CLARiiON DAE2P and DAE3P Disk-Array Enclosures Hardware ... · DAE2P/DAE3P Disk-Array Enclosures...

EMC CorporationCorporate Headquarters:

Hopkinton, MA 01748-9103

1-508-435-1000www.EMC.com

EMC® CLARiiON®

DAE2P and DAE3P Disk-Array Enclosures

HARDWARE REFERENCEP/N 300-002-407

REV A05

www.emc.com

DAE2P/DAE3P Disk-Array Enclosures Hardware Reference2

Copyright © 2005 - 2008 EMC Corporation. All rights reserved.

Published November, 2008

EMC believes the information in this publication is accurate as of its publication date. The information is subject to change without notice.

THE INFORMATION IN THIS PUBLICATION IS PROVIDED “AS IS.” EMC CORPORATION MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WITH RESPECT TO THE INFORMATION IN THIS PUBLICATION, AND SPECIFICALLY DISCLAIMS IMPLIED WARRANTIES OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE.

Use, copying, and distribution of any EMC software described in this publication requires an applicable software license.

For the most up-to-date regulatory document for your product line, go to the Technical Documentation and Advisories section on EMC Powerlink.

For the most up-to-date listing of EMC product names, see EMC Corporation Trademarks on EMC.com.

All other trademarks used herein are the property of their respective owners.

DAE2P/DAE3P Disk-Array Enclosures Hardware Reference 3

Preface

Warnings and cautions

Chapter 1 About DAE2P and DAE3P disk enclosuresIntroduction ....................................................................................... 16Link Control Cards (LCCs).............................................................. 22Disk modules..................................................................................... 23Power supply/system cooling modules ....................................... 25

Chapter 2 Installing a DAE2P/DAE3PRequirements..................................................................................... 28Installing a disk enclosure in a cabinet .......................................... 29Setting up an installed disk enclosure ........................................... 30Connecting AC power...................................................................... 31Setting the enclosure address.......................................................... 37Connecting the DAE2P/DAE3P to the back end bus.................. 39Binding disk modules into RAID groups...................................... 42

Chapter 3 Servicing a DAE2P/DAE3PMonitoring disk enclosure status ................................................... 46Handling FRUs.................................................................................. 50Replacing or adding a disk module ............................................... 54Replacing an LCC module............................................................... 62Replacing a power supply/system cooling module.................... 65

Contents


Appendix A Technical specificationsEnclosure specifications................................................................... 70Operating limits ................................................................................ 74

Index


Title Page

1 DAE2P/DAE3P .............................................................................................. 172 DAE2P/DAE3P front LED display ............................................................. 193 DAE2P/DAE3P rear components ............................................................... 194 Disk enclosure rear view — LEDs and connectors ................................... 205 Disk enclosure bus and address indicators ................................................ 206 Disk enclosure front bezel............................................................................. 217 LCC connectors and status LEDs................................................................. 228 Disk module types ......................................................................................... 249 Power/cooling module LEDs....................................................................... 261 Plugging in the AC line cords ...................................................................... 312 Connecting DAE2P power cords (CX300/CX500 storage system)......... 333 Connecting DAE3P power cords (CX3-80 storage system) ..................... 344 Connecting DAE3P power cords (CX4 storage system)........................... 355 Setting the enclosure address (EA).............................................................. 386 Connecting a disk enclosure to another FC device ................................... 397 Cabling disk enclosures together — two Fibre Channel buses ............... 408 Cabling DAE2Ps/DAE3Ps together — four Fibre Channel buses.......... 411 Front disk enclosure and disk module status lights (bezel removed).... 462 Enclosure address and bus ID indicators ................................................... 483 Power/cooling module status indicators ................................................... 494 LCC status LEDs............................................................................................. 495 Disk module examples .................................................................................. 556 Unlocking and removing the front bezel.................................................... 577 Removing a disk filler module ..................................................................... 588 Removing a disk module .............................................................................. 599 Installing a disk or filler module.................................................................. 6010 Installing and locking the front bezel.......................................................... 6111 Removing a copper cable from an LCC ...................................................... 6212 Removing an LCC .......................................................................................... 6313 Installing an LCC............................................................................................ 64

Figures


14 Reconnecting a copper cable to an LCC ..................................................... 6415 Unplugging the AC power cord .................................................................. 6516 Removing a power/cooling module........................................................... 6617 Installing a power/cooling module ............................................................ 6618 Plugging in the power cord .......................................................................... 67


Preface

This manual is your primary source of information about EMC CLARiiON 2- and 4-gigabit UltraPoint disk-array enclosure (DAE2P and DAE3P) hardware.

Note: The DAE2P/DAE3P is often called a disk enclosure.

Audience This guide is part of the DAE2P and DAE3P documentation set, and is intended for use by system administrators and others responsible for the installation, setup, and maintenance of the product.

Readers of this guide are expected to be familiar with the following topics:

◆ Storage-system operation◆ Basic computer hardware safety and maintenance procedures.

Organization The information in this guide is organized as follows:

Chapter 1, “About DAE2P and DAE3P disk enclosures,” provides a descriptive overview of the disk enclosure.

Chapter 2, “Installing a DAE2P/DAE3P,” describes how to set up and power up the enclosure(s) in your cabinet.

Chapter 3, “Servicing a DAE2P/DAE3P,” provides instructions and procedures for recognizing and replacing failed components.

Appendix A, “Technical specifications,” lists operating limits, shipping and storage requirements, and technical specifications.

8 DAE2P/DAE3P Disk-Array Enclosures Hardware Reference

Preface

Relateddocumentation

EMC Rails and Enclosures (CX Series Storage Systems) Field Installation Guide (P/N 300-001-799)

EMC Rails and Enclosures (CX3 Series Series Storage Systems) Field Installation Guide (P/N 300-003-630)

EMC Rails and Enclosures (CX4 Series Series Storage Systems) Field Installation Guide (P/N 300-007-436)

EMC Navisphere Manager Administrator’s Guide (P/N 300-003-511)

Planning your CX3 series Fibre Channel Storage System Configuration Available on EMC Powerlink

Planning your CX4 series Storage System Configuration Available on EMC Powerlink

EMC Navisphere Security Administrator’s Guide (P/N 069001124)

EMC Installation Roadmap for CLARiiON Storage Systems (P/N 069001166)

CX3 Series and CX Series Disk and FLARE OE Matrix (P/N 014003111)

CX4 Series Storage Systems Disk and FLARE OE Matrix (P/N 300-007-437)

Conventions used inthis guide

EMC uses the following conventions for notes, cautions, warnings, and danger notices.

Note: A note presents information that is important, but not hazard-related.

CAUTION!A caution contains information essential to avoid data loss or damage to the system or equipment. The caution may apply to hardware or software.

WARNING

A warning contains information essential to avoid a hazard that can cause severe personal injury, death, or substantial property damage if you ignore the warning.


Preface

DANGER

A danger notice contains information essential to avoid a hazard that will cause severe personal injury, death, or substantial property damage if you ignore the message.

Typographical conventionsThis manual uses the following format conventions:

Finding currentinformation

The most up-to-date information about the DAE2P and DAE3P is posted on the EMC Powerlink website. We recommend that you download the latest information before you install or service your enclosure. If you purchased this product from an EMC reseller and you cannot access Powerlink, the latest product information should be available from your reseller.

To access EMC Powerlink, use the following link:

http://Powerlink.EMC.com

This typeface

Indicates text (including punctuation) that you type verbatim, all commands, pathnames, filenames, and directory names. It indicates the name of a dialog box, field in a dialog box, menu, menu option, or button.

This typeface Represents variables for which you supply the values; for example, the name of a directory or file, your username or password, and explicit arguments to commands.

This typeface

Represents a system response (such as a message or prompt), a file or program listing.

x > y Represents a menu path. For example, Operations > Poll All Storage Systems tells you to select Poll All Storage Systems on the Operations menu.

[ ] Encloses optional entries.

| Separates alternative parameter values; for example:LUN-name | LUN-number means you can use either the LUN-name or the LUN-number.

http://powerlink.emc.com


Preface

After you log in, select Support > Technical Documentation and Advisories>Hardware/Platforms Documentation. Locate your storage system folder and find the following within it:

◆ The FLARE™ software release notes

◆ The latest version of this reference.

