography steps that belong to a single

structure must be aligned to one another The first pattern transferred to a wafer usually includes a set of alignment marks which are high precision features that are used as the reference when positioning subsequent patterns to the first pattern

3) Exposure The exposure parameters required in order to achieve accurate pattern transfer from the mask to

the photosensitive layer depend primarily on the wavelength of the radiation source and the dose required to achieve the desired properties change of the photoresist Different photoresists exhibit different sensitivities to different wavelengths The dose required per unit volume of photoresist for good pattern transfer is somewhat constant however the physics of the exposure process may affect the dose actually received For example a highly reflective layer under the photoresist may result in the material experiencing a higher dose than if the underlying layer is absorptive as the photoresist is exposed both by the incident radiation as well as the reflected radiation The dose will also vary with resist thickness

ETCHING PROCESSES

In order to form a functional MEMS structure on a substrate it is necessary to etch the thin films previously deposited andor the substrate itself In general there are two classes of etching processes

1) Wet etching where the material is dissolved when immersed in a chemical solution

2) Dry etching where the material is sputtered or dissolved using reactive ions or a vapor phase etchant

Other Microfabrication Processes1)Soft lithography2)Micro-Imprint Lithography3)Microstereolithography (MSTL

Base material of MEMS1048766 Single crystal wafers- Diameter of 4lsquolsquo to 6lsquolsquo- Thickness 200 μm to 1 mm- Orientation mostly lt110gt and lt100gt

COMPARISON OF MICROELECTRONICS AND MICROSYSTEMS

Fabrication techniques are proven and well documented

Packaging technology is relatively well established

Primarily 2-dimensional structures

Stationary structures

Many microfabrication techniques are used for production but with no standard procedures

Packaging technology is Complex

3-dimensional structure at the infant stage

May involve moving components

Microelectronics Microsystems (silicon based)

ADVANTAGES Less material usageLower power requirementsGreater functionality per unit spaceAccessibility to regions that are forbidden to larger productsIn most cases smaller products should mean lower prices because less material is used

1)Materials are the basic things required to develop micro sensors

2)Metals3)Polymers4)Ceramic materials5)Semiconductors6)Composite materials

MATERIALS FOR MEMS

mems product is always based on siliconwhySilicon has good mechanicalproperties

High strength and elasticity good hardness and relatively low density Techniques to process silicon are well established from processing of ICs

CURRENT CHALLENGES

MEMS and Nanotechnology is currently used in low- or medium-volume applications Some of the obstacles preventing its wider adoption are

1) Limited Options Most companies who wish to explore the potential of MEMS and

Nanotechnology have very limited options for prototyping or manufacturing devices and have no capability or expertise in microfabrication technology Few companies will build their own fabrication facilities because of the high cost A mechanism giving smaller organizations responsive and affordable access to MEMS and Nano fabrication is essential

2) Packaging The packaging of MEMS devices and systems needs to improve considerably from its current primitive state MEMS packaging is more challenging than IC packaging due to the diversity of MEMS devices and the requirement that many of these devices be in contact with their environment Currently almost all MEMS and Nano development efforts must develop a new and specialized package for each new device Most companies find that packaging is the single most expensive and time consuming task in their overall product development program As for the components themselves numerical modeling and simulation tools for MEMS packaging are virtually non-existent Approaches which allow designers to select from a catalog of existing standardized packages for a new MEMS device without compromising performance would be beneficial

3) Fabrication Knowledge Required Currently the designer of a MEMS device requires a high level of fabrication knowledge in order to create a successful design Often the development of even the most mundane MEMS device requires a dedicated research effort to find a suitable process sequence for fabricating it MEMS device design needs to be separated from the complexities of the process sequence

4)CAD Design tool inaccuracies

FUTURE

It has the potential to change our daily life as much as computer As with all emerging technologies the MEMS industry had been predicted to revolutionize technology and our lives

bullMicroorganisms act as tiny machines in future MEMS devices

REFERENCE SITES1) Memxorg

2) Googlecom

Querieshelliphellip

Thank uhelliphelliphellip

LITHOGRAPHY Various steps involved in Lithography1) Pattern Transfer Lithography in the MEMS context is typically the transfer of a pattern to a photosensitive material

by selective exposure to a radiation source such as light A photosensitive material is a material that experiences a change in its physical properties when exposed to a radiation source If we selectively expose a photosensitive material to radiation (eg by masking some of the radiation) the pattern of the radiation on the material is transferred to the material exposed as the properties of the exposed and unexposed regions differs

