An Introduction to Electronics Systems Packaging -...
Transcript of An Introduction to Electronics Systems Packaging -...
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!An Introduction to
Electronics Systems Packaging!!2012
NPTEL Video Course
Course Instructor: G V Mahesh
Electronics Systems Packaging Laboratory Department of Electronic Systems Engineering
(formerly CEDT)
Indian Institute of Science Bangalore 560012
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ESP Group Activities at DESE, IISc
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ESP Group Activities at DESE, IISC! ! Only Packaging course to offer hands-on curriculum
! Dust-free lab for photolithography; analysis lab
! Chemical process lab and SMD lab
! Research focus on microvias and embedded
passives
! Organic substrate sequential build-up technology
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WHAT IS ELECTRONICS SYSTEMS PACKAGING?
! Packaging is ‘every technology’ required between
the IC and the system.
! Packaging is just not a study of ‘interconnections’.
It is a lot more than that.
! Without a proper packaging methodology a
manufactured die/IC is no good.
! Packaging is basically done at three levels- chip
level, board level and system level.
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Methodology ! This video course will try to cover all the fundamental aspects of electronic systems packaging- namely, chip level, board level and system level packaging.
! This course is currently not available at any undergraduate university ! Parts of it or a few individual topics may be taught
by professors at universities and IITs/IISc
INFORMATION
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Methodology!
! Will sensitize the student to electronics packaging work at the graduate level
! The course will have lectures, short video clips enhancing the presentation and some tutorial work to make a better understanding of the topic(s).
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INFORMATION
Benefits from this course
! CAD design capability, ! Understand Design for Manufacturing,
Design for Testing, Design for Reliability, ! Holistic view of packaging
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OBJECTIVES OF THIS COURSE
! Student masters the fundamental knowledge of electronic packaging including package styles, hierarchy and methods of package necessary for various environments. ! Sensitize students to the multi-disciplinary areas and appreciate the role of packaging in electronic products. ! Provide pathway for further studies in packaging if the student is inclined to do so.
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OBJECTIVES OF THIS COURSE!
! Provide industry perspective.
! Ability to distinguish between engineering performance and economic efficiency and develop cost-efficient high-performance packaging approaches.
! Student should be able to predict the reliability of electronic components and structures.!
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CONTENTS OF COURSE
! Overview of packaging; levels of packaging ! Semiconductor, board and system level packaging Highlights ! Packages and interconnection choices; single chip and multichip packages ! Electrical design; CAD for PWBs
! RF packaging; power delivery in systems
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CONTENTS OF COURSE ! ! PWB Technologies
! Surface mount technology-design, fabrication and Assembly ! Soldering, lead-free and green electronics ! Design for reliability, thermo-mechanical reliability, thermal management on PWBs
! Materials and processes at board level
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CONTENTS OF COURSE ! ! Embedded Passives for miniaturization
! some tutorials
! Short video clips describing the processes in detail (for some topics only)
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TEXT BOOKS Books recommended
! Fundamentals of Microsystems Packaging, Ed. Rao Tummala, McGraw Hill 2001 ! Advanced MCM Handbook, Ed. William Brown ! Electronics Packaging Handbook-3 Vol series; Ed Rao Tummala ! ‘Microvias’ by Ricky Lee
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Books recommended!
! ‘Solders’ by John Lau, J Huang
! ‘Packaging Handbook’ by Charles Harper
! ‘Printed Circuit Board Technology’ by R S Khandpur
! System on Package: Ed Rao Tummala, 2008
! Other books in PCB technology, design
! Web reading
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ADDITIONAL READING
Online Magazines and General reading:
! Advanced Packaging ! Chip Scale Review ! Flipchips.com ! Electronics Packaging and Production ! IEEE Spectrum ! Circuit Assembly Asia ! CircuiTree Asia ! Transactions of IEEE-CPMT (refereed journal)
More links in ESP web page ! www.cedt.iisc.ernet.in/people/mahesh/links.htm
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WEB READING Useful Websites:
! For roadmaps and standards/documents published pertaining to semiconductor and PWB industry
www.ipc.org (Institute for interconnects and printed circuits)
www.sia.org (Semiconductor industry association) www.itrs.org (international technology roadmap for
semiconductors) www.inemi.org (international electronics manufacturing
initiative)
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WEB READING!
! IEEE-CPMT (Components, Packaging and Manufacturing Technology) website
! ITRI- Industrial Technology Research Institute (globally- several places)
! Surface Mount Technology Association, SMTA IMAPS USA and IMAPS India
! Indian Printed Circuit Association, IPCA
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Academic centers and Industries Academic Centers worldwide for packaging research
! PRC, Georgia Tech, Atlanta
! CALCE, University of Maryland
! Cornell University Packaging Lab ! MIT and Stanford ! IME and NUS, Singapore
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Academic centers and Industries!
! IMEC, Belgium; Chalmers University in Sweden
! University of Arkansas
! University of Colorado at Boulder and a few others
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! GE
! IBM
! Intel
! Kyocera
! AT&T Bell Labs
Industries pioneering packaging research !
! Delphi ! Samsung
! Motorola
! IMEGO (Sweden)
! Nokia ..and a few others
“wanted packing engineers”
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Safety and Right to Know (RTK) Issues in Lab
! Safety training and Quiz
! Awareness on right to know issues in lab
" Very common practice in universities abroad
! Be aware when working in chemical lab and photolithography area
" Wear safety goggles provided by the lab " Spillages " Prevent Fire and accidents in lab " Be ready to help in case of emergency
! There should be no compromise on SAFETY
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It is hoped you will find the course beneficial. We will now start with the topics..
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Once again, I can be reached by email: [email protected]