Cyclo Olefin Polymer (COP)y y

http://www.zeon.co.jp/

Zeon Europe GmbH

Zeon Chemicals L.P.

Zeon Asia Pte Ltd.

Zeon CSC Corporation

Zeon India Private Limited

Zeon Trading (Shanghai) Co., Ltd.

Hansaallee 249, 40549 Dusseldorf, GermanyTel:+49-211 5267 0 Fax:+49-211 5267 160

4111 Bells Lane, Louisville, KY 40211 USATel:+1-800-735-3388 Fax:+1 502.775.2055

331 North Bridge Road,#20-01/02, Odeon Towers, Singapore 188720Tel:+65-6332-2338 Fax:+65-6332-2339

3rd Fl. 266, Sec1, Wen Hwa 2 Road, Linkou Hsiang, Taipei Hsien, Taiwan, R.O.CTel:+886-2-2609-2156 Fax:+886-2-2600-6413

Time Tower, Unit No.507, Sector–28, M.G Road, Gurgaon, Haryana, India 122002TEL：+91-124-4229461　FAX：+91-124-4229462

Room 1501, Hongwell International Plaza, No.1600 Zhongshan West Road, Xuhui District, Shanghai, Code:200235, CHINATEL: +86-21-6040-7255 FAX: +86-21-6040-7258

Global ContactEurope:

U.S.A.:

ASIA:

Mar. 20160316005(SE)

Printed in Japan

1-6-2 Marunouchi, Chiyoda-ku, Tokyo 100-8246

Tel : +81-(0)3-3216-1769 Fax: +81-(0)3-3216-2334

Specialty Plastics Division

New high-performance thermoplastics for next-generation

Applications

ZEONEX® Applications

Digital camera lenses, prisms and Mobile phone camera lensesZEONEX® has earned high marks for low moisture absorption, good transparency, and high precision molding ability.

Pickup lenses, LBP Fθlenses.For pickup lenses and LBP Fθ lenses, ZEONEX’s low birefringence, low moisture absorption, and high-precision molding ability will bring high values.

Other applicationsZEONEX® is also favored in electronics, medical packaging and optronics fields, with its outstanding heat resistance, low impurity chemical resistance and electric properties.

MirrorsZEONEX’s low moisture absorption, good dimensional stability, and high-precision molding are perfectly fit for mirrors.

32

18:20Monday, 5 September

ZEONEX®̶ Cyclo Olefin Polymer(COP)offers excellent optical properties for creating optical parts for cameras and laser beam printers.ZEONEX's high purity is suitable for a wide range of medical packaging products,while its low dielectric constant and loss tangents are appropriate for electrical insulation applications.

For optics, electronics, and medical applicationsAnother industry-leading development from ZEON CORPORATION

New high-performance thermoplastics for next-generation

Applications

ZEONEX® Applications

Digital camera lenses, prisms and Mobile phone camera lensesZEONEX® has earned high marks for low moisture absorption, good transparency, and high precision molding ability.

Pickup lenses, LBP Fθlenses.For pickup lenses and LBP Fθ lenses, ZEONEX’s low birefringence, low moisture absorption, and high-precision molding ability will bring high values.

Other applicationsZEONEX® is also favored in electronics, medical packaging and optronics fields, with its outstanding heat resistance, low impurity chemical resistance and electric properties.

MirrorsZEONEX’s low moisture absorption, good dimensional stability, and high-precision molding are perfectly fit for mirrors.

32

18:20Monday, 5 September

ZEONEX®̶ Cyclo Olefin Polymer(COP)offers excellent optical properties for creating optical parts for cameras and laser beam printers.ZEONEX's high purity is suitable for a wide range of medical packaging products,while its low dielectric constant and loss tangents are appropriate for electrical insulation applications.

For optics, electronics, and medical applicationsAnother industry-leading development from ZEON CORPORATION

ZEONEX® basic properties ZEONEX® characteristic properties

Low water absorptionWater absorption is less than 0.01%

Precision moldingIdeal for high-precision molded products and blow molding

TransparencyHigh transparency and Low birefringence.

Chemical resistanceExcellent resistance to acid and alkali.

Low dielectric constant and low dielectric loss tangentThermoplastic resin with the lowest dielectric constant and lowest dielectric loss tangent

Low content of impuritiesVery low impurities

Low specific gravitySpecific gravity is approximately 1, which is 20% lighter than general plastics.

