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Transcript of [email protected] 1 Thermal tests planning for mock-up TM0 [email protected] Thermal tests...
1 Thermal tests planning for mock-up TM0
Thermal tests planning for CLIC prototype module type 0
May 30th, 2012
F. Rossi
2 Thermal tests planning for mock-up TM0
Experimental program for thermal testsG. Riddone, A. Samoshkin, CLIC Test Module meeting 25.07.2011
3 Thermal tests planning for mock-up TM0
INTRODUCTION
Topics and updates concerning the status of:
1. CLIC prototype module type 0
2. Laboratory environment (air conditioning, ventilation, etc. )
3. Heating system (heaters, temperature sensors, etc.)
4. Cooling system (water supply, inlet/outlet cooling circuits, control valves, etc.)
5. Numerical simulations
6. Measurements (alignment, strain gauges, etc.)
4 Thermal tests planning for mock-up TM0
1. CLIC PROTOTYPE MODULE TYPE 0
Brazing of 1st stack
Fiducialisation
EBW of 2 stacks
Brazing of 2nd stack
Fiducialisation
TIG welding of vacuum flanges
W26
W27
W28
W29
Installation on girders
W30
EBW tooling manufactured by COMEB
W22
Planning according to Bodycote
5 Thermal tests planning for mock-up TM0
2. LABORATORY ENVIRONMENT
• Lab dimensions (169-S-039): 17 x 6 x 3 m
• Current annual temperature excursion: 17 - 27 °C
• Environmental temperature for Lab: adjustable range 20 - 40 °C
• Max temperature inside module: o MB: 43 °Co DB: 34 °C
• Meeting with Martel on 29.05
Temperature field inside module
6 Thermal tests planning for mock-up TM0
2. LABORATORY ENVIRONMENT
VEN
TILA
TIO
NFAN FAN
• Preliminary meeting to define basic operating conditions:
o Adjustable temperature range: 20 – 40 °C (by steps of 5 °C)
o Humidity: “the relative humidity will not be regulated”, CLIC CDR Chapter 6, Civil engineering and technical services
o Low air flow on wires for alignment (solution under study)
o Delivery: end of September
o Responsible: S. Lebet, F. Rossi, C. Martel
20 - 40 °C
T ± 0.5 °C
T ± 1 °C
7 Thermal tests planning for mock-up TM0
3. HEATING SYSTEM: heaters
• Experimental conditions to be reproduced:G. Riddone, A. Samoshkin, CLIC Test Module meeting 25.07.2011
All heaters are currently stored in the lab
8 Thermal tests planning for mock-up TM0
3. HEATING SYSTEM: temperature sensors
solid state relay
temperature sensors
heaters
NI safety system for max. temperature
max. temp. limit: 50 °C
All temperature sensors are currently stored in the lab
9 Thermal tests planning for mock-up TM0
3. HEATING SYSTEM: rack and panel connectors
• Rack for connectors and NI modules (temperature sensors, heaters, control valves, etc.)
• Procurement of panel connectors
RACK FOR CONNECTORS AND NI MODULES
10 Thermal tests planning for mock-up TM0
3. HEATING SYSTEM: planning
Temperature sensors Heaters
SSR (control system for heaters)
Safety system for max. temperature
Panel connectors (procurement, assembly, etc. )
Rack (assembly of panel connectors, etc. )
Preliminary tests for heaters
M. Sosin
M. Sosin
I. Kossyvakis, F. Rossi
Requested by M. Sosin:• electric engineer for electric plans (to
be defined)• electrician for electric crates (FSU)
I. Kossyvakis, F. Rossi, M. Sosin
Mid of July
I. Kossyvakis, F. Rossi
11 Thermal tests planning for mock-up TM0
4. COOLING SYSTEM
•Demineralized water
•Nominal volumetric flow rate: 0.36 m3/h
•Water inlet temperature: 25 °C
•Water outlet temperature: ~45 °C
•Max. pressure allowed: 5 bar
•Inlet/outlet interface
•Water supply
12 Thermal tests planning for mock-up TM0
4. COOLING SYSTEM: inlet/outlet interface
Mechanical design
Selection of standard parts (pipes, safety valves, pressure regulating valve, etc.)
Procurement
F. Bashir
F. Bashir
F. Bashir
Meeting with C. Parente for safety requirementsF. Rossi, F. BashirW22
F. Bashir
Delivery and assembly
W30
13 Thermal tests planning for mock-up TM0
4. COOLING SYSTEM: water supply
Water pump
Heat exchanger
Temperature regulator
Inlet/outlet port
Water tank
• Water supply delivered to Lab and tested -> OK
• Responsible: S. Lebet, F. Rossi
14 Thermal tests planning for mock-up TM0
4. COOLING SYSTEM: control valves
1. Delivered to Lab
2. Procurement of panel connectors
3. Preparation of cables
15 Thermal tests planning for mock-up TM0
5. NUMERICAL SIMULATIONS
Deformed shape of prototype module type 0 due to applied thermal RF loads
(values in µm)
Displacements [m]
(location and load type)Prototype type
0
MB (RF load) 183
DB (RF load) 47
MB (vacuum load) 30
DB (vacuum load) 131
MB (gravity load) 27
DB (gravity load) 40
Resulting displacements on the DB and MB lines due to thermal, vacuum and
gravity loads
Temperature [°C]Prototype type
0
Max temp. of module 43
Water output temp. MB 35
Water output temp. DB 30
Resulting temperatures inside the modules
R. Raatikainen
16 Thermal tests planning for mock-up TM0
6. MEASUREMENTS
• Strain gauges are still an open issue
17 Thermal tests planning for mock-up TM0
CONCLUSIONS
#JUNE JULY AUGUST SEPTEMBER
W23 W24 W25 W26 W27 W28 W29 W30 W31 W32 W33 W34 W35 W36 W37 W38 W39
1 Installation of 1st TM0
2 Air conditioning & ventilation
3 Heating system
Heaters, temperature sensors
4 Cooling system
Inlet/outlet interface
Water supply
Control valves
