Lg Ls902p b Ls903p b

Color Video Camera

Website http://biz.lgservice.comInternal Use Only

P/NO : AFN36799083 MARCH, 2008

SERVICE MANUAL

MO

DE

LS

: LS

902P-B

, LS

903P-B

SE

RV

ICE

MA

NU

AL

MODELS: LS902P-B, LS903P-B

1-1

CONTENTS

SECTION 1 GENERAL

SAFETY PRECAUTIONS .................................................................................................................................1-2

SPECIFICATIONS .............................................................................................................................................1-3

SECTION 2 EXPLODED VIEW

CABINET AND MAIN FRAME SECTION.........................................................................................................2-1

SECTION 3 ELECTRICAL

CAMERA CONNECTION FOR ADJUSTMENT................................................................................................3-1

TROUBLESHOOTING GUIDE........................................................................................................................3-10

WIRING DIAGRAM .........................................................................................................................................3-11

BLOCK DIAGRAMS .......................................................................................................................................3-13

1. CCD BLOCK DIAGRAM ...........................................................................................................................3-13

2. CSP BLOCK DIAGRAM............................................................................................................................3-15

3. POWER BLOCK DIAGRAM .....................................................................................................................3-17

CIRCUIT DIAGRAMS......................................................................................................................................3-19

1. CCD CIRCUIT DIAGRAM.........................................................................................................................3-19

2. CSP_DSP CIRCUIT DIAGRAM................................................................................................................3-21

3. CSP_MCU CIRCUIT DIAGRAM...............................................................................................................3-23

4. KEY CIRCUIT DIAGRAM .........................................................................................................................3-25

5. IF CIRCUIT DIAGRAM .............................................................................................................................3-27

6. POWER CIRCUIT DIAGRAM ...................................................................................................................3-29

PRINTED CIRCUIT DIAGRAMS.....................................................................................................................3-31

1. CCD P.C. BOARD DIAGRAM...................................................................................................................3-31

2. CSP P.C. BOARD DIAGRAM ..................................................................................................................3-33

3. KEY P.C. BOARD DIAGRAM....................................................................................................................3-35

4. IF P.C. BOARD DIAGRAM .......................................................................................................................3-37

5. POWER P.C. BOARD DIAGRAM .............................................................................................................3-39

SECTION 4 REPLACEMENT PARTS LIST.................................................4-1

Copyright © 2008 LG Electronics. Inc. All right reserved.Only for training and service purposes

LGE Internal Use Only

Electrostatically Sensitive Devices (ESD)Some semiconductor (solid state) devices can be damaged easily by static electricity. Such componentscommonly are called electrostatically sensitive devices (ESD). Examples of typical ESD devices are inte-grated circuits and some field-effect transistors and semiconductor chip components. The following tech-niques should be used to help reduce the incidence of component damage caused by static electricity.

1. Immediately before handling any semiconductor component or semiconductor-equipped assembly,drain off any electrostatic charge on your body by touching a know earth ground. Alternatively, obtainand wear a commercially available discharging wrist strap device, which should be removed for poten-tial shock reasons prior to applying power to the unit under test.

2. After removing an electrical assembly equipped with ESD devices, place the assembly on a conductivesurface such as aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.

3. Use only a grounded-tip soldering iron to solder or unsolder ESD devices.

4. Use only an anti-static solder removal device. Some solder removal devices not classified as "anti-stat-ic" can generate electrical charges sufficient to damage ESD devices.

5. Do not use freon-propelled chemicals These can generate electrical charges sufficient to damage ESDdevices.

6. Do not remove a replacement ESD device from its protective package until immediately before you areready to install it. (Most replacement ESD devices are packaged with leads electrically shorted togetherby conductive foam, aluminum foil or comparable conductive materials).

7. Immediately before removing the protective material from the leads of a replacement ESD device, touchthe protective material to the chassis or circuit assembly into which the device will by installed.

CAUTION : BE SURE NO POWER IS APPLIED TO THE CHASSIS OR CIRCUIT, AND OBSERVEALL OTHER SAFETY PRECAUTIONS.

8. Minimize bodily motions when handing unpackaged replacement ESD devices. (Otherwise harmlessmotion such as the brushing together of your clothes fabric or the lifting of your foot from a carpetedfloor can generate static electricity sufficient to damage an ESD device).