2) Alignment In order to make useful devices the patterns for different lithography steps that belong to a single

structure must be aligned to one another The first pattern transferred to a wafer usually includes a set of alignment marks which are high precision features that are used as the reference when positioning subsequent patterns to the first pattern

3) Exposure The exposure parameters required in order to achieve accurate pattern transfer from the mask to

the photosensitive layer depend primarily on the wavelength of the radiation source and the dose required to achieve the desired properties change of the photoresist Different photoresists exhibit different sensitivities to different wavelengths The dose required per unit volume of photoresist for good pattern transfer is somewhat constant however the physics of the exposure process may affect the dose actually received For example a highly reflective layer under the photoresist may result in the material experiencing a higher dose than if the underlying layer is absorptive as the photoresist is exposed both by the incident radiation as well as the reflected radiation The dose will also vary with resist thickness

ETCHING PROCESSES

In order to form a functional MEMS structure on a substrate it is necessary to etch the thin films previously deposited andor the substrate itself In general there are two classes of etching processes

1) Wet etching where the material is dissolved when immersed in a chemical solution

2) Dry etching where the material is sputtered or dissolved using reactive ions or a vapor phase etchant

Other Microfabrication Processes1)Soft lithography2)Micro-Imprint Lithography3)Microstereolithography (MSTL

Base material of MEMS1048766 Single crystal wafers- Diameter of 4lsquolsquo to 6lsquolsquo- Thickness 200 μm to 1 mm- Orientation mostly lt110gt and lt100gt

COMPARISON OF MICROELECTRONICS AND MICROSYSTEMS

Fabrication techniques are proven and well documented

Packaging technology is relatively well established

Primarily 2-dimensional structures

Stationary structures

Many microfabrication techniques are used for production but with no standard procedures

Packaging technology is Complex

3-dimensional structure at the infant stage

May involve moving components

Microelectronics Microsystems (silicon based)

ADVANTAGES Less material usageLower power requirementsGreater functionality per unit spaceAccessibility to regions that are forbidden to larger productsIn most cases smaller products should mean lower prices because less material is used

1)Materials are the basic things required to develop micro sensors

2)Metals3)Polymers4)Ceramic materials5)Semiconductors6)Composite materials

MATERIALS FOR MEMS

mems product is always based on siliconwhySilicon has good mechanicalproperties

High strength and elasticity good hardness and relatively low density Techniques to process silicon are well established from processing of ICs

CURRENT CHALLENGES

MEMS and Nanotechnology is currently used in low- or medium-volume applications Some of the obstacles preventing its wider adoption are

1) Limited Options Most companies who wish to explore the potential of MEMS and

Nanotechnology have very limited options for prototyping or manufacturing devices and have no capability or expertise in microfabrication technology Few companies will build their own fabrication facilities because of the high cost A mechanism giving smaller organizations responsive and affordable access to MEMS and Nano fabrication is essential

2) Packaging The packaging of MEMS devices and systems needs to improve considerably from its current primitive state MEMS packaging is more challenging than IC packaging due to the diversity of MEMS devices and the requirement that many of these devices be in contact with their environment Currently almost all MEMS and Nano development efforts must develop a new and specialized package for each new device Most companies find that packaging is the single most expensive and time consuming task in their overall product development program As for the components themselves numerical modeling and simulation tools for MEMS packaging are virtually non-existent Approaches which allow designers to select from a catalog of existing standardized packages for a new MEMS device without compromising performance would be beneficial

3) Fabrication Knowledge Required Currently the designer of a MEMS device requires a high level of fabrication knowledge in order to create a successful design Often the development of even the most mundane MEMS device requires a dedicated research effort to find a suitable process sequence for fabricating it MEMS device design needs to be separated from the complexities of the process sequence

4)CAD Design tool inaccuracies

FUTURE

It has the potential to change our daily life as much as computer As with all emerging technologies the MEMS industry had been predicted to revolutionize technology and our lives

bullMicroorganisms act as tiny machines in future MEMS devices

REFERENCE SITES1) Memxorg

2) Googlecom

Querieshelliphellip

Thank uhelliphelliphellip

ETCHING PROCESSES

In order to form a functional MEMS structure on a substrate it is necessary to etch the thin films previously deposited andor the substrate itself In general there are two classes of etching processes

