ICMAP 2016

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www.icmap2016.org ICMAP 2016 The 6 th International Conference on Microelectronics and Plasma Technology September 26-29, 2016, Gyeongju, Korea Abstracts Book Organized by The Materials Research Society of Korea(MRS-K) ICMAP Organizing Committee

Transcript of ICMAP 2016

  • www.icmap2016.org

    ICMAP 2016The 6th International Conference on Microelectronics and Plasma TechnologySeptember 26-29, 2016, Gyeongju, Korea

    AbstractsBook

    Organized by The Materials Research Society of Korea(MRS-K)

    ICMAP Organizing Committee

  • ICMAP 2016The 6th International Conference on Microelectronics and Plasma Technology | September 26-29, 2016, Gyeongju, Korea

    ICMAP 2016The 6th International Conference on Microelectronics and Plasma Technology | September 26-29, 2016, Gyeongju, Korea

    Table of Contents

    ICMAP 2016 Sponsors

    Welcome Message

    Organization

    General Information- Registration- Hotel Information

    Conference Topics

    Plenary Speakers

    Tutorial Sessions

    Instruction for Presentation

    Submission of Manuscripts

    Conference Site Map

    Program at a Glance

    Program Schedule- Plenary Speakers- Tutorial Sessions- Special Sessions- Oral Sessions- Poster Sessions

    Abstracts

    Author Index

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    ICMAP 2016The 6th International Conference on Microelectronics and Plasma Technology

  • ICMAP 2016 1

    ICMAP 2016The 6th International Conference on Microelectronics and Plasma Technology | September 26-29, 2016, Gyeongju, Korea

    ICMAP 2016The 6th International Conference on Microelectronics and Plasma Technology | September 26-29, 2016, Gyeongju, Korea

    ICMAP 2016The 6th International Conference on Microelectronics and

    Plasma TechnologySeptember 26-29, 2016, Gyeongju, Korea

    Organized by- The Materials Research Society of Korea(MRS-K) / ICMAP Organizing Committee

    Supported by- The Korean Vacuum Society- The Korean Federation of Science and Technology Societies- National Fusion Research Institute

    Sponsored by- Tokyo Electron- Wonik IPS- Edwards- MKS Instruments- SNTEK- Naintech

    This work was supported by the Korean Federation of Science and Technology Societies(KOFST) Grant funded by the Korean Government.

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    ICMAP 2016The 6th International Conference on Microelectronics and Plasma Technology | September 26-29, 2016, Gyeongju, Korea

    ICMAP 2016The 6th International Conference on Microelectronics and Plasma Technology | September 26-29, 2016, Gyeongju, Korea

    Welcome Message

    The 6th International Conference on Microelectronics and Plasma Technology 2016 (ICMAP) is held biennially in Korea to share the latest knowledge in plasma technology and microelectronic processing and to promote international relationship among researchers working on plasmas and microelectronics. In ICMAP, the scope generally covers a variety of plasma and processing technologies including (but not limited to) newly-developed materials, processes, and integration technologies applied to bio-devices, semiconductor devices, flexible display devices, energy conversion devices, etc.

    This year, ICMAP 2016 is 6th ICMAP is held at Dream Center, Gyeongju, in Korea, on September 26-29, 2016. On August 22-26 2016, International Vacuum Congress (IVC)-20 was held at BEXCO in Busan, and, at this world scale conference organized by International Union for Vacuum Science, Technology, and Applications (IUVSTA), similar plasma topics were opened in the conference and some of the recent researches on plasma technologies were already discussed in details. Therefore, in this ICMAP 2016, we decided to focus on some of the important topics related to plasma technologies and microelectronics and to limit the general sessions up to two parallel sessions. Especially, special sessions with novel topics which draw more attention to plasma-related/microelectronic R&D communities will be opened to provide more in-depth discussion and understanding on plasma-related R&D directions.

    After all, the attendants a little more than 200 researchers including professors and students will participate the conference and we believe that, through the focused topics in a few parallel sessions, the attendants will enjoy the presentations and close discussion among researchers.

    We welcome you to ICMAP 2016 in Gyeongju known to be open museum city.

    ____________________Geun Young YeomConference Chair,

    ICMAP 2016

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    ICMAP 2016The 6th International Conference on Microelectronics and Plasma Technology | September 26-29, 2016, Gyeongju, Korea

    ICMAP 2016The 6th International Conference on Microelectronics and Plasma Technology | September 26-29, 2016, Gyeongju, Korea

    Organization

    Honorary Chair

    Chi Kyu Choi(Jeju National Univ., Korea)

    International Organizing Committee Chair

    Hong Young Chang(KAIST, Korea)

    General Secretary

    HeeHwan Choe(Korea Aerospace Univ., Korea)

    Conference Chair

    Geun Young Yeom(Sungkyunkwan Univ., Korea)

    Executive Committee Chair

    Suk Jae Yoo(NFRI, Korea)

    General Secretary

    ShinJae You(Chungnam National Univ.,

    Korea)

    International Advisory Committee Chair

    J. E. Greene(Univ. of Illinois at Urbana

    Champaign, USA)

    Executive Committee Co-Chair

    Jaihyung Won(Wonik IPS, Korea)

    Treasurer

    Se Youn Moon(Chonbuk National Univ.,

    Korea)

    Scientific Program Committee Chair

    Jung Hoon Joo(Kunsan National Univ., Korea)

    Publication Committee Chair

    Nae-Eung Lee(Sungkyunkwan Univ., Korea)

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    ICMAP 2016The 6th International Conference on Microelectronics and Plasma Technology | September 26-29, 2016, Gyeongju, Korea

    ICMAP 2016The 6th International Conference on Microelectronics and Plasma Technology | September 26-29, 2016, Gyeongju, Korea

    Organizing Committee

    Name Role Affiliation

    Chi Kyu Choi Honorary Chair Jeju National University

    Geun Young Yeom Conference Chair SungKyunKwan University

    Hong Young Chang International Organizing Chair Korea Advanced Institute of Science and Technology

    Suk Jae Yoo Executive Chair Plasma Technology Research Center, NFRI

    Jaihyung Won Executive Co-chair Wonik IPS

    J. E. Greene International Advisory Committee Chair University of Illinois at Urbana-Champaign

    Jung Hoon Joo Scientific Program Committee Chair Kunsan National University

    Nae-Eung Lee Publication Committee Chair SungKyunKwan University

    HeeHwan Choe General Secretary Korea AerospaceUniversity

    Shin JaeYoo General Secretary ChungnamNational University

    Se Youn Moon Treasurer Chonbuk National University

    International Advisory Committee

    Name Affiliation Country

    J. E. Greene, Chair University of Illinois at Urbana-Champaign U.S.A

    Joung Cho Kim Edwards Korea Ltd. Korea

    Rod Boswell Australia National University Australia

    Han Sub Uhm Kwangwoon University Korea

    Masaru Hori Nagoya University Japan

    Osamu Takai Kanto Gakuin University Japan

    ChengKang Wu Chinese Academy of Science China

    Chang-Jin Kang Samsung Electronics, Ltd Korea

    You-Nian Wang Dalian University of Technology China

    Ki-Woong Whang Seoul National University Korea

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    ICMAP 2016The 6th International Conference on Microelectronics and Plasma Technology | September 26-29, 2016, Gyeongju, Korea

    ICMAP 2016The 6th International Conference on Microelectronics and Plasma Technology | September 26-29, 2016, Gyeongju, Korea

    International Organizing Committee

    Name Affiliation Country

    Hong Young Chang, Chair Korea Advanced Institute of Science and Technology Korea

    Hee Yeop Chae Sungkyunkwan University Korea

    Chul Joo Hwang Jusung Engineering Korea

    Eun Ha Choi Kwangwoon University Korea

    Jeon K. Han Sungkyunkwan University Korea

    Yasuhiro Horiike National Institute for Materials Science Japan

    David B. Graves University of California Berkley U.S.A

    Bert Ellingboe Dublin City University Ireland

    Hiroshi Fujiyama Nagasaki University Japan

    Yuan-Hong Song Dalian University of Technology China

    Seung Jeong NOH Dankook Univ. Korea

    Harm Tolner Phillips Netherlands

    Ming-Show Wong National Dong Hwa University Taiwan

    Denis Shamiryan IMEC Belgium

    Jung-Joong Lee Seoul National University Korea

    Larry F. Weber SID USA

    Jin Hyo Boo SungKyunKwan University Korea

    Seong In Kim Cheorwon Plasma Research Institute Korea

    Rubin Ye Advanced Micro-fabrication Equipment Inc. China

    Masaharu Shiratani Kyushu University Japan

    Hong-Bin Ding Dalian University of Technology China

    Wonho Choe Korea Advanced Institute of Science and Technology Korea

    Mori Yusuke Osaka University Japan

    Rajiv Onkar Dusane Indian Institute of Technology Bombay India

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    ICMAP 2016The 6th International Conference on Microelectronics and Plasma Technology | September 26-29, 2016, Gyeongju, Korea

    ICMAP 2016The 6th International Conference on Microelectronics and Plasma Technology | September 26-29, 2016, Gyeongju, Korea

    Scientific Program Committee

    Name Affiliation Country

    Jung Hoon Joo, Chair Kunsan National University Korea

    Yuichi Setsuhara Osaka University Japan

    David Ruzic Univ. of Illinois at Urbana-Champaign USA

    Lawrence J. Overzet Univ. of Texas at Dallas USA

    Takayuki Watanabe Kyushu University Japan

    Seiji Samukawa Tohoku University Japan

    Bong Guen Hong Chonbuk National University Korea

    Munpyo Hong Korea University Korea

    Yong-Hoon Cho Korea Advanced Institute of Science and Technology Korea

    Bo-yun Jang Korea Institute of Energy Research Korea

    Taejoon Han Tokyo Electron Ltd., Technology Center America (TTCA) USA

    Bert Ellingboe Dublin City University Ireland

    Publication Committee

    Name Affiliation Country

    Nae-Eung Lee, Chair SungKyunKwan University Korea

    Chin-Wook Chung Hanyang University Korea

    Hyun Woo Kim Hanyang University Korea

    Yi Kang Pu Tsinghua University China

    Chee Won Chung Inha University Korea

    Jiyoung Kim UT Dallas USA

    Hyoung Sub Kim Sungkyunkwan University Korea

    Ji Hyun Kim Korea University Korea

    Jianjun Shi Donghua University China

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    ICMAP 2016The 6th International Conference on Microelectronics and Plasma Technology | September 26-29, 2016, Gyeongju, Korea

    ICMAP 2016The 6th International Conference on Microelectronics and Plasma Technology | September 26-29, 2016, Gyeongju, Korea

    Executive Committee

    Name Affiliation Country

    Suk Jae Yoo, Chair Plasma Technology Research Center, NFRI Korea

    Jaihyung Won, Co-Chair Wonik IPS Korea

    Hee Hwan Choe, Conference Secretary Korea Aerospace University Korea

    Shin Jae You, Conference Secretary Chungnam National University Korea

    Se Youn Moon, Conference, Treasure Chonbuk National University Korea

    Gichung Kwon Kwangwoon University Korea

    Yongmin Kim Dankook University Korea

    Il Ki Han Korea Institute of Science and Technology Korea

    Yong-Seok Hwang Seoul National University Korea

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    ICMAP 2016The 6th International Conference on Microelectronics and Plasma Technology | September 26-29, 2016, Gyeongju, Korea

    ICMAP 2016The 6th International Conference on Microelectronics and Plasma Technology | September 26-29, 2016, Gyeongju, Korea

    General Information

    RegistrationRegistration GuideAll participants must pay the registration fee. The all registration fee includes admittance to al l special session and one copy of the program book. Registrants can access e-Proceedings on the conference website. Online registration with credit cards will be available through the homepage (http://www.icmap2016.org). For those who wish to register on-site, credit cards and cash in local currency (KRW; Korean Won) will be accepted. The registration fees are: Real Time Exchage Rate

    Events Classification Pre-registration (6/30-8/15)Online registration

    (8/16-9/2)On-site registration

    (9/25)

    Regular Sessions

    Regular USD 500 / KRW 600,000USD 550 /

    KRW 660,000 KRW 720,000

    Student / Retiree USD 250 / KRW 300,000USD 275 /

    KRW 330,000 KRW 360,000

    Lunch meal at Dream-Center (Korean foods)

    *This should be paid at the registration desk

    Optional(KRW8,800/each meal) KRW 8,800 KRW 8,800 Not available

    Inclusion of VAT* Special Session: Plasma Agriculture and Food * The banquet fee is not included in the registration fee. * Lunch meal will be supported only for paid persons in conference site through on-line and on-

    site registration.* Including TSF, JNN, and SAM, one manuscript submission per registration (regular or student)

    will be allowed. For student manuscript submission, at least one of the authors needs to be a regular registrant of the conference.