[CAUTION. GRAPHIC SYMBOLS]

1-2

SECTION 1 GENERAL

SAFETY PRECAUTIONS

THE LIGHTNING FLASH WITH ARROWHEAD SYMBOL. WITHIN AN EQUILATERALTRIANGLE, IS INTENDED TO ALERT THE SERVICE PERSONNEL TO THE PRESENCEOF UNINSULATED "DANGEROUS VOLTAGE" THAT MAY BE OF SUFFICIENT MAGNI-TUDE TO CONSTITUTE A RISK OF ELECTRIC SHOCK.

THE EXCLAMATION POINT WITHIN AN EQUILATERAL TRIANGLE IS INTENED TOALERT THE SERVICE PERSONNEL TO THE PRESENCE OF IMPORTANT SAFETYINFORMATION IN SERVICE LITERATURE.



1-3

Model LS903P LS903N LS902P LS902N LS901P LS901N

SPECIFICATIONS

Total/Effective Pixels

Pick-up Device 1/3” Interline Color CCD

Lens C/CS Moun

Iris DC/ELC/VIDEO Selectable

Signal Process Digital Signal Process

Scanning System 2:1 Interlace

Synchronization System Internal/Line Lock

Scanning Frequency

Resolution 570 Lines

S/N Ratio More than 52 dB (AGC Off, F 1.0)

Video Output Signal 1.0 Vp-p Composite Signal (75 Ω)

Auto Gain Control OFF/LOW/MIDDLE/HIGH

Exposure ALC/ELC

Electric Shutter

White Balance ATW / AWC->PUSH / MANUAL

Back Light

WDR

MOTION DET. OFF/ON

Power Consumption 4.4W

Operation Temperature -10ºC - 50ºC (Humidity: 0%RH - 80%RH)

Storage Temperature -20ºC - 60ºC (Humidity: 0%RH - 85%RH)

Weight 420g

Dimension (H x V x D) 68 x 61.5 x 122 mm

* FEATURES

LS903P-B Yes Yes Filter changeLS902P-B Yes No Filter changeLS902P-B1 Yes No DigitalLS901P-B No Yes Filter changeLS901P-B1 No Yes DigitalLS903N-B Yes Yes Filter changeLS902N-B Yes No Filter changeLS902N-B1 Yes No DigitalLS901N-B No Yes Filter changeLS901N-B1 No Yes Digital

Models WDR Sense-up Day & Night

0.0003 Lux (Sens-Up Auto, F1.2) 0.1 Lux (F1.2) 0.0003 Lux (Sens-Up Auto, F1.2)(0.1 Lux : Sens-Up Off) (0.1 Lux : Sens-Up Off)

0.00003 Lux (Sens-Up Auto, F1.2) 0.01 Lux (F1.2) 0.00003 Lux (Sens-Up Auto, F1.2)(0.01 Lux : Sens-Up Off) (0.01 Lux : Sens-Up Off)

470K/440K 410K/380K 470K/440K 410K/380K 470K/440K 410K/380K

OFF/WDR/BLC/HSBLC OFF/WDR/BLC/HSBLC OFF/BLC/HSBLC

60dB 60dB -

50 Hz (VD) 59.94 Hz(VD) 50 Hz (VD) 59.94 Hz(VD) 50 Hz (VD) 59.94 Hz(VD)

1/50 - 1/90,000(Auto Mode)

1/60 - 1/90,000(Auto Mode)

1/50 - 1/90,000(Auto Mode)

1/60 - 1/90,000(Auto Mode)

1/50 - 1/90,000(Auto Mode)

1/60 - 1/90,000(Auto Mode)

Day

Night

Standard Illuminance



2-1

SECTION 2 EXPLODED VIEWCABINET AND MAIN FRAME SECTION

CCD

CSP

POWER

KEY

IF

250

251

252

253

254273

272

271

A46

A45

257

258

450

450A47

A48

A48

453

453

453

453

260

451

456

451

451

451

452

452

454

263

262

261

A40

264

265

455

CABLE1

CABLE2

A48 : IF & KEY Array Assembly

Caution Point



3-1

SECTION 3 ELECTRICAL

CAMERA CONNECTION FOR ADJUSTMENT

1. REQUIRED EQUIPMENTS

2. CONNECTION OF THE EQUIPMENT

3. STANDARD IMAGE SIZE

1.2m or above (But when adjusting the iris, keep tightly close with the viewer)

