Advancement in Microelectronics Packaging for Medical Implantsimapsne.org/virtualCDs/2019/2019...
Transcript of Advancement in Microelectronics Packaging for Medical Implantsimapsne.org/virtualCDs/2019/2019...
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Advancement in Microelectronics
Packaging for Medical Implants:
Solving the Need for “More” with
“Less” SpaceCaroline Bjune
07 May 2019
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What Does Medical Device Packaging Mean?
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• Packaging in the traditional sense in the medical community pertains to
the external package housing the device.
– Subjected to and required to meet transport and shelf-life
specifications
– Typically requires custom designed trays and sealing process
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What Does Medical Device Packaging Mean?
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• Today’s talk pertains to the device or system
itself:
– Electronics (internal guts of the device)
– components (ASICs, SMTs, discrete);
circuit board (rigid, flex, rigid-flex)
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Photo: MST/Dyconex, https://www.mst.com/dyconex/
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What Does Medical Device Packaging Mean?
4
• Today’s talk pertains to the device or system
itself:
– Electronics (internal guts of the device)
– components (ASICs, SMTs, discrete);
circuit board (rigid, flex, rigid-flex
– Enclosure of the electronics – hermetic,
biocompatible, impact resistance, RF
transparent where applicable (other
considerations: form factor)
footer
Enclosure shell
Photo: MST/Dyconex, https://www.mst.com/dyconex/
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What Does Medical Device Packaging Mean?
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• Today’s talk pertains to the device or system
itself:
– Electronics (internal guts of the device)
– components (ASICs, SMTs, discrete);
circuit board (rigid, flex, rigid-flex)
– Enclosure of the electronics – hermetic,
biocompatible, impact resistance, RF
transparent where applicable (other
considerations: form factor)
– Interconnect (how to bring the functions
from the inside out to world, i.e.
communication)
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Photo: MST/Dyconex, https://www.mst.com/dyconex/
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What Does Medical Device Packaging Mean?
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• Today’s talk pertains to the device or system
itself:
– Electronics (internal guts of the device)
– components (ASICs, SMTs, discrete);
circuit board (rigid, flex, rigid-flex)
– Enclosure of the electronics – hermetic,
biocompatible, impact resistance, RF
transparent where applicable (other
considerations: form factor)
– Interconnect (how to bring the functions
from the inside out to world, i.e.
communication)
– Power (battery within the implant;
wirelessly powered)
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Photo: MST/Dyconex, https://www.mst.com/dyconex/
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What Does Medical Device Packaging Mean?
7
• Today’s talk pertains to the device or system
itself:
– Electronics (internal guts of the device)
– components (ASICs, SMTs, discrete);
circuit board (rigid, flex, rigid-flex)
– Enclosure of the electronics – hermetic,
biocompatible, impact resistance, RF
transparent where applicable (other
considerations: form factor)
– Interconnect (how to bring the functions
from the inside out to world, i.e.
communication)
– Power (battery within the implant;
wirelessly powered)
– Interfaces with other sub-systems (i.e.