    * The registration fee does not include the publication charge. The accepted manuscript will be published in the journals with an extra fee of about $120/journal page. (The exact fee will be notified later.)

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    ICMAP 2016The 6th International Conference on Microelectronics and Plasma Technology | September 26-29, 2016, Gyeongju, Korea

    ICMAP 2016The 6th International Conference on Microelectronics and Plasma Technology | September 26-29, 2016, Gyeongju, Korea

    Refund policyPlease notify ICMAP2016 secretariat in writing [email protected] request a refund and cancel your registration. Refund will be made upon receipt of this written notice after the conference. All bank service charges are to be paid by the registrant

    Refund No Refund

    Notice Received before Aug 15, 2016 50% of registration fee

    Notice Received after Aug 15, 2016 No Refund

    ContactThe Materials Research Society of Korea(MRS-K) Rm1506, Daejong Bldg.435 Teheran-ro, Gangnam-gu, Seoul 135-527, KoreaTel: +82-2-566-4496,4833 | Fax: +82-2-566-4497 / e-mail :[email protected]

    Hotel InformationAccommodationPlease book the following roomsdirectlyat the hotels by stating thekeyword ICMAP2016. In this way you get the specified rates (room only). Booking is possible accordingly to availability.The reservation should be complete to each hotel. Reservations are on a first-come-first-served basis

    Dream Center, Gyeongju (written in Korean)

    http://dream-center.co.kr280-34 Bomunro, Gyeongju, Gyeongsangbuk-dotel +82-54-778-5000

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    ICMAP 2016The 6th International Conference on Microelectronics and Plasma Technology | September 26-29, 2016, Gyeongju, Korea

    ICMAP 2016The 6th International Conference on Microelectronics and Plasma Technology | September 26-29, 2016, Gyeongju, Korea

    Hyundai Hotel, Gyeongju

    338, Bomunro, Gyeongju, Gyeongsangbuk-dotel +82-54-748-2233

    The Suites Hotel, Gyeongju

    http://gyeongju.suites.co.kr/eng/index.asp?1=5280-12 Bomunro, Gyeongju, Gyeongsangbuk-dotel +82-54-778-5300

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    ICMAP 2016The 6th International Conference on Microelectronics and Plasma Technology | September 26-29, 2016, Gyeongju, Korea

    ICMAP 2016The 6th International Conference on Microelectronics and Plasma Technology | September 26-29, 2016, Gyeongju, Korea

    Conference Topics[Special Session: 9/27 (Tuesday)]Advanced topics

    Plasma in Agriculture and Food Applications

    [Session 1] Materials and Processing on next generation & Semiconductor Nano Devices 2-D materials for nano-devices Nanolithography/Fabrication Plasma processing technology for next generation semiconductor devices Plasma nano engineering ALD

    [Session 2]Materials and Processing on Energy & Conversion Storage Solar cell technologies Secondary battery technologies Fuel cell technologies Energy harvesting technologies New materials and processing for energy conversion and storage

    [Session 3]Materials and Processing on Next Generation Displays Materials and processes for next generation display Plasma processing and equipment for display devices Materials and processes for oxide and new semiconductor thin film Plasma applications for display technology

    [Session 4]Basic Plasma Science and Technology Plasma diagnostics and control Plasma technology Materials by plasma Characterization of plasma: numerical analysis and diagnostics Plasma sources Thermal plasma

    [Session 5]Plasma Bioscience Plasma Biosciences and Medicine Plasma Biomaterials and Films Nonthermal Bioplasma Sources and Diagnostics Plasma Bio-Nano Materials and Scaffolds

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    ICMAP 2016The 6th International Conference on Microelectronics and Plasma Technology | September 26-29, 2016, Gyeongju, Korea

    ICMAP 2016The 6th International Conference on Microelectronics and Plasma Technology | September 26-29, 2016, Gyeongju, Korea

    Plenary SpeakersSeptember 27 (Tuesday) 11:00-12:00

    Dr. Suk Jae YooVice President of National Fusion Research Institute (NFRI), Korea

    Plasma FarmingThe plasma technology has great potential to innovate the agriculture as well as the cultivation of livestock and fishes owing to various chemical and physical properties. In the other words, by using characteristics of plasmas based on the chemical and physical properties, for instance, we can activate seed germinations, sterilize harmful microorganisms, and

    make catalytic dissociations of gaseous molecules for improving the cultivation environment. Based on the plasma properties as mentioned, the plasma technology can be applied to the whole agricultural periodic phases from farm to table: The cultivation, post-harvest, and securing safety of agricultural products and foods. We named the whole agricultural periodic phases with the plasma treatments as Plasma Farming which includes plasma cultivation for productivity promotion, plasma post-harvest for freshness preservation, and plasma safety for securing safety of agricultural products and foods. The plasma farming can also be well applied to livestock and fish farms. The traditional agriculture was innovatively replaced by the chemical agriculture with much higher productivity owing to the invention of agricultural pesticides and chemical fertilizers just like the invention of the transistors in the semiconductor industry. Due to the pesticide residue, however, the chemical agriculture has been increasingly replaced by the inorganic agriculture which has even the disadvantage of lower productivity. Even though the inorganic agricultural products are free of the pesticide residue, they are sometimes exposed to deadly infection of harmful microorganisms bred well in the eco-friendly cultivation environment. The recent agricultural issues of the food safety and productivity can be innovatively overcome by adopting the plasma technology. Some case studies will be introduced so that the Plasma Farming can be well realized and contribute to the agricultural innovation from farm to table.

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    ICMAP 2016The 6th International Conference on Microelectronics and Plasma Technology | September 26-29, 2016, Gyeongju, Korea

    ICMAP 2016The 6th International Conference on Microelectronics and Plasma Technology | September 26-29, 2016, Gyeongju, Korea

    September 28 (Wednesday) 11:00-12:00

    Dr.Manabu TsujimuraDirector of the board, CTO of EBARA Corporation,Japan Innovations to support Semiconductor TechnologyThe semiconductor technology and market have continued to develop in accordance with Moores law and Dennards scaling law for the past 70 years. Now, however, semiconductor technology is starting to show signs of slowdown. In my paper Paradigm Cliff 2020 (2014), I gave a broad overview of semiconductor technology up to 2020, and showed the course that chemical

    mechanical polishing (CMP) process technology would take by 2020 in The Way To Zeros (2015). To follow these two papers, I will suggest in this plenary speech what we should do as engineers in the chaotic era that will arrive after 2020. In order to respond to the technological innovations required for semiconductor devices by reflecting on past innovations and reevaluating technologies, including those that have been done away with (failed), I have suggested the direction of future innovation creation, as well as a development example, based on the concept of the R&D balance sheet.

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    ICMAP 2016The 6th International Conference on Microelectronics and Plasma Technology | September 26-29, 2016, Gyeongju, Korea

    ICMAP 2016The 6th International Conference on Microelectronics and Plasma Technology | September 26-29, 2016, Gyeongju, Korea

    Tutorial SessionsSession Chair: Prof. Jung Hoon Joo (Kunsan National Univ., Korea)

    Tutorial ISeptember 27 (Tuesday) 09:00-10:30

    Introduction to RF technologyLecturer: Dr. Jin Huh, CTO MKS Instruments, Korea

    This presentation introduces RF generators and matches, and basic structure, theory, and operation of RF generators and matches are presented. The presentation consists of two sections, RF generator and match. In the first section, the structure of RF generator, which includes AC to DC converter, DC to DC converter, RF amplifier, filter and combiner, and sensors, and its operation are presented. Some important specifications that show the performance of

    RF generator are reviewed based on MKS RF generator specifications with measurement results. In addition, concept of power calibration and accuracy, and some state-of-the-art like pulsing, pulse shaping and frequency tuning technologies are also presented. In the section 2, basic theory and its operation of match are presented. Matching networks design such as L-type, Pi-type and T-type with vacuum variable capacitors and the method of measurement of matching range are presented. Using mesh and node circuit analysis, peak voltage and current are analyzed and safe operation area (SOA) is calculated for conventional L-type match.

    Tutorial IISeptember 27 (Tuesday) 13:30-15:00

    Design of Vacuum Pumping System for Plasma ProcessesLecturer: Dr. Jang Hun Joo, CTO Edwards Vacuum Korea The audience can understand the design concept of vacuum pumping system for semiconductor, FPD manufacturing processes, and the like in this course. For the vacuum pumping system for them, the followings have to be considered.Difference between vacuum pumps for compressible materials and fluid pumps for non-compressible materials. Pumping capacity and conductance

    of forelines in terms of pump down time and gas flow rate for the processes. Relationship between primary vacuum pumps(booster, TMP etc.) and backing pumps including compression ratio and volume ratio. Process conditions, such as the process chemistries including gas recipe, gas flow rate,

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    ICMAP 2016The 6th International Conference on Microelectronics and Plasma Technology | September 26-29, 2016, Gyeongju, Korea

    ICMAP 2016The 6th International Conference on Microelectronics and Plasma Technology | September 26-29, 2016, Gyeongju, Korea

    process pressure and chemical reactions with by-product formation.Longer lifetime of vacuum pumping system against phase transitions from vapor(gas) to liquid and/or solid. Safety assessment to prevent fire and explosion.After this course, you can have a solid confidence on your own vacuum pumping system to meet your process condition with longer lifetime and Safety assessment.

    Tutorial IIISeptember 27 (Tuesday) 15:30-17:00

    Development of Dry Etcher SystemLecturer: Dr. Namhun Kim, CEO APTC, Korea Conventional product development is mainly based on the previous experience and some kind of benchmarking. In this approach, each team only contributes to its own specific realm. For example, the process development team hardly takes part in the plasma source development team activity. Besides, some jargons are being used ambiguously without clear understanding, which confused most engineers. A new smart approach to

    the next generation semiconductor processing equipment is suggested to improve the existing product development strategy. In this new approach, the barriers among engineering teams consisting of each product are eliminated and more flexible feedback is made among the plasma source development team, hardware development team, software development team, process development team and the customer support team. Also the new smart approach is focused on the quantitative understanding of the plasma system based on measurements and simulations. The plasma source and the process chamber were developed with some modeling and simulations, which used electromagnetic analysis, thermo structural analysis and fluid dynamics analysis. In addition, field issues could be efficiently resolved in close collaboration among the engineering teams. As an example, the etch rate nonuniformity issue during the process development could be resolved by combination of both new plasma source design and hardware implementation. Some fundamental understanding about the process chamber is proposed using polymer kinetics. Finally, productivity improvement is proposed using the modified Avrami equation, the steady state chamber constant and the smart seasoning. Here the smart seasoning enables us to get the same etch rate within process spec regardless of the chamber condition such as the idle state and wet cleaning, resulting in tighter CD control

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    ICMAP 2016The 6th International Conference on Microelectronics and Plasma Technology | September 26-29, 2016, Gyeongju, Korea

    ICMAP 2016The 6th International Conference on Microelectronics and Plasma Technology | September 26-29, 2016, Gyeongju, Korea

    Instruction for PresentationFirst of all, we would like to welcome all of you to ICMAP 2016, Gyeongju, Korea. Thank you for presenting your studies in the conference. To make sure that all sessions run smoothly, we provide the following brief guidelines for all authors to follow:

    Oral Presentation Sessions Please try to arrive at the meeting room of your presentation session at least 20 minutes before the

    start of the session. - Please upload your PowerPoint file onto the computer for presentation and make sure that your

    file runs appropriately. - Please introduce yourself to your session chair so that the session chair will know who is

    presenting the paper. Each oral presentation is allocated 20-40 minutes including Q & A(contributed : 20, invited 30,

    keynote 40). Time management is VERY critical because people may switch between sessions for presentations that they are interested in.