PC Connecting JIG VIEWER

CAMERA

WAVEFOM MONITORVECTOR SCOPETV or MONITOR

CN601

WIRE

Yl Cy G Mg R BW

1) TV or MONITOR2) VECTOR SCOPE3) WAVEFORM MONITOR4) VIEWER ( 3200°K ) 5) LA100, LB140, LB200 FILTER

6) COLLIMATOR7) DIGITAL EVR Equipment

( Initial / Adjustment )8) PC (Pentium or Higher)

CAMERA VIEW ANGLE (Make the outer block full)



3-2

4. ADJUSTMENT AND TEST ORDER

1. Download part adjustment1) MICOM DOWNLOAD2) PR selection

2. Bad pixel adjustment

3. Final 1st test1) Day and night function test2) Communication test3) Alarm and multi-function test

4. Final 2nd test (Maintain existing method)1) Set and module external key operation test2) W/B tracking test3) Final VOUT test4) Set dimension test5) Test standard specification test6) Multi-language OSD test

5. CAMERA ADJUSTMENT METHOD

5-1. ADJUSTMENT DOWNLOAD PART

(1) MICOM PROGRAM DOWNLOAD

* DOWNLOAD METHOD

ADJUSTMENT OBJECTIVE

ERROR

EQUIPMENT AND JIG

ADJUSTMENT METHOD

CAM EE

TO SAVE THE MICOM PROGRAM TO MICOM.

NOT DOWNLOADED

EFP-RC JIG, PC, INTERFACE BOARD

NUMBER OF MEASUREMENT LOCATIONS NUMBER OF ADJUSTMENT LOCATIONS ADJUSTMENT SPECIFICATION

1. Connect the PC with the downloadingdevice

1) Connect the PC and EFP-RC download devicewith the USB cable.

2) When the device is connected, use the power ofthe PC to turn on the power of the EFP-RC down-loading device.

3) When the device is connected, the USB driver forthe new device must be installed so that the com-munication between the PC and device can beenabled.

4) USB driver exists in the CD and set the followingpath.



3-3

5) The connection between the new hardware (EFP-RC) and the PC is completed as shownbelow.

2. Install the control program to thedownloading device.

1) Install the program within the CD.

2) Execute the install.exe file.

3) When the installation is finished, click on Finish tocomplete the installation.

3. Execute control program on downloading device

1) Execute control program on downloading device.

2) Execute the control program of the downloadingdevice and select the File Download Tab.

3) Select the LS900’s_verXXXX.hxw file and click onthe Download button to download the file from thePC to the downloading device.

4) And then download the LS900’s_verXXXX.pbt filein the same method.

4. Description of downloading device

1) There are following items on the LCD panel asshown below on the EFP-RC downloading device.

2) In the actual LCD panel, only two lines will beshown, but if you press the button, the followingitems will be displayed.

3) When the cursor is at 1. FILES, press the todisplay the right screen.

4) When you press the button to move down theitem, the files downloaded before will be displayed.

1:FILES2:PROGRAM3:MCU SET4:USER5:FIRM UPDATE

<DOWNLOAD><MCU_TYPE><USER>LS900’s_verXXXX.hxwLS900’s_verXXXX.pbt



3-4

5) Press the button to set the cursor atLS900’s_verXXXX.pbt and press the S button onthe device twice.

6) The selected file will be downloaded in the follow-ing order of Erasing --> Programming --> Verifying.(It takes about 1 minute)

7) When the download is completed, the alarm will gooff three times.

8) When you see the "V COMMAND OK" messageon the LCD panel, the download is completed.

5. Delete downloaded file

1) Place the cursor on the file to delete (.hxw or .pdt)and press the A button on the equipment.

2) The screen will be displayed as follows.

3) When you press the S button, the file will be deleted.

A, LS900’s_verXXXX.hxwDELETE THIS FILE?

A, LS900’s_verXXXX.hxwB=CANCEL / S=YES



3-5

(2) PR Selection

- Use the PR Apply Jig program to apply the initial data for the model where PR is applied.1. Open the PR jig program.2. Click on the Connect button to connect the communication.3. After setting the model to PR, press the PR Apply button.