◆ EMC Installation Roadmap for CLARiiON Storage Systems, which provides a checklist of the tasks that you must complete to install your storage system in a storage area network (SAN) or direct attach configuration.

Where to get help EMC support, product, and licensing information can be obtained as follows.

Product information — For documentation, release notes, software updates, or for information about EMC products, licensing, and service, go to the EMC Powerlink website (registration required) at:

http://Powerlink.EMC.com

Technical support — For technical support, go to EMC WebSupport on Powerlink. To open a case on EMC WebSupport, you must be a WebSupport customer. Information about your site configuration and the circumstances under which the problem occurred is required.

Your comments Your suggestions will help us continue to improve the accuracy, organization, and overall quality of user publications. Please send a message to [email protected] with your opinions of this manual.

http://powerlink.emc.com

mailto:[email protected]


The following warnings and cautions pertain throughout this guide.

WARNING Trained service personnel only

Ground circuit continuity is vital for safe operation of the machine. Never operate the machine with grounding conductors disconnected. Remember to reconnect any grounding conductors removed for or during any installation procedure.

ATTENTION Resérvé au personnel autorisé.

Un circuit de terre continu est essentiel en vue du fonctionnement sécuritaire de l'apareil. Ne jamais mettre l'appareil en marche lorsque le conducteur de mise a la terre est débranché.

WARNUNG Nur für Fachpersonal.

STROMSTREUVERLUST: Gerät muss geerdet werden, bevor es am Stromnetz angeschlossen wird.

Warnings andcautions



WARNING

Trained personnel are advised to exercise great care at all times when working on the unit. Remember to:

◆ Remove rings, watches, or other jewelry and neckties before you begin any procedures.

◆ Use caution near any moving part and any part that may start unexpectedly such as fans, motors, solenoids, and so on.

◆ Always use the correct tools for the job.◆ Always use the correct replacement parts.◆ Keep all paperwork, including incident reports, up to date, complete,

and accurate.

Static precautions EMC incorporates state-of-the-art technology in its designs, including the use of LSI and VLSI components. These chips are very susceptible to damage caused by static discharge and need to be handled accordingly.

CAUTION!Before handling printed-circuit boards or other parts containing LSI and/or VLSI components, observe the following precautions:

◆ Store all printed-circuit boards in antistatic bags. ◆ Use a ground strap whenever you handle a printed-circuit board. ◆ Unless specifically designed for nondisruptive replacement, never

plug or unplug printed-circuit boards with the power on. Severe component damage may result.

Replacing the SP batteryA lithium battery on the storage processor powers the real-time clock (RTC) for three to four years in the absence of power. Only trained personnel should change or replace this battery.



WARNING

Danger of explosion if battery is incorrectly replaced. Replace only with the same or equivalent type recommended by the equipment manufacturer. Discard used batteries according to manufacturer's instructions.

About DAE2P and DAE3P disk enclosures 15

1Invisible Body Tag

Topics in this chapter include:

◆ Introduction ........................................................................................ 16◆ Link Control Cards (LCCs)............................................................... 22◆ Disk modules ...................................................................................... 23◆ Power supply/system cooling modules......................................... 25

About DAE2P andDAE3P disk enclosures


About DAE2P and DAE3P disk enclosures

IntroductionEMC® CLARiiON® DAE2P and DAE3P UltraPoint™ (sometimes called "point-to-point") disk-array enclosures are highly available, high-performance, high-capacity storage systems that use a Fibre Channel Arbitrated Loop (FC-AL) as the interconnect interface. An enclosure connects to another DAE or a CX-series processor, and is managed by storage-system software in RAID (Redundant Array of Independent Disk) configurations. The enclosure is only 3U (5.25 inches) high, but can include 15 hard disk drive/carrier modules. Its modular, scalable design allows for additional disk storage as your needs increase. The examples and illustrations in this manual show the rackmounted DAE2P/DAE3P in a standard 40U EMC cabinet.

DAE2P enclosures include high-performance Fibre Channel disk drives. DAE3P enclosures can include either Fibre Channel, economical Serial Advanced Technology Attach (SATA 3 Gb/s, sometimes called SATA II) drives, or Enterprise Flash Drives (sometimes called Solid State Disk, or SSD drives). You can integrate and connect Fibre Channel, SSD drives, and SATA enclosures within a storage system. Combinations of SATA disk modules with any other type within a DAE are not supported.

Introduction 17


Figure 1 DAE2P/DAE3P

The DAE2P/DAE3P uses FC-AL link control cards to manage disks and I/O traffic between enclosures. A DAE2P supports 2- or 4-gigabit disks and 2-gigabit data transfer to and from disks on a Fibre Channel loop called a back-end bus. DAE3P enclosures can support 2- or 4-gigabit disk modules and operate at either 2- or 4-gigabit bus speed. 2 Gb processors, enclosures, and disk modules cannot support or operate on a 4 Gb bus. The DAE2P and DAE3P are externally identical except for a distinguishing "4GB" label on the back of DAE3P enclosures.

Any DAE2P or DAE3P includes up to fifteen disk modules. Simple serial cabling provides easy scalability. You can interconnect disk enclosures to form a large disk storage system; the number and size of buses depends on the capabilities of your storage processor. Highly available configurations require at least one pair of physically independent loops (A and B sides of bus 0, sharing the same dual-port disks). Other configurations use two, three, four, or more buses. You can place the disk enclosures in the same cabinet, or in one or more separate cabinets. High-availability features are standard.

EMC2164stil

DiskDrive(0 - 14)

FrontBezel

RackmountCabinet



The DAE2P/DAE3P includes the following components:

◆ A sheet-metal enclosure with a midplane and front bezel◆ Two link control cards (LCCs)◆ As many as 15 disk modules◆ Two power supply/system cooling modules

Note: The power supply and system cooling components of the power/cooling modules function independently of each other, but the assemblies are packaged together into a single field-replaceable unit (FRU).

Any unoccupied disk module slot has a filler module to maintain air flow.

The LCCs, disk modules, power supply/system cooling modules, and filler modules are field-replaceable units (FRUs), which you can add or replace without tools while the array is powered up.

The enclosure can continue running with one operating power supply and a single functional LCC. At least three of the four system cooling blowers must be running correctly for continuous operation.

Figures 1-2 through 4 show the disk enclosure components. Details on each component accompany the figures. Where the enclosure provides slots for two identical components, the components are called component-name A or component-name B, as shown in the illustrations.

Note: For increased clarity, the following figures depict the disk enclosure outside of the rack cabinet. Your disk enclosure may be installed in a rackmount cabinet as shown in Figure 1.

As shown in Figure 2, the front LED display contains two status lights for each disk module, and two disk enclosure status lights. The enclosure status lights are visible with the front bezel installed.

Introduction 19


Figure 2 DAE2P/DAE3P front LED display

A blue power LED indicates a DAE3P enclosure operating at four gigabits per second. The power LED is green in DAE2P enclosures, and DAE3Ps operating at two Gb.

Figure 3 and Figure 4 show the DAE2P/DAE3P components visible from the rear of the enclosure. Each highly-available enclosure includes two link control cards and two power supply/system cooling (power/cooling) modules.

Figure 3 DAE2P/DAE3P rear components

EMC2166a

Power LED(Green or Blue)

Fault LED(Amber)

Fault LED(Amber)

Disk Activity LED(Green)

!!

!!

!

EXP PRI

EXP PRI

#

!

EXPPRI

EXPPRI

#

Power/Cooling Module B Link Control Card B

Power/Cooling Module A Link Control Card A EMC3232



Figure 4 Disk enclosure rear view — LEDs and connectors

As shown in Figure 5, an enclosure address (EA) indicator is located on each LCC. (The EA is sometimes referred to as an enclosure ID.) Each link control card (LCC) includes a bus (loop) identification indicator. The storage processor initializes bus ID when the operating system loads.

Figure 5 Disk enclosure bus and address indicators

!!

!!

!

EXP PRI

EXP PRI

#

!

EXPPRI

EXPPRI

#A

B+ -

+-

PrimaryLinkActive

ExpansionLinkActive

Expansion(Out)

Primary(In)

SPS (Not used inCLARiiON)

Fault(Amber)

Power(Green)

Loop(Bus) ID

EnclosureAddress

EA Selection

BlowerFault(Amber)

PowerFault(Amber)

Power

EMC3209

!!

