Dynamic CMOS Circuits - ChulaDynamic CMOS Circuits Boonchuay Supmonchai Integrated Design...
Transcript of Dynamic CMOS Circuits - ChulaDynamic CMOS Circuits Boonchuay Supmonchai Integrated Design...
B.Supmonchai July 4th, 2005
2102-545 Digital ICs 1
Chapter 6
Dynamic CMOS Circuits
Boonchuay SupmonchaiIntegrated Design Application Research (IDAR) Laboratory
August 15, 2004; Revised - July 4, 2005
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Goals of This Chapter
q In-depth discussion of CMOS logic families
ß Static and Dynamic
ß Pass-Transistor
ß Nonratioed and Ratioed Logic
q Optimizing gate metrics
ß Area, Speed, Energy or Robustness
q High Performance circuit-design techniques
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Dynamic CMOS
q In static circuits at every point in time (exceptwhen switching) the output is connected toeither GND or VDD via a low resistance path.ß fan-in of N requires 2N devices
q Dynamic circuits rely on the temporary storageof signal values on the capacitance of highimpedance nodes.ß requires only N + 2 transistors
ß takes a sequence of precharge and conditionalevaluation phases to realize logic functions
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on
Dynamic Gate
In1
In2 PDN
In3
Me
Mp
CLK
CLK
Out
CL
Out
CLK
CLK
A
BC
Mp
Me
Two phase operation Precharge (CLK = 0) Evaluate (CLK = 1)
on
off
1off
!((A&B)|C)
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Conditions on Output
q Once the output of a dynamic gate is discharged, itcannot be charged again until the next prechargeoperation.
q Inputs to the gate can make at most one transitionduring evaluation.
q Output can be in high impedance state during andafter evaluation (PDN off), state is stored on CL
ß This behavior is fundamentally different than the staticcounterpart that always has a low resistance pathbetween the output and one of the power rails
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Properties of Dynamic Gatesq Number of transistors is N + 2 (versus 2N for static
complementary CMOS)
ß Logic function is implemented by the PDN only
ß Should be smaller in area than static complementary CMOS
q Full swing outputs (VOL = GND and VOH = VDD)
q Nonratioed - sizing of the devices is not important forproper functioning (only for performance)
q Low noise margin (NML)
ß PDN starts to work as soon as the input signals exceed VTn, soset VM, VIH and VIL all equal to VTn
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Properties of Dynamic Gates IIq Faster switching speeds
ß Reduced load capacitance due to lower number of transistorsper gate (Cint) so a reduced logical effort
ß Reduced load capacitance due to smaller fan-out (Cext)
ß No Isc, so all the current provided by PDN goes intodischarging CL
ß Ignoring the influence of precharge time on the switchingspeed of the gate, tpLH = 0 but the presence of the evaluationtransistor slows down the tpHL
q Needs a precharge/evaluate clock
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Properties of Dynamic Gates IIIq Power dissipation should be better than CMOSß Consumes only dynamic power – no short circuit power
consumption since the pull-up path is not on when evaluating
ß Lower CL- both Cint (since there are fewer transistorsconnected to the drain output) and Cext (since there the outputload is one per connected gate, not two)
ß No glitches - By construction can have at most one transitionper cycle
q However overall power dissipation is usually higherthan static CMOS due toß higher transition probabilitiesß extra load on CLK
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Dynamic Behavior
CLK
CLK
In1
In2
In3
In4
Out
83ps0ns110psVTn2.5-VTnVTn0V2.5V6
tptpLHtpHLNMLNMHVMVOLVOH#Trs
In &CLK Out
-0.5
0.5
1.5
2.5
0 0.5 1
Time (ns)V
olt
age
(V)
Evaluate
Precharge
all data inputs set to 1
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Notes on Dynamic Behaviorq The precharge time is determined by the time it takes to
charge CL through the PMOS precharge transistor.