    Poster Sessions There are two poster sessions and 2 hour is allocated for each poster session. Please try to arrive at the meeting area of your poster session at least 20 minutes before the start of

    the session. Please post your posters on the poster board designated to you. During your poster session, please be around the poster board designated to you in order to

    interact with participants who are interested in your study. After your poster session, please help remove your posters from the board so that the author(s) of

    the next poster session can put their posters on the board. Drawing pins will be supplied to mount posters. It is advisable to present the poster in a clear and

    legible format. The poster board size at the meeting is 95cm x 150cm

    Poster Session Student Awards All posters are eligible for award reviewing process after confirmation of registration desk : one registration can hold for one presentation either oral or poster. Presenters should be around the poster board waiting for the reviewing committee members and should answer their questions. Competition rule includes poster contents, printing and Q&A with the committee member.

    The AWARDS will be given at the Closing Ceremony at 12:00 on September 29.

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    ICMAP 2016The 6th International Conference on Microelectronics and Plasma Technology | September 26-29, 2016, Gyeongju, Korea

    ICMAP 2016The 6th International Conference on Microelectronics and Plasma Technology | September 26-29, 2016, Gyeongju, Korea

    Submission of ManuscriptsThe submitted regular manuscripts will be published in SCI and SCIE journals after peer reviews.

    In order to be included in the journals, at least one of the authors should attend the conference and make a presentation in the assigned session.For all journals, one manuscript submission per registration (regular or student) will be allowed.

    The manuscripts should be prepared in MS-Word format. There is no journal page limit (But, more than 3 pages of Results and Discussion in the full journal paper submission format are required)

    The registration fee does not include the publication charge. The accepted manuscript will be published in the journals with a fee(The exact fee will be notified later.).

    Name of Journal Impact factors Publication fee Submission due

    Thin Solid Films 1.759 October 7

    Journal of Nanoscience and Nanotechnology 1.338

    USD 100 per journal page October 7

    Science of Advanced Materials 1.812

    USD 120 per journal page October 7

    1. Thin Soild Films[Online Submission:http://icmap2016.tsf.aspbs.org/]Submission of your manuscript for the proceedings will be open from the26th September 2016. Please prepare for theCover Letterand submit it together with your full paper to this conference websitelink(thelink will be open from 26th September 2016)

    * Please do not submit the manuscript directly to Thin Solid Films. Manuscripts for Thin Solid Films (TSF) will be pre-checked for the appropriacy of subjects and official submission to Thin Solid Films will be notified to the authors after pre-checking.The deadlinefor submitting your manuscripts inthis conference site forall three journalsis the7th of October 2016. And the deadlinefor official submission of the pre-checked manuscriptsfor Thin Solid Films is the21th of October 2016.Please prepare your manuscript according to standardstandard Author Guide.Note: Please make sure that you indicate (1) your abstract submission number and (2) approved abstract number and (3) registration/payment information. Manuscripts submitted without those information will not be handled.

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    ICMAP 2016The 6th International Conference on Microelectronics and Plasma Technology | September 26-29, 2016, Gyeongju, Korea

    ICMAP 2016The 6th International Conference on Microelectronics and Plasma Technology | September 26-29, 2016, Gyeongju, Korea

    2. Journal of Nanoscience and Nanotechnology[Online Submission:http://icmap2016.jnn.aspbs.org/]Journal of Nanoscience and Nanotechnology (JNN) is a multidisciplinary peer-reviewed journal with a wide-ranging coverage, consolidating research activities in all areas of nanoscience and nanotechnology into a single and unique reference source. JNN is the first cross-disciplinary journal to publish original full research articles, rapid communications of important new scientific and technological findings, timely state-of-the-art reviews with authors photo and short biography, and current research news encompassing the fundamental and applied research in all disciplines of science, engineering and medicine.

    * Please do not submit the manuscript directly to Journal of Nanoscience and NanotechnologyPlease prepare for theCover Letterand submit it together with your full paperPlease prepare your manuscript according tostandardstandard Author Guide.Note: Please make sure that you indicate (1) your abstract submission number and (2) approved abstract number and (3) registration/payment information. Manuscripts submitted without those information will not be handled.

    3. Science of Advanced Materials[Online Submission:http://icmap2016.sam.aspbs.org/]Science of Advanced Materials (SAM) is an interdisciplinary peer-reviewed journal consolidating research activities in all aspects of advanced materials in the fields of science, engineering and medicine into a single and unique reference source. SAM provides the means for materials scientists, chemists, physicists, biologists, engineers, ceramicists, metallurgists, theoreticians and technocrats to publish original research articles as reviews with authors photo and short biography, full research articles and communications of important new scientific and technological findings, encompassing the fundamental and applied research in all latest aspects of advanced materials.

    * Please do not submit the manuscript directly to Science of Advanced MaterialsPlease prepare for theCover Letterand submit it together with your full paperPlease prepare your manuscript according to standardstandard Author Guide.Note: Please make sure that you indicate (1) your abstract submission number and (2) approved abstract number and (3) registration/payment information. Manuscripts submitted without those information will not be handled.

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    ICMAP 2016The 6th International Conference on Microelectronics and Plasma Technology | September 26-29, 2016, Gyeongju, Korea

    ICMAP 2016The 6th International Conference on Microelectronics and Plasma Technology | September 26-29, 2016, Gyeongju, Korea

    Conference Site Map

    1st floor

    DREAM ACADEMY

    TEDDY BEAR MUSEUM

    SESSION A/B

    SPECIAL

    LUNCH

    2nd floor

    DREAM ACADEMY

    TEDDY BEAR MUSEUM

    LOBBY PLENARY

    POSTER SESSION

    LOUNGE

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    ICMAP 2016The 6th International Conference on Microelectronics and Plasma Technology | September 26-29, 2016, Gyeongju, Korea

    ICMAP 2016The 6th International Conference on Microelectronics and Plasma Technology | September 26-29, 2016, Gyeongju, Korea

    Program at a Glance

    September 26 (Monday) September 27 (Tuesday)Time Room A Room B Room A Room B Room C9:00

    Special session TA1 (Plasma Agriculture) TB1

    Tutorial I (RF technology, MKS

    Jin Huh)

    9:109:209:309:409:50

    10:00

    MA1 MB1

    10:1010:2010:30

    Coffee Break (10:30 ~ 11:00)10:4010:5011:00

    Plenary lecture 1 (Plasma Farming, Seok jae Yoo, NFRI, Korea)

    11:1011:2011:3011:40 Opening Ceremony (11:40 ~ 12:00)11:50

    Lunch (12:00 ~ 13:20)13:20

    MA2 MB2 Special session TA2 (Plasma Agriculture) TB2

    Tutorial II (Vacuum technology,

    Edwards Vacuum, Janghun Joo)

    13:3013:4013:5014:0014:1014:2014:3014:4014:5015:00 Coffee Break

    (15:00 ~ 15:30)15:10 Coffee Break (15:00 ~ 15:30)15:2015:30

    MA3

    MB3

    Special session TA3 (Plasma Agriculture) TB3

    Tutorial III (Dry etcher

    development, APTC, Namhun Kim)

    15:4015:5016:0016:1016:2016:3016:4016:5017:0017:10

    TP: Poster I (17:00 ~ 19:00)17:2017:30

  • ICMAP 2016 21

    ICMAP 2016The 6th International Conference on Microelectronics and Plasma Technology | September 26-29, 2016, Gyeongju, Korea

    ICMAP 2016The 6th International Conference on Microelectronics and Plasma Technology | September 26-29, 2016, Gyeongju, Korea

    September 28 (Wednesday) September 29 (Thursday)Time Room A Room B Room A Room B9:00

    WA1 WB1

    ThA THB

    9:109:209:309:409:50

    10:0010:1010:2010:3010:4010:50 Coffee Break (10:40 ~ 11:00)11:00

    Plenary lecture 2 (Supporting Semiconductor Technology, Tsujimura,

    EBARA, Japan)

    11:1011:2011:3011:4011:50

    Lunch (12:00 ~ 13:20) Poster Award/Closing Ceremony (12:00 - 12:30)

    WA2

    13:20

    WB2

    13:3013:4013:5014:0014:1014:2014:3014:4014:5015:0015:10 Coffee Break (15:00 ~ 15:30)15:2015:30

    WA3 WB3

    15:4015:5016:0016:1016:2016:3016:4016:5017:0017:10

    WP: Poster II (17:10 ~ 19:00)

  • ICMAP 201622

    ICMAP 2016The 6th International Conference on Microelectronics and Plasma Technology | September 26-29, 2016, Gyeongju, Korea

    ICMAP 2016The 6th International Conference on Microelectronics and Plasma Technology | September 26-29, 2016, Gyeongju, Korea

    Program Schedule

    Plenary Speakers

    September 27 (Tuesday) 11:00-12:00

    September 28 (Wednesday) 11:00-12:00

    Dr. Suk Jae YooVice President of National Fusion Research Institute (NFRI), Korea Plasma Farming

    Dr. Manabu TsujimuraDirector of the board, CTO of EBARA Corporation, Japan Innovations to support Semiconductor Technology

    Tutorial Sessions

    Date: September 27 (Tuesday)

    Session Chair: Prof. Jung Hoon Joo (Kunsan National Univ., Korea)

    Tutorial I | 09:00-10:30

    Introduction to RF technologyJin Huh, CTO MKS Instruments, Korea

    Tutorial II | 13:30-15:00

    Design of Vacuum Pumping System for Plasma ProcessesJang Hun Joo, CTO Edwards Vacuum Korea

    Tutorial III | 15:30-17:00

    Development of Dry Etcher SystemNamhun Kim, CEO APTC, Korea

  • ICMAP 2016 23

    ICMAP 2016The 6th International Conference on Microelectronics and Plasma Technology | September 26-29, 2016, Gyeongju, Korea

    ICMAP 2016The 6th International Conference on Microelectronics and Plasma Technology | September 26-29, 2016, Gyeongju, Korea

    Special Sessions

    Plasma in Agriculture and Food Application: September 27(Tuesday)

    Advances topics

    9:00-9:45Plasma assisted plant growth enhancement for agricultural yield enhancementMasaharu Shiratani, Kyushu University, Japan

    9:45-10:30Agricultural applications of atmospheric-pressure plasma using pulsed power technologyKoichi Takaki, Iwate University, Japan

    14:00-14:45Plasma treatment of seeds for agriculture applicationPetr patenka, Czech Technical University in Prague, Czech Republic

    14:45-15:30Direct and Indirect Treatment of Perishable Food with Atmospheric Pressure PlasmasJuergen Kolb, Leibniz Institute for Plasma Science and Technology

    16:00-16:30Control for plant disease and growth by plasmaGyungsoon Park, Plasma Bioscience Research Center, Kwangwoon University, Korea

    16:30-17:00Plasma Applications for Agri-food StorageSeong Bong Kim, Plasma Technology Research Center, National Fusion Research Institute, Korea

    17:00-17:30Requirements and considerations for high efficiency non-thermal atmospheric pressure plasma sources for agriculture and food areasWonho Choe, Department of Physics, KAIST, Korea

