Demands for Producing IPC Class 3! Lars-Olof Wallin IPC European Representative Seminar MITT...

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Demands for Producing IPC Class 3! Lars-Olof Wallin IPC European Representative Seminar MITT University 2014-11-

Transcript of Demands for Producing IPC Class 3! Lars-Olof Wallin IPC European Representative Seminar MITT...

Page 1: Demands for Producing IPC Class 3! Lars-Olof Wallin IPC European Representative Seminar MITT University 2014-11-27.

Demands for Producing IPC Class 3!

Lars-Olof WallinIPC European Representative

Seminar MITT University 2014-11-27

Page 2: Demands for Producing IPC Class 3! Lars-Olof Wallin IPC European Representative Seminar MITT University 2014-11-27.

IPC Part: 7Introduction to Produce

acc to IPC Class 3

How extensive is it towrite a specification?

Page 3: Demands for Producing IPC Class 3! Lars-Olof Wallin IPC European Representative Seminar MITT University 2014-11-27.

What expectations do you have of this

workshop?

The answer is?You hope to find some Gold!

Page 4: Demands for Producing IPC Class 3! Lars-Olof Wallin IPC European Representative Seminar MITT University 2014-11-27.
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I can convert Lead into GOLD!!

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Which IPC Standards does is most known?

IPC-A-610E?

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Page 8: Demands for Producing IPC Class 3! Lars-Olof Wallin IPC European Representative Seminar MITT University 2014-11-27.

Is it OK according to IPC-610E Class 3?

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IPC-A-610E

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It is not OK!!

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The board didn't work!

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Will this book solve the problems?

NO!!

Rev E

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Questions??• Please answer the following questions:

• Do you have demands for IPC Class 3 today?

• Have you some problems with the solder joint results and or your bare boards?

Page 14: Demands for Producing IPC Class 3! Lars-Olof Wallin IPC European Representative Seminar MITT University 2014-11-27.

Why do you have PROBLEMS?

The Answer is:

Lot of parameters during the entire production chain!

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Number of Combinations

4200 000 000 000 000 000 0

Too Many!!

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PWB

COMPONENTSSTENCIL

PASTE

Digital Data

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Let us take some examples!

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Offset resist window opening up trackand possibly touching BGA pad

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Inner layer

Solderfilled

via hole

Copperwall

Crack

Implications of CTE in the Z-direction

Greater tendency for cracks betwee inner layer and the wall for wider holes.

Greater tendency for barrel crack in thinner via holes (larger aspect ratio)

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What can GO WRONG?

Page 54: Demands for Producing IPC Class 3! Lars-Olof Wallin IPC European Representative Seminar MITT University 2014-11-27.

The Electronic Designer

I like complicated functions on a small surface!!

Is the Electronic Design the ROOT CAUSE?

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The CAD People

What is IPC-7351B?

My footprints hasn't changed

since 1903!

Is the CAD the ROOT CAUSE?

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Is PCB OK?

Is the Bare Board the ROOT CAUSE?

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What do you see here?

How many PTH do you have in your PCB?

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PWB

COMPONENTSSTENCIL

PASTE

Digital Data

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Loading

Loading

CAMScreen print

Jet printer

Is the Screen printing the ROOT CAUSE?

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Pick & Place

Pick & Place

Pick & Place

Pick & Place

Is the Pick & Place the ROOT CAUSE?

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Pick & Place

Repair of BGA

X-Ray

Vapor Phase

Reflow

AOI Unload

Unload

Is the Reflow or Wave Soldering the

ROOT CAUSE?

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Reflow

AOI Unload

Unload

Wave SolderingCleaning

Manual Assa

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It is many Process Steps!

The cause of a bad SolderJoint can be hard to find!

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It is NOT a piece of cake!

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What shall You Do Now?

No Control – Just Deliver?

Deliver and hope for the Best?

Start to Repair and Lose €€€?

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What can it COST?

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A typical Bare boardYou are assembling in

quantities of: 1000?

Costs:- Bare Board: 3€ each?- Components (BOM): 15€/board?- Assembling, Soldering & Testing: 4€/PCB? Total: 1000 x (3 + 15 + 4) = 22 000€

18%

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IPC-A-610E

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It is not OK!!

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SUMMARY

What shall You do?

COST

IPC Class 3

GO WRONG