leads, controller)
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Photo: MST/Dyconex, https://www.mst.com/dyconex/
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From cardiac to neuro: variations on a common theme
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2010s
Epilepsy
2000s
DBS
1990s
Spinal Pain
1970s
Pacemaker1960s
Pacemaker
1980s
Cochlea
The Evolution of Neuromodulation
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Deep Brain Stimulation (DBS)
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4-channels
Implantable Pulse
Generator (IPG)
http://www.medtronic.com/ca-en/your-health/treatments-
therapies/parkinsons-disease/getting-therapy.html
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Personalized Responsive Therapies
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Smarter, Responsive
Closed-loop Therapies
Smaller,
Denser
Electrodes
Distributed Multimodal
Sense + Stim
http://www.medtronic.com/ca-en/your-health/treatments-
therapies/parkinsons-disease/getting-therapy.html
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Limitations of Current Technology
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Function & Channels
Min
iatu
rization
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Miniaturization without Compromise
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Function & Channels
Min
iatu
rization
Small
Smart
Safe
Scalable
Electrodes
Recording
Stimulation
Low Power
Algorithms
Wireless
Packaging
Safety
Miniaturization
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Neurotechnology Development at Draper
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Deep Brain Stimulation
(DBS)
Peripheral Nerve
StimulationStimulation Particle
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Distributed, multi-modal, closed-loop neuromodulation
5 SatellitesRecord + Stim
Central HubClosed-loop Processing
Wireless SensorsBiometrics + Patient Input
Base StationStreaming + PC Link
• 320 channels
• Responsive stimulation
• Record Spikes + LFP
• Multi-modal data fusion
• Wireless data streaming
• PERSONALIZED
TREATMENT
TRANSFORM DBS
• 8 channels
• Responsive stimulation
• Record LFP only
Neuropace
• 4 channels
• Constant stimulation
• Record LFP only
• Leads/cables transverse
through neck
Medtronic PC+S
TRANSFORM DBS
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Satellite System
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Miniaturized Hermetic Enclosure:
• Designed to fit within a within a 14mm
diameter surgical burr hole
• Rigid-flex board – enables folding of
electronics
• 81-pin high density ceramic feedthrough plate
and titanium enclosure
• Each satellite can accommodate up to 64
channels (electrodes; COTS connectors);
connects to hub cable
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Satellite – Miniaturization
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• Increasing functionality in a limited footprint required:
– Custom designed ASIC’s
– Combination of traditional rigid with flex Rigid-flex
design
– Dual sided design for each
– Low profile BGA-style attached
• Challenges:
– Incorporating COTS components
• Amplifier (die)
• FPGA (SMT)
• Passives
– Size limitation prohibited blocking
capacitors for all channels
– Complex design
• Increase design time
• Vendor sourcing (fab and assembly)
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Satellite – Miniaturization
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• Increasing functionality in a limited footprint required:
– Custom designed ASIC’s
– Combination of traditional rigid with flex Rigid-flex
design
– Dual sided design for each
– Low profile BGA-style attached
• Improvements in the future
– Reduction of COTS components where
possible
– Flip chip and/or die stacking approach
(interposer)
– Decrease pin (d) and/or increase pin pitch
– Goal to simply PCB design
• Reduce number of pedestals
• Increase feasibility of manufacturing and assembly
• Decrease fabrication time
• Increase feasibility of testing
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Satellite – Connecting to the Outside
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• Development process for each wire type
– Various wire diameter (pin d = 10mil)
– Dissimilar materials (pin = 90/10 Pt/Ir)
• To strip or not too strip?
– Bond strength and robust
– Method, potential damage, time
External Side
(electrodes/hub
cable)
Hub cable (5mil
Pt/Ir wire)ECOG, DBS
Electrodes (1mil
Pt/Ir wire)
Microelectrode array
(1mil Au wire) Wire bundles to COTS
connectors (2mil Pt/Ir wire)
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Feedthrough Interconnection Challenges
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Challenge #1 – Laser welding of EACH INDIVIDUAL wire to pin
• Labor intensive; process development often required
• As number of channels per electrodes increase, proper handling
and tracking of each electrode wire to pin becomes more of a
challenge.
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Feedthrough Interconnection Challenges
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Challenge #2 – Splitting and re-bundling 64 channel electrode
was required
• Resulted in an increase to satellite size
– Too large for implanting high channel electrodes into animals
for clinical research
• Ultimately need scales with wire counts.