  • ICMAP 201624

    ICMAP 2016The 6th International Conference on Microelectronics and Plasma Technology | September 26-29, 2016, Gyeongju, Korea

    ICMAP 2016The 6th International Conference on Microelectronics and Plasma Technology | September 26-29, 2016, Gyeongju, Korea

    Oral SessionsMA1Materials and Processing on next generation Semiconductor & Nano Devices 1

    September 26 (Monday), 10:00-11:40, Room A

    Session Chairs: Se Youn Moon (Chonbuk National University)

    MA1-1 160041 | 10:00 - 10:30[Invited] Etch Technologies for N7 and N5 Nodes - Patterning in the age of Atomic Scale Control Naoki Inagaki (Tokyo Electron Ltd., Japan), Wontae Hwang (Tokyo Electron Ltd., Technology Center America (TTCA), United States)

    MA1-2 160104 | 10:30 - 10:50Necessity of Plasma Information (PI) Parameters for Developing Acute Virtual Metrology (VM) of Oxide Etching Process Yunchang Jang, Seolhye Park, Sangmin Jeong, Hyun-Joon Roh, Sangwon Ryu, Nam-Kyun Kim, Younggil Jin, Ki-Baek Roh, and Gon-Ho Kim (Seoul National University, Korea) MA1-3 160136 | 10:50 - 11:10Flexible Transparent Sensors Utilizing Reduced Graphene Oxide Stacked with Bromophenol Blue for Dual-mode Rapid Gas Detection Le Thai Duy, Tran Quang Trung, Vinh Quang Dang and Byeong-Ung Hwang, Saqib Siddiqui, Il-Yung Son, Seung Kyun Yoon, Dong June Chung, and Nae-Eung Lee (Sungkyunkwan University, Korea) MA1-4 160240 | 11:10 - 11:40[Invited] Universal law in RF gas breakdown- implication to micro-scale high-pressure discharges driven by microwave Gunsu Yun (Pohang University of Science and Technology (POSTECH), Korea)

    MA2Materials and Processing on next generation Semiconductor & Nano Devices 2

    September 26 (Monday), 13:20-14:50, Room A

    Session Chairs: Bert Ellingboe (Dublin City University)

    MA2-1 160020 | 13:20 - 14:00[Keynote] The psychology and applications of a Bipolar plasma Focused Ion Beam Rod Boswell (Australian National University, Australia) MA2-2 160236 | 14:00 - 14:30[Invited] Silicon photonics for optical interconnection and network switch applications Jong Moo Lee (ETRI, Korea)

  • ICMAP 2016 25

    ICMAP 2016The 6th International Conference on Microelectronics and Plasma Technology | September 26-29, 2016, Gyeongju, Korea

    ICMAP 2016The 6th International Conference on Microelectronics and Plasma Technology | September 26-29, 2016, Gyeongju, Korea

    MA2-3 160155 | 14:30 - 14:50Self-limiting Layer Synthesis of MoS2and its use for MoS2/WSe2 Heterostructure Youngjun Kim, Jeong-Gyu Song and Yong Ju Park (Yonsei University, Korea), Gyeong Hee Ryu (UNIST, Korea), Su Jeong Lee, Jin Sung Kim, Hyungjun Kim, Whang Je Woo, Jae-Min Myoung, and Seongil Im (Yonsei University, Korea), Zonghoon Lee (UNIST, Korea), Jong-Hyun Ahn and Jusang Park (Yonsei University, Korea)

    MA3Materials and Processing on next generation Semiconductor & Nano Devices 3

    September 26 (Monday), 15:30-17:00, Room A

    Session Chairs: Doguen Kim (Korea Insitutue of Materials Science)

    MA3-1 160139 | 15:30 - 16:00[Invited] Woven resistive switching memory devices for fabric electronics Mijung Lee (Kookmin University, Korea) MA3-2 160211 | 16:00 - 16:30[Invited] Graphene: Scalable Synthesis and Emerging Application Jong-Souk Yeo and Jaehyun Han (Yonsei University, Korea) MA3-3 160237 | 16:30 - 17:00[Invited] Highly Stable Silver Nanowires Transparent Electrode with Plasma Treatment Dogeun Kim (KIMS, Korea)

    MB1Materials and Processing on Energy Conversion & Storage 1

    September 26 (Monday), 10:00-11:30, Room B

    Session Chairs: Sunho Choi (Korea Institute of Energy Research)

    MB1-1 160221 | 10:00 - 10:30[Invited] ESS Industry Trend & Government R&D Strategy YunSeok Choi (Korea Energy Technology Evaluation and Planning, Korea) MB1-2 160095 | 10:30 - 10:50Numerical modeling of Inductively Coupled Plasma sources : effects of gas inlet position Junghoon Joo (Kunsan National University, Korea) MB1-3 160231 | 10:50 - 11:30[Keynote] Plasma technology for roll-2-roll processing high-performance films on wide webs Bert Ellingboe (Dublin City University, Ireland)

  • ICMAP 201626

    ICMAP 2016The 6th International Conference on Microelectronics and Plasma Technology | September 26-29, 2016, Gyeongju, Korea

    ICMAP 2016The 6th International Conference on Microelectronics and Plasma Technology | September 26-29, 2016, Gyeongju, Korea

    MB2Materials and Processing on Energy Conversion & Storage 2

    September 26 (Monday), 13:20-14:50, Room B

    Session Chairs: Yunseok Choi (Korea Institute of Energy Technoogy Evaluation and Planning)

    MB2-1 160080 | 13:20 - 13:40Wideband Light Scattering of Periodic Micro Textured Surface Morphologies for Silicon Thin Film Solar Cells Hyeongsik Park (Sungkyunkwan University, Korea), Myunghun Shin (Korea Aerospace University, Korea), Jaesung Jung (Korea Electronics Technology Institute, Korea), Hyeong-Seok Kim (Korea Aerospace University, Korea), Junsin Yi (Sungkyunkwan Univeristy, Korea) MB2-2 160061 | 13:40 - 14:00Contrasting characteristics of cold atmospheric plasma jets with different electrode configurations Yanhui Wang, Guoqing Lian, Qinglin Wen, Jiao Zhang, Xiaoyu Han and Dezhen Wang (Dalian University of Technology, China) MB2-3 160048 | 14:00 - 14:30 [Invited] Characteristics of carbon-based thermal protection material for radioisotope thermoelectric generator Bong Guen Hong (Chonbuk National University, Korea)

    MB2-4 160161 | 14:30 - 14:50A Growth Behavior of SiOx Nanoparticles Synthesized by Evaporation-Condensation Process with Steam InjectionSunho Choi (Korea Institute of Energy Research, Korea)

    MB3Basic Plasma Science and Technology 1

    September 26 (Monday), 15:30-17:40, Room B

    Session Chairs: Ho-Jun Lee (Pusan National University)

    MB3-1 160070 | 15:30 - 16:10 [Keynote] Hybrid simulation of pulse modulated RF CCP in electronegative SiH4 mixture gasesYuan-Hong Song, Wen-Zhu Jia, Xi-Feng Wang, You-Nian Wang (School of Physics and Optoelectronic Technology, Dalian University of Technology)

    MB3-2 160126 | 16:10 - 16:40[Invited] Plasma simulation for materials processing and nanoparticle synthesis: from fundamental physics to industrial applications Hae June Lee, Min Young Hur, Jin Seok Kim, and Jung Yeol Lee (Pusan National University, Korea)

  • ICMAP 2016 27

    ICMAP 2016The 6th International Conference on Microelectronics and Plasma Technology | September 26-29, 2016, Gyeongju, Korea

    ICMAP 2016The 6th International Conference on Microelectronics and Plasma Technology | September 26-29, 2016, Gyeongju, Korea

    MB3-3 160165 | 16:40 - 17:00Effect of Electron Energy Distribution on the Hysteresis of Plasma Density in Inductively Coupled Plasmas: Theory, Experiment, and Modeling Hyo-Chang Lee (Korea Research Institute of Standards and Science (KRISS), Korea) and Chin-Wook Chung (Hanyang University, Korea)

    MB3-4 160017 | 17:00 - 17:20On the particle in cell simulating of magnetic and low pressure gas discharge: key issue, magnetized ICP and CCP Hongyu Wang and Peng Sun (Anshan Normal University, China), Wei Jiang (Huazhong University of Science and Technology, China), Xiang Xu (Dalian University of Technology, China) MB3-5 160059 | 17:20 - 17:40Fluid simulation of the RF bias effect on inductively coupled plasmas with different substrate materials Xiao-Yan Sun and You-Nian Wang (Dalian University of Technology, China)

    TA1Special session (Plasma Agriculture)

    September 27 (Tuesday), 09:00-10:30, Room A

    Session Chairs: Petr Spatenka (University of South Bohemia)

    TA1-1 160063 | 09:00 - 09:45Plasma assisted plant growth enhancement for agricultural yield enhancement Masaharu Shiratani and Kazunori Koga (Kyushu University, Japan)

    TA1-2 160147 | 09:45 - 10:30Plasma and pulsed power applications to agriculture, fishery and food control Koichi Takaki (Iwate University, Japan)

    TA2Special session (Plasma Agriculture)

    September 27 (Tuesday), 13:20-14:50, Room A

    Session Chairs: Wonho Choi (KAIST)

    TA2-1 160105 | 13:20 - 14:05Plasma Treatment of Seeds for agriculture application Petr Spatenka, Andrea Bohata, Pavel Olsan and Petr Bartos (University of South Bohemia, Czech Republic), Vladimir Curn (University of South Bohemia, Denmark) TA2-2 160242 | 14:05 - 14:50Direct and Indirect Treatment of Perishable Food with Atmospheric Pressure Plasmas Juergen Kolb, Jrg Ehlbeck, Uta Schnabel, Mathias. Andrasch, Thomas von Woedtke, Ronny Brandenburg and Klaus-Dieter Weltmann (Leibniz Institute for Plasma Science and Technology, Germany)

  • ICMAP 201628

    ICMAP 2016The 6th International Conference on Microelectronics and Plasma Technology | September 26-29, 2016, Gyeongju, Korea

    ICMAP 2016The 6th International Conference on Microelectronics and Plasma Technology | September 26-29, 2016, Gyeongju, Korea

    TA3Special session (Plasma Agriculture)

    September 27 (Tuesday), 15:30-17:00, Room A

    Session Chairs: Juergen Kolb (Leibniz Institute for Plasma Science and Technology)

    TA3-1 160170 | 15:30 - 16:00Control for plant disease and growth by plasma Gyungsoon Park, Sang Hye Ji, Min Ho Kang, Seong Sil Jeon, Se Hoon Ki, Somin Shin, Jae Ho Shin, Han Sup Uhm and Eun Ha Choi (Kwangwoon University, Korea)

    TA3-2 160235 | 16:00 - 16:30Plasma Applications for Agri-food Storage Seong Bong Kim (Plasma Technology Research Center, National Fusion Research Institute, Korea), Suk Jae Yoo (National Fusion Research Institute, Korea), Seungmin Ryu, Sangheum Eom, Yeunsoo Park, Jung Woo Yoon, Sung-Young Yoon, and HyeongWon Jeon (Plasma Technology Research Center, National Fusion Research Institute, Korea), Kyung Jin Park and Hyun Joo AN (Citrus Research Institute, Korea) TA3-3 160179 | 16:30 - 17:00Requirements and considerations for high efficiency non-thermal atmospheric pressure plasma sources for agriculture and food areas Wonho Choe (KAIST, Korea)

    TB1Materials and Processing on next generation Semiconductor & Nano Devices 4

    September 27 (Tuesday), 09:00-10:30, Room B

    Session Chairs: Changhwan Choi (Hanyang University)

