Enabling Technologies for Semiconductor Manufacturing 3 Enabling Technologies for Semiconductor...

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    Enabling Technologies for Semiconductor Manufacturing

  • Semiconductor manufacturing is a fiercely competitive business. To stay ahead

    of the pack, you need a partner who can provide innovative materials, technical

    resources and process expertise that address the challenges you face every day.

    That’s where we can help.

    3M offers a portfolio of products designed to meet critical market requirements,

    including improved performance, lower manufacturing costs, reduced time to

    market and environmentally responsible manufacturing.

    All 3M electronic materials are supported by sales, technical and customer

    service resources around the world – with fully-staffed tech service laboratories

    in North America, Europe, Japan, Latin America and Asia. Our people are ready

    to assist you in optimizing your equipment and processes to take full advantage

    of all the benefits these technologies have to offer.

    3M Electronic Materials Enabling technologies for tomorrow’s leading-edge devices

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    Equipment and Tool Cleaning

    3M offers a broad line of advanced chemistries that have demonstrated outstanding performance in a wide variety of general electronics cleaning and drying applications.

    3M™ Novec™ Engineered Fluids were developed to provide an outstanding balance of performance, safety and environmental properties. These segregated hydrofluoroether (HFE) products offer zero ozone depletion potential, low global warming potential and low toxicity. They are also nonflammable and, in their neat form, are not classified as volatile organic compounds (VOCs). Novec Fluids can be used neat, as azeotropes or in co-solvent processes to effectively remove sub-micron particulate and ionic soils from assemblies and components. Increased solvency and low surface tension allow these fluids to penetrate into tight spaces found in delicate electronic equipment – ensuring a complete clean. In addition, Novec Fluids are compatible with a wide range of metals, plastics and elastomers.

    Suggested Products

    3M™ Novec™ Engineered Fluid HFE-7100 – Ideal cleaning solvent in applications such as vapor degreasing, wet cleaning and FOUP cleaning.

    3M™ Novec™ Engineered Fluid HFE-7100DL – A higher purity version of Novec fluid HFE-7100. Tightly-controlled for ions, metals and non-volatile residue.

    3M™ Novec™ Engineered Fluid HFE-71DE – Excellent cleaning, rinsing and drying agent. Ideal for immersion and vapor degreasing, and for medium-duty cleaning of soils such as oils, greases and waxes.

    3M™ Novec™ Engineered Fluid HFE-71DA – Ideal for immersion defluxing and degreasing applications. Provides enhanced removal of ionic contaminants. Suitable for use in a number of aqueous systems.

    3M™ Novec™ Engineered Fluid HFE-71IPA – Used for medium-duty precision cleaning and rinsing to remove particulate, fingerprints and light soils from metal, plastic and glass parts. Suitable for wet cleaning of dry etcher parts.

    3M™ Novec™ Engineered Fluid HFE-7200 – Used for cleaning light-duty soils, e.g. particulates, fluorolubes, light oils and fluoropolymers, in applications such as vapor degreasing, wet cleaning and FOUP cleaning. Can be paired with co-solvents to clean heavier-duty soils.

    3M™ Novec™ Engineered Fluid HFE-7200DL – A high-purity version of Novec fluid HFE-7200. Tightly- controlled for ions, metals and non-volatile residue.

    3M™ Novec™ Engineered Fluid HFE-72DE – A blend of two hydrofluoroether solvents and trans-1,2- dichloroethylene (t-DCE). Safe and effective for medium- to heavy-duty cleaning of soils such as oils, greases and waxes.

    3M™ Novec™ Engineered Fluid HFE-72DA – A blend of two hydrofluoroether solvents, trans-1,2- dichloroethylene (t-DCE) and isopropanol. Effective for medium- to heavy-duty degreasing and defluxing applications.

    3M™ Novec™ Engineered Fluid 7300 – Used for cleaning light-duty soils, such as particulates, fluorolubes, light oils and fluoropolymers.

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    Wafer Carrier Cleaning

    Dry Etcher Parts Cleaning

    Selected 3M™ Novec™ Engineered Fluids offer a number of important advantages in this application. Because of their high efficiency, they can often eliminate or reduce the need for manual and ultrasonic cleaning – helping to save time, energy and labor costs.

    3M™ Novec™ Engineered Fluids are very effective for particulate cleaning of all SEMI- standard 300 mm FOUPs (Front-Opening Unified Pods) and FOSBs (Front Opening Shipping Boxes). They offer a very fast cycle time and the ability to clean and dry FOUP doors effectively. What’s more, the high cleaning efficiency, fast, complete drying and simplified equipment requirements of Novec Fluids help deliver a lower cost of ownership, compared to aqueous cleaning.

