iNEMI 2011 Roadmap, Medical/Auto PEG European Webinar -...
47
iNEMI 2011 Roadmap, Medical/Auto PEG European Webinar - Introduction Chuck Richardson March 19, 2010
Transcript of iNEMI 2011 Roadmap, Medical/Auto PEG European Webinar -...
iNEMI 2011 Roadmap,
Medical/AutoPEG European
Webinar -Introduction
Chuck RichardsonMarch 19, 2010
1
Some Definitions…
• TWG - Technology Working Group
– Develops the roadmap technology chapters
– Presently 21 groups
• PEG – Product Emulator Group
– ―Virtual Product‖: future product attributes plus key cost and density drivers
• Portable / Consumer
• Office / Large Business Systems
• Netcom Systems
• Medical Products
• Automotive
• Aerospace & Defense
2
Product
Needs
Technology
Evolution
GAP
AnalysisResearch
Projects
Methodology
Competitive
Solutions
Roadmap
Industry Solution
Needed
Academia
Government
iNEMI
Members
Collaborate
No Work
Required
Available
to Market
Place
Global
Industry
Participation Disruptive
Technology
33
2009/11Product Emulator Groups
Product Emulator Chair(s) 2009 Chair(s) 2011
Automotive Products Jim Spall, Delphi Jim Spall
Medical Products Anthony Primavera, Boston Scientific
Anthony Primavera, Micro Systems Eng. Bill Burdick, GE Research
Consumer / Portable Products Susan Noe, 3M Shahrokh Shahidzadeh, Intel
Office/Large Business System Products
David Lober, Intel David Copeland, Sun
David Lober, Intel
Network, Data, Telecom John Duffy, Cisco Need Chair
Aerospace/Defense William Murphy, Lockheed Martin Mradul Mahrotra, Raytheon
4
Roadmap Development
Product Emulator GroupsTWGs
Med
ical P
rod
ucts
Au
tom
oti
ve
Defe
ns
e a
nd
Aero
sp
ace
Semiconductor Technology
Design Technologies
Manufacturing Technologies
Comp./Subsyst. Technologies
Modeling, Thermal, etc.
Board Assy, Test, etc.
Packaging, Substrates, Displays, etc.
Product Sector Needs Vs. Technology Evolution
Business Processes
Prod Lifecycle Information Mgmt.
Po
rta
ble
/ C
on
su
mer
Off
ice / L
arg
eS
yste
ms
Netc
om
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2011 Technology Working Groups (TWGs)
Organic PCBBoard
Assembly Customer
RF Components &
Subsystems
OptoelectronicsLarge Area, Flexible Electronics
Energy Storage &
Conversion Systems
Modeling, Simulation,
and Design
Packaging &
Component
SubstratesSemiconductor
Technology
Final
Assembly
Mass Storage (Magnetic & Optical)
Passive Components
Information
Management
Test, Inspection &
Measurement
Environmentally
Conscious
Electronics
Ceramic
Substrates
Thermal
Management
Connectors
MEMS/
Sensors
Red=Business Green=Engineering Blue=Manufacturing Blue=Component & Subsystem
Solid State Illumination
Photovoltaics
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2011 Preliminary Roadmap Schedule
• 3Q2009: Recruit Product Sector Champions, teams and refine data
charts/Begin 2011 Roadmap Newsletter & send 2009 PEG chapters 8/1/09
• 3/4Q09: Product Sector Champions Develop Emulators
– September 9, 2009 – Teleconference with P.E. Group Chairs
– September 17, 2009 Web based meeting TWG/PEG Chairs (key attributes)
– October 9, 2009 - Roadmap PEG Kick-off with PEG/TWG/TC at SMTAI
– January 8, 2010 – Web based Teleconference with TC on PEG Emulator review
• 2009 ―Word‖chapter, format, Exec. Summary emailed to each TWG chair
(Word) 1/4/2010
• Organizing Teleconference with TWG Chairs 1/11/2010:
• February 23-24, 2010 PEG Workshop/TWG Kick-off CA:
– Product Sector Tables Complete – PEG Chapter rough drafts written
– Cross cut issues are initially addressed
• March 19, 2010 European Webinar on Auto, Medical PEG Review