ß Often, the overall digital system can be designed in such a waythat the precharge time coincides with other system functions(e.g., precharge of a FU can coincide with instruction decode).
q The duration of the precharge cycle can be adjusted bychanging the size of the PMOS precharge transistor.
q But making it too large increases the gate’s Cint as wellas increasing the capacitive load on the clock.
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Gate Parameters are Time Independentq The amount by which the output voltage drops is a
strong function of the input voltage and the availableevaluation time.ß Noise needed to corrupt the signal has to be larger if the
evaluation time is short – i.e., the switching threshold is trulytime independent.
Time (ns)
-0.5
0.5
1.5
2.5
0 20 40 60 80 100
Vo
ltag
e (V
)
CLK
Vout (VG=0.45)
Vout (VG=0.5)
Vout (VG=0.55)
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Power Consumption of Dynamic Gate
Power only dissipated when previous Out = 0
In1
In2 PDN
In3
Me
Mp
CLK
CLK
Out
CL
But what about clock power impact?
EliminatesStatic powerConsumption
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011
001
010
100
OutBA
Dynamic 2-input NOR Gate
Assume signal probabilities PA=1 = 1/2 PB=1 = 1/2
Then transition probability P0Æ1 = Pout=0 x Pout=1
= 3/4 x 1 = 3/4
Switching activity can be higher in dynamic gates!P0Æ1 = Pout=0
Dynamic PC is Data Dependent
(static NOR gate P0Æ1 = 3/16)
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Issues in Dynamic Design 1: Charge Leakage
CLK
VOut
Precharge
EvaluateCLK
CLK
Out
A=0
Leakage sources
CL
Mp
Me
1
2
34
Minimum clock rate of a few kHz
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Source of Charge Leakageq Charge stored on CL will leak away with time (input in
low state during evaluation)
q Dominant leakage sources are reverse-biased diode (1)and the sub-threshold leakage (2) of the NMOSpulldown device.
q PMOS precharge device also contributes some leakagedue to reverse bias diode (3) and subthresholdconduction (4) that, to some extent, offsets the leakagedue to the pull down paths.
q Requires a minimum clock rateß Not good for low performance products such as watches (or
when there are conditional clocks)
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-0.5
0.5
1.5
2.5
0 20 40
Time (ms)
Vo
ltag
e (V
)
CLK
Out
Impact of Charge Leakageq Output settles to an intermediate voltage determined by a
resistive divider of the pull-up and pull-down networks
ß Once the output drops below the switching threshold of thefan-out logic gate, the output is interpreted as a low voltage.
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A Solution to Charge Leakage
Same approach aslevel restorer logic
Keeper
q Keeper compensates for the charge lost due to the pull-down leakage paths.
CL
CLK
CLK
Me
Mp
A
B
Mkp
Out
ONVDDOFFEvaluate
ON
Irr.
PDN
ON Æ OFFVDD Æ 0
ONVDDPrecharge
MkpOutState
If PDN is on, there is a fight between the PDN and the PUN - circuitmust be ratioed so that PDN wins, eventually
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Issues in Dynamic Design 2: Charge Sharing
Charge stored originally onCL is redistributed (shared)over CL and CA leading tostatic power consumption bydownstream gates andpossible circuit malfunction.
When DVout = - VDD (Ca / (Ca + CL )) the drop in Vout islarge enough to be below the switching threshold ofthe gate it drives causing a malfunction.
CL
CLK
CLK
Ca
Cb
B=0
A
OutMp
Me
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What is the worst case voltage drop on y? (Assume all inputs arelow during precharge and that all internal nodes are initially at 0V.)
