AP Bridge - GP Bridge · 2021. 8. 1. · CSI/DSI CSI/DSI Host Bus Interface I2C, I2S, GPIOs CSI/DSI...

SEMICONDUCTORS

Copyright 2015, Toshiba Corporation.

Bridges for Building an ARA Module

Presentation Date: January 2015

Presented by: Eugene Chang

AP Bridge - GP Bridge

2Copyright 2015, Toshiba Corporation.

Agenda

1. Bridge IC specifications Overview– AP Bridge– GP Bridge

2. Switch ASIC3. Configuration4. Contactless Interface5. Bridge IC Revisions6. Starter Kit


Bridge IC specifications Overview

• Application Processor• Display• Camera• Mic/Speaker• 2nd Display/Camera• etc

<Applicable modules>

• Wifi, Bluetooth®, GPS• SIM• Modem• Memory Card• Mic/Speaker• etc

<Applicable modules>

CSI/DSI

CSI/DSIHost Bus Interface

I2C, I2S, GPIOs

CSI/DSI Tx0 4LaneD-PHYCSI/DSI Rx0

CSI/DSI Tx1 4LaneD-PHYCSI/DSI Rx1

HOST BUS I/F

Toshiba is developing 2 types of Bridge ICs.

I2S masterI2C master

GPIOs

HSIC(HOST)SDIO(MASTER)

UART, I2C, I2S, EPM, GPIOs

HSIC 1.0HOST

HSIC PHY

SDIO v2 master

UARTI2S masterI2C master

GPIOsEPM

GP Bridge- T6WT2XBG

AP Bridge- T6WT1XBG

Wi-Fi is a registered trademark of Wi-Fi Alliance. / Bluetooth is a registered trademark owned by Bluetooth SIG, Inc. and any use of such marks by Toshiba Corporation is under license.

M-P

HY

UniP

ro

M-P

ORTDual Tx, Rx

5.8Gbps/lane

M-P

HY

UniP

ro

M-P

ORTDual Tx, Rx

5.8Gbps/lane


“T6WR5XBG” ARA AP Bridge

• Bridges the UniproSM network with ARA modules featuring the Application Processor or Display or Camera

• Supports CSI-2, DSI, HSIC (USB), I2C, I2S and GPIO• Based on an ARM Cortex M3 for fast handling of protocol

conversions• Main features include:

• MIPI® UniPro ver 1.6 UniPort with 2 lane bidirectional capable of 5.8Gbps/lane, -Up to 32 C-ports

• CSI-2 Interface – 2 links with each link having 4 lanes@1Gbps/lane

• DSI Interface – 2 links with each link having 4 lanes @1Gbps/lane

• HSIC Device• SPI Master• I2C Master• Audio I2S Interface• 15 GPIOs• Package;

107pin 5.0x5.0x1.0 0.4mm ball pitch BGA


Module

Endoskeleton

4 Lane CSI-2 for CameraOR

4 Lane DSI for Display

Unipro BusTo Switch IC

ROM

Audio Codec

AP Bridge

AP Bridge showing two possible uses – Display or Camera


“T6WR6XBG” ARA GP Bridge

• A general purpose bridge that connects the UniproSM

network with ARA modules featuring application that uses HSIC, SDIO, UART, SPI, I2C, I2S

• Based on an ARM Cortex M3 for fast handling of protocol conversions

Main features include:• MIPI® UniPro ver 1.6 UniPort with

2 lane bidirectional capable of 5.8Gbps/lane -Up to 16 C-ports

• HSIC Host• SDIO Host• SPI Master• I2C Master• Audio I2S Interface• 15 GPIOs• Package;

107pin 5.0x5.0x1.0 0.4mm ball pitch BGA


ModuleEndoskeleton

Unipro BusTo Switch IC

ROM

Audio Codec

Wi-Fi / BluetoothModule

Example of GP Bridge w/ Wi-Fi®/ Bluetooth® Module

GP Bridge

Wi-Fi is a registered trademark of Wi-Fi Alliance. Bluetooth® word mark is a registered trademark owned by Bluetooth SIG, Inc. and any use of such mark by Toshiba Corporation is under license.


“T6WM8BGX” ARA Switch LSI

• Unipro based switch device that resides only on the Endoskeleton and handles data transfer between UniPorts at the L3 level.

• The Switch has 14 UniPorts with each UniPort consists of 2 lane TX and 2 Lane RX M-PORT supporting 5.8Gbps/lane

• A supervisory microcontroller controls and configures the Switch LSI via I2C slave address.