    TB1-1 160244 | 09:00 - 09:30 [Invited] Ultra-low Platinum based electrocatalyst for polymer electrolyte fuel cellsSun-Mi Hwang (Korea Institute of Energy Research (KIER), Korea), Sang Hoon Joo (Ulsan National Institute of Science and Technology (UNIST), Korea), Sung-Dae Yim and Gu-Gon PARK (Korea Institute of Energy Research (KIER), Korea), YongMan Choi (SABIC, Saudi Arabia)

    TB1-2 160223 | 09:30 - 10:00 [Invited] Emerging challenges in modern semiconductor manufacturing regarding the role of data analytics impacting productivity Taejoon Han (Tokyo Electron Ltd., Technology Center America (TTCA), USA, United States) TB1-3 160124 | 10:00 - 10:30[Invited] Analyses of surface reactions and damage formation in plasma etching processes: a study based on beam experiments and molecular dynamics simulation Satoshi Hamaguchi, Hu Li, Tomoko Ito, Michiro Isobe and Kazuhiro Karahashi (Osaka University, Japan)

  • ICMAP 2016 29

    ICMAP 2016The 6th International Conference on Microelectronics and Plasma Technology | September 26-29, 2016, Gyeongju, Korea

    ICMAP 2016The 6th International Conference on Microelectronics and Plasma Technology | September 26-29, 2016, Gyeongju, Korea

    TB2Materials and Processing on next generation Semiconductor & Nano Devices 5

    September 27 (Tuesday), 13:20-15:10, Room B

    Session Chairs: Satoshi Hamaguchi (Osaka University)

    TB2-1 160228 | 13:20 - 14:00[Keynote] Recent progress on diamond semiconductor electronics Hong-Xing Wang (Xian Jiaotong University, China)

    TB2-2 160243 | 14:00 - 14:30[Invited] Numerical Modeling of Semiconductor Fabrication Equipment : Plasma and Gas Flow Hojun Kim (Samsung Electronics, Korea) TB2-3 160229 | 14:30 - 15:10[Keynote] Advanced RF Technologies for Pulsed Plasma Processes Jaehyun Kim (MKS Instruments, Korea), Aaron Radomski (MKS Instruments, United States)

    TB3Basic Plasma Science and Technology 2

    September 27 (Tuesday), 15:30-17:10, Room B

    Session Chairs: Bong Guen Hong (Chonbuk National University)

    TB3-1 160005 | 15:30 - 16:10[Keynote] Gaseous Plasma Technologies for Cardiovascular Implants Miran Mozetic (Jozef Stefan Institute, Slovenia)

    TB3-2 160128 | 16:10 - 16:40[Invited] Advanced microwave plasma technology for materials processing Jaeho Kim, Hiromoto Itagaki and Hajime Sakakita (National Institute of Advanced Industrial Science and Technology (AIST), Japan)

    TB3-3 160110 | 16:40 - 17:10[Invited] Impacts of Wet and Dry Cleaning Process on the Performance of MOS Devices Changhwan Choi (Hanyang University, Korea)

  • ICMAP 201630

    ICMAP 2016The 6th International Conference on Microelectronics and Plasma Technology | September 26-29, 2016, Gyeongju, Korea

    ICMAP 2016The 6th International Conference on Microelectronics and Plasma Technology | September 26-29, 2016, Gyeongju, Korea

    TC1Tutorial I (RF technology, MKS Jin Huh)

    September 27 (Tuesday), 09:00-10:30, Room C

    Session Chairs: Junghoon Joo (Kunsan National University)

    TC1-1 160209 | 09:00 - 10:30Introduction to RF generator and match for plasma Huh Jin (MKS instrument, Korea)

    TC2Tutorial II (Vacuum technology, Edwards Vacuum, Janghun Joo)

    September 27 (Tuesday), 13:20-15:00, Room C

    Session Chairs: Junghoon Joo (Kunsan National University)

    TC2-1 160185 | 13:20 - 15:00Vacuum Technology for Next generation plasma applications Janghun Joo (Edwards Korea Ltd, Korea)

    TC3Tutorial III (Dry etcher development, APTC, Namhun Kim)

    September 27 (Tuesday), 15:30-17:10, Room C

    Session Chairs: Junghoon Joo (Kunsan National University)

    TC3-1 160214 | 15:30 - 17:10A Smart Approach to the Next Generation Semiconductor Processing Equipment Nam-Hun Kim (APTC, Korea)

    WA1Plasma Bioscience, Agriculture and Food 1

    September 28 (Wednesday), 09:00-10:50, Room A

    Session Chairs: Wu Guosong (Kwangwoon University)

    WA1-1 160158 | 09:00 - 09:30[Invited] The role of non-thermal atmospheric pressure bio-compatible plasma (NBP) on human stem cells Ihn Han and Eun Ha Choi (Kwangwoon University, Korea)

  • ICMAP 2016 31

    ICMAP 2016The 6th International Conference on Microelectronics and Plasma Technology | September 26-29, 2016, Gyeongju, Korea

    ICMAP 2016The 6th International Conference on Microelectronics and Plasma Technology | September 26-29, 2016, Gyeongju, Korea

    WA1-2 160224 | 09:30 - 10:00[Invited] Plasma activated solution enhances melanogenesis through increasing reactive oxygen and nitrogen species Kyu-Sun Lee (Korea Research Institute of Bioscience & Biotechnology, Korea), Anser Ali (Kwangwoon University, Korea), Ameer Rasheed (Korea Research Institute of Bioscience & Biotechnology, Korea), Eun Ha Choi (Kwangwoon University, Korea) WA1-3 160148 | 10:00 - 10:20High-speed and low-temperature sterilization using flexible plasma packaging pouch Youbong Lim (KAIST, Korea), Jaejune Hwang (Plasmapp Co., Ltd, Korea), Jooyoung Park and Wonho Choe (KAIST, Korea) WA1-4 160084 | 10:20 - 10:50[Invited] Multiplex coherent anti-Stokes Raman scattering microscopy for monitoring plasma-treated cells Takayuki Ohta (Meijo University, Japan), Ryo Furuta (Nagoya University, Japan), Masafumi Ito (Meijo University, Japan), Kenji Ishikawa and Masaru Hori (Nagoya University, Japan)

    WA2Plasma Bioscience, Agriculture and Food 2

    September 28 (Wednesday), 13:10-15:10, Room A

    Session Chairs: Seolhye Park (Samsung Display)

    WA2-1 160039 | 13:10 - 13:40[Invited] Degradation control of magnesium alloys by plasma related technologies Paul K. Chu (City University of Hong Kong, Hong Kong), Guosong Wu and Eun-Ha Choi (Kwangwoon University, Korea) WA2-2 160019 | 13:40 - 14:10[Invited] Non-thermal atmospheric pressure plasma functionalization for dental application Jung-Hwan Lee (Institute of Tissue Regeneration Engineering (ITREN), Korea)

    WA2-3 160078 | 14:10 - 14:40[Invited] Development of Optimized Electrochromic Devices with High Color Efficiency Jin-Hyo Boo (Sungkyunkwan University, Korea)

    WA2-4 160248 | 14:40 - 15:10[Invited] High performance metal oxide field-effect transistorsJae Kyeong Jeong (Hanyang University, Korea)

  • ICMAP 201632

    ICMAP 2016The 6th International Conference on Microelectronics and Plasma Technology | September 26-29, 2016, Gyeongju, Korea

    ICMAP 2016The 6th International Conference on Microelectronics and Plasma Technology | September 26-29, 2016, Gyeongju, Korea

    WA3Materials and Processing on Next Generation Displays

    September 28 (Wednesday), 15:30-17:20, Room A

    Session Chairs: Jin-Hyo Boo (Sungkyunkwan University)

    WA3-1 160101 | 15:30 - 16:00 [Invited] Application of the PI-VM for management of the plasma-assisted processes in OLED display manufacturing Seolhye Park (Samsung Display, Korea), Hyun-Joon Roh, Sangwon Ryu, Yunchang Jang and Nam-Kyun Kim (Seoul National University, Korea), Juyoung Lee (Samsung Display, Korea), Gon-Ho Kim (Seoul National University, Korea) WA3-2 160169 | 16:00 - 16:20 Geometry effects of Polymeric Bio-inspired Nanostructures on Specular Reflectance Seungmuk Ji, Jihye Lee and Young-Shik Yun (Yonsei University, Korea), Namsu Kim and Hyuneui Lim (Korea Institute of Machinery and Materials, Korea), Jong-Souk Yeo (Yonsei University, Korea)

    WA3-3 160109 | 16:20 - 16:50 [Invited] High-performance nanomaterial sensors-principles and trends of gas sensors Hyoun Woo Kim (Hanyang University, Korea)

    WA3-4 160230 | 16:50 - 17:20 [Invited] Neutral Beam Based Plasma Applications to Flexible & Wearable Displays MunPyo Hong (Korea University, Korea)

    WB1Basic Plasma Science and Technology 3

    September 28 (Wednesday), 09:00-10:50, Room B

    Session Chairs: Hirotaka Toyoda (Nagoya University)

    WB1-1 160018 | 09:00 - 09:20 Effects of secondary electron emission on capacitively coupled plasmas: Hybrid model simulation Yu-Ru Zhang, Ge Jiang and You-Nian Wang (Dalian University of Technology, China) WB1-2 160062 | 09:20 - 09:40 The application of plasma diagnostic in the damage assessment of shaped charge jet Qiong Hou, Qing Ming Zhang and Yi Jiang Xue (Beijing Institute of Technology, China) WB1-3 160222 | 09:40 - 10:10 [Invited] Surface reaction modeling for 3D feature profile simulation of fluorocarbon plasma etch process toward sub-10 nm node technology Yeon Ho Im (Chonbuk National University, Korea)

  • ICMAP 2016 33

    ICMAP 2016The 6th International Conference on Microelectronics and Plasma Technology | September 26-29, 2016, Gyeongju, Korea

    ICMAP 2016The 6th International Conference on Microelectronics and Plasma Technology | September 26-29, 2016, Gyeongju, Korea

    WB1-4 160217 | 10:10 - 10:50[Keynote] Nitriding Process using High Density Plasma by Hollow Cathode Discharge and Its Applications Youngha Jun, Joonyong Moon and Jaemin Cheon (J&L TECH CO., LTD, Korea)

    WB2Basic Plasma Science and Technology 4

    September 28 (Wednesday), 13:20-15:10, Room B

    Session Chairs: Mun Pyo Hong (Korea University)

    WB2-1 160225 | 13:20 - 13:50 [Invited] Development of microwave plasma sources and their applications Hirotaka Toyoda (Nagoya University, Japan) WB2-2 160091 | 13:50 - 14:10 Fluid Simulation of Chemical Reaction Mechanisms in Capacitively Coupled N2/Ar Plasmas Ying-Shuang Liang, Fei Gao and You-Nian Wang (Dalian University of Technology, China)

    WB2-3 160088 | 14:10 - 14:40 [Invited] Anode Spot Plasma Ion Source: High current ion beam extraction with high power efficiency Yong-Seok Hwang, Yuna Lee and Kyoung-Jae Chung (Seoul National University, Korea)

    WB2-4 160233 | 14:40 - 15:10[Invited] Diagnostics of magnetron sputtering plasmas for deposition of CuZnSnS films Koichi Sasaki (Hokkaido University, Japan), Nayan Nafarizal (Universiti Tun Hussein Onn Malaysia, Malaysia)

    WB3Basic Plasma Science and Technology 5

    September 28 (Wednesday), 15:30-17:20, Room B

    Session Chairs: Yuan-Hong Song (Dalian University of Technology)

    WB3-1 160220 | 15:30 - 16:10 [Keynote] Atmospheric-pressure air microplasmas: from their generations and characterizations to their applications Dongping Liu (Dalian Nationalities University, China)

    WB3-2 160227 | 16:10 - 16:40 [Invited] AlGaN-based deep ultraviolet light-emitting diodes: Challenges and Countermeasures Jong Kyu Kim (POSTECH, Korea)