– As channel count increase, so does this problem
6.5mm
(in skull)
6mm (exterior
to skull)Satellite package
(d): 13.75mm
With flange and
overmold (d): 18.5 mm
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Feedthrough Interconnection Solutions
Potential Solutions:
• Recesses in feedthrough flange
– Enables wires splay when exiting
– Provides specific entry points for each
cable/bundle
• Design a flex interconnect cable
– Interface between feedthrough and
electrodes
– Integrate electrode contacts (i.e. flex
electrode) or interconnects to
components/system
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Central Hub System - Modular
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• Three discrete subsystems:
– Electronics system – PCB’s, antenna
– Rechargeable battery
– High density custom connector
• Flex cable integrate electronics and battery to connector
• System’s curvature can be set by encapsulation tool
• Advantages of modular approach
– Custom design curvature to meet specific patient’s requirements
– Discrete battery enables introduction of new battery without the need for
redesigning the entire package/housing
– Each subsystem can be tested and validated individually reducing the risk
of losing the entire system
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Central Hub System
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• Electronics system– PCBs, antenna with ferrite
‒ 64-pin ceramic feedthrough plate with
titanium flange
‒ Alumina cover (RF transparent) with a
titanium flange (hermetic seal)
satellites
Low-Power Processor &
Stimulator ASICs:
– Neural signal processing
and stimulation control
AC Power Management:
– Power conversion and
distribution to satellites
Dual Telemetry:
– Long-range controller
link for reprogramming &
high-bandwidth link for
neural data to an
external base station
Hub Electronics
Subsystem
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Central Hub System
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• Electronics system– PCBs, antenna
with ferrite
• Rechargeable battery
– Medical, implantable grade cell
– Protection PCB
– Hermetically sealed (Ti to Ti)
– Titanium housing also serves as
system’s ground
Ground contact for
Hub system
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Central Hub System
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• Electronics system– PCBs, antenna with ferrite
• Rechargeable battery - Housing also serves as
system’s ground
• High density custom connector system
– ~ 5x volume reduction compare to traditional
connector systems
– Housing contains 5 x 10 contacts sockets (50
contacts total)
– Locking clip secures each plug/cable to
housing
– Each cable is hardwired to a satellite
High density custom
connector system
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Central Hub System
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• Electronics system– PCBs, antenna with ferrite
• Rechargeable battery - Housing also serves as
system’s ground
• High density custom connector system
• Flex cable integrate electronics to connector
pins
• System’s curvature can be set by encapsulation
tool
Flex interconnect
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• More than 185,000 amputations are performed annually in the US.
• Lack of realistic sensations of touch hampers effective use of prosthetic limbs.
• Program’s Objective - Create a prosthetic hand system that could move and
provide sensory feedback like a natural hand would do
– Requires development of next generation neuro-technologies to provide
sensory stimulation (touch and proprioception) for enhanced prosthetics.
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Peripheral Nerve Stimulation - HAPTIX
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HAPTIX Passive System Overview
Skin Interface
Implanted
ComponentsExternal
Components
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L.I.F.E. Electrodes – Validated as a Passive System
• Longitudinal Intra-Fascicular electrodes
(LIFE) fine featured electrodes designed
to be implanted within the body of the
peripheral nerve.
• Allows interrogation and stimulation of both
sensory and motor nerve fascicles with the
same device.
– 6 cuff electrodes (1) for macro recording,
stimulation, and a secure anchoring point
around the nerve
– 9 intra-neural electrodes (2) for micro
recording and stimulation for more
precise motor control and sensory
perception
– A needle at the tip (3) allows for easy
implantation and simplifies implantation
within individual motor and sensory
fascicles for safer and more reliable
access to targeted neurons
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Electrodes Percutaneous Leads
• Use for connecting each electrode to the external system
• Arranged as bundles of four wires (quads).
• Each quad consist of a section of helical coil - allows for the movement of the cable without
breakage.
– Also aids in forming closure around the tunnel opening where the bundles exit the skin to
plug into the connector.
• Bundles and individual wires are color coded with biocompatible heat shrink tubing for signal
identification.
• The bundles separate out into individual wires once outside the skin.
– Proximal and Crimp Pins inserted into a connector block for interfacing with external
controller.
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Passive Leads – Animal and Cadaver
Implants• Verification of the nerve interface:
– Histology of tissue response and stimulation threshold stability
– Stimulated on different electrode sites
– 120 days+ of rodent studies
– Acute NHP studies
• Cadaveric assessment of electrodes placement for surgical optimal position for
human clinical studies
120 days+ rodent study
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Passive Leads – Clinical Outcome
90-day implants in 2 human patientsPassive Implants
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HAPTIX Active System Overview
Implanted Components External Components
L.I.F.E. Electrodes Combined with Implant Device for
Recording and Stimulation
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SSL Satellite - Overview
• Active electronics interfaces with
the electrodes and controller
system (via percutaneous leads).