High heat resistanceThe heat distortion temperature is above 120℃

PC

0.1000

0.0100

0.0010

0.0001

2 3 4 5

エポキシPET

PPSPPO

PP

PTFE

PAR

PC PI

Die

lect

ric lo

ss ta

ngen

t

Dielectric constant

Light transmittance

Index of refraction

NIR wavelength

Light transmittance

Properties

Features1.401.201.000.800.600.400.200.00

PMMAPC PPS PET

Spec

ific

grav

ity

ZEONEX®

1401201008060402000

PMMA PPS PET PP PTFEHeat

dist

ortio

n te

mpe

ratu

re (℃

)

ZEONEX®

0.3

0.25

0.2

0.15

0.1

0.05

0PMMAPC PPS PET

Wat

er a

bsor

ptio

n (%

)

ZEONEX®

1.5

1

0.5

00.06

1.04

ZEONEX® PPS PC(High purity)

Resid

ual m

etal

(ppm

)

1.361.36

ZEONEX®

54

1009080706050403020100

1100 1150 1200 1300 13501250 1400 1450 150010501000Wavelength (nm)

Tran

smitt

ance

(%

)

1009080706050403020100

400 500 600 700 800300200Wavelength (nm)

Tran

smitt

ance

(%)

ZEONEX®480ZEONEX®E48RZEONEX®K26R

ZEONEX®480ZEONEX®E48RZEONEX®K26RPCPMMA

Inde

x of

ref

ract

ion

Abbe number

1.60

1.58

1.56

1.54

1.52

1.50

1.4870 60 20304050

PMMA

PC

ZEONEX®

(Frequency: 1 MHz)

PC

ZEONEX® basic properties ZEONEX® characteristic properties

Low water absorptionWater absorption is less than 0.01%

Precision moldingIdeal for high-precision molded products and blow molding

TransparencyHigh transparency and Low birefringence.

Chemical resistanceExcellent resistance to acid and alkali.

Low dielectric constant and low dielectric loss tangentThermoplastic resin with the lowest dielectric constant and lowest dielectric loss tangent

Low content of impuritiesVery low impurities

Low specific gravitySpecific gravity is approximately 1, which is 20% lighter than general plastics.

High heat resistanceThe heat distortion temperature is above 120℃

PC

0.1000

0.0100

0.0010

0.0001

2 3 4 5

エポキシPET

PPSPPO

PP

PTFE

PAR

PC PI

Die

lect

ric lo

ss ta

ngen

t

Dielectric constant

Light transmittance

Index of refraction

NIR wavelength

Light transmittance

Properties

Features

1.401.201.000.800.600.400.200.00

PMMAPC PPS PET

Spec

ific

grav

ity

ZEONEX®

1401201008060402000

PMMA PPS PET PP PTFEHeat

dist

ortio

n te

mpe

ratu

re (℃

)

ZEONEX®

0.3

0.25

0.2

0.15

0.1

0.05

0PMMAPC PPS PET

Wat

er a

bsor

ptio

n (%

)

ZEONEX®

1.5

1

0.5

00.06

1.04

ZEONEX® PPS PC(High purity)

Resid

ual m

etal

(ppm

)

1.361.36

ZEONEX®

54

1009080706050403020100

1100 1150 1200 1300 13501250 1400 1450 150010501000Wavelength (nm)

Tran

smitt

ance

(%

)

1009080706050403020100

400 500 600 700 800300200Wavelength (nm)

Tran

smitt

ance

(%)

ZEONEX®480ZEONEX®E48RZEONEX®K26R

ZEONEX®480ZEONEX®E48RZEONEX®K26RPCPMMA

Inde

x of

ref

ract

ion

Abbe number

1.60

1.58

1.56

1.54

1.52

1.50

1.4870 60 20304050

PMMA

PC

ZEONEX®

(Frequency: 1 MHz)

PC

Electric properties

Chemical resistance Impurities

Hours2000 1000800600400

1009080706050403020100

Hours2000 400 600 800 1000 1200

1009080706050403020100

0.00

0.01

0.02

0.03

0.04

0.00

0.01

0.02

0.03

0.04

1. High temperature and high humidity̶maintainsat 60C, 90% RH, for 168 hours.

Lens: Pickup collimator lens Measurement condition: 25C, 50% RH

PMMA(Low moisture absorption grade)

PMMA(Low moisture absorption grade)

ZEONEX® 480RZEONEX® 480R

2. Heat cycle test̶10 cycles at 85℃ for 30 minutes to 40C for 30 minutes

Wav

e su

rface

abe

rratio

n（λ

RMS）

Wav

e su

rface

abe

rratio

n（λ

RMS）

Environmental resistance of ZEONEX® lenses

Tran

smitt

ance

(%)

Tran

smitt

ance

(%)

Measurement condition : 3mmt Injection molding plate　　　　　 80℃ Oven

Measurement condition : 3mmt Injection Moldingplate　　　　　 Black panel temperature 63℃　　　　　 Light corbon mark／fede mater

Temperature（℃） Temperature（℃）

Frequency（MHz）(Temperature: 22℃）

(Frequency: 1 MHz) (Frequency: 1 MHz)