5-2. LENS SELECT TEST

1. Lens select test

2. Test method1) Test lens: Manual, DC iris, video lens2) Manual lens: Set the Lens Select Switch at the center and check the screen.3) DC iris lens: Set the Lens Select Switch to the top and check the screen.4) Video lens: Set the Lens Select Switch to the bottom and check the screen.

3. Error1) Iris is full2) The iris does not recover to normal screen after 3 seconds. (Iris is detected with delay)3) Iris does not open as black cap.4) Iris vibrates


ERROR

EQUIPMENT AND JIG

ADJUSTMENT METHOD

CAM EE

TO SAVE THE INITIAL PR VALUE ON MICOM

PR NOT SET

EFP-RC JIG, PC, INTERFACE BOARD



ERROR

EQUIPMENT AND JIG

ADJUSTMENT METHOD

CAM EE

CHECK WHETHER IRIS OF EACH LENS IS OPERATING PROPERLY

IRIS OF EACH LENS NOT OPERATING PROPERLY

MONITOR




3-6

5-3. IRIS ADJUSTMENT

1. Iris adjustmentTo adjust to find the central value of control scope for DC iris control

2. PC adjustment method and precaution1) Assemble CCD, CSP, IF and POWER PCB to DC lens.2) Adjust the IRIS value by pressing the DC IRIS ADJUST button of JIG program after connecting

the communication device.3) Press the iris adjustment button.4) When the adjusting value is displayed, proceed to the following process.

5-4. BAD PIXEL CORRECTION

1. Bad pixel correctionTo adjust the for the bad pixel

2. PC adjustment method and precaution1) Assemble the DC iris lens.2) Open adjustment jig program and connect the communication.3) Press the bad pixel correction button.4) When adjustment completion message is displayed, proceed to the following process.


ERROR

EQUIPMENT AND JIG

ADJUSTMENT METHOD

CAM EE

DC IRIS AUTO ADJUSTMENT

IRIS VIBRATION, FULL SCREEN.

PC,W/FORM MONITOR, VIEWER



ERROR

EQUIPMENT AND JIG

ADJUSTMENT METHOD

CAM EE

BAD PIXEL AUTO CORRECTION FUNCTION

BAD PIXEL NOT CORRECTION

WAVE FORM MONITOR, MONITOR




3-7

5-5. TTL OR RS485 COMMUNICATION TEST

1. Check whether TTL or RS485 communication is executed well.

2. Test method1) Connect the RX and TX of CN601 to the communication port of the PC.2) Execute the LS900’s jig program on the PC.3) Turn on the Connect button and press the key port to prepare for communication.4) Press the Insert button to check whether OSD is displayed.

3. LS900’s adjustment program


ERROR

EQUIPMENT AND JIG

ADJUSTMENT METHOD

CAM EE

TTL OR RS485 COMMUNICATION TEST

NOT COMMUNICATED

TEST JIG OR PC, MONITOR




3-8

5-6. ALARM AND MULTI-FUNCTION TEST

1. Alarm function : Function to notify external equipment when object is detected in screen while motion detec-tion function in effectAs the external output port, high signal is sent when an object is detected.

EXTD/N function : Function to operate Day and Night function by receiving external input.

2. Test method1) Alarm function

Turn on the Motion Detection function from the Main Menu of OSD.Change the luminance of the screenWhen there is a change in the luminance of the screen, the motion detection is displayed and then checkwhether the LED is turned on at the jig.

2) EXT-D/N functionSet the Day/Night function to EXT.Press the EXTD/N button on the jig. Check whether the Day <--> Night condition has changed on the screen.

5-7. MULTI-LANGUAGE OSD TEST

1. Multi-language OSD function: Multi-language OSD through button operationMulti-language OSD type: English, Chinese

2. Test method1) OSD test

Move the cursor to the main menu.Press the right button to check whether the OSD is switched.

2) Shipment OSD fix after test completionSet the initial OSD of PR, test the OSD language and ship the product.