!!

!

EXP PRI

EXP PRI

#

!

EXPPRI

EXPPRI

#A

B

0 1 2 3

4 5 6 7

0 1 2 3

4 5 6 7

Bus IDEnclosureAddress

#

EA Selection(Press here tochange EA)

EMC3210

Introduction 21


Note: The enclosure address is set at installation. Disk module IDs are numbered left to right (looking at the front of the unit) and are contiguous throughout an array: enclosure 0 contains modules 0-14; enclosure 1 contains modules 15-29; enclosure 2 includes 30-44, and so on through eight enclosures.

The enclosure EA switch and bus indicator are described in the installation procedure in Chapter 2. The status lights are described in the “Monitoring disk enclosure status” section of Chapter 3.

Midplane A midplane between the disk modules and the LCC and power/cooling modules distributes power and signals to all components in the enclosure. LCCs, power/cooling modules, and disk drives — the enclosure’s field-replaceable units (FRUs) — plug directly into the midplane.

Front bezel The front bezel, shown in Figure 6, has a locking latch and an electromagnetic interference (EMI) shield. You must remove the bezel to remove and install drive modules. EMI compliance requires a properly installed front bezel.

Figure 6 Disk enclosure front bezel

EMC2173



Link Control Cards (LCCs)An LCC supports and controls one Fibre Channel bus and monitors the DAE2P/DAE3P.

Figure 7 LCC connectors and status LEDs

Note: A blue Link Active LED indicates a DAE3P enclosure operating at four gigabits. The Link Active LED(s) is green in DAE2P enclosures, and DAE3Ps operating at two Gb.

The LCCs in a DAE2P/DAE3P connect to other Fibre Channel devices (processor enclosures, or other DAEs) with twin-axial copper cables. The cables connect LCCs in a storage system together in a daisy-chain (loop) topology.

Internally, each DAE2P/DAE3P LCC uses FC_AL protocols to emulate a loop; it connects to the drives in its enclosure in a point-to-point fashion through a switch. The LCC independently receives and electrically terminates incoming FC-AL signals. For traffic from the system’s storage processors, the LCC switch passes the input signal from the primary port (PRI) to the drive being accessed; the switch then forwards the drive's output signal to the expansion port (EXP), where cables connect it to the next DAE in the loop. (If the target drive is not in the LCC’s enclosure, the switch passes the input signal directly to the EXP port.) At the unconnected expansion port (EXP) of the last LCC, the output signal (from the storage processor) is looped back to the input signal (to the storage processor). For traffic

!!

!!

!

EXP PRI

EXP PRI

#

!

EXPPRI

EXPPRI

#A

B

EMC3226_revised

Expansion LinkActive LED (Green/Blue)

Primary LinkActive LED (Green/Blue)

Fault LED (Amber)

Power LED (Green)

!

EXP PRI

EXP PRI

Disk modules 23


directed to the system's storage processors, the switch passes input signals from the expansion port directly to the output signal of the primary port.

Each LCC independently monitors the environmental status of the entire enclosure, using a microcomputer-controlled FRU (field-replaceable unit) monitor program. The monitor communicates status to the server, which polls disk enclosure status. LCC firmware also controls the LCC port bypass circuits and the disk-module status lights.

LCCs do not communicate with or control each other.

Each LCC has four status lights. These status lights are described in “Monitoring disk enclosure status,” in Chapter 3.

Captive screws on the LCC lock it into place to ensure proper connection to the midplane. You can add or replace an LCC while the disk enclosure is powered up.

Disk modulesEach disk module consists of one disk drive in a carrier. You can add or remove a disk module while the DAE2P/DAE3P is powered up, but should exercise special care when removing modules while they are in use.

DAE2P and DAE3P disk modules support dual-port FC-AL interconnects through the two LCCs and their cabling; SATA modules include a paddle card that provides a bridge between Fibre Channel and SATA signals.

Note: With some configuration restrictions, you can integrate and connect Fibre Channel and ATA (Advanced Technology Attachment) DAE2 enclosures with DAE2P/DAE3Ps within a storage system, but you cannot use ATA disks within a DAE2P or DAE3P. (DAE3P SATA disks will not work in a DAE2-ATA enclosure.)

A DAE3P enclosure can include Fibre Channel, SSD, or SATA disk modules, but combinations of SATA disk modules with any other type are not supported. DAE2P enclosures do not support SATA disk modules.You can visually distinguish between module types by their different latch and handle mechanisms and by labels on each module. 4 Gb Fibre Channel drive carriers include a label that indicates they can operate at 2/4 Gb; 2 Gb drive labels list capacity and spindle



speed only. SATA drive labels list type, capacity, and spindle speed. Figure 8 shows different disk module types supported in a DAE2P/DAE3P, and an unsupported ATA module.

Figure 8 Disk module types

Disk drives DAE2P/DAE3P Fibre Channel disk drives conform to FC-AL specifications and 2 or 4 Gb Fibre Channel interface standards. SATA disk drives conform to Serial ATA II Electrical Specification 1.0 and include dual-port SATA interconnects; a paddle card on each drive provides a 4 Gb Fibre Channel connection for the module. SSD drives are 4 Gb and support a Fibre Channel interface.

CL4204

Fibre Channel2- and 4-Gb

SSD4-Gb

Fibre Channel2-Gb only

SATA2- and 4-Gb

ATA(Not supported)

Power supply/system cooling modules 25


Note: If your system will include Enterprise Flash Drives (solid state disk drives with flash memory, or SSD drives), be sure to carefully plan your configuration using the Best Practices and planning documentation available on EMC Powerlink: Home > Support > Technical Documentation and Advisories > White Papers > Configuration/Administration.

The 4 Gb drives in a DAE2P will operate at 2 Gb; a DAE3P supports 2 Gb drives only if the entire back-end bus that contains the drives is operating at 2 Gb.

Note: Drive modules are extremely sensitive electronic components. Refer to the instructions on “Handling FRUs” whenever you handle a disk module.

Drive carrier The disk drive carriers are metal and plastic assemblies that provide smooth, reliable contact with the enclosure slot guides and midplane connectors. Each carrier has a handle with a latch and spring clips. The latch holds the disk module in place to ensure proper connection with the midplane. Disk drive Activity/Fault LEDs are integrated into the carrier.

Power supply/system cooling modulesThe power supply/system cooling (power/cooling) modules are located above and below the LCCs. The units integrate independent power supply and dual-blower cooling assemblies into a single module.

Each power supply is an auto-ranging, power-factor-corrected, multi-output, off-line converter with its own line cord. Each supply supports a fully configured DAE2P/DAE3P and shares load currents with the other supply. The drives and LCC have individual soft-start switches that protect the disk drives and LCCs if you install them while the disk enclosure is powered up. A FRU (disk, LCC, or power/cooling module) with power-related faults will not adversely affect the operation of any other FRU.

The enclosure cooling system includes two dual-blower modules. If one blower fails, the others will speed up to compensate. If two blowers in a system (both in one power/cooling module, or one in each module) fail, the DAE2P/DAE3P will go off line within two minutes.



Each power/cooling module has three visible status lights. The green LED indicates power to the supply; the center LED indicates a power supply fault. The remaining LED indicates a failure in one of the integrated blowers within that module. The status lights are shown in Figure 9 and described in “Monitoring disk enclosure status” in Chapter 3.

Figure 9 Power/cooling module LEDs

A captive screw on the power/cooling module locks it into place to ensure proper connection to the midplane. You can add or remove one power/cooling module in a DAE2P/DAE3P while the system is powered up.

!!

!!

!

EXP PRI

EXP PRI

#

!

EXPPRI

EXPPRI

#A

B

!!

Power LED (Green)Power Fault LED (Amber)Blower Fault LED (Amber)

EMC3211

Installing a DAE2P/DAE3P 27

2Invisible Body Tag

This chapter describes the DAE2P/DAE3P installation requirements and procedures. Major topics are:

◆ Requirements...................................................................................... 28◆ Installing a disk enclosure in a cabinet ........................................... 29◆ Setting up an installed disk enclosure ............................................ 30◆ Connecting AC power....................................................................... 31◆ Setting the enclosure address ........................................................... 37◆ Connecting the DAE2P/DAE3P to the back end bus................... 39◆ Binding disk modules into RAID groups....................................... 42

Installing aDAE2P/DAE3P


Installing a DAE2P/DAE3P

RequirementsThis section explains site and cabling requirements.