Frequency（MHz）(Temperature: 22℃）

00 102 103

3.0

2.8

2.6

2.4

2.2

2.0

Die

lect

ric c

onst

ant

101 102 103

0.0010

0.0008

0.0006

0.0004

0.0002

0

Die

lect

ric lo

ss ta

ngen

t

Die

lect

ric c

onst

ant

Die

lect

ric lo

ss ta

ngen

t

0

3.0

2.8

2.6

2.4

2.2

2.050 100 150 0

0

0.0002

0.0004

0.0006

0.0008

0.0010

50 100 150

100100 101

Dielectric constant vs. temperature

Dielectric constant vs. frequency Dielectric loss tangent vs. frequency

Dielectric loss tangent vs. temperature

Concentration of impurities in ZEONEX®

Less thandetectablelimit

Impurity ConcentrationCaNaClSOSOPO　

Methanol EthanolIPA (isopropyl alcohol) Acetone MEK (methyl ethyl ketone) Cyclohexanone MIBK (methylisobutyl ketone) THF (tetrahydrofuran) Xylene n-Hexane Concentrated hydrochloric acid Concentrated sulfuric acid Nitric acid Caustic soda (50%) Aqueous ammonia (10%)Salad oil MargarineLemon juiceLimonene

○○○○△××× × × ○××○○××○×

○○○○○××× × × ○××○○××○×

○△×××××× × × ○××○○××○×

Alcohol

Ketone

EtherAromaticHydrocarbon

Foods

Other

Alkali

Acid

0.020.020.21.12.73.3

Test results

Detectable limit（ppm）

－42

3－

－42

－

+

2+330Ｒ 480Ｒ E48Ｒ

ZEONEX® characteristic properties

Environmental resistance

Heat resistance rest

Light resistance rest

Properties

Properties

76

Before test After

testBefore test After

test1st

2nd

5th

10th

1st

2nd

5th

10th

Number of days (day) Number of days (day)

Marginal stress 140MPa or more =○ (usable) 10～14MPa =△ (exercise caution in use) 10MPa or less =× (unusable)

DissolveDissolveDissolve

DissolveSwollen

WhiteSwollenWhite

Dissolve DissolveDissolve

Electric properties

Chemical resistance Impurities

Hours2000 1000800600400

1009080706050403020100

Hours2000 400 600 800 1000 1200

1009080706050403020100

0.00

0.01

0.02

0.03

0.04

0.00

0.01

0.02

0.03

0.04

1. High temperature and high humidity̶maintainsat 60C, 90% RH, for 168 hours.

Lens: Pickup collimator lens Measurement condition: 25C, 50% RH

PMMA(Low moisture absorption grade)

PMMA(Low moisture absorption grade)

ZEONEX® 480RZEONEX® 480R

2. Heat cycle test̶10 cycles at 85℃ for 30 minutes to 40C for 30 minutes

Wav

e su

rface

abe

rratio

n（λ

RMS）

Wav

e su

rface

abe

rratio

n（λ

RMS）

Environmental resistance of ZEONEX® lenses

Tran

smitt

ance

(%)

Tran

smitt

ance

(%)

Measurement condition : 3mmt Injection molding plate　　　　　 80℃ Oven

Measurement condition : 3mmt Injection Moldingplate　　　　　 Black panel temperature 63℃　　　　　 Light corbon mark／fede mater

Temperature（℃） Temperature（℃）

Frequency（MHz）(Temperature: 22℃）

(Frequency: 1 MHz) (Frequency: 1 MHz)

Frequency（MHz）(Temperature: 22℃）

00 102 103

3.0

2.8

2.6

2.4

2.2

2.0

Die

lect

ric c

onst

ant

101 102 103

0.0010

0.0008

0.0006

0.0004

0.0002

0

Die

lect

ric lo

ss ta

ngen

t

Die

lect

ric c

onst

ant

Die

lect

ric lo

ss ta

ngen

t

0

3.0

2.8

2.6

2.4

2.2

2.050 100 150 0

0

0.0002

0.0004

0.0006

0.0008

0.0010

50 100 150

100100 101

Dielectric constant vs. temperature

Dielectric constant vs. frequency Dielectric loss tangent vs. frequency

Dielectric loss tangent vs. temperature

Concentration of impurities in ZEONEX®

Less thandetectablelimit

Impurity ConcentrationCaNaClSOSOPO　

Methanol EthanolIPA (isopropyl alcohol) Acetone MEK (methyl ethyl ketone) Cyclohexanone MIBK (methylisobutyl ketone) THF (tetrahydrofuran) Xylene n-Hexane Concentrated hydrochloric acid Concentrated sulfuric acid Nitric acid Caustic soda (50%) Aqueous ammonia (10%)Salad oil MargarineLemon juiceLimonene