  • ICMAP 201634

    ICMAP 2016The 6th International Conference on Microelectronics and Plasma Technology | September 26-29, 2016, Gyeongju, Korea

    ICMAP 2016The 6th International Conference on Microelectronics and Plasma Technology | September 26-29, 2016, Gyeongju, Korea

    WB3-3 160188 | 16:40 - 17:00 Low Temperature PECVD Processes for Flexible Moisture Barrier Films with SiNx/Organic Multilayer Structure Sun Jung Kim, Sang Heon Yong, Hyung June Ahn and Heeyeop Chae (Sungkyunkwan University (SKKU), Korea)

    WB3-4 160154 | 17:00 - 17:20 Laboratory experiment relevant to mesospheric clouds, Saturns rings and protoplanetary disks Kil-Byoung Chai (Korea Atomic Energy Research Institute, Korea), Paul M Bellan (Caltech, United States)

    ThABasic Plasma Science and Technology 6

    September 29 (Thursday), 09:00-12:00, Room A

    Session Chairs: Shinjae You (Chungnam National University)

    ThA-1 160238 | 09:00 - 09:40[Keynote] Silicon nano-structures for energy storage Rajiv Onkar Dusane (Indian Institute of Technology Bombay, India) ThA-2 160037 | 09:40 - 10:00Optical emission spectroscopy as a diagnostic of helicon plasma discharges Peiyu Ji, Jun Yu, Chenggang Jin, Lanjian Zhuge and Xuemei Wu (Soochow University, China) ThA-3 160038 | 10:00 - 10:20 Design and measurement of High-Field-Side probe on EAST tokamaks Yan Zhao, Yibo Hu, Lanjian Zhuge and Xuemei Wu (Soochow University, China)

    ThA-4 160226 | 10:20 - 10:50 [Invited] Development of new plasma sources for thin film deposition Yong Sup Choi and Kang-IL Lee (National Fusion Research Institute, Korea) ThA-5 160232 | 10:50 - 11:20 [Invited] Helicon plasma source with M=0 antenna Bert Ellingboe, Cezar Gaman, Rachel Moloney, Andrew Killoch and Nishant Sirse (Dublin City University, Ireland) ThA-6 160033 | 11:20 - 11:40 Research on characteristics of array type air plasma driven by high frequency and high voltage power source Yibo Hu, Chenggang Jin, Lanjian Zhuge and Xuemei Wu (Soochow University, China)

  • ICMAP 2016 35

    ICMAP 2016The 6th International Conference on Microelectronics and Plasma Technology | September 26-29, 2016, Gyeongju, Korea

    ICMAP 2016The 6th International Conference on Microelectronics and Plasma Technology | September 26-29, 2016, Gyeongju, Korea

    ThA-7 160032 | 11:40 - 12:00 A tunable microwave plasma photonic crystal super narrow band filter Dongjin Yang, Haiyun Tan, Chenggang Jin, Lanjian Zhuge and Xuemei Wu (Soochow University, China)

    ThBBasic Plasma Science and Technology 7

    September 29 (Thursday), 09:00-12:00, Room B

    Session Chairs: Se Youn Moon (Chonbuk National University)

    ThB-1 160066 | 09:00 - 09:30 [Invited] Aero-sol Deposition Process for All Solid State Battery Kiyoshi Kanamura (Tokyo Metropolitan University, Japan)

    ThB-2 160034 | 09:30 - 09:50 Synthesis of TiO2 thin films by multi-frequency and multi-target ICP enhanced RF magnetron sputtering Jiaqi Yang, Yibo Hu, Chenggang Jin, Lanjian Zhuge and Xuemei Wu (Soochow University, China) ThB-3 160036 | 09:50 - 10:10 Synthesis of nanocrystalline diamond by helicon wave plasma Jun Yu, Tianyuan Huang, Peiyu Ji, Chenggang Jin, Lanjian Zhuge and Xuemei Wu (Soochow University, China)

    ThB-4 160121 | 10:10 - 10:40 [Invited] Linear Microwave Plasma Source for Low Temperature Roll-to-Roll Processing Ho-Jun Lee (Pusan National University, Korea)

    ThB-5 160035 | 10:40 - 11:00 Development of magnetic probe for use in helicon wave excited plasma Guilu Zhang, Yibo Hu, Yan Zhao, Chenggang Jin, Lanjian Zhuge and Xuemei Wu (Soochow University, China) ThB-6 160239 | 11:00 - 11:30 [Invited] Current Status and Prospects of High Efficiency Solar Cells Junsin Yi (Sungkyunkwan University, Korea) ThB-7 160241 | 11:30 - 12:00 [Invited] High brightness single photon emission from a semiconductor single quantum dot embedded in a solid immersion lens Donghan Lee, Jongseo Baik, Vasanthan Devaraj, Yudong Jang and Hyuck Jeong (Chungnam National University, Korea), Jihoon Kyhm and Jindong Song (KIST, Korea)

  • ICMAP 201636

    ICMAP 2016The 6th International Conference on Microelectronics and Plasma Technology | September 26-29, 2016, Gyeongju, Korea

    ICMAP 2016The 6th International Conference on Microelectronics and Plasma Technology | September 26-29, 2016, Gyeongju, Korea

    Poster SessionsTPPoster Session 1

    September 27 (Tuesday), 17:00-19:00, Hall

    Session Chairs: Seyoun Moon (Chonbuk National Univ)

    TP-1 160213 | 17:00 - 19:00 Tunneling conduction by diffusion current of thin film transistor at low temperature Teresa Oh (Cheongju University, Korea) TP-2 160206 | 17:00 - 19:00 withdrawn

    TP-3 160203 | 17:00 - 19:00 Plasma treated effects on the electrical reliability of multi-layer MoS2 field-effect transistorBoung Jun Lee, Byung Jun Lee, Jongchan Lee, Ji-Woon Yang and Kwang-Ho Kwon (Korea University, Korea) TP-4 160201 | 17:00 - 19:00 Characteristic of BCE type IGZO TFT device with various source/drain metals. Jeong Hyeon Kim (Korea Aerospace University, Korea) TP-5 160198 | 17:00 - 19:00 Surface smoothness improvement of atomic layer deposited HfO2 film via inserting Al2O3 thin layers Bo Li, Yong Chan Jung, Sejong Seong, Taehoon Lee, In-Sung Park and Jinho Ahn (Hanyang University, Korea)

    TP-6 160197 | 17:00 - 19:00 Feasibility study on graphene-embedded EUV pellicle Ji Eun Kim, Jung Hwan Kim, Yong Ju Jang, Young Woong Kim and Jinho Ahn (Hanyang University, Korea)

    TP-7 160196 | 17:00 - 19:00 Optical properties of quasicrystal patterned Y2O3:Eu3+ thin-film phosphors by nanosphere lithography Hyojun Kim and In-Sung Park (Hanyang University, Korea), Ki-Young Ko (Korea Invention Promotion Association, Korea), Jinho Ahn (Hanyang University, Korea)

    TP-8 160195 | 17:00 - 19:00 withdrawn TP-9 160194 | 17:00 - 19:00 withdrawn

  • ICMAP 2016 37

    ICMAP 2016The 6th International Conference on Microelectronics and Plasma Technology | September 26-29, 2016, Gyeongju, Korea

    ICMAP 2016The 6th International Conference on Microelectronics and Plasma Technology | September 26-29, 2016, Gyeongju, Korea

    TP-10 160184 | 17:00 - 19:00 Graphene-Metal Zig-Zag Edge Contact for Reducing Contact Resistance Jeongun Choe, Jong-Souk Yeo and Jaehyun Han (Yonsei University, Korea)

    TP-11 160180 | 17:00 - 19:00 withdrawn TP-12 160178 | 17:00 - 19:00 Optical properties in graphene quantum dots: from linear to nonlinear property for their applications Min-Ho Jang (KAIST, Korea), Sung Ho Song (Kongju National University, Korea), Jin Chung (KAIST, Korea), Bo Hyun Kim (DGIST, Korea), Seunghyup Yoo, Seokwoo Jeon and Yong-Hoon Cho (KAIST, Korea) TP-13 160176 | 17:00 - 19:00 Cyclic Plasma Cleaning Process for SiO2 Film using Surface Fluorination Kyongbeom Koh, Duhyeon Ka, Hongrae Shin, Haegyu Jang and Heeyeop Chae (Sungkyunkwan University (SKKU), Korea) TP-14 160152 | 17:00 - 19:00 A Transparent and Stretchable Humidity Sensor for Body-Attachable Wearable Electronics Tran Quang Trung and Nae-Eung Lee (Sungkyunkwan University, Korea) TP-15 160151 | 17:00 - 19:00 Stretchable, patchable, and piezoresistive pressure sensor with high stability under stretching Eun Roh and Nae-Eung Lee (Sungkyunkwan University, Korea) TP-16 160150 | 17:00 - 19:00 A Stretchable Electrochemical Biosensor Platform on Microstructure Patterned Elastomeric Substrate Bo-yeong Kim and Nae-Eung Lee (Sungkyunkwan Univ., Korea) TP-17 160146 | 17:00 - 19:00 Understanding the Mechanism of MoS2 Atomic Layer Etching for Nano-Devices Ki Seok Kim, Ki Hyun Kim, You Jin Ji and Geun Young Yeom (Sungkyunkwan University, Korea) TP-18 160144 | 17:00 - 19:00 Surface Treatment Process for Graphene-based Electronics Kihyun Kim, Kiseok Kim, You Jin Ji and Geun Young Yeom (Sungkyunkwan Univ.(SKKU), Korea) TP-19 160142 | 17:00 - 19:00 High-Quality HfO2 Deposition on Graphene through Low Energy Ar+ Ion Beam Treatment You Jin Ji, Geun Young Yeom, Kiseok Kim, and Kihyun Kim (Sungkyunkwan University, Korea) TP-20 160141 | 17:00 - 19:00 Etching of magnetic tunneling junction materials with pulsed bias frequency variation Sung Woo Park, Kyung Chae Yang, Ho Seok Lee and Geun Young Yeom (Sungkyunkwan University, Korea)

  • ICMAP 201638

    ICMAP 2016The 6th International Conference on Microelectronics and Plasma Technology | September 26-29, 2016, Gyeongju, Korea

    ICMAP 2016The 6th International Conference on Microelectronics and Plasma Technology | September 26-29, 2016, Gyeongju, Korea

    TP-21 160120 | 17:00 - 19:00 Incorporation of Pt nanoparticles on the surface of TeO2-branched porous Si nanowire structures for enhanced gas sensing. Myung Sik Choi, Yong Jung Kwon, Sung Yong Kang, Jae Hoon Bang, Ali Mirzaei and Hyoun Woo Kim (Hanyang University, Korea), Sang Sub Kim (Inha University, Korea) TP-22 160111 | 17:00 - 19:00 MOS Device VFB Shift Using Oxygen Modulation within PVD and PEALD TiN Gate Electrode Changhwan Choi, Young Jim Kim, Hoon Hee Han and Seokki Son (Hanyang University, Korea) TP-23 160100 | 17:00 - 19:00 Anisotropic etching of CoFeB magnetic thin films in C2H5OH/Ar plasma Jae Sang Choi, Jae Yong Lee, Su Min Hwang, Doo Hyeon Cho, Chee Won Chung and Adrian Adalberto Garay (Inha University, Korea)

    TP-24 160099 | 17:00 - 19:00 Nanometer-Size Patterning of TiN Thin Films Using Inductively Coupled Plasma of Cl2/C2F6/Ar Su Min Hwang, Jae Yong Lee, Jae Sang Choi, Doo Hyeon Cho and Chee Won Chung (Inha University, Korea)