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    3M™ Specialty Gases PFG-3218 (C3F8) and PFG-3480 (C4F8O) are high molecular weight perfluorocarbon gases used to clean dielectric film buildup from chemical vapor deposition (CVD) chambers. These products are designed as “drop-in” replacements for C2F6 and CF4, and offer a number of important performance and environmental advantages:

    • Reduced costs through reduced gas usage (up to 60%) without sacrificing etch rate

    • Reduced PFC gas emissions (up to 90% with C4F8O)

    • Allows use of existing gas lines and controllers

    In addition, 3M can assist you with specialized services (such as on-site FTIR analysis) to help you evaluate 3M Specialty Gases, optimize manufacturing processes, recover and recycle spent material and document PFC abatement programs. Use of 3M Specialty Gases can help wafer processing fabs meet voluntary PFC emission reduction targets.

    CVD Chamber Cleaning

    Suggested Products

    3M™ Specialty Gas PFG-3218 (C3F8) – Provides a higher etch gas utilization than conventional C2F6, requiring 25% less material by weight, and reducing net PFC emissions.

    3M™ Specialty Gas PFG-3480 (C4F8O) – Also provides a higher etch gas utilization than C2F6, requiring 60% less material by weight, and reducing net PFC emissions upwards of 90%, compared to existing cleaning processes.

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    CMP

    Fixed Abrasives for CMP

    Suggested Products

    3M™ SlurryFree™ Fixed Abrasive M3152 – For direct polish STI CMP. Ceria based fixed abrasive rolls for use with Applied Materials Reflexion CMP tools. Offers higher throughput, lower cost of ownership, compared to conventional slurry systems.

    3M™ SlurryFree™ Fixed Abrasive M3154 – For direct polish STI CMP. Ceria based fixed abrasive rolls for use with Applied Materials Reflexion CMP tools. Offers higher throughput, lower cost of ownership, compared to conventional slurry systems. Similar performance to M3152 Fixed Abrasive, but designed for use with higher overfill wafers.

    3M™ SlurryFree™ Fixed Abrasive P6900 Subpads – Composite subpad for use with 3M™ SlurryFree™ Fixed Abrasive rolls. Specific constructions sized for use on web-based CMP tools.

    3M™ SlurryFree™ Fixed Abrasives are a production- proven, high-performance alternative to conventional slurries, pads and conditioners. This technology consists of a composite of cerium oxide particles, dispersed in a unique resin system. The uniform, microreplicated, three-dimensional polishing surface provides the consistent interface necessary for predictable, high-quality performance.

    3M SlurryFree Fixed Abrasives offer a number of critical advantages in the production of today’s more complex wafers, including: superior planarization, with low nitride erosion and trench oxide dishing; consistent process repeatability, both roll-to-roll and within each roll; and low defect rates. The long roll life of 3M SlurryFree Fixed Abrasives allows you to polish literally thousands of wafers between consumable changes.

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    High quality, long lasting 3M™ Diamond Pad Conditioners properly prepare the surface of the CMP pad, lengthening its life and enabling more

    consistent wafer removal rates. Exclusive 3M sintered abrasive process and diamond-free edge

    exclusion zone provide excellent diamond retention, reducing

    the possibility of macro-scratching and

    helping to improve wafer yields.

    CMP Pad Conditioning

    Suggested Products

    3M™ Pad Conditioner A160 – For metal and oxide applications on Applied Materials platforms. 4.25" disk.

    3M™ Pad Conditioner A165 –For metal and oxide applications on Applied Materials platforms. 4.25" disk. Beveled edge for improved cleanliness, performance and aggressiveness control.

    3M™ Pad Conditioner A4-55 – For oxide applications on Applied Materials platforms. 4.25" disk. Features polycarbonate carrier with ring format.

    3M™ Pad Conditioner E221 – For oxide applications using IC series pads. Available as 360 or 260mm disk for Ebara 300 or 200 mm platform.

    3M™ Pad Conditioner E187 – For metals applications on IC series pads. Available as 360 or 200mm disk for Ebara 300 or 200mm platform.

    3M™ Pad Conditioner R115 – For oxide and metals applications on IC series pads. 10" ring for Novellus Auriga tool platform.

    3M™ Pad Conditioner R400 – For oxide and metals applications on IC series pads. Bar style conditioner is available in sizes for both Novellus Momentum and IPEC tool platforms.

    3M manufactures pad conditioners for all other CMP tools. Contact 3M for more information.

    New 3M™ Diamond Pad Conditioner A4 Series del