○○○○△××× × × ○××○○××○×

○○○○○××× × × ○××○○××○×

○△×××××× × × ○××○○××○×

Alcohol

Ketone

EtherAromaticHydrocarbon

Foods

Other

Alkali

Acid

0.020.020.21.12.73.3

Test results

Detectable limit（ppm）

－42

3－

－42

－

+

2+330Ｒ 480Ｒ E48Ｒ

ZEONEX® characteristic properties

Environmental resistance

Heat resistance rest

Light resistance rest

Properties

Properties

76

Before test After

testBefore test After

test1st

2nd

5th

10th

1st

2nd

5th

10th

Number of days (day) Number of days (day)

Marginal stress 140MPa or more =○ (usable) 10～14MPa =△ (exercise caution in use) 10MPa or less =× (unusable)

DissolveDissolveDissolve

DissolveSwollen

WhiteSwollenWhite

Dissolve DissolveDissolve

PropertiesFeatures

98

ZEONEX® basic molding properties Comparison of ZEONEX® and other resins

ZEONEX®characteristic properties

－

%

%

－

℃

cm/cm℃

%

MPa

MPa

MPa

MPa

%

J/m

－

Ωcm

KV/mm

－

－

ASTM D792

ASTM D570

ASTM D1003

ASTM D542

ASTM D648

ASTM D696

ASTM D955

ASTM D790

ASTM D790

ASTM D638

ASTM D638

ASTM D638

ASTM D256

JIS K5401

ASTMD257

ASTM D149

ASTMD150

ASTMD150

n

1MHZ

1MHZ

1.2

0.2

89

1.59

121

7×10

0.5～0.7

2100

90

2100

62

90

59

B

＞10　

30

3.0

0.009

PC

1.2

0.15

89

1.59

7×10

0.5～0.7

2400

98

66

110

B

＞10　

18～22

3.0

0.01

PMMA

0.3

93

1.49

0.3～0.7

3000

108

48～76

2～10

16～32

3H

＞10　

20

2.6

0.02

PTFE

＜0.01

　－　

－

55

10×10

－

14～34

160

－

＞10　

9～12

2.1

0.0002

＜0.1

90

1.59

0.3～0.7

78

49～57

2.0～3.6

22～24

－

22

2.5

0.0005

PP

＜0.01

－

1.49

49～60

11×10

1.6～1.9

　

39

　

31～41

22～53

－

30～32

2.3

0.0003

ア イ ゾット衝 撃 強 度

18.0MPaNo annealing

3.2mmNotched

ＰＣ光学グレード

1.17～1.2

2.14～2.2

1.04～1.05

0.90～0.91

90～104

74～99

123～132

343～618

1200～1800

　

100～600

200～400

16

16 16 15 16 16

PＳ(GP)

d25

－5

3000

ZEONEX®

K22Ｒ

1.01

＜0.01

92

1.535

132

6×10

0.5～0.7

2400

110

2600

70

5

23

F

＞10　

110

2.5

0.0003

－5

17

5～9×10 6～8×10－5 －5 －5 －5 －5 －5

＞10　16

＞10　

1200～1600

3200～3400

400～560

2300～33002200

Product name

Recommended temperature

ZEONEX®

RS420100～110℃

ZEONEX®

330R90～100℃

ZEONEX®

E48R100～110℃

ZEONEX®

K26R・K22R100～110℃

ZEONEX®

F52R100～110℃

ZEONEX®

480R・480100～110℃

※When a nitrogen sealing is applied, carefully monitor the increase in nitrogen 　density in the molding room and be sure to provide periodical ventilation.

Air(oxygen) dissolved in ZEONEX® pellets can cause discoloration, carbide and the occurrence of voids. ZEONEX® should be dried (heated) to remove air in the pellets for 4 to 10 hours at the temperaturesre commended for each product number indicated below before molding. Drying for too long a period may cause heat deterioration, and possibly discoloration in the molded articles.

(1) Necessity of Nitrogen Sealing ZEONEX® is stable even at 280℃ for 30 hours when oxygen is not present, so defects such as carbonization, burning and discoloration do not occur in products. Since these problems will arise in the presence of oxygen, nitrogen sealing should be used to prevent oxygen from entering into the injection molding process. Nitrogen sealing is very effective

for molding optical parts, preventing discoloration and the entrance of contamination caused by resin decomposition.(2) Nitrogen Sealing MethodFig.1 Shows the method for nitrogen sealing, and Fig.2 shows a simplified nitrogen sealing method.(1) As shown below, feeding nitrogen to the lower part of the hopper prevents mixture with air. This is also effective when air is used for transport. (2) Before increasing the cylinder temperature, nitrogen is introduced in order to purge air from the inside of the cylinder. After this, the resin can be poured.(3) The flow rate of nitrogen depends on the capacity of the molding machine. For example, nitrogen flow rate 15 liters/ minute (cylinder diameter:15 to 30 mm;resin residence time: 5 to 30 minutes). Concentration of N2 should be 99% or higher, and a concentration of 99.9% or higher is recommended.