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2011 Preliminary Roadmap Schedule - Continued
• April 9, 2010 TC/PEG/TWG face to face chapter status review meeting at
APEX
• May 6, 2010 Telecon With TWG Chairs, Preliminary PEG Chapters Due
• June 1, 2010 – N.A. Roadmap Workshop at ECTC, Las Vegas, NV
• June 16, 2010 European Roadmap Workshop – IMEC, Leuven, Belgium
• June 8, 2010 – Asian Roadmap Workshop – TPCA, Taiwan
• July 1, 2010 – TWG Drafts Due for TC Review
• August 4, 2010 – TC Face-to-Face Review with TWG Chairs at TBD
• September 22, 2010 Final Chapters of Roadmap Due
• October , 2010 Council of Members Briefing SMTAI
• October 31, 2010 – Edit, Prepare Appendix A-D, Executive Summary
• November 20, 2010 – Go To ―Press‖
• December 5, 2010 – Ship to Members
• April, 2011 – Industry presentation at APEX
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Optoelectronics and
Optical Storage
Organic Printed
Circuit Boards
Magnetic and
Optical Storage
Supply Chain
Management
Semiconductors
iNEMI
Information
Management
TWG
iNEMI
Mass Data
Storage TWG
iNEMI / IPC / EIPC
Organic PWB
TWG
iNEMI / ITRS /
MIG
Packaging
TWG
iNEMI
Board Assembly
TWG
Interconnect
Substrates—Ceramic
iNEMI Roadmap
iNEMI
Optoelectronics
TWG
Ten Contributing Organizations
iNEMI / MIG
/ ITRS
MEMS
TWG
iNEMI 2011 Roadmap,
AutomotivePEG European
Webinar
Jim Spall, Delphi
March 19, 2010
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Automotive Product Emulator
• Situation Analysis
– Business Issues
• Reduced North American volume in 2009 (worst year in 30
years)
– Over capacity in North America resulted in the bankruptcy
of GM and Chrysler
– Many assembly plants were closed to adjust to the lower
volume in North America
– Permanent shift away from trucks and large SUV’s
» Reduced content because these vehicles carried high
option content
– 200 U.S. suppliers permanently closed in 2009
– 60 U.S. suppliers went bankrupt in 2009
Automotive Product Emulator
– Business Issues
• Western Europe sales tracking at a full-year rate near 14.7 million
units for 2009
– 2010 volume could be reduced to 13.7 million units
» Western Europe’s patchwork of 12 scrappage programs are
ending
» Germany and Italy have ended their versions
» France and Britain are phasing out theirs
» Spain’s remains in place, but economy is too weak for that
to make much of a difference
– 2008 volume was 15.4 million units
• Japan sales declined to the lowest level in 38 years (2.9 million
units)
• China exceeding the U.S. in auto output in 2009 (12 million units)
– Up 34 percent from a year earlier
Automotive Product Emulator
• Increased Corporate Average Fuel Economy to 35.5 mpg by 2016
– Downsizing of engines and increased use of Gas Direct
injection
– Increased use of turbo-charging
– Researchers project 14 million electrified vehicles annually by
2020
» 1.5 million full Electric Vehicles (EV)
» 1.5 million Plug-in Hybrid Electric Vehicles (PHEV)
» 11 million Hybrid Electric Vehicles (HEV)
» Volume will based on operating cost, carbon benefits,
range limitations, cost of fuel and government incentives
for EV sales
13
Automotive Product Emulator
– Technical Issues
• Shift to Hybrid Electric Vehicles (HEV), Plug-in Hybrid Electric
Vehicles (PHEV), and Electric Vehicles (EV)
– Invention required to reach the battery cost target of $250/kWh
» Today’s cost $1,000 -$1,200/kWh
– Key components that are in need include: power devices, bulk
capacitors, inductors and transformers, cooling structures,
motor drive microprocessors, high current connectors, current
sensors, gate driver ICs, battery management ICs, busbars,
and enclosures.