1) Wet etching where the material is dissolved when immersed in a chemical solution

2) Dry etching where the material is sputtered or dissolved using reactive ions or a vapor phase etchant

Other Microfabrication Processes1)Soft lithography2)Micro-Imprint Lithography3)Microstereolithography (MSTL

Base material of MEMS1048766 Single crystal wafers- Diameter of 4lsquolsquo to 6lsquolsquo- Thickness 200 μm to 1 mm- Orientation mostly lt110gt and lt100gt

COMPARISON OF MICROELECTRONICS AND MICROSYSTEMS

Fabrication techniques are proven and well documented

Packaging technology is relatively well established

Primarily 2-dimensional structures

Stationary structures

Many microfabrication techniques are used for production but with no standard procedures

Packaging technology is Complex

3-dimensional structure at the infant stage

May involve moving components

Microelectronics Microsystems (silicon based)

ADVANTAGES Less material usageLower power requirementsGreater functionality per unit spaceAccessibility to regions that are forbidden to larger productsIn most cases smaller products should mean lower prices because less material is used

1)Materials are the basic things required to develop micro sensors

2)Metals3)Polymers4)Ceramic materials5)Semiconductors6)Composite materials

MATERIALS FOR MEMS

mems product is always based on siliconwhySilicon has good mechanicalproperties

High strength and elasticity good hardness and relatively low density Techniques to process silicon are well established from processing of ICs

CURRENT CHALLENGES

MEMS and Nanotechnology is currently used in low- or medium-volume applications Some of the obstacles preventing its wider adoption are

1) Limited Options Most companies who wish to explore the potential of MEMS and

Nanotechnology have very limited options for prototyping or manufacturing devices and have no capability or expertise in microfabrication technology Few companies will build their own fabrication facilities because of the high cost A mechanism giving smaller organizations responsive and affordable access to MEMS and Nano fabrication is essential

2) Packaging The packaging of MEMS devices and systems needs to improve considerably from its current primitive state MEMS packaging is more challenging than IC packaging due to the diversity of MEMS devices and the requirement that many of these devices be in contact with their environment Currently almost all MEMS and Nano development efforts must develop a new and specialized package for each new device Most companies find that packaging is the single most expensive and time consuming task in their overall product development program As for the components themselves numerical modeling and simulation tools for MEMS packaging are virtually non-existent Approaches which allow designers to select from a catalog of existing standardized packages for a new MEMS device without compromising performance would be beneficial

3) Fabrication Knowledge Required Currently the designer of a MEMS device requires a high level of fabrication knowledge in order to create a successful design Often the development of even the most mundane MEMS device requires a dedicated research effort to find a suitable process sequence for fabricating it MEMS device design needs to be separated from the complexities of the process sequence

4)CAD Design tool inaccuracies

FUTURE

It has the potential to change our daily life as much as computer As with all emerging technologies the MEMS industry had been predicted to revolutionize technology and our lives

bullMicroorganisms act as tiny machines in future MEMS devices

REFERENCE SITES1) Memxorg

2) Googlecom

Querieshelliphellip

Thank uhelliphelliphellip

Other Microfabrication Processes1)Soft lithography2)Micro-Imprint Lithography3)Microstereolithography (MSTL

Base material of MEMS1048766 Single crystal wafers- Diameter of 4lsquolsquo to 6lsquolsquo- Thickness 200 μm to 1 mm- Orientation mostly lt110gt and lt100gt

COMPARISON OF MICROELECTRONICS AND MICROSYSTEMS

Fabrication techniques are proven and well documented

Packaging technology is relatively well established

Primarily 2-dimensional structures

Stationary structures

Many microfabrication techniques are used for production but with no standard procedures

Packaging technology is Complex

3-dimensional structure at the infant stage

May involve moving components

Microelectronics Microsystems (silicon based)

ADVANTAGES Less material usageLower power requirementsGreater functionality per unit spaceAccessibility to regions that are forbidden to larger productsIn most cases smaller products should mean lower prices because less material is used