Charge Sharing Example
CLK
CLK
A !A
B !B B !B
C!C
y = A ⊕ B ⊕ C
Cy=50fF
Ca=15fF
Cc=15fF
Cb=15fF
Cd=10fF
Loadinverter
a
b
dc
DVout = - VDD [(Ca + Cc)/((Ca + Cc) + Cy)]
= - 2.5V*(30/(30+50)) = -0.94V
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Notes on Charge Sharing Example
q Output stays high for 4 out of 8 cases (!A B C,!A !B !C, A !B C, and A B !C)
q Worst case is obtained by exposing themaximum amount of internal capacitance tothe output node during evaluation.
ß This happens when !A B C or A !B C
q ∆V = -0.94 V so the output drops to 2.5 - 0.94 =1.56 V which is below the switching threshold ofthe Load inverter.
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Precharge internal nodes using a clock-driven transistor(at the cost of increased area and power)
Solution to Charge Redistribution
Me
Mp
CLK
CLK
A
B
Out
Mkp CLK
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=1=0
q Susceptible to crosstalk due to 1) high impedance of theoutput node and 2) capacitive coupling
Issues in Dynamic Design 3: Backgate Coupling
CLK
CLK
B=0
A=0
Out1Mp
Me
Out2
In
Dynamic NAND
Static NAND
M1
M2M3
M4
M5M6
CL1 CL2
Out2 capacitively couples with Out1through the gate-source and gate-drain capacitances of M4
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Backgate Coupling Effect
Vo
lta
ge
Time (ns)
-1
0
1
2
3
0 2 4 6
CLK
In
Out1
Out2
q Capacitive coupling means Out1 drops significantly soOut2 does not go all the way to ground
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Notes on Backgate Coupling Effectq The high impedance of the output node makes
the circuit very sensitive to crosstalk effects.ß A wire routed over or next to a dynamic node may
couple capacitively and destroy the state of thefloating node.
q Due to capacitive backgate coupling between theinternal and output node of the static gate andthe output of the dynamic gate, Out1 voltage isreduced.
q Out1 overshoots VDD (2.5V) due to clockfeedthrough
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CL
CLK
CLK
B
A
OutMp
Me
Coupling between Out andCLK input of the prechargedevice due to the gate- draincapacitance. So voltage ofOut can rise above VDD. Thefast rising (and falling edges)of the clock couple to Out.
q A special case of capacitive coupling between the clockinput of the precharge transistor and the dynamic outputnode
Issues in Dynamic Design 4: Clock Feedthrough
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CLK
CLK
In1
In2
In3
In4
Out
In &CLK
Out
Time (ns)
-0.5
0.5
1.5
2.5
0 0.5 1
Vo
ltag
e (V
)
Clockfeedthrough
Clock Feedthrough Example
Clock feedthrough
Signal levels can rise enough above VDD that the normally reverse-biased junction diodes become forward-biased causing electronsto be injected into the substrate.
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Cascading Dynamic GatesV
t
CLK
In
Out1
Out2DV
VTn
Only a single 0 Æ 1 transition allowed at theinputs during the evaluation period!
CLK
Out1
CLK
CLK
In
Mp
Me
Out2
CLK Mp
Me
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Domino Logic
1 Æ 11 Æ 0
0 Æ 00 Æ 1
Out1 Out2
Mkp
In1
In2 PDN
In3
Me
Mp
CLK
CLK
In2 PDN
In3
Me
Mp
CLK
CLK
Assume all inputs to the Domino gate are initially zero
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Why Domino?
In1
CLK
CLK
Ini PDNInj
Ini
Inj
PDN Ini PDNInj
Ini PDNInj
Like falling dominos!
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Notes on Dominic Logicq Ensures all inputs to the Domino gate are set to 0 at the
end of the precharge period. Hence, the only possibletransition during evaluation is 0 to 1
q Additional advantage is that the fan-out of the gate isdriven by a static inverter with a low-impedance outputthat increases the noise immunity.
q The buffer also reduces the capacitance of the dynamicoutput node by separating internal and loadcapacitances.
q Finally, the inverter can be used to drive a bleeder tocombat leakage and charge redistribution.