• Increased use of MEMS in automotive
– Accelerometers
– Gyroscopes
– Pressure
– Air Flow
Automotive Product Emulator
• 12.3 inch reconfigurable displays for the instrument panel
• LED lighting used internal and external lighting
• Connected Vehicle
– Key Drivers: cost, reliability, size
• Cost is still the main key driver for automotive
– Competitive cost will get you an opportunity to win a program
• Reliability is a given in the automotive sector
– Failure to deliver will result in no future business
– Toyota situation will test its loyal customer base
• Size is a benefit because some vehicles having 100 electronic
controllers and space is limited
Automotive Product Emulator
– Chart 2009 vs. 2011 forecast differences
• Circuit board – use of 8 layer with blind vias
• Lower memory prices in 2011 version
• Increased use of MEMS sensors (Identified the types being used
in the emulator)
• The use of 0201 components in the future
• Higher resolution and larger displays being used (12.3‖ displays
for the instrument cluster)
• Nand Flash used for Hard Drive emulation
• Increased use of Built In Self Test (BIST) and Boundry Scan
• Quicker conversion to lead free solder
• Greater thermal demands due to the electrified vehicle
Automotive Product Emulator
• Critical (Infrastructure) Issues –
– Identify Paradigm Shifts
• The shift to electrified vehicles
• The connected vehicle
• The use of reconfigurable displays
– Provide Vision of Final Assembly Process
• Varied - dependent on the type of product (sealed underhood
versus unsealed passenger compartment)
– Discuss System Test
• More in depth to eliminate problems in the field
• Example – Toyota Prius brake issue
– Discuss Environmental Issues
• Lead free conversion occurring sooner than expected
Automotive Product Emulator
• Prioritized Technology Requirements and Trends: Research,
Development, Implementation
– Components related to the Electrified Vehicle
• Lower cost batteries ($250/kWh)
• Improved thermal interface materials
• Improved power devices, capacitors, inductors, tranformers, battery
management ICs, gate drive ICs
– Infrastructure for Electrified Vehicles
• Limits to energy storage
• Long recharging times
• Updated electrical grid
• Contributors
– Many engineers at Delphi
iNEMI 2011 Roadmap,
AutomotivePEG European Webinar Q & A
Jim Spall, Delphi
March 19, 2010
iNEMI 2011 Roadmap,
MedicalPEG European
Webinar
Anthony Primavera, Biotronik
March 19, 2010
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Medical Market
• United States
– 65+ year old population = 40M (2009)
• Global
– 65+ year old population will triple by 2050 .. from 516M (2009)
to 1.53B (2050)
– 80+ year old population will increase from 40M (2009) to 219M
(2050)
• Currently, the U.S. spends 1.75 Trillion dollars … 15% of
2009 GDP … 25% of GDP 2015
• It is estimated that current annual spending on medical
devices / electronics is 70 to 100 Billion dollars
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Variation in Sector
1) Implanted products (devices implanted in a human body)• Strict regulatory procedures
• Driven by battery life (low power loss) – this limits the use of certain components such as DRAM due to high energy consumption
• Validation and traceability
• Long term reliability paramount
• Long development cycles, primary assembly and design by OEMs
2) Portable products (devices that are easily transported) • Cost parity with consumer / portables
• Dynamic market, needs fast response … 9 to 24 month product cycle time
• Mixed regulatory environment
• Mostly outsourced assembly and design (SEA)
• Diagnostic Ultrasound in PDA size .. and smaller .. form factors
3) Diagnostic imaging devices and large scale equipment, e.g., MR, CT• Larger scale (often similar to servers or telecom equipment)
• Often requires thermal management and heat sinking
• Utilizes commercial off-the-shelf components, when available
• Development cycle is shorter than implantables
• Application and design well suited to EMS environment
• Often does not require clean room or sterile assembly floor
Since the product types within the sector are varied, medical products were grouped into three general categories.
