AMD Radeon Vega Frontier Edition - System Plus Consulting€¦ · Company Profile 7 o 2.5D & 3D...
Transcript of AMD Radeon Vega Frontier Edition - System Plus Consulting€¦ · Company Profile 7 o 2.5D & 3D...
©2017 System Plus Consulting | AMD Radeon Vega Frontier Edition 1
21 rue la Noue Bras de Fer44200 NANTES - FRANCE +33 2 40 18 09 16 [email protected] www.systemplus.fr
AMD Radeon Vega Frontier Edition
2.5D & 3D Packaging – SPIL CoW last – Samsung HBM2
Adv. Packaging report by Romain FRAUXNovember 2017 – Version 1
©2017 System Plus Consulting | AMD Radeon Vega Frontier Edition 2
Table of Contents
Overview / Introduction 3
o Executive Summary
o Reverse Costing Methodology
Company Profile 7
o 2.5D & 3D Packaging Market
o AMD Company Profile
o AMD Radeon Vega Frontier Edition Characteristics
o Vega GPU Supply Chain
o Globalfoundries
o SPIL 2.5D Process Flow
o Samsung HBM2
Physical Analysis 20
o Summary of the Physical Analysis
o Physical Analysis Methodology
o AMD Radeon Frontier Edition Teardown
o Package
Views & Dimensions
Passives Assembly
o DRAM Die
View, Dimensions & Marking
µBumps & TSVs
o Package Cross-Section
Laminate & Frame Cross-Section
Interposer Cross-Section
GPU Cross-Section
8-Hi HBM2 Stack Cross-Section
o Comparison with AMD Fury X including SK-Hynix HBM1
o Comparison with NVIDIA Tesla P100 including Samsung 4-Hi HBM2
Manufacturing Process Flow 72o Global Overviewo GPU Process Description & Foundryo Interposer Process Flow & Foundryo HBM2 Stack Process Flow & Foundryo CoW Process Flow & Foundry
Cost Analysis 97o Summary of the cost analysiso Yields Explanation & Hypotheses
o GPU Front-End & Die Cost
o HBM2 Stack
TSV Manufacturing Cost
Micro-Bumping Manufacturing Cost
Dies Cost (DRAM + Logic)
8-Hi HBM2 Stack Cost
o Interposer
TSV Manufacturing Cost
Microbumping Cost
Interposer Cost
o CoW & Final Assembly Manufacturing Cost
o Final Component Cost
Estimated Price Analysis 118
o Manufacturer Financial Ratios
o Component Manufacturer Price
Company services 121
©2017 System Plus Consulting | AMD Radeon Vega Frontier Edition 3
O V E R V I E WMETHODOLOGY
©2017 System Plus Consulting | AMD Radeon Vega Frontier Edition 4
Overview / Introductiono Executive Summaryo Reverse Costing
Methodologyo Glossary
Company Profile & Supply Chain
Physical Analysis
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Plus
Executive Summary
• 2 years after the release of the Radeon fury X using the world’s first HBM integrated on chip, AMD presented at CES2017 the Radeon Vega GPU featuring second generation of HBM. The analyzed version of the graphic card is theRadeon Vega Frontier Edition, exhibiting 13/25 TFLOPS and 16GB High Bandwidth Cache assembled in two 8-HiHBM2 stacks.
• Packaged in a smaller, 47x47mm 10-layer fcBGA, the component uses more than 2,800mm² of silicon area,highlighting an impressive silicon / package ratio.
• Compared to NVIDIA which uses only one major source (TSMC) for the manufacturing of the Pascal GPU, AMDchoose to use multiple sources for the production of the Vega GPU. Indeed, the GPU die is made by Globalfoudries,featuring a 14nm FinFET process and 12.5 billion transistors. The interposer, with via-middle TSV, is provided byUMC which was also the provider for the Radeon Fury X. Regarding the 2.5D assembly of the component, twosources has been identified, with SPIL estimated to be the major one. The process used is supposed to be SPIL's Chipon Wafer after TSI backside process (CoW last).