Site requirements For proper operation, the installation site must conform to certain environmental specifications. These are detailed below and in Appendix A.

Power To determine a enclosure’s worst case power requirements, use the power rating on the enclosure label. This rating is the maximum power required for a fully loaded enclosure. The amount of internally regulated power that a maximum configuration requires from the power supplies and cooling system determines the values for input current, power (VA), and dissipation per disk enclosure. Typical values will be less depending on the number, manufacturer, and type of disk drives. These values represent the sum of the values shared by the line cords of two power supplies in the same enclosure. Power cords and supplies share the power load evenly. If one of the two power supplies fails, the remaining supply and cord support the full load. You must use a rackmount cabinet with AC power distribution, and have main branch AC distribution that can handle these values for the number of disk enclosures that you will interconnect.

Cooling The temperature at the front bezel inlet must meet the ambient temperature specification described in Appendix A. The site must have air conditioning that can maintain the specified ambient temperature range. The air conditioning must be able to handle the BTU requirements of the DAE2P/DAE3P disk enclosures.

Cabling requirements

The DAE2P/DAE3P supports copper cable for a Fibre Channel connection to another Fibre Channel device (for example, a storage processor, DAE2, or another DAE2P/DAE3P).

Any copper cables you use must meet the appropriate standards for 2-Gb FC-AL. Such cables are fully shielded, twin-axial, full-duplex cables with at least one High Speed Serial Data Connector - 2 (HSSDC2) connector (DAE2s and CX series storage processors require HSSDC connections; CX4 and CX3 series processors use SFP connectors). The DAE2P/DAE3P does not support cables shorter than 1 meter or longer than 10 meters.

Note: EMC supports and can provide 2-, 5-, and 8-meter cables.

Installing a disk enclosure in a cabinet 29


Interconnections between disk enclosures should maintain LCC consistency; that is, one Fibre Channel (FC) loop should interconnect all and only the LCC As, and the other Fibre Channel loop should interconnect all and only LCC Bs.

Connect all cables at both ends, or remove unused cables completely from the host or LCC ports. An unused (dangling) cable may cause excess noise on the bus.

Installing a disk enclosure in a cabinetEach disk enclosure mounts on two L-shaped rails that connect to the cabinet’s vertical channels.

◆ The Cabinet Setup Guide for the 40U-C Cabinet ships with standard EMC cabinets, and explains how to unpack and install the cabinet itself.

◆ The EMC Rails and Enclosures Field Installation Guide for your storage system is available on your support website. It explains how to install universal mounting rails in the cabinet, and how to install the enclosure on those rails.

Warnings and recommendations

The cabinet in which you will install the disk enclosure(s) must have a full earth ground to provide reliable grounding. Also, the cabinet should have its own switchable power distribution. We suggest that you use a cabinet that has dual power distribution units, one on each side.

WARNING

The enclosure is heavy and should be installed into a rack by two people. To avoid personal injury and/or damage to the equipment, do not attempt to lift and install the enclosure into a rack without a mechanical lift and/or help from another person.

L’armoire étant lourde, sa mise en place sur une rampe nécessite deux personnes. Afin de ne pas vous blesser et/ou endommager le matériel, n’essayez pas de soulever et d’installer l’armoire sur une rampe sans avoir recours à un relevage mécanique et/ou à l’aide d’une autre personne.



Das Gehäuse ist schwer und sollte nur von zwei Personen in einem Rack installiert werden. Zur Vermeidung von körperlichen Verletzungen und/oder der Beschädigung des Gerätes, bitte das Gehäuse nicht ohne die Hilfe einer zweiten Person anheben und einbauen.

Il contenitore è pesante e dev'essere installato nel rack da due persone. Per evitare danni personali e/o all’apparecchiatura, non tentare di sollevare ed installare in un rack il contenitore senza un sollevatore meccanico e/o l’aiuto di un’altra persona.

Debido a su considerable peso, la instalación del compartimento en el bastidor deben realizarla siempre dos personas. Para evitar daños personales o en el equipo, el compartimento no debe levantarse ni instalarse en el bastidor sin la ayuda de un elevador mecánico o de otra persona.

We recommend that you use cabinet anti-tip devices, especially if you are installing or removing a disk enclosure in the upper half of the cabinet when the lower half is empty.

Setting up an installed disk enclosureOnce your DAE2P/DAE3P is properly installed in a cabinet, follow the remaining steps in this chapter to

◆ Connect AC power and power up the enclosure

◆ Set the enclosure address (EA)

◆ Connect the DAE2P/DAE3P to a back end bus (loop)

◆ Bind disk modules into RAID groups

Note: You must set the DAE2P/DAE3P enclosure address with power ON while the enclosure is not connected to a BE bus.

Connecting AC power 31


Connecting AC power

CAUTION!The disk-array enclosure will power up immediately once you attach it to an active AC power source. Plan your power configuration before connecting to a power distribution unit or standby power supply.

1. Plug an AC line cord into each power/cooling module, as shown in Figure 1.

Note: Make certain you secure the power cord with the retention bails (strain reliefs) at each connector. The strain reliefs prevent the power cord from pulling out of the connections.

Figure 1 Plugging in the AC line cords

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2. For proper cooling and normal operation, make sure all the disk module slots in each disk enclosure contain either disk or filler modules.

Note: Do not power up a disk enclosure without at least one LCC installed.

You can configure a driveless disk enclosure within a Fibre Channel bus. High availability with write-caching requires disks in slots 0-4 in the first disk enclosure (DPE2, DAE, DAE2P, or DAE3P) connected to a storage processor (Enclosure Address 0, bus 0).

3. Connect the DAE2P/DAE3P power cords to an appropriate power source.

a. In most cases, you should connect each power cord to the closest power distribution unit (pdu) in a cabinet. For example, connect power/cooling module A to the right pdu, and power/cooling module B to the pdu on the left (facing the rear of the cabinet). For high availability, always connect each power/cooling module to a separate power source.



Figure 2 shows the power cord connections for a typical CX300- or CX500-Series configuration.

Figure 2 Connecting DAE2P power cords (CX300/CX500 storage system)

b. Highly available, write-caching configurations require that you connect the first disk enclosure in a storage system (EA 0, bus 0) to a Standby Power Supply (SPS) for enclosure power.

Note: An integrated disk-and-processor enclosure, such as a CX300 or CX500-series DPE2, is always the first disk enclosure on the first bus (0,0). You should not connect any DAE in a DPE2 configuration to an SPS.

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If you do connect a DAE2P/DAE3P to an SPS (if, for example, the DAE2P/DAE3P is the first disk enclosure in a CX700, CX3, or CX4 series configuration), be sure that you maintain power/bus integrity; always connect power module A to SPS A, and module B to SPS B.

Figure 3 shows the power cord connections for a typical CX3-80 configuration. Figure 4 shows the power cord connections for a CX4 storage system.

Figure 3 Connecting DAE3P power cords (CX3-80 storage system)

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Figure 4 Connecting DAE3P power cords (CX4 storage system)

4. Repeat steps 1 through 3 for each disk enclosure in the cabinet, as necessary.

5. Set any SPS switches, and then the master (or main circuit breaker) switches, to the on position. The disk enclosures in the cabinet power up.

Note: The only power switches that control DAE2Ps and DAE3Ps are those on the SPS and the cabinet master switch or circuit breakers, which are normally on. As a result, a DAE2P/DAE3P is always active.

Power source C

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When you initially apply AC power to a disk enclosure, the disk drive modules power up according to their specifications, and spin up in a staggered sequence. The slot spin-up delays range from 0 to 84 seconds. (The same delays are used when you insert a drive module while the system is powered up.)

Setting the enclosure address 37


Setting the enclosure addressBefore you specify an enclosure address or connect your DAE2P/DAE3P to a back end bus, make certain the loop (bus) and EA are in agreement.