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Stents
PTCA Systems
IntravascularBrachytherapy
Atherectomy
Diagnostics
Glucose
Thermometers
Telemedicine
Home Health Care
Areas of Opportunity in Medical Market
Pacemakers
AICDs
Leads
AblationCatheters
Pacemakers
AICDs
Leads
AblationCatheters
AAA Systems
PeripheralStents
Neurovascular
AAA Systems
PeripheralStents
Neurovascular
ENDO--
VASCULAR
SOLUTIONS
Beating Heart BypassSurgery
Minimally-Invasive
Vein Harvesting
Beating Heart BypassSurgery
Minimally -Invasive
Vein Harvesting
-
CARDIACCARDIAC
SURGERYSURGERY
EQUIPMENT
FOR
SURGERY
DATA TRANSFER AND ANALYSIS
IMPLANTABLE
PRODUCTS
Pacemakers
AICDs
Leads
Cochlear devices
Pin and drug
PERSONAL
HEALTHCARE
Beating Heart BypassSurgery
Minimally-Invasive
Vein Harvesting
Beating Heart BypassSurgery
Minimally -Invasive
Vein Harvesting
-
DIAGNOSTIC
AND
MONITORING
AAA Systems
Peripheral Stents
Neurovascular
Beating Heart
Bypass
Surgery
Minimally
Invasive Vein
Harvesting
MRI
Sonogram
EKG, EMG
Blood
Analyzer
2323
Medical PEG: 2011 Chapter Focus
• Emerging markets expected to have double digit growth.
• Focus on lower cost diagnostic equipment for developing
nations and rural areas.
• Regional assembly, design and distribution expected to
increase in India and China.
• High Growth of Tele-Medicine using multi functional portable
devices.
• Continued migration from prescriptive to preventive medicine
will drive increase in portable/wearable medical monitoring
devices.
• Unknown business implications and potentially increased
regulatory changes could materialize if health care reform
legislation is enacted.
Market Environment and Economics Of Medical Electronics Market
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Medical Market
• Market Size, Electronics Revenue
• 2006: 62.5 B$, 2007: 69.1B$, 2008: 75.6B$ … 9.4% Change
Medical Electronics Revenue
0
2
4
6
8
10
12
14
16
18
20A
bbot
Labora
tories
Agilent Life
Scie
nce
GE
Healthcare
Hoffm
an-L
a
Roche L
td
Philip
s
Medic
al
Syste
ms
Sie
mens
Medic
al
Solu
tions
Toshib
a
Medic
al
Syste
ms
Varian
Medic
al
Syste
ms
Company
Reven
ue in
Billio
ns $
2006
2007
2008
Source: 2010 - G Dan Hutcheson
weSRCH.com
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Another Estimate of Market Size
$0
$20
$40
$60
$80
$100$Bn
GEOGRAPHIC DISTRIBUTION
Americas
$66Bn
5% of
Electronics Industry
2007
4.1% CAAGR2007-2013
$84Bn
$60Bn
$66Bn
54%
Japan
8%
Europe
25%
Asia/ROW
13%
0%
10%
20%
30%
40%
50%
60%
70%
2006 2007 2008 2009 2010 2011 2012 2013
ls108.273mw-med revPrismark
Overall market is approximately 70B$ (Non-IT), growing at a predicted 4.1% per year
Note: Tony’s opinion is this is still too low a predicted growth rate.
Prismark
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Market Observations
• Many market size predictions include mostly large scale
diagnostic and system equipment suppliers.
– INEMI Medical PEG is not sufficiently represented in market size.
• Revenue from the other market sectors within medical not well
estimated, e.g., implantables
– Medtronic
– St Jude Medical
– Boston Scientific
– Biotronik
– ELA Group 20+ B$ / year
– Cochlear
– Med-el
– Advanced Bionics
– Others
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Sector Overview
• PEG: missing items, suggested changes, et al.