1)Materials are the basic things required to develop micro sensors

2)Metals3)Polymers4)Ceramic materials5)Semiconductors6)Composite materials

MATERIALS FOR MEMS

mems product is always based on siliconwhySilicon has good mechanicalproperties

High strength and elasticity good hardness and relatively low density Techniques to process silicon are well established from processing of ICs

CURRENT CHALLENGES

MEMS and Nanotechnology is currently used in low- or medium-volume applications Some of the obstacles preventing its wider adoption are

1) Limited Options Most companies who wish to explore the potential of MEMS and

Nanotechnology have very limited options for prototyping or manufacturing devices and have no capability or expertise in microfabrication technology Few companies will build their own fabrication facilities because of the high cost A mechanism giving smaller organizations responsive and affordable access to MEMS and Nano fabrication is essential

2) Packaging The packaging of MEMS devices and systems needs to improve considerably from its current primitive state MEMS packaging is more challenging than IC packaging due to the diversity of MEMS devices and the requirement that many of these devices be in contact with their environment Currently almost all MEMS and Nano development efforts must develop a new and specialized package for each new device Most companies find that packaging is the single most expensive and time consuming task in their overall product development program As for the components themselves numerical modeling and simulation tools for MEMS packaging are virtually non-existent Approaches which allow designers to select from a catalog of existing standardized packages for a new MEMS device without compromising performance would be beneficial

3) Fabrication Knowledge Required Currently the designer of a MEMS device requires a high level of fabrication knowledge in order to create a successful design Often the development of even the most mundane MEMS device requires a dedicated research effort to find a suitable process sequence for fabricating it MEMS device design needs to be separated from the complexities of the process sequence

4)CAD Design tool inaccuracies

FUTURE

It has the potential to change our daily life as much as computer As with all emerging technologies the MEMS industry had been predicted to revolutionize technology and our lives

bullMicroorganisms act as tiny machines in future MEMS devices

REFERENCE SITES1) Memxorg

2) Googlecom

Querieshelliphellip

Thank uhelliphelliphellip

Base material of MEMS1048766 Single crystal wafers- Diameter of 4lsquolsquo to 6lsquolsquo- Thickness 200 μm to 1 mm- Orientation mostly lt110gt and lt100gt

COMPARISON OF MICROELECTRONICS AND MICROSYSTEMS

Fabrication techniques are proven and well documented

Packaging technology is relatively well established

Primarily 2-dimensional structures

Stationary structures

Many microfabrication techniques are used for production but with no standard procedures

Packaging technology is Complex

3-dimensional structure at the infant stage

May involve moving components

Microelectronics Microsystems (silicon based)

ADVANTAGES Less material usageLower power requirementsGreater functionality per unit spaceAccessibility to regions that are forbidden to larger productsIn most cases smaller products should mean lower prices because less material is used

1)Materials are the basic things required to develop micro sensors

2)Metals3)Polymers4)Ceramic materials5)Semiconductors6)Composite materials

MATERIALS FOR MEMS

mems product is always based on siliconwhySilicon has good mechanicalproperties

High strength and elasticity good hardness and relatively low density Techniques to process silicon are well established from processing of ICs

CURRENT CHALLENGES

MEMS and Nanotechnology is currently used in low- or medium-volume applications Some of the obstacles preventing its wider adoption are

1) Limited Options Most companies who wish to explore the potential of MEMS and

Nanotechnology have very limited options for prototyping or manufacturing devices and have no capability or expertise in microfabrication technology Few companies will build their own fabrication facilities because of the high cost A mechanism giving smaller organizations responsive and affordable access to MEMS and Nano fabrication is essential

2) Packaging The packaging of MEMS devices and systems needs to improve considerably from its current primitive state MEMS packaging is more challenging than IC packaging due to the diversity of MEMS devices and the requirement that many of these devices be in contact with their environment Currently almost all MEMS and Nano development efforts must develop a new and specialized package for each new device Most companies find that packaging is the single most expensive and time consuming task in their overall product development program As for the components themselves numerical modeling and simulation tools for MEMS packaging are virtually non-existent Approaches which allow designers to select from a catalog of existing standardized packages for a new MEMS device without compromising performance would be beneficial

3) Fabrication Knowledge Required Currently the designer of a MEMS device requires a high level of fabrication knowledge in order to create a successful design Often the development of even the most mundane MEMS device requires a dedicated research effort to find a suitable process sequence for fabricating it MEMS device design needs to be separated from the complexities of the process sequence

