Intelligent Solutions BVBATogether we reach the goal

http://www.intelligentsolutionsbvba.com

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Organization

CaliforniaBelgium

Shanghai

Singapore

Japan

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Morocco

Confidential

Key Members

CEO: Dr. Hany Fahmy (EMEA)

• Director of SI/PI/EMC Engineering of NVIDIA• Sr. Manager and Sr. Staff of Memory Architecture Group of Intel• WW Business Development Manager for High Speed Digital and RF

Technology of Agilent

Sr. Engineer: Vincent Yan (Asia) • Sr. SI and EMI engineer of NVIDIA• Sr. SI and EMI engineer of EMC2

Sr. Engineer: Kevin Cai (Asia) • Sr. SI and EMC engineer of GE

Sr. Engineer: Stevin Shen (Asia) • Sr. SI and EMC engineer

Sr. Engineer: Ahmed Zahid (Morocco) • Sr. SI/PI/EMC engineer LEAR Corporation

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Who is Hany Fahmy?

More info pls. Click Here

A Director and Technologist of Signal Integrity and Electromagnetic Compatibility with a wide experience in design and analysis of High-Speed Digital and Analog interconnects (Memory, Ethernet Backplanes, PCI-e, DVI/HDMI/LVDS/DP and USB).

Innovative interconnect & High-Speed-Digital architect for I/O buffer design/modeling and electrical characterization of signal interconnects in the microwave/mm-wave frequency range.

Group manager for SI/PI/EMC teams designing Smartphones/Tablets, GPU-cards and memory products chartered to simulate, model and lab characterize advanced high speed digital solutions.

Expertise in designing Embedded, Mobile and Server platforms for complex CPU/GPU’s, chipsets and FPGAs with Synchronous Buses like DDR1/2/3, GDDR3/5, and SERDES interfaces. Dedicated, results-oriented and customer satisfaction are top priorities. A crucial player in JEDEC DDR1/2/3/4 and UHS-II for the development of SDRAM electrical & DIMM specifications.

Watch my Seminar at IMEC Academy: The European Silicon Valley

Holder of Nine-Patents & Many Publications @ DesignCon & IEEE-AP, IEEE-MTT, …etc.

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Top Happy Customers

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Happy Customers work

Broadcom: High-speed Ethernet design guideline & EMC solution space for Infotainment systems

GE-Intelligent Platforms: Single-Board-Computer System high-speed-digital interface design special focus on DDR3/4 memory, PCIE-GEN3, USB 3.0 & 10GBps Ethernet.

SanDisk: SiP design of MCH-die talking with multiple SDRAM-dies

3D-Plus: 3D-Package design for DDR2/3 Memory interface (SDRAM package integration)

Nvidia: RF-Antenna & Digital-2-RF coupling on Tegra3/4 Smartphones.

Comtel: CPU Module & Ethernet-Backplane beyond 10GBps

Avago: EMI suppression techniques for Optical-Transciever design

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Our Partners

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Kuljit Bains : Sr. memory

Architect and JEDEC rep

Paul Fahey: Dr. of PMO

(platform memory

operation)

VNA & TDR & 3m

EMI-pre-compliance

EMI-lab: 5m &

10m chambers

EMC

PCB layout

Tommy Lee Sr. VP

Ross Jatou Sr. Director

Charlie Shu Sr. SI/EMC Manager

Romi Mayder: Sr.

TME (Techncial

Marketing Engineer)

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Standardization Committees

JEDEC – Bill Gervasi ( x-Chairman)

PCIe-GEN3 – Mike Mirmak & Arpad Muranyi

UHS-II: Max Perri (Chairman)

USB 3.0

IEEE 803.3ba

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DevelopGuidelines

Our Expertise

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10%

Confidential

Fast Debug & Root Cause

Get failure data

Locate the suspect

Verify and analyze by sim. & meas.

Optimization in simulation

Achieve the Goal Successfully

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RX

TX

Failed Overdesign

Puzzled !

Solutions For Cost-Down

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Develop Guidelines

SAS

SATA

PCIe

Ethernet

DDR EMI

BP InterconnectSmart phone

DVI/DP/HDMI Package

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Build Team and SI/PI/EMC Process

New to SI/EMI

WorldRamp up

Handle general

projectTo be Experts

EMEA & China & India & Morocco

local support

Face to face mentor

Face to face discussion

Advanced training

Experience sharing

10+ years mentor

10+ years team managing

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Training

Fundamental

Circuit Simulation Measurement

Advanced

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Success Hall-Fame Click-Here for Outlook of Success Stories

• 10G Ethernet Back plane root cause and optimization for current and next gen product

• DDR2/3 package XTALK root cause and optimization• DDR2/3 PCB routing and termination root cause and

optimization• DDR2/3 power deliver network root cause and

optimization• Decoupling cap optimization for cost down project• EMI package issue root cause• EMI connector issue root cause• EMI board issue root cause• Smartphone antenna design and XTALK issue root cause

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