Chapter (3) Transistors and Integrated Circuits

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Chapter (3) Transistors and Integrated Circuits B I P O L A R J U N C T I O N T R A N S I S T O R BJT in contrast to the "unipolar " FET Both minority and majority carries play significant roles. Permits greater gain better high-frequency performance. Alloy Structure consist of Collector (C) n-type chip less than 1 mm square Base (B) p-type thinner than this paper Emitter n-type alloyed to the base The result is a pair of pn junctions separated by a base region, npn

description

Chapter (3) Transistors and Integrated Circuits. B I P O L A R J U N C T I O N T R A N S I S T O R. BJT in contrast to the "unipolar " FET Both minority and majority carries play significant roles. Permits  greater gain  better high-frequency performance. Alloy Structure consist of. - PowerPoint PPT Presentation

Transcript of Chapter (3) Transistors and Integrated Circuits

Page 1: Chapter (3) Transistors and Integrated Circuits

Chapter (3)Transistors and Integrated Circuits

B I P O L A R J U N C T I O N T R A N S I S T O R

BJT in contrast to the "unipolar" FET

• Both minority and majority carries play significant roles.• Permits greater gain better high-frequency performance.

Alloy Structure consist of

• Collector (C) n-type chip less than 1 mm square• Base (B) p-type thinner than this paper• Emitter n-type alloyed to the base • The result is a pair of pn junctions separated by a base

region, npn junction transistor.

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Chapter (3)Transistors and Integrated Circuits

Planar Structure

npn BJT• (n) grown upon a heavily doped (n+) substrate.• oxidation of the surface • window opened to diffuse impurities

(P) into the crystal to form the pn junction.• A smaller window for emitter in opened to diffuse emitter region (n).

Biasing Parameters

BJT C E B VEB VCB iE iC iB

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Chapter (3)Transistors and Integrated Circuits

Operation• The emitter junction forward biased

VEB reduced the barrier at emitter electrons injection into B where they are

minority carriers.• The collector junction is reverse biased

VCB increase the barrier at C

• B is very thin most electron pass from E to C

• The net result transfer electron from E to C.• Large RL insertion in C large voltage

voltage amplification • Variation of the base current iB large iC

current amplification • Switching operation used in digital signal

processing.

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Chapter (3)Transistors and Integrated Circuits

DC Behavior• E forward C reverse biased. • iE consist electron across

np J holes from B.

• almost unity iE nearly electrons.• varies from 0.90 to 0.999 where a typical value is 0.98.• Most of these electrons in B

diffuse to C B is very narrow. • iC consist of iE and a very small current due to thermally generated minority carrier ICBO CBO

KTevCBO IeI 1/

iC = -iE + ICBO

iB = -iE -iC

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Chapter (3)Transistors and Integrated Circuits

Common - Base Characteristics

• CB configuration

• B common input E output C.

• The emitter-base section forward-biased

diode.

Input Characteristics

• Input characteristics Fig.( b ) similar to

Fig. (a) diode characteristics

• The effect of VCB small

• +VCB emitter open-circuited IE = 0

C section reverse-biased junction

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Chapter (3)Transistors and Integrated Circuits

Output Characteristics

• The collector

characteristic reverse

bias diode iE = - 5 mA,

iC = - iE + 5 mA.

• The slope of the curves

in Fig C due to an

effective increase in

as VCB increases.

• always less 1

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The common base

configuration is not good for

practical current amplification

Chapter (3)Transistors and Integrated Circuits

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Chapter (3)Transistors and Integrated Circuits

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Chapter (3)Transistors and Integrated Circuits

Input and output CE Characteristics

iB depends on VBE only .

iB = 0 iC = iCEO

= 0.98 = 49,

A very small increase in iB large

increase in iC

A very small increase in much

greater change in .Practice Problem 6-3

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Chapter (3)Transistors and Integrated Circuits