    TP-25 160098 | 17:00 - 19:00 Investigation on etch characteristics of Palladium thin films using CH3COOH/Ar gas. Jae Yong Lee, Su Min Hwang, Jae Sang Choi, Doo Hyeon Cho and Chee Won Chung (Inha University, Korea) TP-26 160092 | 17:00 - 19:00 Technological landscape of physical vapor deposition apparatus Min W. Lee (Sungkyunkwan University / Korea Intellectual Property Strategy Agency, Korea), Jun S. Lee and Jeon G. Han (Sungkyunkwan University, Korea), In H. Lee (Korea Intellectual Property Strategy Agency, Korea) TP-27 160089 | 17:00 - 19:00 Characteristics of boron nitride thin films for high performance nanoelectronics Jun-Young Jeon, Ban-Suk Park and Tae-Jun Ha (Kwangwoon University, Korea), Anne Henry (Linkping University, Sweden)

    TP-28 160079 | 17:00 - 19:00 Process fault detection of PECVD equipment for manufacturing Multi-layer Minji Kwon, Chiyoung Lee, Hyeju Hwang, Hyunchul Wang and Nae IlL Lee (Wonik IPS, Korea)

    TP-29 160071 | 17:00 - 19:00 Softness, Emission Enhancement and Fluorescence Image Patterning of Conjugated Polymer via in Situ Embedding into Elastomeric Silicone Rubber Matrix Dong Cheul Han, Wang-Hoon Lee and Han-Jae Shin (Gumi Electronics & Information Technology Research Institute, Korea)

  • ICMAP 2016 39

    ICMAP 2016The 6th International Conference on Microelectronics and Plasma Technology | September 26-29, 2016, Gyeongju, Korea

    ICMAP 2016The 6th International Conference on Microelectronics and Plasma Technology | September 26-29, 2016, Gyeongju, Korea

    TP-30 160069 | 17:00 - 19:00 Implementation of rapid thermal processing with real time measuring technique by thermocouple C.S. Cho (Kyungpook National University, Korea), C.G. Seog, D.Y. Kong and M.G. Song (Ultech Co. Ltd., Korea), B.H. Kim (Catholic University of Daegu, Korea), D.I. Lee (Yeungnam University, Korea)

    TP-31 160068 | 17:00 - 19:00 Porous Nanostructures by Low Vacuum Sputtering for Surface Enhanced Raman Scattering C.S. Cho and S.H. Yun (Kyungpook National University, Korea), Y.C. Hong and J.M. Yang (Yonsei University, Korea), B.H. Kim (Catholic University of Daegu, Korea)

    TP-32 160049 | 17:00 - 19:00 Thermal Effect on the Properties of TiN FilmsGrown by a pure N2 Plasma Sputtering Changhwan Park (Daegu Catholic Univerity, Korea)

    TP-33 160025 | 17:00 - 19:00 Solution-Processed Sub-Nano-Channel Carbon Nanotube Thin-Film Transistors Jun-Young Jeon, Ban-Suk Park and Tae-Jun Ha (Kwangwoon University, Korea)

    TP-34 160016 | 17:00 - 19:00 InGaP/GaAs Superlattice-Emitter and GaAsBi Base Heterojunction Bipolar Transistor with High Current-Gain Linearity Jung-Hui Tsai (National Kaohsiung Normal University, Taiwan), Yi-Chen Wu (National University of Kaohsiung, Taiwan), Syuan-Hao Liou and Pao-Sheng Lin (National Kaohsiung Normal University, Taiwan), Te-Kuang Chiang (National University of Kaohsiung, Taiwan)

    TP-35 160015 | 17:00 - 19:00Performance of Al0.2Ga0.3In0.5P/In0.15Ga0.85As complementary co-integrated pseudomorphic doping-channel field-effect transistors Jung-Hui Tsai and Pao-Sheng Lin (National Kaohsiung Normal University, Taiwan), Yi-Chen Wu (National University of Kaohsiung, Taiwan), Syuan-Hao Liou (National Kaohsiung Normal University, Taiwan), Te-Kuang Chiang (National University of Kaohsiung, Taiwan)

    TP-36 160014 | 17:00 - 19:00Influence of Doping-Channel Layer on AlGaN/GaN High Electron Mobility Transistors Fu-Min Wang, Syuan-Hao Liou, Pao-Sheng Lin and Jung-Hui Tsai (National Kaohsiung Normal University, Taiwan)

    TP-37 160013 | 17:00 - 19:00Dominant Sensing mechanism in Bi2O3-core/ZnO-shell nanobelts Hyejoon Kheel, Gun-Joo Sun, Jae Kyung Lee and Wan In Lee (Inha University, Korea), Hyoun Woo Kim (Hanyang University, Korea), Chongmu Lee (Inha University, Korea)

    TP-38 160012 | 17:00 - 19:00Acetone gas sensing using a networked PbO-functionalized SnO2 nanorod sensor Ram Prakash Dwivedi (Shoolini University, India), Gun-Joo Sun, Hyejoon Kheel and Jae Kyung Lee (Inha University, Korea), Hyoun Woo Kim (Hanyang University, Korea), Chongmu Lee (Inha University, Korea)

  • ICMAP 201640

    ICMAP 2016The 6th International Conference on Microelectronics and Plasma Technology | September 26-29, 2016, Gyeongju, Korea

    ICMAP 2016The 6th International Conference on Microelectronics and Plasma Technology | September 26-29, 2016, Gyeongju, Korea

    TP-39 160234 | 17:00 - 19:00The low temperature solution process using visible laser and fuel Jae-Won Choi, Soo-Yeun Han, Manh-Cuong Nguyen, An Hoang Thuy Nguyen, Jung Yeon Kim and Rino Choi (Inha University, Korea)

    TP-40 160219 | 17:00 - 19:00Laser Induced Forward Transfer of Nano Patterned Metal Line Using Visible Laser Manh-Cuong Nguyen, Hack-Yeon Kim, Jae-Won Choi, Soo-Yeun Han, An Hoang-Thuy Nguyen, Jungyeon Kim, Sang-Woo Kim, Su-Jin Choi, Jong-Kyu Jun and Rino Choi (Inha University, Korea)

    TP-41 160207 | 17:00 - 19:00Electrochemical analysis on wet etching behaviors of copper/titanium in phosphoric acid solution Jong Hyun Seo, Byoung O Kim and Jeong Hyun Kim (Korea Aerospace University, Korea)

    TP-42 160205 | 17:00 - 19:00Effect of fluoride ion on wet etching of copper/molybdenum in hydrogen peroxide Byoung O Kim, Jeong Hyun Kim and Jong Hyun Seo (Korea Aerospace University, Korea)

    TP-43 160202 | 17:00 - 19:00PECVD SiNx and PEALD Al2O3 Alternating Multilayers for Flexible Mositure Barrier Films Jang Soon Park, Heeyeop Chae, Sang Heon Yong and Sun Jung Kim (Sungkyunkwan University(SKKU), Korea)

    TP-44 160193 | 17:00 - 19:00Inductively coupled plasma reactive ion etching of titanium nitride thin films in a N2/Cl2/Ar plasma Yiyu Wang, Young-Hee Joo, and Chang-Il Kim (Chung-Ang University, Korea)

    TP-45 160192 | 17:00 - 19:00withdrawn

    TP-46 160187 | 17:00 - 19:00Photosensitive organic-inorganic hybrid passivation layers on a-InGaZnO thin-film transistors for flexible display backplane KyungDuck Kim, SeulGi Kim, DongHyeok Lee and MunPyo Hong (Korea University, Korea)

    TP-47 160182 | 17:00 - 19:00Effects of magnetic field shielded sputtering process on the properties of InGaZnO thin film transistor DongHyeok Lee, KyungDuck Kim, SeulGi Kim and MunPyo Hong (Korea University, Korea)

    TP-48 160181 | 17:00 - 19:00High efficiency Phosphor-free white LEDs using InGaN/GaN ring structure Youngchul Sim, Seung-Hyuk Lim, Yang-Seok Yoo and Yong-Hoon Cho (KAIST, Korea)

  • ICMAP 2016 41

    ICMAP 2016The 6th International Conference on Microelectronics and Plasma Technology | September 26-29, 2016, Gyeongju, Korea

    ICMAP 2016The 6th International Conference on Microelectronics and Plasma Technology | September 26-29, 2016, Gyeongju, Korea

    TP-49 160177 | 17:00 - 19:00Room temperature copper dry etching by using electron cyclotron resonance plasma Seong Yong Kwon, Jin Nyoung Jang, JangWon Yun and MunPyo Hong (Korea University, Korea)

    TP-50 160175 | 17:00 - 19:00Multidimensional Comprehension of Haptic Perception using Micro Topographic Surfaces with Various Pitches and Materials Hee-Jae Hwang, Jong-Souk Yeo, Jeongun Choe, Jihye, Seungmuk Ji, and Da Young Ju (Yonsei University, Korea)

    TP-51 160174 | 17:00 - 19:00Neutral beam assisted roll-to-roll sputtering systems forming high density gas barriers for flexible AMOLEDs YunSung Jang, SeungMin Shin, Seungjun Yi and MunPyo Hong (Korea University, Korea)

    TP-52 160172 | 17:00 - 19:00Nonvolatile Memory device using mobile protons via insertion hydrogen neutral beam treatment process at room temperature. JangWon Yun, Jin Nyoung Jang and MunPyo Hong (Korea University, Korea)

    TP-53 160168 | 17:00 - 19:00Effect of the atmospheric plasma treatment of the plastic substrate on the adhesion characteristics Cheol-Hee Moon (Hoseo University, Korea)

    TP-54 160167 | 17:00 - 19:00New method to measure the WVTR of the OLED encapsulation Cheol-Hee Moon (Hoseo University, Korea)

    TP-55 160166 | 17:00 - 19:00New OLED encapsulation technology for the application of the flexible substrate Cheol-Hee Moon (Hoseo University, Korea)

    TP-56 160164 | 17:00 - 19:00Dielectric Properties of Poly(vinylidenefluoride-co-hexafluoropropylene) Nanocomposites Embeded Barium Titanate Nanoparticles Wooje Han and Hyung-Ho Park (Yonsei University, Korea)

    TP-57 160163 | 17:00 - 19:00A study of atomic layer deposited F-doped ZnO thin films with various deposition temperatures Kyung-Mun Kang, Wooje Han, and Hyung-Ho Park (Yonsei University, Korea)

    TP-58 160149 | 17:00 - 19:00Plasma press for improved adhesive strength between copper and composite materials Doo San Kim, Geun Young Yeom, Mu Kyeom Mun and Jin Woo Park (Sungkyunkwan University, Korea)

  • ICMAP 201642

    ICMAP 2016The 6th International Conference on Microelectronics and Plasma Technology | September 26-29, 2016, Gyeongju, Korea

    ICMAP 2016The 6th International Conference on Microelectronics and Plasma Technology | September 26-29, 2016, Gyeongju, Korea

    TP-59 160145 | 17:00 - 19:00Fabrication of transparent, flexible and stretchable electrode based on a graphite nanoplatelet/silver nanowire hybrid film for organic light emitting diode Jisoo Oh, Geun Young Yeom, Jongsik Oh and Dain Sung (Sungkyunkwan University, Korea)

    TP-60 160135 | 17:00 - 19:00Deposition of ITO thin film for electrochromic (EC) and flat panel display applications using DC magnetron sputtering technology Md. Shahinur Rahman, Ulugbek Shaislamov, Jong-Keun Yang, Suresh Rai, Konstantin Lyakhov and Heon-Ju Lee (Jeju National University, Korea)

    TP-61 160116 | 17:00 - 19:00Direct ablation of aluminum-doped zinc oxide thin films for electrode patterning by optimization of laser beam conditions. Hanyeob Nam, Minyu Yin, Sang Jik Kwon and Eou-Sik Cho (Gachon Univ., Korea)