4)CAD Design tool inaccuracies

FUTURE

It has the potential to change our daily life as much as computer As with all emerging technologies the MEMS industry had been predicted to revolutionize technology and our lives

bullMicroorganisms act as tiny machines in future MEMS devices

REFERENCE SITES1) Memxorg

2) Googlecom

Querieshelliphellip

Thank uhelliphelliphellip

COMPARISON OF MICROELECTRONICS AND MICROSYSTEMS

Fabrication techniques are proven and well documented

Packaging technology is relatively well established

Primarily 2-dimensional structures

Stationary structures

Many microfabrication techniques are used for production but with no standard procedures

Packaging technology is Complex

3-dimensional structure at the infant stage

May involve moving components

Microelectronics Microsystems (silicon based)

ADVANTAGES Less material usageLower power requirementsGreater functionality per unit spaceAccessibility to regions that are forbidden to larger productsIn most cases smaller products should mean lower prices because less material is used

1)Materials are the basic things required to develop micro sensors

2)Metals3)Polymers4)Ceramic materials5)Semiconductors6)Composite materials

MATERIALS FOR MEMS

mems product is always based on siliconwhySilicon has good mechanicalproperties

High strength and elasticity good hardness and relatively low density Techniques to process silicon are well established from processing of ICs

CURRENT CHALLENGES

MEMS and Nanotechnology is currently used in low- or medium-volume applications Some of the obstacles preventing its wider adoption are

1) Limited Options Most companies who wish to explore the potential of MEMS and

Nanotechnology have very limited options for prototyping or manufacturing devices and have no capability or expertise in microfabrication technology Few companies will build their own fabrication facilities because of the high cost A mechanism giving smaller organizations responsive and affordable access to MEMS and Nano fabrication is essential

2) Packaging The packaging of MEMS devices and systems needs to improve considerably from its current primitive state MEMS packaging is more challenging than IC packaging due to the diversity of MEMS devices and the requirement that many of these devices be in contact with their environment Currently almost all MEMS and Nano development efforts must develop a new and specialized package for each new device Most companies find that packaging is the single most expensive and time consuming task in their overall product development program As for the components themselves numerical modeling and simulation tools for MEMS packaging are virtually non-existent Approaches which allow designers to select from a catalog of existing standardized packages for a new MEMS device without compromising performance would be beneficial

3) Fabrication Knowledge Required Currently the designer of a MEMS device requires a high level of fabrication knowledge in order to create a successful design Often the development of even the most mundane MEMS device requires a dedicated research effort to find a suitable process sequence for fabricating it MEMS device design needs to be separated from the complexities of the process sequence

4)CAD Design tool inaccuracies

FUTURE

It has the potential to change our daily life as much as computer As with all emerging technologies the MEMS industry had been predicted to revolutionize technology and our lives

bullMicroorganisms act as tiny machines in future MEMS devices

REFERENCE SITES1) Memxorg

2) Googlecom

Querieshelliphellip

Thank uhelliphelliphellip

ADVANTAGES Less material usageLower power requirementsGreater functionality per unit spaceAccessibility to regions that are forbidden to larger productsIn most cases smaller products should mean lower prices because less material is used

1)Materials are the basic things required to develop micro sensors

2)Metals3)Polymers4)Ceramic materials5)Semiconductors6)Composite materials

MATERIALS FOR MEMS

mems product is always based on siliconwhySilicon has good mechanicalproperties

High strength and elasticity good hardness and relatively low density Techniques to process silicon are well established from processing of ICs

CURRENT CHALLENGES

MEMS and Nanotechnology is currently used in low- or medium-volume applications Some of the obstacles preventing its wider adoption are

1) Limited Options Most companies who wish to explore the potential of MEMS and

Nanotechnology have very limited options for prototyping or manufacturing devices and have no capability or expertise in microfabrication technology Few companies will build their own fabrication facilities because of the high cost A mechanism giving smaller organizations responsive and affordable access to MEMS and Nano fabrication is essential