ERROR

EQUIPMENT AND JIG

ADJUSTMENT METHOD

CAM EE

TO TEST FOR ACCURATE REALIZATION OF ALARM AND EXT-D/N FUNCTION

ALARM AND EXT-D/N FUNCTION NOT OPERATING

TEST JIG



ERROR

EQUIPMENT AND JIG

ADJUSTMENT METHOD

CAM EE

WHEN SHIPPED IN MULTI-LANGUAGE OSD, SET THE OSD TO THE PR

MULTI-LANGUAGE OSD CANNOT BE SWITCHED.

TEST JIG




3-9

TROUBLESHOOTING GUIDE

1. PICTURE DEAD(IN CASE OF LS901, LS902, LS903.)

YES

YES

YES

NOCheck the Power

NOCheck the IC800,IC801.

NOCheck the IC803,IC808.

NOCheck the IC806.

Is the VCC (15V,-8.5V,9V,3.3V ) right?

Is the CSP VCC (5V,3.3V,1.8V,9V) right?

Is the XRST (IC805:R995, IC809:17PIN) right?

Is Video Out right.

YESNO

Check the X-TAL OR IC805.Is Frequency (X800 XTAL_OUT) right.

YES

NOCheck the IC705 (AFE).

Is AD0 ~11 (IC705 1PIN~9PIN,34~36PIN)right?

YES

Check the CCD(IC704 8PIN).

2. EXTERNAL SYNCHRONISM IS NOT OPERATED

YES

YES

YES

NOCheck the Adaptor.

NOCheck the OSD.

NOCheck the Photo coupler (P102.P202)

NOCheck the Connector (CN803,CN500)

Is the AC Adaptor right?

Is the OSD (SPECIAL -> LL) right?

Can you see the VD Pulse at CN102(10pin)?

Is Sync (IC805 B19pin) right?

YESNO

Check the PLL_AVDD,PLL_AVSS.Is PLL_SEL(IC805 G19pin) right?

YES

Check the LPF (CCD Board).



3-10

3. POWER IS NOT OPERATED (DC12V/AC24V)

YES

YES

YES

NO Check the Fuse(F101),line filter(L101) and bridge diode(D112)

NOCHECK the Q106 and D101

NOCheck the Oscillator IC101(7)

Power board trouble(DC output is not)

Is the Rectified voltage is good?(Around 7V ~ 30V DC )

Is the VCC voltage at IC101(7) more than 5V?

Is the output of IC101(6) good?

YES

Check the IC101 and its around.Replace Component with trouble.



3-11 3-12

• WAVEFORM

1)

IC704 Pin1,V1V:2V/Div , H:20µsec/Div

2)

IC704 Pin2,V3V:2V/Div , H:20µsec/Div

3)

IC704 Pin3,V2AV:2V/Div , H:20µsec/Div

4)

IC704 Pin4,V2BV:2V/Div , H:20µsec/Div

5)

IC704 Pin8,V OUTV:200mV/Div , H:20µsec/Div

6)

IC704 Pin12,SUBV:5V/Div , H:20µsec/Div

7)

IC704 Pin14,RGV:5V/Div , H:20µsec/Div

8)

IC704 Pin15,H1V:2V/Div , H:20µsec/Div

9)

IC704 Pin16,H2V:2V/Div , H:20µsec/Div

10)

IC705 Pin13,ADCKV:2V/Div , H:100nsec/Div

11)

IC705 Pin14,PBLKV:1V/Div , H:50µsec/Div

12)

IC705 Pin15,HOPBV:1V/Div , H:50µsec/Div

13)

IC705 Pin16,SP1V:2V/Div , H:50nsec/Div

14)

IC705 Pin18,SP2V:2V/Div , H:100nsec/Div

15)

IC705 Pin21,CDS_INV:500mV/Div , H:100µsec/Div

1)

IC809 Pin23,CPU INTRV:2V/Div , H:5msec/Div

2)

IC809 Pin24,CPU VDV:2V/Div , H:5msec/Div

3)

IC809 Pin25,CPU WVV:2V/Div , H:10msec/Div

4)

IC809 Pin50,CPU SRDV:2V/Div , H:10msec/Div

5)

IC809 Pin59,CPU RDV:2V/Div , H:10msec/Div

7)

IC809 Pin66,CPU CSV:2V/Div , H:10msec/Div

6)

IC809 Pin65,CPU FLDV:2V/Div , H:10msec/Div

8)

IC809 Pin96,D15V:2V/Div , H:10msec/Div

9)