– PCBs: one layer flex is missing, e.g., glucose strips
– PCBS: suggest changing from FR4 and state-of-the-art in technology column to input of actual substrate used.
– Reliability: pressure environment missing (hyperbaric chamber and scuba testing) … implantables
– Reliability: MRI safe, compatibility
– Reliability: bends/folds mechanical robustness
– Business: how to capture regional design / manufacturing for point of use applications.
– Business: capture supply chain leaders in component / PCB area. Maybe a survey of players in each respective market, e.g., who makes 1000+ Volt caps? Or, which companies make HDI flex? … can be part of PEG, TIG or TWG?
28
Trends and Market Drivers in Medical
– Increased health awareness and preventive care leading to an
increased demand for diagnostic and imaging systems.
– Healthcare demands of 78M ―US baby boomers‖, et al. … clinician
shortage, global aging, technology expectations
– Development of higher power systems capable of higher patient
throughput, higher resolution, and a greater ability to discriminating
individual tissue types, et al.
– Medical video imaging … for specific applications
29
Current Market Drivers in Medical
• Implantable therapy devices continue to be a growing market area and have expanded beyond pacemakers and implantable cardioverter defibrillators (ICDs).
• The average YoY growth rate for implantable products has been between 15-18% for the last 10 years.
• A shift towards remote monitoring has increased demand for ―external wireless telemetry‖
Example: An estimated 200,000 patients are currently
enrolled in home / remote monitoring system.
These systems are communication devices that interact
with the implanted device and a host network system.
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Digital Health
• Patient care enhancement- New and Unique Medical Products
- Monitor Systems
- Sensor Technology
- Improved Diagnostics
• Wireless technology for data
transfer - Instant and remote monitoring
- Power transfer by RF
- Off-load computing and data storage
to remote host system, outside the
device.
In the past 10 years, growth, innovation and miniaturization
have lead to major advances in medical electronics
manufacturing and the therapies they deliver.
31
Diagnostic Imaging
• Patient-centric, clinician-centric environment
– Comfort
– Workflow
• Demands for higher resolution maybe abating
• Demands for greater imaging volumes not
abating
• Anatomy defines package volumes
– More bits per cubic inch translates to higher
functional densities
• Portable systems for ―baseline‖ diagnostics
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Example of Differences:
Medical PEG Roadmap Highlights
Dominant US regions: MA, MN, CA, AZ
Dominant EU regions: Ireland and Germany
Dominant SEA regions: Malaysia, Singapore
Future Dominant Regions: China, India
Supply Chain Locations 2009 2011 2013 2015 2021
System Design N.America/Europe N.America/Europe N.America/Europe N.America/Europe N.America/Europe Implantable, (portable and externals mostly Asia)
System Fabrication N.America/Europe N.America/Europe N.America/Europe N.America/Europe N.America/Europe Implantable, (portable and externals mostly Asia)
Processor Design/Fab N.America/Europe N.America/Europe N.America/Europe Asia Asia Implantable, (portable and externals mostly Asia)
Display Design/Fab Asia Asia Asia Asia Asia externals
Memory Subsystems Asia Asia Asia Asia Asia externals
Component Design N.America/Europe N.America/Europe Asia Asia Asia Implantable, (portable and externals mostly Asia)
Board Assembly N.America/Europe N.America/Europe N.America/Europe N.America/Europe N.America/Europe Implantable, (portable and externals mostly Asia)
PCB Fabrication Europe/Asia Europe/Asia Europe/Asia Asia Asia All
Component Procurement N.America/Europe N.America/Europe N.America/Europe N.America/Europe N.America/Europe Implantable, (portable and externals mostly Asia)
Final Product Assembly N.America/Europe N.America/Europe N.America/Europe N.America/Europe N.America/Europe Implantable, (portable and externals mostly Asia)
33
• Example of differences
• Consumer portables are weeks to years; implantables are years
– Heavily influenced by regulatory
– Product qualification time lengthy
– Long production times (Geography Dependant)
Medical PEG Roadmap Highlights
Cycle Time Typical Product/Best Case 2009 2011 2013 2015 2021
Time to add
EMS
Elapsed time for qualified, production
product delivery once a supplier is chosen.