2) Packaging The packaging of MEMS devices and systems needs to improve considerably from its current primitive state MEMS packaging is more challenging than IC packaging due to the diversity of MEMS devices and the requirement that many of these devices be in contact with their environment Currently almost all MEMS and Nano development efforts must develop a new and specialized package for each new device Most companies find that packaging is the single most expensive and time consuming task in their overall product development program As for the components themselves numerical modeling and simulation tools for MEMS packaging are virtually non-existent Approaches which allow designers to select from a catalog of existing standardized packages for a new MEMS device without compromising performance would be beneficial

3) Fabrication Knowledge Required Currently the designer of a MEMS device requires a high level of fabrication knowledge in order to create a successful design Often the development of even the most mundane MEMS device requires a dedicated research effort to find a suitable process sequence for fabricating it MEMS device design needs to be separated from the complexities of the process sequence

4)CAD Design tool inaccuracies

FUTURE

It has the potential to change our daily life as much as computer As with all emerging technologies the MEMS industry had been predicted to revolutionize technology and our lives

bullMicroorganisms act as tiny machines in future MEMS devices

REFERENCE SITES1) Memxorg

2) Googlecom

Querieshelliphellip

Thank uhelliphelliphellip

1)Materials are the basic things required to develop micro sensors

2)Metals3)Polymers4)Ceramic materials5)Semiconductors6)Composite materials

MATERIALS FOR MEMS

mems product is always based on siliconwhySilicon has good mechanicalproperties

High strength and elasticity good hardness and relatively low density Techniques to process silicon are well established from processing of ICs

CURRENT CHALLENGES

MEMS and Nanotechnology is currently used in low- or medium-volume applications Some of the obstacles preventing its wider adoption are

1) Limited Options Most companies who wish to explore the potential of MEMS and

Nanotechnology have very limited options for prototyping or manufacturing devices and have no capability or expertise in microfabrication technology Few companies will build their own fabrication facilities because of the high cost A mechanism giving smaller organizations responsive and affordable access to MEMS and Nano fabrication is essential

2) Packaging The packaging of MEMS devices and systems needs to improve considerably from its current primitive state MEMS packaging is more challenging than IC packaging due to the diversity of MEMS devices and the requirement that many of these devices be in contact with their environment Currently almost all MEMS and Nano development efforts must develop a new and specialized package for each new device Most companies find that packaging is the single most expensive and time consuming task in their overall product development program As for the components themselves numerical modeling and simulation tools for MEMS packaging are virtually non-existent Approaches which allow designers to select from a catalog of existing standardized packages for a new MEMS device without compromising performance would be beneficial

3) Fabrication Knowledge Required Currently the designer of a MEMS device requires a high level of fabrication knowledge in order to create a successful design Often the development of even the most mundane MEMS device requires a dedicated research effort to find a suitable process sequence for fabricating it MEMS device design needs to be separated from the complexities of the process sequence

4)CAD Design tool inaccuracies

FUTURE

It has the potential to change our daily life as much as computer As with all emerging technologies the MEMS industry had been predicted to revolutionize technology and our lives

bullMicroorganisms act as tiny machines in future MEMS devices

REFERENCE SITES1) Memxorg

2) Googlecom

Querieshelliphellip

Thank uhelliphelliphellip

mems product is always based on siliconwhySilicon has good mechanicalproperties

High strength and elasticity good hardness and relatively low density Techniques to process silicon are well established from processing of ICs

CURRENT CHALLENGES

MEMS and Nanotechnology is currently used in low- or medium-volume applications Some of the obstacles preventing its wider adoption are

1) Limited Options Most companies who wish to explore the potential of MEMS and

Nanotechnology have very limited options for prototyping or manufacturing devices and have no capability or expertise in microfabrication technology Few companies will build their own fabrication facilities because of the high cost A mechanism giving smaller organizations responsive and affordable access to MEMS and Nano fabrication is essential

2) Packaging The packaging of MEMS devices and systems needs to improve considerably from its current primitive state MEMS packaging is more challenging than IC packaging due to the diversity of MEMS devices and the requirement that many of these devices be in contact with their environment Currently almost all MEMS and Nano development efforts must develop a new and specialized package for each new device Most companies find that packaging is the single most expensive and time consuming task in their overall product development program As for the components themselves numerical modeling and simulation tools for MEMS packaging are virtually non-existent Approaches which allow designers to select from a catalog of existing standardized packages for a new MEMS device without compromising performance would be beneficial