Each disk enclosure in a Fibre Channel bus must have a unique enclosure address (also called an EA, or enclosure ID) that identifies the enclosure and determines disk module IDs. In many cases, the factory sets the enclosure address before shipment to coincide with the rest of the system; you will need to reset the selection if you installed the enclosure into your rack independently. The enclosure address ranges from 0 through 7 (refer to your storage system’s Hardware Overview). You set the EA with the enclosure selection button. To set the EA, use a tool such as a pen, paper clip, or small screwdriver.

Note: The enclosure address is set at installation. Disk module IDs are numbered left to right (facing the unit) and are contiguous throughout an array: enclosure 0 contains modules 0-14; enclosure 1 contains modules 15-29; enclosure 2 includes 30-44, and so on through eight enclosures.

CAUTION!If your system will include Enterprise Flash Drives (solid state disk drives with flash memory, or SSD drives), be sure to carefully plan your configuration using the Best Practices and planning documentation available on EMC Powerlink: Home > Support > Technical Documentation and Advisories > White Papers > Configuration/Administration.

When you set up a new DAE we recommend that you segregate enclosures by bus speed and type whenever practical. For example, configure DAE2Ps on separate buses (loops) from DAE2s to achieve the maximum advantage of their point-to-point fault and data isolation. You should also keep 2 Gb enclosures (any DAE with 2 Gb disks) and 4 Gb DAE3P enclosures on separate buses. (A 4 Gb bus will not recognize 2 Gb devices unless the bus speed is manually reset to the slower speed). Wherever possible, assign a new DAE with enclosures of its speed and type to the next logically available back-end (BE) bus and address, and balance the number of enclosures on each bus. For example, if your system supports two buses (loops) and includes only an enclosure 0 on bus 0, you would start a second



bus and add the new DAE as enclosure 0 on bus 1. If the same two-BE system has three enclosures on bus 0 and two enclosures of the same speed and type on bus 1, add the new DAE as enclosure 2 on bus 1.

Optimize your system by using every available bus, and spreading the number of enclosures as evenly as possible across the buses.

CAUTION!Each drive reads its FC-AL physical address at powerup or when the drive is reset. To avoid losing data, you must set the enclosure address when power is on and the enclosure is not part of a back-end bus; you cannot change the EA while the back end is connected.

1. Set the enclosure address to the desired value, as shown in Figure 5. The address is indicated by the appropriate LED next to the selection button; each button press increments the value.

Note: You can set the EA on either link control card. The second LCC will automatically change to the new value.

Figure 5 Setting the enclosure address (EA)

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Connecting the DAE2P/DAE3P to the back end bus 39


Connecting the DAE2P/DAE3P to the back end busAttach your DAE2P/DAE3P to a back end bus after you have set the enclosure address.

1. Attach the copper cable from the external device (storage processor, DAE2, or another DAE2P/DAE3P) to the PRI connector as shown in Figure 6. If you are continuing the bus to another DAE2P/DAE3P, attach a cable from the EXP connector to the PRI connector in the next DAE2P/DAE3P.

Note: Use HSSDC-HSSDC2 cables to connect a CX series DPE2 , DAE2, or SPE; use HSSDC2-HSSDC2 cables to connect DAE2Ps and DAE3Ps, and use SFP-HSSDC2 cables to connect to a CX4 series or CX3 series SPE.

CAUTION!Make sure to orient the HSSDC2 connectors as shown in Figure 6. The connector thumb clip faces up when connecting to LCC B, and down when connecting to LCC A. An audible/tangible click indicates that the cable is completely seated in the LCC connector.

Figure 6 Connecting a disk enclosure to another FC device

2. If you are installing multiple disk enclosures, cable them as shown in Figures 7 and Figure 8.

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Note: The figures in this chapter show configurations with DAE2P/DAE3Ps as the only disk-array enclosures. Environments with a mix of DAE2 and DAE2P/DAE3P enclosures follow the same EA, bus balancing, and cabling conventions whenever possible and practical.

The configuration example in Figure 7 shows a CX3-series Model 40 storage processor enclosure (SPE3) below eight DAE3P disk-array enclosures. Each of the eight devices supports two completely redundant loops. Note that the external device connects to the Primary disk enclosure connectors, and subsequent enclosures connect in an Expansion-to-Primary chain.

Figure 7 Cabling disk enclosures together — two Fibre Channel buses

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Connecting the DAE2P/DAE3P to the back end bus 41


Figure 8 shows a more complicated configuration with ten DAE3Ps and four Fibre Channel buses.

Figure 8 Cabling DAE2Ps/DAE3Ps together — four Fibre Channel buses

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Binding disk modules into RAID groupsAfter cabling the disk enclosure, use EMC Navisphere® Manager software to bind the disks into RAID groups. Refer to the EMC Navisphere Manager Administrator’s Guide and your storage processor configuration and planning guide for detailed information.

Disk configuration rules and recommendations

The following rules and recommendations apply to all CX series, CX3 series, and CX4 series systems.

◆ You cannot use any of the disks 000 through 004 (enclosure 0, bus 0, disks 0-4) as a hot spare in a CX4 series, CX3 series, or CX series system.

◆ The hardware reserves several gigabytes on each of disks 000 through 004 for the cache vault and internal tables. To conserve disk space, you should avoid binding any other disk into a RAID group that includes any of these disks. Any disk you include in a RAID group with a cache disk 000-004 is bound to match the lower unreserved capacity, resulting in lost storage of several gigabytes per disk.

◆ Each disk in the RAID group should have the same capacity. All disks in a Group are bound to match the smallest capacity disk, and you could waste disk space. The first five drives (000-004) should always be the same size.

◆ You cannot mix drive types within a RAID group. ATA (Advanced Technology Attachment), Fibre Channel, SSD, and Serial ATA (SATA) disk drives cannot share a RAID group.

◆ ATA drives require ATA hot spares. Hot spares for Fibre Channel and SATA drives can be either type; we recommend SATA spares for SATA drives and Fibre Channel spares for Fibre Channel, and SSD spares for SSD drives whenever possible.

◆ If a storage system uses disks of different capacities and/or speeds (for example, 146 GB and 73 GB, or 10K and 15K rpm) within any enclosure, then EMC recommends that you place them in a logical order, such as the following:

• Place drives with the highest capacity in the first (leftmost) slots, followed by drives of lower capacities.

Binding disk modules into RAID groups 43


• Within any specific capacity, place drives of the highest speed first, followed by drives of lower speed.

◆ You should always use disks of the same speed and capacity in any RAID group.

◆ Do not use ATA or SATA drives to store boot images of an operating system. You must boot host operating systems from a Fibre Channel drive or an SSD.

Servicing a DAE2P/DAE3P 45

3Invisible Body Tag nvisible

This chapter describes how to monitor disk enclosure status, handle FRUs, and replace or add a Field Replaceable Unit (FRU). Topics are:

◆ Monitoring disk enclosure status .................................................... 46◆ Handling FRUs................................................................................... 50◆ Replacing or adding a disk module ................................................ 54◆ Replacing an LCC module................................................................ 62◆ Replacing a power supply/system cooling module..................... 65

Note: For more information about upgrading your DAE2P/DAE3P, contact your service provider.

Servicing aDAE2P/DAE3P


Servicing a DAE2P/DAE3P

Monitoring disk enclosure statusStatus lights on the DAE2P/DAE3P and its FRUs indicate error conditions. These lights are visible outside the disk enclosure. Some lights are visible from the front, and the others from the back. Figures Figures 1 through 4 and Tables Tables 1 through 3 describe the status lights.

Figure 1 Front disk enclosure and disk module status lights (bezel removed)

Table 3-1 describes the LEDs visible from the front of the DAE2P/DAE3P.

EMC2166a

Power LED(Green or Blue)

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Monitoring disk enclosure status 47


Table 1 Status lights visible from the front of the disk enclosure

Light Quantity Color Meaning

Disk Enclosure Power 1 GreenBlue

Power to enclosure is on; back-end bus running at 2 Gb/sPower to DAE3P enclosure is on; back-end bus running at 4 Gb/s

Disk Enclosure Fault 1 Amber On when any fault condition exists; if the fault is not obvious from a disk module light, look at the back of the disk enclosure.