Includes qualified documentation system. Weeks 12 (104) 8 (104) 6 (78) 6 (78) 4 (78)
Externals, (Implantables in
brackets)
NPI Cycle
Time
Elapsed time from alpha proto release to
production release w/ long lead & all alpha
parts available Weeks 16 (104) 14 (104) 12 (78) 10 (78) 6 (78)
Consumer and portable,
(implantable and Class 3
externals in brackets)Product
Production
Life Length of time a product is produced Years 10 9 7 7 7
7 year minimum in some
geographic locations
34
Estimated PCB Needs/Costs
Implantables
PCB Technology (FR4 baseline) Cost 2009 2011 2013 2015 2021 Comments
2 layer flexible $ per cm2 0.25 0.24 0.23 0.22 0.2
Implantable materials,
Connectors, sub-assemblies,
components, etc.
2 layer Rigid $ per cm2 0.025 0.02 0.015 0.012 0.008
Portables, Sensors, sub
assemblies, components
3 layer flex $ per cm2 0.4 0.4 0.35 0.35 0.3
3d packaging, subassemblies,
implantables
4 layer flexible $ per cm2 0.5 0.5 0.45 0.45 0.4 implantables
6 layer flex (with micro vias) $ per cm2 1 0.9 0.85 0.8 0.75 implantables - High Power
4 layer conventional $ per cm2 0.013 0.013 0.013 0.013 0.013 External / Consumer products
4 layer - embedded capacitor / resistor $ per cm2 0.25 0.25 0.23 0.2 implantables
6 layer conventional $ per cm2 0.018 0.018 0.018 0.018 0.018
externals, patient monitoring,
wearables
4 layer w/ microvia $ per cm2 0.18 0.18 0.15 0.12 0.12
implantables, patient
monitoring, wearables
6layer rigid (with micro vias) $ per cm2 0.2 0.2 0.18 0.15 0.15 implantables - low power
6 layer, blind/buried $ per cm2 0.2 0.2 0.18 0.15 0.15 implantables - low power
6 layer - embedded capacitor / resistor $ per cm2 0.3 0.3 0.28 0.2 Implantables
14 layer, no blind/buried $ per cm2 0.45 0.43 0.41 0.39 0.36 Diagnostic, telecom
28 layer, blind & buried vias $ per cm2 1.17 1.1 1.05 1.05 0.95
High end imaging, high speed
telecom, data storage
Wearables
Large Scale
35
Estimated Assembly Costs
Driven by Diagnostic and Externals
Implantables have very special assembly needs
Traceability
Hermetically Sealed
Clean Room Assembly
Assembly Costs Cost 2009 2011 2013 2015 2021 Comments
Board Assembly Cost ¢ per I/O 0.28 0.25 0.23 0.19 0.19
Implantable costs are several X cost due
to process and equipment validation,
traceability requirements and clean room
assembly
Final Product Assembly Cost $/unit 12 10 8 6 5
Can be 10 to 20X cost for implantables,
due to welding and hermetic container
assembly, clean room requirements and
traceability,
Packaging Cost 2009 2011 2013 2015 2021 Comments
IC Package Cost ¢ per I/O 0.21 0.18 0.16 0.15 0.15 Externals / Imaging products
Package Cost (High Density
Ceramic/w/ Area Connector) ¢ per I/O 6 5 4 3 2 Externals / Imaging products
Package Cost (High Density µvia
Laminate w/ Area Connector) ¢ per I/O 5 4 3 2 2 Externals / Imaging products
Connector Cost ¢ per I/O 2.1 1.9 1.6 1.3 1 Externals / Imaging products
Energy Cost $/Wh 0.5 0.4 0.3 0.25 0.2 Externals / Imaging products
Memory Cost (Flash) $/MB 0.23 0.2 0.18 0.15 0.1 Externals / Imaging products
Memory Cost (SRAM) $/MB 0.23 0.2 0.18 0.15 0.1 Externals / Imaging products
Cost of Test as a ratio to assembly ratio 0.4 0.4 0.5 0.6 0.6 Externals / Imaging products
36
Product NeedsSize constraints on implantables will drive M0402,
1005 and embedded passives in next few years.