10)


11)


12)

IC806 Pin2,OUTV:1V/Div , H:20µsec/Div

1)

IC101 Pin6 OUTV:5V/Div , H:5µsec/Div

2)

IC101 Pin4 RC_OSCV:1V/Div , H:10µsec/Div

3)

T101 Pin3V:200mV/Div , H:5µsec/Div

4)

T101 Pin4V:500mV/Div , H:5µsec/Div

5)

T101 Pin9V:10V/Div , H:5µsec/Div

1. CCD PART

3. POWER PART

2. CSP PART



3-13 3-14

BLOCK DIAGRAMS1. CCD BLOCK DIAGRAM

8 7 6 5 4 3 2 1

9 10 11 12 13 14 15 16

Cy

Mg

Cy

G

Cy

Mg

Ye

G

Ye

Mg

Ye

G

Cy

Mg

Cy

G

Cy

Mg

Ye

G

Ye

Mg

Ye

G

Ver

tical

Reg

isto

r

Horizontal Registor

VO

UT

NC

GN

D

VL

V2B

V2A

V3

V1

VD

D

NC

GN

D

SU

B

CS

UB

RG

HØ

1

HØ

2

GND50AD1249AD1148AD1047AD946AD845AD744GND43AD642AD541AD440AD339AD238AD137GND365V35

3.3V34AGND333.3V32

AGND3115V30

AGND29-8.5V28SHD27SHP26

HOBP25PBLK24

ADCLK23SDAT22SCK21CS20H219H118RG17XV416GND15XSG214XV3GND12XSG111

10XV29GND8XSHT7GN6

54

D/N139V(MOTOR)2

1CN

13

XV1

GND

D/N2D/N3

GNDCN701701

1

2

3

4

5

6

7

8

10

9

11

12

13

14

15

16VSS

OFDX

V2X

V1X

VH1AX

V3X

VH3AX

V4X

V3A

V4

VME

V1A

V2

VL

POFD

VH

M_OUT2216

15

14

13

12

11

10

9

8

7

6

5

4

3

2

1

CN70

M_OUT22

M_OUT22

M_OUT22

M_OUT21

M_OUT21

M_OUT21

M_OUT21

M_OUT12

M_OUT12

M_OUT12

M_OUT12

M_OUT11

M_OUT11

M_OUT11

M_OUT11

CN7000

20

17

21

22

13

16

18

23 25 26

31

30

29

15

14

DifferentialCode

12bitADC

PGA

Clamp

CDS

Timing

Generator

V_ref Bias

Serial

Comm

ADC_in

CDS_in

FBC

SHC

ADCLK

SP1

SP2B

ias

VR

T

VR

B

14

13

12

11

10

9

8

1

2

3

4

5

6

7

ControlLogic1

ControlLogic2

PowerSave

DRIVER1

DRIVER2

TSD

SUB

OUT12

VM1

VCC

IN3

VM2

OUT22

PGND1

OUT11

IN1

GND

IN2

OUT21

PGND2

AD1~AD12

CDS_CS, CDS_DATCDS_CLK, SHD,SHPHOBP,PBLK,ADCK

XV1,XV2,XV3,XV4XSG1, XSG2,

XSHT

H1

INVERTER

RG

INVERTER

H1

INVERTER

H2

RG

H2

V1

V2

V3

V4

3.3V

15V

-8.5V

-8.5V

15V

15V

D/N1, D/N2, D/N3

D/N1, D/N2, D/N3

9V

CCD_OUT

CCD_OUT

3.3V

5V

5V

5V

5V

3.3V

SUB

IC70

4IC

X21

2/21

3

IC703BA6846FV IC705

HD49343NP

IC706HT82V805

Connector to CSP

Connector toD&N Module

IC70274LVC1G14

IC70174LVC1G14

IC70074LVC1G14

VL

24

AV

DD

AV

ss

DV

DD

DV

ss

D0 to D11

PBLK

OBP

CS

Sdata

SCK



3-15 3-16

2. CSP BLOCK DIAGRAM

GND509V(MOTOR)49

D/N148D/N247D/N346GND45XSHT44GND43XV242XV141

XSG140GND39XV338

