Stave 4028Thermal testsElectrical tests

4028: THERMAL TESTS• We have studied the effect of the liquid

speed on the modules heating. • Test 1: all 13 modules are powered and

configured (SURF and ROD): about 50 W• Test 2: measure of (T/power) for each

module powered one at a time (only half stave - SURF). Is it possible to set a threshold for the variable T/power as we have done until now indipendently of the cooling variables?

General conditions We are using 2 indendent circuits to

cool down the stave and the box• T_CoolingStave= -20C• T_CoolingBox = -6C• T_InsideBox = 3C• Speed of the cooling inside the Al

pipe set to 1 (slow), 4, 8 (fast).

Test 1: all modules powered

Test 2: modules powered one at at time

Example of monitoring on 4 modules…

Example of temperature monitoring on 4 central modules…

Test 1: all modules powered

Test 2: modules powered one at at time

Speed 4

Speed 1Speed 8

Speed 4

Speed 1Speed 8

Results of Test 1 (all modules on)

NTC Temperature: T/ W

-6.0

-4.0-2.0

0.0

2.04.0

6.0

8.010.0

12.0

Module

Tntc

(º

C)

speed = 8speed = 1speed = 4

speed = 8 - 1.7 - 4.1 - 3.2 - 3.8 - 3.5 - 3.5 1.5 - 2.5 - 0.8 0.5 - 0.5 - 1.5 - 1.8speed = 1 11.2 10.1 10.9 9.2 9.1 9.3 10.7 8.4 9.0 9.3 7.5 4.5 1.0speed = 4 8.5 6.9 7.3 5.5 4.9 4.4 5.5 3.0 4.0 4.0 2.0 0.0 - 1.5

M6C M5C M4C M3C M2C M1C M0 M1A M2A M3A M4A M5A M6A

Cooling direction

When speed is low 1 -4, there is a significant increase of temperature along the stave (Tmax –Tmin 10C!)

A better uniformity is achieved incresing the cooling speed (Tmax –Tmin 4C)

How cooling speed change the T/power?

NTC Temperature: T/ W

0.00

0.50

1.00

1.50

2.00

2.50

3.00

Module

T

/ W

(º

C /

W)

speed = 8speed = 1speed = 4

speed = 8 1.97 1.74 1.81 1.93 2.14 2.02 1.98speed = 1 2.51 2.19 2.21 2.46 2.10 2.30 2.22speed = 4 1.99 1.78 1.96 2.15 2.23 2.08 1.98

M6C M5C M4C M3C M2C M1C M0 M1A M2A M3A M4A M5A M6A

4028 Electrical tests• LOAD/STAVE tests are performed using 2 SURF

boards.

Comments:• In the STAVE macro with respect to the list, it is not

included DVDD scan as DVDD is not controlled by TDAQ anymore but by ambush. The scan can be done modyfing the ambush script but…

• Threshold scan with HV off with SURF is sometimes very different from scan HV off with MAC (due to my SURF or my script??)….see slides 10-11

Example of T monitoringduring STAVE test:

MODULES 7-13 TEMPERATURE7 hours for half stave (source excluded)

510893 510844 510405 510396

Cooling flow

510803 510237510864

Test 510237

Test 510803

Test 510864

Module Test direction

HV off with SURF or with MAC Noise ~400e!

Then the analysis findsUnconnected bad pixelswith this low rows peculiar pattern!

Electrical tests analysis STAVE\FLEX Comparison done using the “official” STAVE cuts without cut on HVoff data (as there is the source scan).LOAD\BURN comparison done with the official LOAD cuts (but some fake problems as HVoff is unusually good)

The two modules with pre-existing large defects increase the number of bad pixels during loading and cycles.In 2 modules new small defects (about 20 pixels) are visible between chip 4 and 5 after loading.

Bad pixels Total Bad Pixels (Digital + Analog + Source)

0

50

100

150

200

250

300

350

M6C M5C M4C M3C M2C M1C M0 M1A M2A M3A M4A M5A M6AModule on Stave

No.

of

bad

pixe

l

FLEXSTAVE

New Defect between 4 and 5

Increasing in pre-existing defects

M2a and M4a

There after loading: is there anything that can damage that point?

M5a

81 225

159 Increasing both in loading and cycling

M6A

135 299

320

Increasing mainly in loading