    TP-62 160093 | 17:00 - 19:00The Characteristics of Green-synthesized Organic Thin Films with Self-Assembly Nanoparticles prepared by Spin-Coating Techniques Chia-Hong Huang and Kwang-Ming Lee (National Kaohsiung Normal University, Taiwan), Cheng-Yen Liu and Chung-Cheng Chang (National Taiwan Ocean University, Taiwan), Yi-Kai Fang (National Kaohsiung Normal University, Taiwan)

    TP-63 160086 | 17:00 - 19:00Electro-Optical Responses by Frequency Modulation of Polymer-Dispersed Liquid Crystals with Nano Particles Hee Yeon Noh and Hyunseok Shim (DGIST, Korea), Bunyod Allabergenov (DGIST, Urgench State University named after Al-Khorezmi (USU), Korea), Hong-Kun Lyu, Myoung-Jae Lee and Byeongdae Choi (DGIST, Korea)

    TP-64 160064 | 17:00 - 19:00Optical and Chemical properties of Nano-Diamond (ND) doped amorphous carbon layer(ACL) films prepared by PECVD Hyo Jun Jung (TES, Korea)

    TP-65 160051 | 17:00 - 19:00Investigation on the cause of hump in the transfer characteristics of a-InGaZnO thin film transistors Young Jun Lee, Dong-Wook Kim, Heehwan Choe and Jae-Hong Jeon (Korea Aerospace University, Korea)

    TP-66 160047 | 17:00 - 19:00Synthesis and characterization of SiN thin films by PECVD Long Wen (Sungkyunkwan University, Korea)

  • ICMAP 2016 43

    ICMAP 2016The 6th International Conference on Microelectronics and Plasma Technology | September 26-29, 2016, Gyeongju, Korea

    ICMAP 2016The 6th International Conference on Microelectronics and Plasma Technology | September 26-29, 2016, Gyeongju, Korea

    TP-67 160045 | 17:00 - 19:00Effect of plasma and radical control for silicon nitride film deposited on flexible substrates at low temperature by plasma enhanced chemical vapor deposition Jun S. Lee, B.B. Sahu, Long Wen and Jeon G. Han (Sungkyunkwan University, Korea)

    TP-68 160030 | 17:00 - 19:00Annealing effect on the crystalline properties of pulsed laser deposited gallium oxide thin films on SiOx/Si substrate Byeongdae Choi (Daegu Gyeongbuk Institute of Science and Technology (DGIST), Korea), Bunyod Allabergenov (Daegu Gyeongbuk Institute of Science and Technology (DGIST) / Urgench State University (USU), Korea), Hyunseok Shim, Myoung-Jae Lee, Hong-Kun Lyu and Woo Young Jung (Daegu Gyeongbuk Institute of Science and Technology (DGIST), Korea)

    TP-69 160010 | 17:00 - 19:00The Current efficiency Characteristics of Double EML Structured Controlled by CBP, TPBi Layer Thickness YoungHoon Kang (SungKyunKwan University, Korea)

    TP-70 160009 | 17:00 - 19:00Fabrication and characterization of SiO2/TiO2 multilayer thin films for blue light band-pass filter application Bunyod Allabergenov (Daegu Gyeongbuk Institute of Science and Technology (DGIST) / Urgench State University (USU), Korea), Hyunseok Shim, Myoung-Jae Lee, Byeongdae Choi and Hong-Kun Lyu (Daegu Gyeongbuk Institute of Science and Technology (DGIST), Korea)

    TP-71 160085 | 17:00 - 19:00Self Assembled Si quantum dot thin film deposition using hybrid plasma CVD at low-temperature H. Kersten (Christian-Albrechts-University Kiel, Germany), M. Hori (Nagoya University, Japan), Yongyi Yin, Bibhuti B. Sahu, Joon S. Lee and Jeon G. Han (Sungkyunkwan University, Korea)

    TP-72 160087 | 17:10 - 19:00Optical and structural properties of plasma-treated DNA bases Geon Joon Lee, Bhagirath Ghimire and Eun Ha Choi (Kwangwoon University, Korea), Su Na Choi, Min Ju Cho and Dong Hoon Choi (Korea University, Korea)

    TP-73 160042 | 17:10 - 19:00Effects of reactive oxygen and nitrogen species on the Cordyceps pruinosa spores as studied by atmospheric pressure plasma jet and nitric oxide water Geon Joon Lee, Min-Ho Kang, Han Sup Uhm and Eun Ha Choi (Kwangwoon University, Korea), Daewook Kim, Jun Young Kim and Seong Hwan Kim (Dankook University, Korea)

  • ICMAP 201644

    ICMAP 2016The 6th International Conference on Microelectronics and Plasma Technology | September 26-29, 2016, Gyeongju, Korea

    ICMAP 2016The 6th International Conference on Microelectronics and Plasma Technology | September 26-29, 2016, Gyeongju, Korea

    WPPoster Session 2

    September 28 (Wednesday), 17:10-19:00, Hall

    Session Chairs: ShinJae You (Chungnam National Univ)

    WP-1 160186 | 17:10 - 19:00Surface Modification Using Plasma Treatment on Polymeric Layer for Triboelectric Generator Nomin Lim, Kwang-Ho Kwon, Changmok Kim, and Byung Jun Lee (Korea University, Korea)

    WP-2 160156 | 17:10 - 19:00Si-SiOx-C core-shell nanoparticles synthesized by atmospheric microwave plasma for Li-ion batterys anode Boyun Jang (Korea institute of energy research, Korea)

    WP-3 160140 | 17:10 - 19:00Photoelectrochemical properties of the CuO photoelectrodes with ZnO nanorod protective layer Ulugbek Shaislamov and Heon-Ju Lee (Jeju National University, Korea)

    WP-4 160138 | 17:10 - 19:00A Highly Durable and Stable Lead Free Nanocomposite Nanofibers Based Piezoelectric Nanogenerator under High Loading for a Self-Powered Sensor System Saqib Siddiqui, Do-Il Kim, Le Thai Duy, Adeela Hanif, and Nae Eung Lee (Sungkyungkwan University, Korea)

    WP-5 160129 | 17:10 - 19:00Some Issues of Industrial Scale Boron Isotopes Separation by the Laser Assisted Retarded Condensation(SILARC) Method Konstantin Andreevich Lyakhov and Heon-Ju Lee (Jeju National University, Korea)

    WP-6 160096 | 17:10 - 19:00The onion-like carbon-supported Pd bimetallic nanoparticles and their enhanced catalytic activities SangYul Lee (Korea Aerospace University, Korea), JungWan Kim (Incheon National University, Korea), YuGeun Cho, SungMin Kim and YehSun Hong (Korea Aerospace University, Korea)

    WP-7 160094 | 17:10 - 19:00Unprecedented Method of Epitaxy Silicon Growth at 200 C using Very High Frequency Plasma Enhanced Vapor Phase Epitaxy Ji-Eun Hong (Korea Institute of Energy Research, Korea), Namwoo Kim (UNIST, Korea), Hyun Yoon (Korea Institute of Energy Research, Korea), Kwanyong Seo (UNIST, Korea), Ka-Hyun Kim (Korea Institute of Energy Research, Korea)

  • ICMAP 2016 45

    ICMAP 2016The 6th International Conference on Microelectronics and Plasma Technology | September 26-29, 2016, Gyeongju, Korea

    ICMAP 2016The 6th International Conference on Microelectronics and Plasma Technology | September 26-29, 2016, Gyeongju, Korea

    WP-8 160090 | 17:10 - 19:00Optical modeling of dye-sensitized solar cells for color analysis Hyeong-Seok Kim, Myunghun Shin, Jeonghoo Jo and Ganghoo Lee (Korea Aerospace University, Korea), Joo-Cheol Lee (Dong-Jin Semichem Inc, Korea)

    WP-9 160073 | 17:10 - 19:00Micro-textured High Efficient n-type Solar Cell Chanseob Cho (Kyungpook National University, Korea), Daeyoung Kong (Ultech Co. Ltd., Korea), Dongin Lee (Yeungnam University, Korea), Bonghwan Kim (Catholic University of Daegu, Korea)

    WP-10 160067 | 17:10 - 19:00Catalytic enhancement on polymer composite counter electrode for low cost quantum dot-sensitized solar cells Hyunwoong Seo, Daisuke Sakamoto, Naho Itagaki, Kazunori Koga and Masaharu Shiratani (Kyushu University, Japan), Chandu V. V. M. Gopi, Mi-young Kim and Hee-Je Kim (Pusan National University, Korea)

    WP-11 160065 | 17:10 - 19:00High performance green quantum dot sensitized solar cell with charge recombination control based on CuInS2/ZnS/SiO2 architecture Hyunwoong Seo and Masaharu Shiratani (Kyushu University, Japan), Chandu Venkata Veera Muralee Gopi, Mi-young Kim and Hee-Je Kim (Pusan National University, Korea)

    WP-12 160056 | 17:10 - 19:00Effect of various surfactants into PEDOT:PSS based counter electrode of DSSCs Hee-Su Yang, Sang-Hun Nam, Ki-Hwan Hwang, Hyeon Jin Seo, Jung-Hoon Yu, Dong In Kim and Jin-Hyo Boo (Sungkyunkwan University, Korea)

    WP-13 160055 | 17:10 - 19:00Study of thermal effect of atmospheric plasma on solar cell wafer Woo Jae Kim, Sang Hyuk Hwang, Ye Seul Lee, Gi won Shin, Jinwoo Choi and Gi-Chung Kwon (Kwangwoon University, Korea)

    WP-14 160052 | 17:10 - 19:00Study of crystalline silicon wafer texturing process with atmospheric plasma Sang Hyuk Hwang, Ye suel Lee, Hee Tae Kwon, Woo Jea Kim and JinWoo Choi (Kwangwoon University, Korea), Chang-Sil Yang (KMH HITECH, Korea), Gi-Chung Kwon (Kwangwoon University, Korea)

    WP-15 160050 | 17:10 - 19:00Study on carbon dioxide reforming of methane by a high power ICP torch at atmospheric pressure Ho-Hyun Song (KAIST, Korea)

    WP-16 160218 | 17:10 - 19:00A study on correlation between induced electric field and plasma uniformity in Inductively Coupled Plasma simulation Young Jun Lee, YoungDo Jeong, Jae-Hong Jeon and HeeHwan Choe (Korea Aerospace University, Korea)

  • ICMAP 201646

    ICMAP 2016The 6th International Conference on Microelectronics and Plasma Technology | September 26-29, 2016, Gyeongju, Korea

    ICMAP 2016The 6th International Conference on Microelectronics and Plasma Technology | September 26-29, 2016, Gyeongju, Korea

    WP-17 160212 | 17:10 - 19:00Investigation on the distribution of ions and molecules in N2/NH3/SiH4 inductively coupled plasma according to gas flow and mixture ratio Kwon-Sang Seo, Dong-Hyun Kim and Ho-Jun Lee (Pusan National University, Korea)

    WP-18 160210 | 17:10 - 19:00Measurement of dielectric film thickness by LC series resonance in the high density plasmas Moo-Young Lee, SangBum Jeon and Chin-Wook Chung (Hanyang University, Korea)

    WP-19 160208 | 17:10 - 19:00Measurementing method of dielectric-film thickness by RC delay HoWon Lee, SangBum Jeon and Chin-Wook Chung (Hanyang University, Korea)

    WP-20 160200 | 17:10 - 19:00Effect of series and parallel antenna structure on plasma parameters in planar inductively coupled plasmas Tae-Woo Kim, Hyun-Ju Kang and CHin-Wook Chung (Hanyang University, Korea)

    WP-21 160199 | 17:10 - 19:00Development of the plasma gauge for measuring plasma parameters based on floating harmonic method Hyun-Dong Uh, Jin-Yong Kim and Chin-Wook Chung (Hanyang University, Korea)

    WP-22 160191 | 17:10 - 19:00Prope