Parameter Descriptions Metric 2005 2007 2009 2011 2017
Passive Components - Implantables
Passive Devices: State of the Art (production volume)Type/Size 0201 case 0201 case M0402 M0402 1005 case
Embedded Passives Passives fabricated into the substrate# per sq. cm 2 4 8 16
Max. Ohms State of the Art (production volume)ohms / sq. 400 600 700 1M 1.2M
Max. Capacitance State of the Art (production volume)μF / sq. 0.1 0.1 0.2 0.3 0.5
Min. % tolerance State of the Art (production volume)% 0.05 0.05 0.04 0.04 0.03
Passive Components - Externals
Passive Devices: State of the Art (production volume)Type/Size 0201 case 0201 case 0201 case 0201 case 0201 case
Embedded Passives Passives fabricated into the substrate# per sq. cm NA NA NA NA NA
Max. Ohms State of the Art (production volume)ohms / sq. 400 600 600 700 1M
Max. Capacitance State of the Art (production volume)μF / sq. 0.1 0.1 0.1 0.2 0.2
Min. % tolerance State of the Art (production volume)% 0.05 0.05 0.05 0.05 0.05
• Major Focus currently on “Medical Grade”
Capacitors. iNEMI Medical Component
Project Currently underway.
• Goal: determine Reliability test
requirements for Medical Grade
classifications
37
Product Needs
Reliability Needs are
Driven by Implantables
Medical often uses “Harsh Condition Testing” for
reliability
• 1000G drop / shock 3 Axis
• 2,000,000 plus bend / deflection cycles
• -55 to + 150C thermal cycle testing
• Scuba and hyper baric chamber
Reliability - Implantable Metric 2007 2009 2011 2015 2017
Temperature Range Deg C - Deg C "-40 to 80 "-40 to 80 "-40 to 80 "-40 to 80 "-40 to 80 Product Screening Test
Temperature Range Deg C - Deg C "-55 to 150 "-55 to 150 "-55 to 150 "-55 to 150 "-55 to 150 Qual.Test
Temperature Range Deg C - Deg C "0 to 100 "0 to 100 "0 to 100 "0 to 100 "0 to 100 Ship / Shock Test
Mechanical Flex Test Number of Cycles Cycles to Pass 250,000 1M+ 2M+ 2M+ 2M+ Simulate Sub-pectoral implant movement
Vibrational Environment (PWB level) G²/Hz 1000 1000 1000 1000 1000 Random Vibration
Use Shock Environment Gs & ms to Pass 500G 3 axis 500G 3 axis 1000G 1000G 1000G Impact Resistance
Altitude Feet 40,000 40,000 40,000 45,000 45,000 Must be Gamma Emmision Safe for Shipping
38
Input For/From Others
• External Systems rely heavily on other system components
– Displays, mass storage, wireless and hard-wire data transfer systems, telecom, network systems.
• Implantables
– Auto & Military – Input to harsh environment reliability. Especially in shock, impact and long term low level fatigue
– Portables – wireless medical device systems now becoming standard. Personal data device transmits implanted or worn device output to medical monitoring facility and physician.
– SiP – Need to better correlate with medical product needs.
– Connector group need to help drive header / wire attachment process away from manual soldered wires to connector attachment.
39
Implantable Defibrillators—US Annual
–350,000 people newly indicated for this therapy
–100,000 + defibrillator implants per year
Shock
Delivered
Tachy Arrhythmia Therapy
Extending the lives of people whose
hearts beat too fast
Medical Market: Example Technology
40
Heart Failure Therapy
– 5 year mortality rates as high as
50%
– Affects > 14M people (US, Europe
& Japan)
TINES
STEROID
COLLAR
GUIDE WIRE
ELECTRODE
Medical Market: Example Technology
Lead Technology
Pacemakers – Currently the largest medical device market
US Annual
– 750,000 patients diagnosed with this condition annually
– 500,000 implants annually
41
Digital Health: New Horizons
• Miniaturization / Nano- MEMS
- Self or bio powered systems
- Localized measurement – ex lab on a chip
- Gaseous and biological sensors – military and homeland security applications.