Molding conditions vary depending upon factors including the molding machine and the tool. Please refer to the list of recommended temperatures below for each product number as well as glass transition point (Tg) and Ml, and set molding conditions accordingly.

※For more details, please ask ZEON

Cylinder temperature Mold temperature Injection pressure Holding pressure

Back pressure Injection speed

Screw speed

Product name

50～180MPa50～180MPa5～10MPa

30～80cm3/sec20～60rpm

ZEONEX®

RS420250～300℃60～120℃

ZEONEX®

330R240～260℃90～120℃

ZEONEX®

K26R・K22R270～300℃95～140℃

ZEONEX®

F52R270～300℃105～150℃

ZEONEX®

E48R260～290℃90～135℃

ZEONEX®

480R・480260～290℃90～135℃

740～980

Properties

Properties

Predrying

Nitrogensealing

Standard injection molding

conditions

UnitProperties

NitrogengasVinyl hose or metal pipe

Stainless pipe

HopperHopper

Fig.1 Nitrogen sealing method

Nitrogen gas

Vinyl hoseAttach a hosetip to the lowerpart of the hopper

Fig.2 Simplified nitrogen sealing method

Fixed

Specificgravity

Waterabsorption

LighttransmittanceRefractive

indexHeat distortiontemperature

MoldingshrinkageFlexuralmodulusFlexural strengthTensile

modulusTensilestrengthTensile

elongationIzod impact

strengthPencil

hardnessVolume

resistivityDielectric

breakdown strength

Dielectricconstant

Linear expansioncoefficient

Dielectric loss tangent

Measurementmethods

Thickness:3mm

Requirements

PropertiesFeatures

98

ZEONEX® basic molding properties Comparison of ZEONEX® and other resins

ZEONEX®characteristic properties

－

%

%

－

℃

cm/cm℃

%

MPa

MPa

MPa

MPa

%

J/m

－

Ωcm

KV/mm

－

－

ASTM D792

ASTM D570

ASTM D1003

ASTM D542

ASTM D648

ASTM D696

ASTM D955

ASTM D790

ASTM D790

ASTM D638

ASTM D638

ASTM D638

ASTM D256

JIS K5401

ASTMD257

ASTM D149

ASTMD150

ASTMD150

n

1MHZ

1MHZ

1.2

0.2

89

1.59

121

7×10

0.5～0.7

2100

90

2100

62

90

59

B

＞10　

30

3.0

0.009

PC

1.2

0.15

89

1.59

7×10

0.5～0.7

2400

98

66

110

B

＞10　

18～22

3.0

0.01

PMMA

0.3

93

1.49

0.3～0.7

3000

108

48～76

2～10

16～32

3H

＞10　

20

2.6

0.02

PTFE

＜0.01

　－　

－

55

10×10

－

14～34

160

－

＞10　

9～12

2.1

0.0002

＜0.1

90

1.59

0.3～0.7

78

49～57

2.0～3.6

22～24

－

22

2.5

0.0005

PP

＜0.01

－

1.49

49～60

11×10

1.6～1.9

　

39

　

31～41

22～53

－

30～32

2.3

0.0003

ア イ ゾット衝 撃 強 度

18.0MPaNo annealing

3.2mmNotched

ＰＣ光学グレード

1.17～1.2

2.14～2.2

1.04～1.05

0.90～0.91

90～104

74～99

123～132

343～618

1200～1800

　

100～600

200～400

16

16 16 15 16 16

PＳ(GP)

d25

－5

3000

ZEONEX®

K22Ｒ

1.01

＜0.01

92

1.535

132

6×10

0.5～0.7

2400

110

2600

70

5

23

F

＞10　

110

2.5

0.0003

－5

17

5～9×10 6～8×10－5 －5 －5 －5 －5 －5

＞10　16

＞10　

1200～1600

3200～3400

400～560

2300～33002200

Product name

Recommended temperature

ZEONEX®

RS420100～110℃

ZEONEX®

330R90～100℃

ZEONEX®

E48R100～110℃

ZEONEX®

K26R・K22R100～110℃

ZEONEX®

F52R100～110℃

ZEONEX®

480R・480100～110℃

※When a nitrogen sealing is applied, carefully monitor the increase in nitrogen 　density in the molding room and be sure to provide periodical ventilation.

Air(oxygen) dissolved in ZEONEX® pellets can cause discoloration, carbide and the occurrence of voids. ZEONEX® should be dried (heated) to remove air in the pellets for 4 to 10 hours at the temperaturesre commended for each product number indicated below before molding. Drying for too long a period may cause heat deterioration, and possibly discoloration in the molded articles.