XSG237GND36XV435RG34H133H232CS31

SCK30SDAT29

ADCLK28PBLK27HOBP26SHP25SHD24-8 .5V23AGND2215V21

AGND203.3V19

AGND183.3V175V16

GND15AD114AD213AD312AD411AD510AD69GND8AD77AD86AD95

AD104AD113AD122GND1

Pin NameNo.CN800

GND509V(MOTOR)49

D/N148D/N247D/N346GND45XSHT44GND43XV242XV141

XSG140GND39XV338

XSG237GND36XV435RG34H133H232CS31

SCK30SDAT29

ADCLK28PBLK27HOBP26SHP25SHD24-8 .5V23AGND2215V21

AGND203.3V19

AGND183.3V175V16

GND15AD114AD213AD312AD411AD510AD69GND8AD77AD86AD95

AD104AD113AD122GND1

Pin NameNo.CN800

ResetIC

GND10

E8_RESET9

E8_TXD8

E8_BUSY7

VCC_5V6

E8_CE5

E8_RXD4

E8_EPM3

E8_CNVSS2

E8_SCK1

Pin NameNo.

CN802

GND10

E8_RESET9

E8_TXD8

E8_BUSY7

VCC_5V6

E8_CE5

E8_RXD4

E8_EPM3

E8_CNVSS2

E8_SCK1

Pin NameNo.

CN802

GND40

GND39

GND38

SW_0137

GND36

SW_0535

CVBS_OUT34

SW_0833

GND32

SW_0931

GND30

SW_1029

GND28

SW_1227

GND26

SW_1325

GND24

SW1623

GND22

SW_RIGHT21

GND20

SW_CENTER19

GND18

SW_UP17

GND16

SW_DOWN15

GND14

SW_LEFT13

GND12

3.3V11

AGND10

3.3V9

AGND8

15V7

AGND6

-8 .5V5

AGND4

9V3

AGND2

9V1

Pin NameNo.

CN803

GND40

GND39

GND38

SW_0137

GND36

SW_0535

CVBS_OUT34

SW_0833

GND32

SW_0931

GND30

SW_1029

GND28

SW_1227

GND26

SW_1325

GND24

SW1623

GND22

SW_RIGHT21

GND20

SW_CENTER19

GND18

SW_UP17

GND16

SW_DOWN15

GND14

SW_LEFT13

GND12

3.3V11

AGND10

3.3V9

AGND8

15V7

AGND6

-8 .5V5

AGND4

9V3

AGND2

9V1

Pin NameNo.

CN803

Clo

ckG

ener

ator

Com

man

dD

ecod

er

BA

NK

A~

D

Row Decoder

Col

umn

Dec

oder

Latch Circuit

I/OBuffer

Dat

a C

trl

Circ

uit

CLK

CK

E

AD

DR

CS

DQ

M0~

3R

AS

CA

SW

E

Con

trol

Lo

gic

DQ

6dB Amp

AND Gate

OP Amp IC812

NJM3414AM

OP AmpIC811

NJM3414AM

RS-485Communication

Block

IC804M12L64322A

HVGenerator

EEPROMArrayPage

Latches

YDEC

Sense Amp.R/W Control

XDECMemoryControlLogic

I/OControlLogic

Timer(16bit)

Output(timer A):5Input(Timer B):6

Three-phase motorControl circuit

A/D Converter(10bits X 8channels

Expandable up to 26 chnnels)

UART of Clock synchronous I/O

(8bits X 3 channels)

CRC arithmetic circuit(CCITT)

Watchdog timer(15bits)

DMAC(2 channels)

D/A Converter(8 bits X 2 channels)

System ClockGeneration circuit

XIN-XOUTXCIN-XCOUT

PLL frequency synthesizerOn-chip oscillator

Clock synchronous I/O(8 bits X 2 channels)