Disk Active 1 per disk module Green Off when the slot is empty or contains a filler module.Also off when the disk is powered down by command; for example, the result of a temperature fault. Flashing (mostly off) when the FC drive is powered up but not spinning; this is a normal part of the spin-up sequence, occurring during the spin-up delay of a slot.Flashing (at a constant rate) when the FC drive is spinning up or spinning down normally.On when the drive has power but is not handling any I/O activity (the ready state).Flashing (mostly on) when the drive is spinning and handling I/O activity.

Disk Fault 1 per disk module Amber On when the disk module is faulty, or as an indication to remove the drive.



Figure 2 shows the enclosure address and bus ID indicators, visible from the back of the enclosure. In this example, the DAE2P/DAE3P is enclosure 2 on loop (bus) 1; note that the indicators for LCC A and LCC B must always match.

Figure 2 Enclosure address and bus ID indicators

Table 2 describes the ID indicators.

Figure 3 shows the status LEDs for the power supply/system cooling (power/cooling) modules.

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Table 2 Enclosure and bus ID indicators


Enclosure Address 8 Green Displayed number indicates Enclosure Address

bus ID 8 Blue Displayed number indicates bus IDBlinking bus ID indicates invalid cabling; LCC A and LCC B are not connected to the same bus or bus maximum exceeded.

Monitoring disk enclosure status 49


Figure 3 Power/cooling module status indicators

Figure 4 shows the status LEDs for the link control cards.

Figure 4 LCC status LEDs

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Table 3 describes the status LEDs visible from the rear of the disk enclosure.

If the disk enclosure Fault light is on, examine the other status lights to determine which FRU(s) is faulty. If a fault light on a FRU remains on, you should replace that FRU as soon as possible.

Note: When a redundant FRU fails, high availability will be compromised until you replace the faulty FRU.

Handling FRUsThis section describes the precautions that you must take and the general procedures you must follow when removing, installing, and storing FRUs.

Table 3 Status lights visible from the rear of the disk enclosure


LCC Power 1 per LCC Green On when the LCC is powered up.

LCC Fault 1 per LCC Amber On when either the LCC or a Fibre Channel connection is faulty.Also on during Power On Self Test (POST).

Primary Link Active 1 per LCC Green On when Primary connection is active; back-end bus running at 2Gb

Blue On when Primary connection is active; back-end bus running at 4Gb

Expansion Link Active 1 per LCC Green On when Expansion connection is active; back-end bus running at 2Gb

Blue On when Expansion connection is active; back-end bus running at 4Gb

Power Supply Active 1 per supply Green On when the power supply is operating.

Power Supply Fault* 1 per supply Amber On when the power supply is faulty or is not receiving AC line voltage.Flashing when either a multiple blower or ambient overtemperature condition has shut off dc power to the system.

Blower Fault* 1 per cooling module Amber On when a single blower in the power supply is faulty.

* The DAE2P/DAE3P will continue running with a single power supply and three of its four blowers. Removing a power/cooling module constitutes a multiple blower fault condition, and will power down the enclosure unless you replace a blower within two minutes.

Handling FRUs 51


Power issues and FRUs

The DAE2P/DAE3P is designed to always be powered up and hot repairable. Its front bezel should be attached and each of its compartments should contain a FRU or filler panel to ensure EMI compliance and proper air flow over the FRUs.

While the disk enclosure is powered up, you can service or replace any FRU, although removing an active LCC will affect operating system access to the disks it controls. You should not remove a faulty FRU until you have a replacement available.

Since you can replace or add any FRU without sliding the disk enclosure out of the cabinet, you do not have to use cabinet anti-tip devices when you upgrade or service a DAE2P.

If you need to power down a DAE2P/DAE3P, simply unplug the unit. You do not need to shut down main AC lines to the disk enclosure unless you need to power down all the cabinet contents connected to that line.

Avoiding Electrostatic Discharge (ESD) damage

When you replace or install FRUs, you can inadvertently damage the sensitive electronic circuits in the equipment by simply touching them. Electrostatic charge that has accumulated on your body discharges through the circuits. If the air in the work area is very dry, running a humidifier in the work area will help decrease the risk of ESD damage. You must follow the procedures below to prevent damage to the equipment.

Read and understand the following instructions:

◆ Provide enough room to work on the equipment. Clear the work site of any unnecessary materials or materials that naturally build up electrostatic charge, such as foam packaging, foam cups, cellophane wrappers, and similar items.

◆ Do not remove replacement or upgrade FRUs from their antistatic packaging until you are ready to install them.

◆ Gather together the ESD kit and all other materials you will need before you service a disk enclosure. Once servicing begins, you should avoid moving away from the work site; otherwise, you may build up an electrostatic charge.

◆ An ESD wristband is supplied with your disk enclosure. To use it, attach the clip of the ESD wristband (strap) to any bare (unpainted) metal on the disk enclosure; then put the wristband around your wrist with the metal button against your skin.



◆ Use the ESD kit when handling any FRU. If an emergency arises and the ESD kit is not available, follow the procedures in the Emergency Procedures (Without an ESD Kit) section.

Emergency procedures (without an ESD kit)

In an emergency when an ESD kit is not available, use the following procedures to reduce the possibility of an electrostatic discharge by ensuring that your body and the subassembly are at the same electrostatic potential.

These procedures are not a substitute for the use of an ESD kit. Follow them only in the event of an emergency.

◆ Before touching any FRU, touch a bare (unpainted) metal surface of the cabinet or enclosure.

◆ Before removing any FRU from its antistatic bag, place one hand firmly on a bare metal surface of the enclosure, and at the same time, pick up the FRU while it is still sealed in the antistatic bag. Once you have done this, do not move around the room or touch other furnishings, personnel, or surfaces until you have installed the FRU.

◆ When you remove a FRU from the antistatic bag, avoid touching any electronic components and circuits on it.

◆ If you must move around the room or touch other surfaces before installing a FRU, first place the FRU back in the antistatic bag. When you are ready again to install the FRU, repeat these procedures.

Precautions when removing, installing, or storing FRUs

Use the precautions listed below when you remove, handle, or store FRUs:

◆ Do not remove a faulty FRU until you have a replacement available.

◆ Handle a FRU only when using an ESD wristband. Attach the clip of the ESD wristband to the ESD bracket or bare metal on the enclosure, and put the wristband around your wrist with the metal button against your skin.

◆ Handle FRUs gently. A sudden jar, drop, or vibration can permanently damage a FRU and may not be immediately evident. Never place a FRU on a hard surface such as an unpadded cart, floor, or desktop, or stacked on top of another FRU.

Handling FRUs 53


◆ Never use excessive force to remove or install a FRU.

◆ Store a FRU in the antistatic bag and specially designed shipping container in which you received it. Use that container if you need to return the FRU for repair.

◆ Store FRUs within the temperature and humidity limits specified in Appendix A.

◆ Place the cables where no one can step on them or roll equipment over them.



Replacing or adding a disk module

Note: If your system will include Enterprise Flash Drives (solid state disk drives with flash memory, or SSD drives), be sure to carefully plan your configuration using the Best Practices and planning documentation available on EMC Powerlink: Home > Support > Technical Documentation and Advisories > White Papers > Configuration/Administration.

CAUTION!Disk modules are extremely sensitive electronic components. Always handle a disk module gently, and observe the following guidelines:

◆ Follow the instructions in the preceding section “Avoiding Electrostatic Discharge (ESD) damage” on page 51.

◆ Do not mix Fibre Channel or SSD components with SATA components in the same enclosure. Refer to Figure 5 for a visual comparison of disk carriers. Note that SATA drives include a "SATA" designation on the module label. SSD drives include a "SSD" designation on the module label.

Replacing or adding a disk module 55


Figure 5 Disk module examples

◆ Always wear a properly attached ESD wristband when removing or replacing a disk module.

◆ Disk modules are sensitive to the extreme temperatures sometimes encountered during shipping. We recommend that you leave new disk modules in their shipping material and expose the package to ambient temperature for at least four hours before attempting to use the new modules in your system.

◆ When removing a disk module, pull the module part way out of the slot, then wait 30 seconds for the drive to spin down before removing it.

◆ When installing multiple disks in a powered up system, wait at least 6 seconds before sliding the next disk into position.

