Formation of Silicon Wafers
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Transcript of Formation of Silicon Wafers
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}Definition of
Wafers}Pure Silicon
}wafer formationprocess
1. Silicon Ingotgrowth
2. Crystal Shapingprocess
3. Wafer slicing
4. Wafer inspectionand Packing
Formation of silicon wafers
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A thin disk of pure silicon ( 99.99% purity)semiconductor used as a substrate material
for Integrated Circuits ( ICs).
A 300mm
silicon wafer
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Silica SiO2 99.99% pure Polycrystalline Silicon
(EG-Si)Reduction of silica with carbon and reactingthe obtained MGMG--SiSi with gaseous HCL to get
the pure EGEG--SiSi.
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StepStep 11SiliconCrystalGrowth
StepStep 22
CrystalShapingProcess
StepStep 33Wafer
Slicing
StepStep 44Wafers
preparatio
n steps
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PolysiliconPolysilicon
25002500ooCC
Seed crystalSeed crystal
Czochralski ProcessCzochralski Process
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Cropping Testing GrindingFlats
grinding
Crystal Shaping processCrystal Shaping process
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Cropping Testing GrindingFlats
grinding
CroppingCropping
Tang Crown
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Cropping Testing GrindingFlats
grinding
TestingTesting
Testing
Slice
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Cropping Testing GrindingFlats
grinding
GrindingGrinding
This process aims to obtain the specifieddiameter of the wafer
Centerless grindingCenterless grinding Center grindingCenter grinding
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Cropping Testing GrindingFlats
grinding
Flats grindingFlats grindingFlats are a straightened parts
of the wafers that havebelow 200mm diameters.
Flat
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EdgeContouring
Waferlapping
Waferetching
Waferpolishing
Wafercleaning
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EdgeContouring
Waferlapping
Waferetching
Waferpolishing
Wafercleaning
Counter RotatingLapping machine
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EdgeContouring
Waferlapping
Waferetching
Waferpolishing
Wafercleaning
Etching purpose is to remove anydamaged layers which may be
10m deep
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EdgeContouring
Waferlapping
Waferetching
Waferpolishing
Wafercleaning
Slurryconsists ofSiO2 and
NaOH
The purpose of polishing isto produce a smooth,specular surface on
which device featurescan be defined by
photolithography.
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EdgeContouring
Waferlapping
Waferetching
Waferpolishing
Wafercleaning
Wafer cleaning is meant to clean wafers
from any contamination source:1. Airborne bacteria2. Grease and wax from physical
handling.3. Metals and abrasive elements such
as : silica , diamond dust and alumina
from lapping ,sewing and polishingprocesses.
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o Some wafers propertiessuch as: flatness,thickness, resistivity andtype are inspected to
meet customersspecifications.
o Wafers are then packedin cassettes and shippedto the customer such asAMD or Intel
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en.wikipedia.org/wiki/Wafer_(electronics)
http://en.wikipedia.org/wiki/Seed_crystal
http://en.wikipedia.org/wiki/Crystal_structure
http://www.xtal.iqfr.csic.es/Cristalografia/index-en.html
http://www.semi.org/en/
http://en.wikipedia.org/wiki/Czochralski_process
www.youtube.com/watch?v=aWVywhzuHnQ
http://cleanroom.byu.edu/EW_formation.phtml
http://cnx.org/content/m16627/latest/
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Any Questions?