R0H R0LR1LR1H

R2R3

A0A1FB

A0A0

SB

INTBPCFLG

ROM

RAM

Multiplier

M16C/60 series 16-bit CPU core Memory

Internal peripheral fuctions

Port P0 Port P1 Port P2 Port P3 Port P4 Port P5 Port P6

Port P

7P

ort P8

Port P

8_5P

ort P9

Port P

10

Port P11 Port P14 Port P12 Port P13

8 8 8 8 8 8 8

87

88

8 2 8 8

<VCC2 Ports> <VCC1 Ports>

<V

CC

1 Ports>

<VCC2 Ports><VCC1 Ports>

5V3.3V

15V

-8.5V

9V

3.3V

15V

-8.5V

9V3.3V

SDRAM_ADDR 0~10

SDRAM_DQ 0~31

WE

CS

CAS/RASBA0~BA1

SDRAMDQ0 ~ DQ31

SDRAM Block

ADDR0 ~ ADDR10

DQM0~DQM1SDRAM_WESDRAM_CS

SDRAM_CAS, RASSDRAM BA0~BA1

SDRAM_CLK DQ0 ~ DQ15

MCU Block

ADDR0 ~ ADDR15

CPU_CTRL_SIG

AFE Block

VIDEO_IN0~IN11

SHD, SHPHOBP, PBLK,CLPDM

ADCKCDS_DATCDS_CLKCDS_CS

CCD TG

XH1, XH2, XRG, XV1~4, XSG1, XSG2, XSHT

X-TAL V OUT

DIGITAL OUT

GPIO

IRISPLL

GND

RST

CLKDQM 0~1

CP

U_

AD

DR

0~

15

CP

U_

DQ

0~

15

CLK

MCU DOWNLOAD CONNECTION

EEPROM CLK

EEPROM DATA

3.3V

AGND20AGND19AGND18V_OUT17AGND16AGND15GND145V13GD12RX11

GND10TX9

8COM7GND6

MOTION5GND4

EXT D&N3GND2GND1

Pin NameNo.CN801

AGND20AGND19AGND18V_OUT17AGND16AGND15GND145V13GD12RX11

GND10TX9

GND8COM7GND6

MOTION5GND4

EXT D&N3GND2GND1

Pin NameNo.CN801

RESET

V_Out

FUNCTION KEY

IRIS_OUT

9V

5V

V_Out

CrystalNT : 28.636MHzPAL : 28.375MHz

SHD, SHP,HOBP,PBLK,ADCLK,SDATSCK,CS

AD7~AD12AD1~AD6

H2, H1, RG, XV4, XSG2, XV3

XSG1, XV1, XV, 2X, SHT

IC981S24CS16A

IC809M30626FHPFP

IC805LGDM2001

IC80874HC1G08GW

RS-232C Option Resistor

RS-232C Option ResistorRegulator

3.3V to 1.8V

Regulator

9V to 5V

3.3V1.8V 9V5V

IC800LD1117A

IC80178L05

Connector to Key Board

Connector to I/F Board

Connector to MCU Downloader

Connector to CCD Board X800

IC803KIA7029

IC806 TK15405



3-17 3-18

3. POWER BLOCK DIAGRAM



3-19 3-20

CIRCUIT DIAGRAMS 1. CCD CIRCUIT DIAGRAM

A

1

2

3

4

5

6

7

8

9

10

11

12

B C D E F G H I J K L M N O P Q R S T



3-21 3-22

2. CSP_DSP CIRCUIT DIAGRAM

A

1

2

3

4

5

6

7

8

9

10

11

12




3-23 3-24

3. CSP_MCU CIRCUIT DIAGRAM

A

1

2

3

4

5

6

7

8

9

10

11

12




3-25 3-26

4. KEY CIRCUIT DIAGRAM

A

1

2

3

4

5

6

7

8

9

10

11

12




3-27 3-28

5. IF CIRCUIT DIAGRAM

A

1

2

3

4

5

6

7

8

9

10

11

12




3-29 3-30

6. POWER CIRCUIT DIAGRAM

A

1

2

3

4

5

6

7

8

9

10

11

12




3-31 3-32

PRINTED CIRCUIT BOARD DIAGRAMS1. CCD P.C. BOARD DIAGRAM

( BOTTOM VIEW )( TOP VIEW )



3-33 3-34

2. CSP P.C. BOARD DIAGRAM( BOTTOM VIEW )( TOP VIEW )



3-35 3-36

3. KEY P.C. BOARD DIAGRAM( BOTTOM VIEW )( TOP VIEW )



3-37 3-38

4. IF P.C. BOARD DIAGRAM( BOTTOM VIEW )( TOP VIEW )



3-39 3-40

5. POWER P.C. BOARD DIAGRAM( BOTTOM VIEW )( TOP VIEW )



Lg Ls902p b Ls903p b

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