CL4204

Fibre Channel2- and 4-Gb

SSD4-Gb

Fibre Channel2-Gb only

SATA2- and 4-Gb

ATA(Not supported)



◆ Place modules on a soft, antistatic surface, such as an industry-standard antistatic foam pad or the container used to ship the module. Never place a disk module directly on a hard surface.

◆ Never hit modules, stack modules, or allow them to tip over or fall.

◆ Avoid touching any exposed electronic components and circuits on the disk module.

◆ Before adding more disks to your configuration planning guide, which contains guidelines for creating RAID groups with disks of varying sizes and speeds.

◆ Do not remove a faulty disk module until you have a replacement module (with the same part number) or a filler module available. The part number (PN005xxxxxx) appears on the top or bottom of the module. A replacement disk module should have the same format (bytes per sector) and the same capacity (size and speed) as the module it is replacing.

You must remove the disk enclosure’s front bezel to gain access to the disk modules. The bezel is required for EMI compliance when the enclosure is powered up. Remove it only to replace or add a disk module.



Unlocking and removing the front bezel Follow these steps to remove the front bezel and gain access to the disk modules. Refer to Figure 6.

1. Insert the key that shipped with your enclosure into the bezel lock, and turn it to release the lock.

2. Press the two latch buttons on the bezel surface toward each other to release the bezel from the cabinet.

3. Pull the bezel off the cabinet and put it on a clean, static-free surface.

Figure 6 Unlocking and removing the front bezel

If you are adding a new disk module, continue to the disk filler module removal procedure that follows. If you are replacing a faulty disk module, proceed to the disk module removal procedure.

EMC2173



Removing a disk filler moduleLocate the slot where you want to install the disk module, and remove the filler module, as shown in Figure 7.

Figure 7 Removing a disk filler module

Skip to the disk installation procedure (page 59) to install the add-on disk in the slot you just emptied.

Removing a disk module

CAUTION!If a disk module has been bound into a LUN, do not move it to another slot unless you do not care about the data on the LUN. Each module contains LUN-identifying information written when it was bound. Moving it to another slot can make information on the original LUN inaccessible.

Generally, you should not remove a disk module unless its amber fault light is on. See Table 1.

1. Attach an ESD wristband to your wrist and the enclosure (see the precautions on page 51).

EMC2210



2. If the active light is on steadily, pull the latch, and slowly pull the module about 1 in (3 cm) from its slot. Wait 30 seconds for the disk to stop spinning. Then remove the module and place it on a padded, static-free surface.

If the activity LED is off or mostly off you do not need to wait for the disk to stop spinning. Pull the latch and slowly pull the module from its slot, as shown in Figure 8. Place it on a padded, static-free surface.

Figure 8 Removing a disk module

Continue to the next section to install the replacement disk module.

Installing a disk or filler module

Note: Always replace a disk drive with another of the same type/model; do not mix Fibre Channel or SSD and SATA components in an enclosure. Refer to Figure 5 on page 55 for a visual comparison of disk carriers.An enclosure running at 4 Gb/s will recognize only 4 Gb disks (with a 2/4 mark on the front label). A DAE2P will support 4 Gb disks at 2 Gb/s.

1. Make sure an ESD wristband is attached to your wrist and the enclosure (see the precautions on page 51).

2. Align the module with the guides in the slot.

EMC2174



3. Refer to Figure 9 as you insert the new disk module.

a. With the disk module latch fully open, gently push the module into the slot.

b. The disk module latch will begin to rotate downward when its tabs meet the enclosure chassis.

c. Push the handle down to engage the latch. After the latch is engaged, push firmly on the bottom of the module to verify that the disk is properly seated.

Figure 9 Installing a disk or filler module

The disk module’s Active light flashes to reflect the disk’s spin-up sequence.

Note: If you are installing multiple disk modules in a system that is powered up, wait at least 6 seconds before sliding the next module into position.

4. Remove and store the ESD wristband and continue to the next section to install the front bezel.

EMC3140

Tabs

A

B

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Installing and locking the front bezelRefer to Figure 10 as you do the following:

1. Align the bezel with the disk enclosure.

2. Gently push the bezel into place on the cabinet until it latches.

3. Secure the bezel by turning the key in the lock.

Figure 10 Installing and locking the front bezel

EMC2222



Replacing an LCC module

CAUTION!Handle an LCC gently and use an ESD wristband. Do not remove a faulty LCC until you have a replacement module available.

Note: LCC modules for DAE2P and DAE3P enclosures are not interchangeable. Make sure you have the correct replacement part before removing the LCC.

A DAE2P or DAE3P must have at least one LCC installed while it is powered up. Do not remove both LCCs while the disk enclosure is powered up.

Removing an LCC1. Gently press the connector latches to release them as you remove

the copper cables connected to the LCC, as shown in Figure 11.

Note: Note where the cable(s) connect to the LCC; you will need to reconnect them to the replacement LCC.

Figure 11 Removing a copper cable from an LCC

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Replacing an LCC module 63


2. Turn the captive screws counterclockwise to release the module, and then remove the LCC from its slot, as shown in Figure 12.

Figure 12 Removing an LCC

Continue to the next section to install the replacement LCC.

Installing an LCC1. Gently insert the LCC as shown in Figure 13. Be sure the module

is completely seated in the enclosure midplane.

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Figure 13 Installing an LCC

The LCC Power light turns on.

2. Secure the module with the captive screws.

3. Reattach the copper cables to the same connector from which you removed them, as shown in Figure 14.

Figure 14 Reconnecting a copper cable to an LCC

4. Remove and store the ESD wristband.

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Replacing a power supply/system cooling module 65


Replacing a power supply/system cooling module

CAUTION!Handle a power supply/system cooling (power/cooling) module gently and use an ESD wristband. Do not remove a power/cooling module until you have a replacement module available.

Access to the disks in your enclosure will time out and the disks will spin down two minutes after a power/cooling module is removed from the enclosure. While the system can continue operating on a single power supply, the loss of a module’s two blowers will cause a time-out unless you replace the module within two minutes.

When replacing a power/cooling module, make certain the green LED on one module has been steadily on for at least 5 seconds before removing power from the second module.

Follow these steps to replace a power/cooling module.

1. Unplug the AC line cord as shown in Figure 15.

Figure 15 Unplugging the AC power cord

2. Turn the captive screw counterclockwise to release the module, and then remove the power/cooling module as shown in Figure 16.

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Retention Bail

Retention Bail



Note: To protect a running system from overheating, the enclosure will time out unless you replace the power/cooling module within two minutes.

Figure 16 Removing a power/cooling module

3. Gently insert the new power/cooling module into the enclosure, as shown in Figure 17. Be sure the module is completely seated.

Figure 17 Installing a power/cooling module

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Replacing a power supply/system cooling module 67


4. Secure the module with the captive screw.5. Plug the AC power cord into the new supply as shown in

Figure 18.

Figure 18 Plugging in the power cord

Note: Make certain you secure the power cord with the retention bails at each connector. The bails prevent the power cord from pulling out of the connections.

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Technical specifications 69

AInvisible Body Tag

Body Tag

This appendix describes the disk-array enclosure technical specifications, operating limits, and shipping and storage requirements. Major topics are:

◆ Enclosure specifications .................................................................... 70◆ Operating limits ................................................................................. 74

Technical specifications



Enclosure specificationsTechnical enclosure specifications include power requirements, size, drive, interface, and standards information.

AC power requirements

The input current, power (VA), and dissipation per DAE2P/DAE3P are based on the requirements that a maximum enclosure configuration places on the power supplies and cooling system to provide internal regulated power. Typical values will be less, depending on the number and manufacturer of disk modules. These values represent either ◆ the values for a single power supply line cord, or ◆ the sum of values shared by the line cords of two power supplies

in the same DAE2P/DAE3P, with the division between the line cords and supplies at the current sharing ratio (approximately 50% each).

A failure of one of the two power supplies in the enclosure results in the remaining supply and cord supporting the full load. You must use a rackmount cabinet with AC power distribution, and have main branch AC distribution that can handle these values for each disk enclosure in the cabinet.

* Ratings assume a fully configured DAE2P/DAE3P that includes two power supplies, two LCCs, and 15 disk drives.