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Ci,0
CLK
CLK
G0
P0 P1 P2 P3
G1 G2 G3
Ci,41234
5
6
3 3 3 3 3
1
2
2
3
3
4
4
5
!(G0 + P0 Ci,0) !(G1 + P1G0 + P1P0 Ci,0)
Domino Manchester Carry Chain
Automatically forms all the intermediate carries
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CLKA3
B3
A2
B2
A1
B1
A0
B0
Out
Domino Comparator
Don’t need isolation NMOS in the pull-down,since the PDN is forced off during precharge.
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Properties of Domino Logicq Only non-inverting logic can be implemented, fixes
include
ß can reorganize the logic using Boolean transformations
ß use differential logic (dual rail)
ß use np-CMOS (zipper)
q Very high speed
ß tpHL = 0, only Low-High transitions allow
ß static inverter can be optimized to match fan-out (separation offan-in and fan-out capacitances)
ß Input capacitances reduced - smaller logical effort
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Due to its high-performance, differential domino is very popularand is used in several commercial microprocessors!
1 0 1 0
onoff
Differential (Dual Rail) Domino
Me
Mp Mkp Mkp Mp
A
B
CLK
CLK
!Out = !(AB)
!A !B
CLK
Out = AB
AND/NAND
q Solve problem of non-inverting logic
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Notes on Differential Dominoq The inputs and their complements come from other
differential DR gates and thus all inputs are low duringprecharge and make a conditional transition from 0 to 1.
q Expensive - but can implement any arbitrary function.
q Use significant power since they have a guaranteedtransition every single clock cycle (regardless of signalstatistics, since either Out or !Out will transit from 0 to 1).
q Nonratioed (even though it has a cross-coupled PMOSpair)
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np-CMOS (Zipper)
1 Æ 11 Æ 0
0 Æ 00 Æ 1
Only 0 Æ 1 transitions allowed at inputs of PDNOnly 1 Æ 0 transitions allowed at inputs of PUN
In1
In2
In3
Me
Mp
CLK
CLKOut1
In4
In5
Me
Mp!CLK
!CLK
Out2(to PDN)
PUN
PDN
In4 and In5 must be from PDN
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NORA (No Race)
1 Æ 11 Æ 0
0 Æ 00 Æ 1
Very sensitive to Noise!
In1
In2
In3
Me
Mp
CLK
CLKOut1
In4
In5
Me
Mp!CLK
!CLK
Out2(to PDN)
to otherPDN’s
to otherPUN’s
PUN
PDN
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Note on np-CMOS and NORAq DEC alpha uses np-CMOS logic (Dobberpuhl)
q Have to size the PUN’s to equalize the delay to that ofthe PDN’s
q Really dense layouts and very high speed (20% fasterthan domino with the correct sizing)
q Reduced noise margin (as with any dynamic gate)
ß More sensitive to noise
q Increase complexity
ß Have two clock signals to generate and route - CLK and !CLK
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np-CMOS Adder Circuit
1 Æ x
0 Æ xB0
C0
C0
C0
!C1
!Sum0B0A0
A0
B0B0 A0
A0
CLK
CLK !CLK
!CLK
C2
Sum1!A1
!A1
!B1!B1
!A1!A1!B1
!B1
!C1
!C1
!CLK
!CLK CLK
CLK
0 Æ x
1 Æ x
0 Æ x
0 Æ x
1 Æ x
1 Æ x
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3
4
2
1
Ease
4
2 + clk
3
1
Power
1yes10DCVSL*
2no6 + 2domino
4no12 + 2CPL*
3no8Comp Static
DelayRatioed?# TransStyle
4-input NAND
* Dual Rail
q Current trend is towards an increased use ofcomplementary static CMOS: design support throughDA tools, robust, more amenable to voltage scaling.
How to Choose a Logic Styleq Must consider ease of design, robustness (noise
immunity), area, speed, power, system clockingrequirements, fan-out, functionality, ease of testing