(1) Necessity of Nitrogen Sealing ZEONEX® is stable even at 280℃ for 30 hours when oxygen is not present, so defects such as carbonization, burning and discoloration do not occur in products. Since these problems will arise in the presence of oxygen, nitrogen sealing should be used to prevent oxygen from entering into the injection molding process. Nitrogen sealing is very effective

for molding optical parts, preventing discoloration and the entrance of contamination caused by resin decomposition.(2) Nitrogen Sealing MethodFig.1 Shows the method for nitrogen sealing, and Fig.2 shows a simplified nitrogen sealing method.(1) As shown below, feeding nitrogen to the lower part of the hopper prevents mixture with air. This is also effective when air is used for transport. (2) Before increasing the cylinder temperature, nitrogen is introduced in order to purge air from the inside of the cylinder. After this, the resin can be poured.(3) The flow rate of nitrogen depends on the capacity of the molding machine. For example, nitrogen flow rate 15 liters/ minute (cylinder diameter:15 to 30 mm;resin residence time: 5 to 30 minutes). Concentration of N2 should be 99% or higher, and a concentration of 99.9% or higher is recommended.

Molding conditions vary depending upon factors including the molding machine and the tool. Please refer to the list of recommended temperatures below for each product number as well as glass transition point (Tg) and Ml, and set molding conditions accordingly.

※For more details, please ask ZEON

Cylinder temperature Mold temperature Injection pressure Holding pressure

Back pressure Injection speed

Screw speed

Product name

50～180MPa50～180MPa5～10MPa

30～80cm3/sec20～60rpm

ZEONEX®

RS420250～300℃60～120℃

ZEONEX®

330R240～260℃90～120℃

ZEONEX®

K26R・K22R270～300℃95～140℃

ZEONEX®

F52R270～300℃105～150℃

ZEONEX®

E48R260～290℃90～135℃

ZEONEX®

480R・480260～290℃90～135℃

740～980

Properties

Properties

Predrying

Nitrogensealing

Standard injection molding

conditions

UnitProperties

NitrogengasVinyl hose or metal pipe

Stainless pipe

HopperHopper

Fig.1 Nitrogen sealing method

Nitrogen gas

Vinyl hoseAttach a hosetip to the lowerpart of the hopper

Fig.2 Simplified nitrogen sealing method

Fixed

Specificgravity

Waterabsorption

LighttransmittanceRefractive

indexHeat distortiontemperature

MoldingshrinkageFlexuralmodulusFlexural strengthTensile

modulusTensilestrengthTensile

elongationIzod impact

strengthPencil

hardnessVolume

resistivityDielectric

breakdown strength

Dielectricconstant

Linear expansioncoefficient

Dielectric loss tangent

Measurementmethods

Thickness:3mm

Requirements

Grade

1110

ZEONEX® Grade ListPL(Product Liability) Notes

●「ZEONEX®」is the resistered trade mark of ZEON CORPORATION

Suitable ZEONEX® grade for your applications.

RS420

1.01

＜0.01

乳白色

－

136（DSC）

110（ISO75）

7×10－5

8（JIS K 6719）

－

1600

64

1700

45

135

510

Ｂ

40

94HB

F52R

1.02

＜0.01

92

1.535

156

144

6×10－5

22

－

2400

109

3000

45

2

19

F

＞1016

60

2.5

0.0007

94HB

　　