• Regarding the HBM2, only two stacks of 8GB are used to obtain the 16GB capacity. As for NVIDIA, Samsung is theprovider of the HBM2 stacks, whereas SK-Hynix was the supplier for previous Radeon Fury X. The 8GB HBM2consists of eight 1GB HBM2 dies and a buffer die at the bottom of the stack, which are all vertically interconnectedby TSVs and microbumps.
• The report includes a complete physical analysis of the packaging process, with details on all technical choicesregarding process, equipment and materials. Also, the complete manufacturing supply chain is described andmanufacturing costs are calculated.
• The report compares the Radeon Vega solution with NVIDIA Tesla P100, highlighting the choices made by bothcompanies in term of integration. Also, the report features a comparison with AMD’s Fury X, which uses HBM1 and2.5D assembly, to explain the interest in evolution through the HBM2 and CoW 2.5D platforms.
©2017 System Plus Consulting | AMD Radeon Vega Frontier Edition 5
Overview / Introductiono Executive Summaryo Reverse Costing
Methodologyo Glossary
Company Profile & Supply Chain
Physical Analysis
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Plus
Teardown analysis
• Package is analyzed and measured• The dies are extracted in order to get overall data: dimensions, main blocks, pad number and pin out, die marking• Setup of the manufacturing process.
Costing analysis
• Setup of the manufacturing environment• Cost simulation of the process steps
Selling price analysis
• Supply chain analysis• Analysis of the selling price
The reverse costing analysis is conducted in 3 phases:
Reverse Costing Methodology
©2017 System Plus Consulting | AMD Radeon Vega Frontier Edition 6
Overview / Introduction
Company Profile & Supply Chain o 2.5D & 3D Packaging Marketo AMD Profileo AMD Radeon Vega
Characteristicso Vega GPU Supply Chaino Globalfoundrieso SPIL 2.5D Processo Samsung HBM2
Physical Analysis
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Plus
AMD Radeon Vega Frontier Edition Characteristics
AMD Radeon Vega Frontier Edition with Vega 10 GPU
Vega architecture with 16GB of HBM2
AMD Radeon Vega Frontier Edition SpecsSource: AMD
©2017 System Plus Consulting | AMD Radeon Vega Frontier Edition 7
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis o Summaryo Graphic Card Teardowno Packageo Dies Sizeo DRAM Dieso Cross-Section – Substrate o Cross-Section – Interposero Cross-Section – GPU o Cross-Section – HBM Stacko Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Plus
GPU Die
BGA Package Substrate
Logic Die
DRAM Die
DRAM Die
DRAM Die
DRAM Die
DRAM Die
DRAM Die
DRAM Die
DRAM Die
Interposer
PACKAGE STRUCTURE:
• 3D Packaging: 9 stacked dies with TSV & µBumps (HBM stack).
• 2.5D Packaging: HBM stack and GPU stacked with µBumps on a silicon interposer holding TSV.