• MEM’s and Implantable Devices are a rapidly growing market segment.
New Research / Growth Areas- Bio-chemical sensors
- Alternative power and rechargeable Batteries
- Wearable, patient monitoring systems
- RF telemetry, offloading diagnostics from primary device
- Nano-scale materials, coatings and conductors
- New High Density Batteries MnO2, may lead to 10+ year life.
- Very small scale systems:
Battery for artificial retina (Sandia)
Technology advancements are predicated on resolving complex
challenges including materials management, energy constraints,
data security, reliability and above all, patient safety.
42
Medical PEG SummaryAttribute Needs (2010 – 2020)
• Major differences from Last Roadmap
- Focus on implantable devices other than ―Life Critical Products‖ –These products still require high reliability due to the implanted nature of their applications.
- Miniaturization of large diagnostic equipment for ―low cost target markets‖. Much larger focus on cost.
- Portable equipment and wearable electronics have similar needs to many ―mobile computing and hand held commercial‖ equipment. Huge potential market for ―Home Medical Electronics‖
• Status of Completion - 85-90% spreadsheet completion.
- Bill Burdick (GE Research) co-chair PEG / TIG
- Celeste Fralick (Intel) and Vivian Zhu (TI) have been helping!
- Targeting spreadsheet completion and 75% of chapter by March End.
iNEMI 2011 Roadmap,
MedicalPEG European Webinar Q & A
Anthony Primavera, Biotronik
March 19, 2010
iNEMI 2011 Roadmap,
Medical/AutoPEG European
Webinar - Summary
Grace O’Malley, iNEMI
Manager EuropeMarch 19, 2010
2010 iNEMI Roadmap European Workshop
• 2011 iNEMI Roadmap — European Workshop
• Wednesday, 16 June, 2010
• 09:00-16:30
• IMEC Headquarters
• Leuven, Belgium
• REGISTRATION DEADLINE: June 12 (earlier if meeting reaches capacity)
• To register, go to
http://www.inemi.org/cms/calendar/2011_RM_Euro10.html
• Objectives
• The purpose of this meeting is to:
• Discuss drafts of roadmap chapters covering primary technology and
infrastructure areas.
• Obtain European input to these draft chapters.
• Ensure inclusion of key European issues in the 2011 Roadmap.
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2010 iNEMI Roadmap European Workshop – Preliminary Agenda
08:30 – 09:00
• Continental Breakfast
09:00 – 09:20
• Welcome
09:20 – 09:40
• IMEC Welcome/Overview
09:40 – 10:00
• Roadmap Process Overview
10:00 - 15:00
Technology Reports
(20 minutes each)
• Product Emulator Group Reports:
10:00 – 10:20
• Medical PEG Report
10:20 – 10:40
• Portable / Consumer PEG Report
10:40 – 11:00
• Discussion/Break
Technical Working Group Reports:
11:00 – 11:20
• Environmentally Conscious Electronics
11:20 – 11:40
• Solid State Illumination / Photovoltaics
11:40 – 12:00
• Large Area, Flexible Electronics
12:00 – 13:00
• Lunch/Discussion
13:00 – 13:20
• Board Assembly
13:20 – 13:40
• Final Assembly
13:40 – 14:00
• Interconnect Substrates – Ceramic
14:00 – 14:20
• Discussion/Break
14:20 – 14:40
• Packaging & Component Substrates
14:40 – 15:00
• Interconnect PCB - Organic
15:00 – 15:15
• Discuss Interest in TWG/PEG Participation
15:15 – 15:30
• Summary / Next Steps
15:30 – 16:30
• Social Gathering
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