Data Analysis for Semiconductor Manufacturing

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Puwen Ning Data Analysis for Semiconductor Manufacturing

Transcript of Data Analysis for Semiconductor Manufacturing

Page 1: Data Analysis for Semiconductor Manufacturing

Puwen Ning

Data Analysis for Semiconductor Manufacturing

Page 2: Data Analysis for Semiconductor Manufacturing

2SMIC Confidential

All copyrights and IP belong to SMIC. For reference only and may not be copied or distributed without written permission from SMIC. SMIC shall not be responsible for any party’s reliance on these materials.

Semiconductor Manufacturing In A Nutshell1. Silicon

4. Chip

5. Product3. Wafer2. Manufacturing

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All copyrights and IP belong to SMIC. For reference only and may not be copied or distributed without written permission from SMIC. SMIC shall not be responsible for any party’s reliance on these materials.

Semiconductor Manufacturing Data Sources

WIP: Product Visibility

• Wafer fab, Probe, FM and Test WIP• Foundry, Subcon and In-transit WIP• Starts/Ships/Inventory/History• Wafer Slot Tracking• Cycle time/planning Information• Process Flow

Equipment: Performance Optimization

• Equipment State Changes• Alarms and Events• Process Data Detail and Summary• Chamber Wafer Tracking• Maintenance Events

Measurement: Yield Acceleration

• In-process Metrology Readings• Class Probe Results• Unit Probe Results• Final Test Results• Coordinate Mapping

Data Presentation: •Information Integration

Enterprise Data Warehouse

AIM Extract/Transform/Load Integration Layer

AIM Manufacturing Data Distribution Layer

Wafer fab Probe Final Assembly Test

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All copyrights and IP belong to SMIC. For reference only and may not be copied or distributed without written permission from SMIC. SMIC shall not be responsible for any party’s reliance on these materials.

Data Analysis for Yield Improvement• The ideal goal of the semiconductor manufacturing processes is to make each individual

integrated circuit perform to specification• However, physical defects induced during processing and variation in processing

causes some individual integrated circuits to fail to perform to specification• The ratio of individual integrated circuits that perform to specification, “good”, to the total

number of circuits is called “yield”

• In addition to monitoring and controlling processing, Yield Analysis Engineering is key to identifying why integrated circuits do not perform to specification

Low Yield Wafer AnalysisLow Yield Wafer Map

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Benefit

Yield Improvement translates to Cost Savings, and Revenue Increasing

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Thank You