－

％

％

－

℃

℃

cm/cm℃

g/10min

MPa

MPa

MPa

MPa

％

J/m

－

　Ωcm　

kV/mm

ー

ー

ー

ー

ASTM D792

ASTM D570

ASTM D1003

ASTM D542

JIS K7121

ASTM D648

ASTM E831

ISO 1133

ISO178

ISO178

ISO527

ISO527

ISO527

ASTM D256

JIS K5401

IEC93

ASTM D149

IEC250

IEC250

UL規格

ー

ー

ー

ー

ー

ー

ー

ー

ー

ー

ー

ー

ー

1MHz

1MHz

ー

ー

480

1.01

＜0.01

92

1.525

138

123

7×10－5

20

ー

2100

94

2200

59

40

24

H

＞1016

40

2.3

0.0002

94HB

480R

1.01

＜0.01

92

1.525

138

123

7×10－5

21

－

2100

94

2200

59

40

24

H

＞1016

40

2.3

0.0002

94HB

K22R

1.01

＜0.01

92

1.535

143

132

6×10－5

32

－

2400

110

2600

70

5

23

F

＞1017

110

2.5

0.0003

94HB

K26R

1.01

＜0.01

92

1.535

143

133

6×10－5

52

－

2400

92

2400

42

2

23

F

＞1017

96.6

2.4

0.0005

94HB

E48R

1.01

＜0.01

92

1.531

139

122

6×10－5

25

－

2500

104

2500

71

10

21

H

＞1016

40

2.3

0.0002

94HB

330R

0.95

＜0.01

92

1.509

123

103

7×10－5

－

11

3100

91

－

45

3

13

3H

＞1016

40

2.3

0.0004

94HB

1.80MPa No aneal

3.2mmWith Notch

short-timemethod,1mm

280℃21.18N

260℃21.18N

＞1016

（ASTM D257）

2.3（ASTM D150）

0.0002（ASTM D150）

Grade

Specific gravity

Water absorption

Light transmittance

Refractive index

Glass transition temperature

Heat distortion temperature

Linear expansion coefficient

M　F　R

Flexural modulus

Flexural strength

Tensile modulus

Tensile strength

Tensile elongation

Izod impact strength

Pencil hardness

Volume resistivity

Dielectric breakdown strength

Dielectric constant

Dielectric loss tangent

Flammability

Major applications

Unit Measurement methods Conditions

Medical equipment and optical components

Lensesand optical

components

Lensesand optical

components

Lensesand optical

components

Lensesand optical

components

Lensesand optical

components

Lensesand optical

components

Connectorand antennacomponents

Properties

※Data represents experimental results and does not guarantee specifie performance levels under actual usage.

Thickness:3mm

1.　Please observe the following precautions for the storage and use of the product and items molded from the product.

2.　Contact ZEON CORPORATION before utilizing ZEONEX® in medical care products, foods or toys.3.　Please refer to the Material Safety Data Sheet for specific details.

Related laws and standards1. TSCA : TSCA Inventory 2. EINECS : EINECS Inventory 　　　Other disclaimers and warnings（1）Specifications listed in the catalog are typical measurements using standard test methods, but are not intended to imply guaranteed values for all possible applications. Consequently,　　　 listed values may not be applicable to products used under differing conditions. （2）Catalog descriptions and specifications are subject to change without notice. （3）Applicable industrial patents and copyrights should be observed when adopting applications introduced in this catalog. （4）Physical properties cited for other resins are drawn from related catalogs and documents.（5）Contact ZEON CORPORATION for detailed technical information.

（1）Keep away from fire, since ZEONEX® is combustible.（2）Avoid exposure to direct sunlight and high-energy-light, which can make ZEONEX® discolorration.（3）Do not use or expose to temperatures over heat distortion temperature, ZEONEX® may discolor, deform, or melt.（4）Avoid exposure to high temperature for a long time, which can distort ZEONEX®

（5）Do not use under high heat temperature and near heat source; ZEONEX® may emit smoke or ignite.（6）Do not use near high-energy-light source, ZEONEX® may emit smoke or ignite due to heat generation by light absorption.（7）Improper molding conditions or use with a poorly designed mold may induce solvent cracking through residual stress. （8）Do not use for parts that are subject to continuing load 　　 (snap fit insert molded products, screw stops, etc.); the material may crack. （9）Do not expose to the following solvents and liquids which may cause ZEONEX® to liquefy or swell. 　　 •　Aromatic solvents such as benzene, toluene, etc.　　 •　Chlorinated hydrocarbon solvents, including dichloromethane, carbon tetrachloride, etc.　　 •　Animai vegetable and mineral oils and greases 　　 •　Hydrocarbon solvents such as n-Hexane, cyclohexane and ligroin, etc.　　 •　Ethers such as diethylether, etc.　　 •　Ketones such as cyclohexanone, etc. 　　 •　Prior to use test other materials and liquids containing long-chain alkyl groups in their structure.（10）Test ZEONEX® under the harsheet conditions to be encountered to determine the safety and suitability of the materials prior to use.

Grade

1110

ZEONEX® Grade ListPL(Product Liability) Notes

●「ZEONEX®」is the resistered trade mark of ZEON CORPORATION

Suitable ZEONEX® grade for your applications.

RS420

1.01

＜0.01

乳白色

－

136（DSC）

110（ISO75）

7×10－5

8（JIS K 6719）

－

1600

64

1700

45

135

510

Ｂ

40

94HB

F52R

1.02

＜0.01

92

1.535

156

144

6×10－5

22

－

2400

109

3000

45

2

19

F

＞1016

60

2.5

0.0007

94HB

　　

