Hi-P INTERNATIONAL LTD 赫比国际集团
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Hi-P INTERNATIONAL LTD赫比国际集团Introduction
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HI-P INTERNATIONAL LIMITED
Incorporated in Singapore on 26 Dec 1980
Listed 17 Dec 2003 on Mainboard of Singapore Stock Exchange
Chairman cum CEO, Mr. CT Yao owns 58%
15 manufacturing plants globally
20,000 employees worldwide
Corporate Overview
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Mr. Yao Hsiao Tung is our Executive Chairman and
Chief Executive Officer of the Group. He is
responsible for formulating the strategic directions of
the Group as well as overall management of the
operations. Mr. Yao has more than 40 years of
experience in the precision tooling and plastic
injection molding industry. Mr. Yao was conferred
Honorary Doctorate by his Alma Mater, National
Kaohsiung University of Applied Sciences, on 25
October 2009.
Chairman Introduction
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History & Milestones
Mr. Yao invested his S$50,000 saving and managed the company
1983
Incorporation in SingaporeHi-P Tool & Die
1980
Molex invested and became its customer
1987
Hi-P XiamenHi-P Mold Base ChengduHaier Hi-P JV Qingdao
2001
Hi-P IndustriesHi-P Tianjin
2002
IPO on Singapore Stock ExchangeRevenue >US$100milHi-P Suzhou TechHi-P Suzhou Electronics
2003Revenue crossed US$10mil 1995
First overseas expansion,Hi-P Shanghai Electronics
1993
Renamed Hi-P InternationalHi-P Camera Products
Hi-P Spray Painting
2000
Hi-P Precision Chengdu 1998
Hi-P Mexico, first in N.AmericaChanged name to Hi-P Singapore
1997
Hi-P Dongguan2006
Hi-P Shanghai Optical Lens2004
Hi-P Poland, first in EuropeHi-P ThailandHi-P Shanghai Tech
2005
2009 Hi-P acquires G-Flex
2010 Acquisition of Motorola’s R&D Center
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Global Presence
中国 China
美国USA
总部 Corp
工厂 Plant
业务拓展及办事处 ESI & Offices
天津 Tianjin
成都 Chengdu
上海 Shanghai
苏州 Suzhou
台湾 Taiwan
厦门 Xiamen泰国Thailand
波兰Wroclaw
芝加哥Chicago
墨西哥Guadalajara
匈牙利Hungary
新加坡Singapore
东京 Tokyo
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Our Vision
Our Vision
“Recognized leader as an integrated electro-mechanical solution provider focusing on value creation and exceeding customer
expectations through innovation”
我们的愿景成为垂直整合机电一体化的行业领导者,透过创新来增加客户的价值并
超过客户的期望
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Our Mission“Partner with customers to add value and contribute to mutual success”
我们的使命作为客户的合作伙伴为客户增加价值并取得双向的成功
Our GoalContinue with the 8 measures as we strive towards our Vision 10, 2020
我们的目标持续贯彻开源节流 ,成就十年百亿大业
Our Mission & Goal
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Key Customers
Wireless Consumer Electronics Computing Peripherals
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Revenue Growth
3.5 4.7 6.8 7.8 12.2 19.3 21.4 27.7 33.2 45.282.5 100.5143.1
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'90 '91 '92 '93 '94 '95 '96 '97 '98 '99 '00 '01 '02 '03 '04 '05 '06 '07 '08 '09 '10
S$’Mil
Tooling House
Component
Manufacturer
Mod
ule
Assem
blies
Inte
grat
ed E
-Mec
h
Solu
tions
Pro
vide
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Vertical IntegrationIntegratedElectro-Mechanics Solutions
Cosmetic MetalPrecision Stamping
Plastic Injection2Colors/3Colors
NCVM
IML
Surface Decoration
ODMTool Fabrication
Tool Design
PCBA
In-house Test Development
Electro-MechanicsAssembly
Module Assembly
FPC
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Tooling NPI
Molding Painting Pad Printing
NCVM IMLCNC
IMD
DesignDFM/ESI with Customer
Laser Etching
Plastics & Decoration Capabilities
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Laser Marking Chemical Etching
Control Env Assy
PolishingSandblasting
Tempo PrintED
Color Anodizing
Laser Welding
PVD
Spot Welding
De-greasing
Metals & Decoration Capabilities
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FPC & Rigid Flex Capabilities
8 Layer Rigid Flex8 Layer Rigid FlexMulti Layer FPCMulti Layer FPC5 Layer Rigid Flex5 Layer Rigid Flex 6 Layer Rigid Flex6 Layer Rigid Flex 10 Layer Rigid Flex10 Layer Rigid Flex
Items Standard Customized
Material Used Polyimide / PET 0.5mil / 1mil 0.5mil / 1mil
Maximum Panel Size 19.7” X 24” (500mm X 610mm)
Line Width and Spacing 3mil (0.07mm) 2mil (0.05mm)
Copper Thickness 1/3 oz min 1/4 oz min
via / Drill Size Min Drill Hole Diameter 6mil (0.15mm) 4mil (0.1mm)
Min via Size After Plating 4mil (0.1mm) 3mil (0.075mm)
Micro via (Laser) 4mil (0.1mm) 3mil (0.075mm)
Hole to Thickness Ratio Thru Hole Via 1:6 Blind Via 1:1 Surface Finished Hard and soft Gold / ENIG / OSP / Tin Lead Plating /HASL
Cover Layer Polyimide / Flexible Solder Mask / PET
Stiffener Material Polyimide / FR4 /Metal / PET
Shielding Material Copper / Silver Ink / Tatsuta
Tooling Tolerance +/-2mil (0.05mm) +/-1mil (0.025mm)
ZIF Tolerance +/-4mil (0.1mm) +/-2mil (0.05mm)
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SMT Capabilities 20 mil Pitch BGA Assembly, Rework and Repair, Re-balling SMT with 0201 Chip & 16 mil Fine Pitch QFP Dome Force Measure & Dome Force Test Double Sided Reflow ICT Testing Lead Free Technology FPC Punch EL Dome Module
Solder Paste Printer
Placement Equipment
Reflow Oven Router
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Hi-P Singapore Design Center Located at Motorola Singapore facility ~100 experienced R&D & support staff Comprehensive mobile phone lab facilities Capable to design mobile phones, tablets
and related products & accessories
1984 - SDC established1990 - Center of Excellence was
formed1992 - Received Singapore Design
Award1996 - Received Singapore Quality
Award 2009 - Changed to iDen Design Center2011- Acquired by Hi-P
Core Competences
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Hi-P CultureOur Core Pillars
• People Oriented: Respect, Care and Support
• Results Oriented: Performance Based Rewards, Bonuses and Promotion
Our Attitudes
- Contribution : One for all and all for one
- Ownership
How we Conduct Ourselves
• Manners , Spirit , Integrity , Discipline
Results Expected
We seek to create a united and highly productive team that will contribute to our families, our company, society and the world.
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Awards• Ranked in 2007 as 658 in Global Chinese Enterprise Listing
with a revenue of US$6.48M• Group Chairman Mr. Yao was awarded the “2009 Asia-
Pacific Region Entrepreneur of the Year”• Top 50 Singapore Companies for five consecutive years• Excellent Supplier Award from Motorola, Braun, Gillette • Forbes ranking of 31 for Singapore companies • RIM "best supplier“ Award
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Summary Recognized leader in Integrated Electro-Mechnical Solution arena
Seamless design to manufacturing solution
Uncompromised quality
Competitive overall cost
Time-to-volume; time-to-market
Simplified supply chain
Strong Employee Value Proposition
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