• Flip-chip BGA: silicon interposer flip-chipped to a 10-layers PCB substrate
Summary of the Physical Analysis
TSV Diam. µm Pitch µm
µBumps Diam. µm Pitch µm
µBumps Diam. µm Pitch µm
Flip-chip Bump Diam. µm Pitch µm
BGA Bump Diam. µm Pitch mm
TSV Diam. m Pitch µm
©2017 System Plus Consulting | AMD Radeon Vega Frontier Edition 8
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis o Summaryo Graphic Card Teardowno Packageo Dies Sizeo DRAM Dieso Cross-Section – Substrate o Cross-Section – Interposero Cross-Section – GPU o Cross-Section – HBM Stacko Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Plus
Package Views & Dimensions
©2017 System Plus Consulting | AMD Radeon Vega Frontier Edition 9
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis o Summaryo Graphic Card Teardowno Packageo Dies Sizeo DRAM Dieso Cross-Section – Substrate o Cross-Section – Interposero Cross-Section – GPU o Cross-Section – HBM Stacko Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Plus
Package Cross-Section – Laminate Substrate
©2017 System Plus Consulting | AMD Radeon Vega Frontier Edition 10
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis o Summaryo Graphic Card Teardowno Packageo Dies Sizeo DRAM Dieso Cross-Section – Substrate o Cross-Section – Interposero Cross-Section – GPU o Cross-Section – HBM Stacko Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Plus
Package Cross-Section – Interposer
©2017 System Plus Consulting | AMD Radeon Vega Frontier Edition 11
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis o Summaryo Graphic Card Teardowno Packageo Dies Sizeo DRAM Dieso Cross-Section – Substrate o Cross-Section – Interposero Cross-Section – GPU o Cross-Section – HBM Stacko Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Plus
Package Cross-Section – HBM2 Stack
©2017 System Plus Consulting | AMD Radeon Vega Frontier Edition 12
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis o Summaryo Graphic Card Teardowno Packageo Dies Sizeo DRAM Dieso Cross-Section – Substrate o Cross-Section – Interposero Cross-Section – GPU o Cross-Section – HBM Stacko Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Plus
Package Cross-Section – HBM2 Stack
©2017 System Plus Consulting | AMD Radeon Vega Frontier Edition 13
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis o Summaryo Graphic Card Teardowno Packageo Dies Sizeo DRAM Dieso Cross-Section – Substrate o Cross-Section – Interposero Cross-Section – GPU o Cross-Section – HBM Stacko Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Plus
AMD Radeon Vega vs AMD Radeon Fury X – Structure
Laminate substrate
(10 layers PCB)
HBM
4 x 4 stacked memory dies4GB Memory
GPU 28nm(xxxmm²)
Silicon Interposer
(xxxmm²)
47 mm x 47 mmBGA Package
55 mm x 55 mmBGA Package
GPU 14nm FinFET(xxxmm²)
HBM2
2 x 8 stacked memory dies
16GB Memory
Silicon Interposer
(xxxmm²)
Laminate substrate
(10 layers PCB)
AMD Radeon Fury X GPU & HBM Integration©2017 by System Plus Consulting
AMD Radeon Vega GPU & HBM2 Integration©2017 by System Plus Consulting
Comparison with AMD Radeon Fury X
3x more throughput (FP16 Teraflops)
4x more memory, 8x capacity/stack
HBM Stack: 4 stacked dies of 256KB = 1GB
HBM2 Stack: 8 stacked dies of 1GB = 8GB
©2017 System Plus Consulting | AMD Radeon Vega Frontier Edition 14
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Manufacturing Process Flowo Global Overviewo GPU Processo GPU Wafer Fab Unito HBM Processo HBM Wafer Fab Unito Interposer Processo Interposer Wafer Fab Unito CoW Process o CoW Assembly Unito Final Assembly Processo Final Assembly Unit
Cost Analysis
Selling Price Analysis
About System Plus
Global Overview
• SPIL CoW last Process Steps:
©2017 System Plus Consulting | AMD Radeon Vega Frontier Edition 15
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Manufacturing Process Flowo Global Overviewo GPU Processo GPU Wafer Fab Unito HBM Processo HBM Wafer Fab Unito Interposer Processo Interposer Wafer Fab Unito CoW Process o CoW Assembly Unito Final Assembly Processo Final Assembly Unit
Cost Analysis
Selling Price Analysis
About System Plus