－

％

％

－

℃

℃

cm/cm℃

g/10min

MPa

MPa

MPa

MPa

％

J/m

－

　Ωcm　

kV/mm

ー

ー

ー

ー

ASTM D792

ASTM D570

ASTM D1003

ASTM D542

JIS K7121

ASTM D648

ASTM E831

ISO 1133

ISO178

ISO178

ISO527

ISO527

ISO527

ASTM D256

JIS K5401

IEC93

ASTM D149

IEC250

IEC250

UL規格

ー

ー

ー

ー

ー

ー

ー

ー

ー

ー

ー

ー

ー

1MHz

1MHz

ー

ー

480

1.01

＜0.01

92

1.525

138

123

7×10－5

20

ー

2100

94

2200

59

40

24

H

＞1016

40

2.3

0.0002

94HB

480R

1.01

＜0.01

92

1.525

138

123

7×10－5

21

－

2100

94

2200

59

40

24

H

＞1016

40

2.3

0.0002

94HB

K22R

1.01

＜0.01

92

1.535

143

132

6×10－5

32

－

2400

110

2600

70

5

23

F

＞1017

110

2.5

0.0003

94HB

K26R

1.01

＜0.01

92

1.535

143

133

6×10－5

52

－

2400

92

2400

42

2

23

F

＞1017

96.6

2.4

0.0005

94HB

E48R

1.01

＜0.01

92

1.531

139

122

6×10－5

25

－

2500

104

2500

71

10

21

H

＞1016

40

2.3

0.0002

94HB

330R

0.95

＜0.01

92

1.509

123

103

7×10－5

－

11

3100

91

－

45

3

13

3H

＞1016

40

2.3

0.0004

94HB

1.80MPa No aneal

3.2mmWith Notch

short-timemethod,1mm

280℃21.18N

260℃21.18N

＞1016

（ASTM D257）

2.3（ASTM D150）

0.0002（ASTM D150）

Grade

Specific gravity

Water absorption

Light transmittance

Refractive index

Glass transition temperature

Heat distortion temperature

Linear expansion coefficient

M　F　R

Flexural modulus

Flexural strength

Tensile modulus

Tensile strength

Tensile elongation

Izod impact strength

Pencil hardness

Volume resistivity

Dielectric breakdown strength

Dielectric constant

Dielectric loss tangent

Flammability

Major applications

Unit Measurement methods Conditions

Medical equipment and optical components

Lensesand optical

components

Lensesand optical

components

Lensesand optical

components

Lensesand optical

components

Lensesand optical

components

Lensesand optical

components

Connectorand antennacomponents

Properties

※Data represents experimental results and does not guarantee specifie performance levels under actual usage.

Thickness:3mm

1.　Please observe the following precautions for the storage and use of the product and items molded from the product.

2.　Contact ZEON CORPORATION before utilizing ZEONEX® in medical care products, foods or toys.3.　Please refer to the Material Safety Data Sheet for specific details.

Related laws and standards1. TSCA : TSCA Inventory 2. EINECS : EINECS Inventory 　　　Other disclaimers and warnings（1）Specifications listed in the catalog are typical measurements using standard test methods, but are not intended to imply guaranteed values for all possible applications. Consequently,　　　 listed values may not be applicable to products used under differing conditions. （2）Catalog descriptions and specifications are subject to change without notice. （3）Applicable industrial patents and copyrights should be observed when adopting applications introduced in this catalog. （4）Physical properties cited for other resins are drawn from related catalogs and documents.（5）Contact ZEON CORPORATION for detailed technical information.

（1）Keep away from fire, since ZEONEX® is combustible.（2）Avoid exposure to direct sunlight and high-energy-light, which can make ZEONEX® discolorration.（3）Do not use or expose to temperatures over heat distortion temperature, ZEONEX® may discolor, deform, or melt.（4）Avoid exposure to high temperature for a long time, which can distort ZEONEX®

（5）Do not use under high heat temperature and near heat source; ZEONEX® may emit smoke or ignite.（6）Do not use near high-energy-light source, ZEONEX® may emit smoke or ignite due to heat generation by light absorption.（7）Improper molding conditions or use with a poorly designed mold may induce solvent cracking through residual stress. （8）Do not use for parts that are subject to continuing load 　　 (snap fit insert molded products, screw stops, etc.); the material may crack. （9）Do not expose to the following solvents and liquids which may cause ZEONEX® to liquefy or swell. 　　 •　Aromatic solvents such as benzene, toluene, etc.　　 •　Chlorinated hydrocarbon solvents, including dichloromethane, carbon tetrachloride, etc.　　 •　Animai vegetable and mineral oils and greases 　　 •　Hydrocarbon solvents such as n-Hexane, cyclohexane and ligroin, etc.　　 •　Ethers such as diethylether, etc.　　 •　Ketones such as cyclohexanone, etc. 　　 •　Prior to use test other materials and liquids containing long-chain alkyl groups in their structure.（10）Test ZEONEX® under the harsheet conditions to be encountered to determine the safety and suitability of the materials prior to use.

Cyclo Olefin Polymer (COP)y y

http://www.zeon.co.jp/

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Zeon Chemicals L.P.

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