3) Fabrication Knowledge Required Currently the designer of a MEMS device requires a high level of fabrication knowledge in order to create a successful design Often the development of even the most mundane MEMS device requires a dedicated research effort to find a suitable process sequence for fabricating it MEMS device design needs to be separated from the complexities of the process sequence

4)CAD Design tool inaccuracies

FUTURE

It has the potential to change our daily life as much as computer As with all emerging technologies the MEMS industry had been predicted to revolutionize technology and our lives

bullMicroorganisms act as tiny machines in future MEMS devices

REFERENCE SITES1) Memxorg

2) Googlecom

Querieshelliphellip

Thank uhelliphelliphellip

CURRENT CHALLENGES

MEMS and Nanotechnology is currently used in low- or medium-volume applications Some of the obstacles preventing its wider adoption are

1) Limited Options Most companies who wish to explore the potential of MEMS and

Nanotechnology have very limited options for prototyping or manufacturing devices and have no capability or expertise in microfabrication technology Few companies will build their own fabrication facilities because of the high cost A mechanism giving smaller organizations responsive and affordable access to MEMS and Nano fabrication is essential

2) Packaging The packaging of MEMS devices and systems needs to improve considerably from its current primitive state MEMS packaging is more challenging than IC packaging due to the diversity of MEMS devices and the requirement that many of these devices be in contact with their environment Currently almost all MEMS and Nano development efforts must develop a new and specialized package for each new device Most companies find that packaging is the single most expensive and time consuming task in their overall product development program As for the components themselves numerical modeling and simulation tools for MEMS packaging are virtually non-existent Approaches which allow designers to select from a catalog of existing standardized packages for a new MEMS device without compromising performance would be beneficial

3) Fabrication Knowledge Required Currently the designer of a MEMS device requires a high level of fabrication knowledge in order to create a successful design Often the development of even the most mundane MEMS device requires a dedicated research effort to find a suitable process sequence for fabricating it MEMS device design needs to be separated from the complexities of the process sequence

4)CAD Design tool inaccuracies

FUTURE

It has the potential to change our daily life as much as computer As with all emerging technologies the MEMS industry had been predicted to revolutionize technology and our lives

bullMicroorganisms act as tiny machines in future MEMS devices

REFERENCE SITES1) Memxorg

2) Googlecom

Querieshelliphellip

Thank uhelliphelliphellip

2) Packaging The packaging of MEMS devices and systems needs to improve considerably from its current primitive state MEMS packaging is more challenging than IC packaging due to the diversity of MEMS devices and the requirement that many of these devices be in contact with their environment Currently almost all MEMS and Nano development efforts must develop a new and specialized package for each new device Most companies find that packaging is the single most expensive and time consuming task in their overall product development program As for the components themselves numerical modeling and simulation tools for MEMS packaging are virtually non-existent Approaches which allow designers to select from a catalog of existing standardized packages for a new MEMS device without compromising performance would be beneficial

3) Fabrication Knowledge Required Currently the designer of a MEMS device requires a high level of fabrication knowledge in order to create a successful design Often the development of even the most mundane MEMS device requires a dedicated research effort to find a suitable process sequence for fabricating it MEMS device design needs to be separated from the complexities of the process sequence

4)CAD Design tool inaccuracies

FUTURE

It has the potential to change our daily life as much as computer As with all emerging technologies the MEMS industry had been predicted to revolutionize technology and our lives

bullMicroorganisms act as tiny machines in future MEMS devices

REFERENCE SITES1) Memxorg

2) Googlecom

Querieshelliphellip

Thank uhelliphelliphellip

FUTURE

It has the potential to change our daily life as much as computer As with all emerging technologies the MEMS industry had been predicted to revolutionize technology and our lives

bullMicroorganisms act as tiny machines in future MEMS devices

REFERENCE SITES1) Memxorg

2) Googlecom

Querieshelliphellip

Thank uhelliphelliphellip

bullMicroorganisms act as tiny machines in future MEMS devices

REFERENCE SITES1) Memxorg

2) Googlecom

Querieshelliphellip

Thank uhelliphelliphellip

REFERENCE SITES1) Memxorg

2) Googlecom

Querieshelliphellip

Thank uhelliphelliphellip

Querieshelliphellip

Thank uhelliphelliphellip