Interposer – TSV Process Flow (1/2)
drawing not to scale
Interposer
• Si 300mm wafer
Interposer
• TSV etch: DRIE
Interposer
• Oxide liner deposition: SiO2 PECVD
Oxide Liner
C4F8 / SF6
Interposer
Interposer
Interposer
©2017 System Plus Consulting | AMD Radeon Vega Frontier Edition 16
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Manufacturing Process Flow
Cost Analysiso Summaryo Supply Chaino Yieldso GPU Costo HBM Stack Costo Interposer Costo CoW Assembly Costo Component Cost
Selling Price Analysis
About System Plus
Main Steps of Economic Analysis
©2017 System Plus Consulting | AMD Radeon Vega Frontier Edition 17
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Manufacturing Process Flow
Cost Analysiso Summaryo Supply Chaino Yieldso GPU Costo HBM Stack Costo Interposer Costo CoW Assembly Costo Component Cost
Selling Price Analysis
About System Plus
HBM TSV Manufacturing Cost
©2017 System Plus Consulting | AMD Radeon Vega Frontier Edition 18
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Manufacturing Process Flow
Cost Analysiso Summaryo Supply Chaino Yieldso GPU Costo HBM Stack Costo Interposer Costo CoW Assembly Costo Component Cost
Selling Price Analysis
About System Plus
DRAM Microbumping Cost
©2017 System Plus Consulting | AMD Radeon Vega Frontier Edition 19
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Manufacturing Process Flow
Cost Analysiso Summaryo Supply Chaino Yieldso GPU Costo HBM Stack Costo Interposer Costo CoW Assembly Costo Component Cost
Selling Price Analysis
About System Plus
DRAM Wafer & Die Cost
©2017 System Plus Consulting | AMD Radeon Vega Frontier Edition 20
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Manufacturing Process Flow
Cost Analysiso Summaryo Supply Chaino Yieldso GPU Costo HBM Stack Costo Interposer Costo CoW Assembly Costo Component Cost
Selling Price Analysis
About System Plus
HBM Stack Cost
©2017 System Plus Consulting | AMD Radeon Vega Frontier Edition 21
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Manufacturing Process Flow
Cost Analysiso Summaryo Supply Chaino Yieldso GPU Costo HBM Stack Costo Interposer Costo CoW Assembly Costo Component Cost
Selling Price Analysis
About System Plus
Total Interposer Wafer Cost (TSV + µBump)
©2017 System Plus Consulting | AMD Radeon Vega Frontier Edition 22
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Manufacturing Process Flow
Cost Analysiso Summaryo Supply Chaino Yieldso GPU Costo HBM Stack Costo Interposer Costo CoW Assembly Costo Component Cost
Selling Price Analysis
About System Plus
Chip-on-Wafer (CoW) Stack Wafer Cost
©2017 System Plus Consulting | AMD Radeon Vega Frontier Edition 23
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Pluso Company serviceso Related Reportso Feedbackso Contacto Legal
MARKET AND TECHNOLOGY REPORTS - YOLE DÉVELOPPEMENT
ADVANCED PACKAGING• 3D TSV and 2.5D Business Update - Market and Technology Trends 2017• Equipment and Materials for 3D TSV Applications 2017
PATENT ANALYSIS - KNOWMADE
ADVANCED PACKAGING• TSV Stacked Memory Patent Landscape Analysis
REVERSE COSTING ANALYSES - SYSTEM PLUS CONSULTING
PACKAGING• NVIDIA Tesla P100 GPU with HBM2• Sony IMX400 Tri-layer Stacked CMOS Image Sensor (CIS) with Integrated DRAM and DSP• NXP SCM-i.MX6 Quad High Density Fan-Out Wafer-Level System-in-Package• TSMC Integrated Fan-Out Package• AMD High-Bandwidth Memory• Samsung 3D TSV – Stacked DDR4 DRAM
Related Reports
©2017 System Plus Consulting | AMD Radeon Vega Frontier Edition 24
COMPANYSERVICES
©2017 System Plus Consulting | AMD Radeon Vega Frontier Edition 25
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Pluso Company serviceso Related Reportso Feedbackso Contacto Legal
Business Models Fields of Expertise
Custom Analyses(>130 analyses per year)
Reports(>40 reports per year)
Costing Tools
Trainings
©2017 System Plus Consulting | AMD Radeon Vega Frontier Edition 26
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Pluso Company serviceso Related Reportso Feedbackso Contacto Legal
Contact
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