Table 1 DAE2P/DAE3P AC power specifications

Requirement Description *

AC line voltage 100 to 240 V AC + 10%, single phase, 47 to 63 Hz

AC line current 3.8 A at 100 V ac, 1.9 A at 200 V ac

Power consumption 380 VA (425 W) max (fully configured)*

Power factor 0.98 min at full load, low voltage

Heat dissipation 1.31 x106 J/hr (1,450 BTU/hr) max

In-rush current 50 A max for 1/2 line cycle, per power supply at 240 V ac25 A max for 1/2 line cycle, per power supply at 120 V ac

Startup surge current 15 A pk (10.6 A rms) max for 100 ms, at any line voltage

AC protection 10 A fuse in each power supply, both phases

AC receptacle type IEC320-C14 appliance coupler, per power supply

Ride-through time 30 ms min

Current sharing 60% max, 40% min, between power supplies

Enclosure specifications 71


Size and weight

Drive type Standard, Fibre Channel drives are 12-volt, and support the Fibre Channel interface. SATA drives (DAE3P only) are 12- and 5-volt and support the SATA 3 Gb/s interface; a paddle card on the drive converts the assembly to 12-volt, 4 Gb/s Fibre Channel operation. Enterprise Flash Drives (solid state disk drives with flash memory, or SSD drives) are 12–volt, and support the Fibre Channel interface.

Each drive slot provides an average maximum of 16 W drive module power.

Refer to the EMC Storage Systems CX-Series Disk and FLARE OE Matrix for a list of supported drives.

LCC FC-AL interface Connectors are shielded HSSDC2 (High Speed Serial Data Connector).

Copper cabling HSSDC2

Requirement Measurement

Height 133.35 mm (5.25 in) 3 NEMA units including mounting hardware

Width 450 mm (17.72 in)

Depth 355.6 mm (14 in)

Weight 30.8 kg (68 lbs) maximum configuration;1.1 kg (2.4 lbs) per FC disk module x 15 max = 16.4 kg (36 lbs);0.7 kg (1.5 lbs) per link control card x 2 =1.4 kg (3 lbs)2.5 kg (5.5 lbs) per power supply x 2 = 5.0 kg (11 lbs)8.2 kg (18 lbs) chassis and midplane

Note: A fully-configured DAE contains 15 disk drives that typically weigh 1.0 kg to 1.1 kg (2.25 to 2.4 lbs) each. The weights listed in this table do not describe enclosures with SSD drives. These SSD drive modules weigh 20.8 ounces (1.3 lb) each.



Type: Shielded, 150 Ω differential, shield bonded to plug connector shell (360°)FC-PI-2 Standard, Revision 13 or higher for HSSDC2SFF-8470 150 specification for SFP transceiverHSSDC2 -HSSDC2 for DAE2P/DAE3P-DAE2P/DAE3P connection;HSSDC2-SFP for DAE2P/DAE3P to CX4- or CX3-series back-endHSSDC-HSSDC2 for connection to CX-series DPE, SPE, or DAE2

Length: 2 meters (6.6 feet);5 meters (16.5 feet) and 8 meters (26.4 feet) Maximum 5-meter support for SFP-HSSDC2 connection

Enclosure specifications 73


Standards certification and complianceRackmount disk enclosures are tested and certified for compliance with the international environmental and safety specifications listed below and marked to indicate such compliance and certification as required.

Fibre Channel related standards

In some cases, the DAE2P/DAE3P uses functions from later revisions of specifications.

Standard Description

Fibre Channel Physical and signaling interface, FC-PI-2, draft Rev. 7 or higher

Fibre Channel Arbitrated Loop (FC-AL), Revision 4.5

Fibre Channel Private Loop Direct Attach (PLDA), Revision 2.1



Operating limitsThe ambient temperature specification is measured at the front bezel inlet. The site must have air conditioning of the correct size and placement to maintain the specified ambient temperature range. The air conditioning must be able to handle the heat dissipation requirements of the disk enclosures.

Note: The operating limits for temperature and humidity must not be exceeded inside the closed cabinet in which the DAE2Ps are mounted. Mounting equipment in a cabinet directly above or below a DAE2P/DAE3P does not restrict air flow to the disk enclosure, because air flows through the enclosure from front to back. Cabinet doors must not impede the front-to-back air flow.

Environmental recoveryIf the system exceeds maximum ambient temperature by approximately 10°C/18°F, the storage processors will begin an orderly shutdown that saves cached data, shuts off the SPs, and — in a DPE2 enclosure — powers down the disks. LCCs in each DAE2P/DAE3P will power down their disks but remain powered on. If the system detects that the temperature has dropped to an acceptable level, it restores power to the storage processors (which power up any disks in their enclosure), and the LCCs restore power to their disk drives.

Requirement Description

Ambient temperature 10oC to 40oC (50oF to 104oF)

Temperature gradient 10oC/hr (18oF/hr)

Relative humidity 20% to 80% noncondensing

Elevation 2286 m (7,500 ft) at 40oC, 3047 m (10,000 ft) at 37oC

Operating limits 75


Shipping and storage requirements

Requirement Description

Ambient temperature -40oC to 65oC (-40oF to 149oF)

Temperature gradient 25oC/hr (45oF/hr)

Relative humidity 10% to 90% noncondensing

Elevation 7620 m (25,000 ft)


Aac power cord

attaching to power supply 67removing from power supply 65

Active lightLCC 50power supply 50

addingdisk module 54

ATA disksconfiguration rules 42

Bbinding RAID groups 42

Ccabinet, installing DAE2P in 29cables

reattaching to LCC 64removing from LCC 62requirements 28

cablingprecautions 53requirements 28

chassis see enclosurecheck light

DAE2P components 46LCC 50power supply 50

comments 10components 18Cooling Check light 50

customer support 10

DDAE2P (2-gigabit point-to-point disk-array

enclosure)disk module

description 23disk drive 24drive carrier 25

EA indicator 48front bezel

description 21operating limits 74power supply 25powering down 51, 65powering up 67rear 20requirements

operating 74technical specifications 70

disk configuration rules 42disk drive

description 24specifications 71

disk moduleadding 54binding into RAID groups 42description 23disk drive 24drive carrier 25drive specifications 71

disksconfiguration rules 42

Index


Index

documentation, related 8drive carrier description 25

EEA (enclosure address)

indicator 48requirements 37setting 38

EA indicator 48electromagnetic interference (EMI)

shield 21electrostatic discharge (ESD)

avoiding 51enclosure

description 18EA indicator 48midplane description 21rear, description 20

Enclosure Address (EA)requirements 37setting 38

Enclosure IDsee Enclosure Addressenvironmental recovery 74

FFC-AL (Fibre Channel Arbitrated Loop)

cabling 71requirements 28

connector 71interface specifications 71physical address 37

Fibre Channelrelated standards 73

front bezeldescription 21unlocking and removing 57

FRUs (field-replaceable units)defined 18disk module

description 23removing 58

handling 50LCC

description 22replacing 62

power issues 51

power supplydescription 25replacing 65

storing 50

Ggrounding 11

Hhelp 10hot spare

restrictions 42

Iindicators, ID 48installation requirements 28installing

DAE2P in cabinet 29disk filler modules 59

LLCC (link control card)

cabling 71requirements 28

description 22FC-AL connector 71reattaching cables to 64removing copper cables 62replacing 62status light

Active 50status lights 23

lights, DAE2P status 46

Mmidplane 21Monitoring 46

Oovertemperature recovery 74

79DAE2P/DAE3P Disk-Array Enclosures Hardware Reference

Index

Ppower

issues and FRUs 51overview 28

power supplyattaching ac power cord 67description 25removing

ac power cord 65replacing 65status lights

Active 50Check 50Cooling Check 50

turning off 65turning on 67

powering down DAE2P 51, 65powering up DAE2P 67

RRAID groups 42rear

description 20

recoveryenvironmental 74

removingdisk module 58

replacingLCC 62power supply 65

requirementscabling 28

Sservice 10shipping requirements 75site requirements 28specifications, DAE2P 70status

monitoring DAE2P 46status lights, DAE2P 46

Ttechnical specifications, DAE2P 70technical support 10turning off power supply 51, 65turning on power supply 67


Index

CLARiiON DAE2P and DAE3P Disk-Array Enclosures Hardware ... · DAE2P/DAE3P Disk-Array Enclosures...

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