• Other features include:– Data routing from every UniPort to any other UniPort– Configuration through UniPro– Traffic class 0 and 1 with routing and arbitration support for

both traffic classes


Supervisory ControllerBlock Diagram of Switch ASIC

Switch ASIC

Endopoint

M-PH

Y

M-PO

RT

UniPro Module 8

Endopoint

M-PH

Y

M-PO

RT

UniPro Module 9

Endopoint

M-PH

Y

M-PO

RT

UniPro Module 10

Endopoint

M-PH

Y

M-PO

RT

UniPro Module 11

Endopoint

M-PH

Y

M-PO

RT

UniPro Module 12

Endopoint

M-PH

Y

M-PO

RT

UniPro Module 13

Endopoint

M-PH

Y

M-PO

RT

UniPro Module 14

ModulesEndopoint

M-P

HY

M-P

OR

T

Uni

Pro

Module 1

Endopoint

M-P

HY

M-P

OR

T

Uni

Pro

Module 2

Endopoint

M-P

HY

M-P

OR

T

Uni

Pro

Module 3

Endopoint

M-P

HY

M-P

OR

T

Uni

Pro

Module 4

Endopoint

M-P

HY

M-P

OR

T

Uni

Pro

Module 5

Endopoint

M-P

HY

M-P

OR

T

Uni

Pro

Module 6

Endopoint

M-P

HY

M-P

OR

T

Uni

Pro

Module 7

Modules

Routing

* M-PHY, MIPI, UniPro are registered trademarks or service mark of MIPI Alliance, Inc.


Configuration

• Two Bridge LSIs (residing in modules)

– AP Bridge:AP/Camera/Display Bridge

– GP Bridge:General-Purpose Bridge

• Switch LSI (residing in Endo)

Wi-Fi is a registered trademark of Wi-Fi Alliance. / Bluetooth is a registered trademark owned by Bluetooth SIG, Inc. and any use of such marks by Toshiba Corporation is under license. / LTE is a trade mark of ETSI.


Contactless inductive interface

Prototype Engineering Sample Commercial Sample

Endo Version Spiral-2 Spiral-3 Spiral-3

M-PHY Coupling DC (contact req’d.) DC / AC Contactless* DC / AC Contactless*

Supported mode ~ HS-G3 (~6Gbps) ~ HS-G3 / PWM1(3~9Mbps), HS-G1,G2,G3

~ HS-G3 / PWM1(3~9Mbps), HS-G1,G2,G3

[Key Features]

• M-PHY protocol over contactless inductor

• Wide band data transmission from Mbps to Gbps over channel with limited band width

• Low power operation in low speed mode


Bridge IC Revisions– Key Features Summary

Prototype Engineering Sample Commercial Sample

Availability Sep. 2014(limited qty)

Feb. 2015(limited qty) Jul. 2015

Endo Version Spiral-2 Spiral-3 Spiral-3

Part No. AP Bridge: T6WR5XBGGP Bridge: T6WR6XBG

AP Bridge: T6WT1XBGGP Bridge: T6WT2XBG

AP Bridge: TBDGP Bridge: TBD

M-PHY Coupling DC(contact req’d.)

DC / AC Contactless*

DC / AC Contactless*

Package AP Bridge: 5x5 107 BGAGP Bridge: 5x5 107 BGA

AP Bridge: 5x5 109 BGAGP Bridge: 5x5 109 BGA

AP Bridge: TBDGP Bridge: TBD

CPORTs AP Bridge: 32GP Bridge: 16

AP Bridge: 44GP Bridge: 16

AP Bridge: 44GP Bridge: 16

* DC / AC Contactless set prior to shipment


Starter Kit for ARA

• Starter Kit– A simple board with Bridge Chip and USB socket for the 1x2

module form factor – This Starter Kit enables module developers to try their idea or

solution easily.

microUSBsocket

GPBridge PHY


Key Features for Starter Kit

• Module to support USB - Type A/B micro receptacle for Data• PCB to support access test points for the following signals that

connect to GP Bridge:– SDIO, UART, SPI, I2S, I2C, PWM, GPIO

Developer’s Application Board

ARA Platform w/ Starter kit ARA Platform w/ Starter kit

Existing USB dongle

Schematics and Layout data will be available upon request


Project Ara site in Toshiba Homepage


Contents


Bridge ICs Brochure

18

TOSHIBA CONFIDENTIAL

Copyright 2015, Toshiba Corporation.

AP Bridge - GP Bridge · 2021. 8. 1. · CSI/DSI CSI/DSI Host Bus Interface I2C, I2S, GPIOs CSI/DSI...

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