• Consists of:
– Ceramic feedthrough substrate
– Titanium can
– Double sided PCB
• Electrodes hardwired to the satellite
(feedthrough)
– LIFE
– EMG’s
• Satellite device size:
– ~ 14mm (diameter), < 5mm
(height)
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Active Electronics – Draper Designed ASIC’s
Function Description
Recording
• 30 recording channels
• Multiplexed up to 30 kHz
• 1.5 µV RMS noise (700 Hz – 5 kHz)
• 36 dB gain
Stimulation
• 30 stimulation channels
• 2 simultaneous stimulation pulses
• Multiplexing capable on all channels
• Pulse resolution of 1 µA and 1 µs
Bottom side
• Double capacitors for protection
(0201, 01005)
• Contact pads for feedthrough
attachment (testing prior)
Height < 5mm
Callout # Draper ASIC
1 High Voltage Charge Pump
2 AC-to-DC Power Conversion
3 Neural Amplifier
4 Cross-point Switch
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SSL Satellite Enclosure• Alumina feedthrough substrate
– Pt/Ir pins
– Arrayed in sections for each electrodes and
bundles of percutaneous leads
– Alumina substrate brazed to Ti flange
– SMT component size on the pin side of the
board drives internal pin height
– Recesses in flange provides entry points for
each electrodes and percutaneous leads
• Enables wires to spread out, thus reducing
excess height from the bundling of wires
• Titanium cover
– Laser welded to feedthrough flange (hermetic)
– Laser marking on surface for system
serialization and traceability
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Leads Attachment to SSL Satellite
• Dissimilarity in materials (stainless steel wires
and Pt/Ir pins) Pt sleeves were used in early
feasibility studies.
– Provides additional thermal mass
– Provides additional support at the weld joint.
• Additional refinement in welding parameters
– Weld joints and pull strength of wires same, if
not more, than with sleeve ( ≥ 1 lb force)
• Advantage of not using the sleeves:
– Ability to observe wire contact during welded
– Ability for rework if needed
Welded with Pt sleeves
Welded without Pt sleeves
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SSL Overmolding
• Custom designed
encapsulation tool for
overmolding the satellite
– Dual layer process:
epoxy followed by
silicone.
– “Boot” design for cable
strain relief
Backer card for shipping
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Networked Active Leads System Overview
Implanted Components External
Components
Skin
Interface
Implantable
Controller
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Networked Active Leads System
SSL SatelliteRecording + Stimulation
ElectrodesMuscle + Nerve
Robotic HandMovement + Touch
Cuff AntennasWireless Power + Data
Controller ModuleNeural Decode + Encode
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Leadless System
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Leadless implants improve scalability and flexibility
GemstonesRecording + Stimulation
ElectrodesMuscle + Nerve
Controller ModuleNeural Decode + Encode
Cuff AntennasWireless Power + Data
Robotic HandMovement + Touch
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Leadless Gemstone Device
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GemstonesRecording + Stimulation
ElectrodesMuscle + Nerve
Implanted Gemstone Device Connected to Electrodes
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Wireless Gemstone Device
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ASICs
Draper Custom Designed ASIC’s Enable Efficient Microelectronics Packaging
AmplifiersStim DAC Bio Radio PowerSwitch Matrix
GemstonesRecording + Stimulation
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Wireless Gemstone Device
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Gemstone to Wearable Cuff Antennas Communicates and Powers
Antennas
Cuff AntennasWireless Power + Data
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Leadless and Wireless System
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Leadless implants improve scalability and flexibility
Stimulation produces
sensory percepts
Recordings control
hand movement
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Stimulation Particles
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Sacral Nerve Stimulation
1.3 mm
2 mm
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Stimulation Particles
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2 mm
Single wearable antenna patch
can coordinate therapies on up
to 10 particles
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Draper’s Neurostimulator Particle
48footer
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Future for Advanced Microelectronics
Packaging and Assembly
Medical Device and Diagnostic Industry (MDDI) article “How FDA Hinders Medical Device Innovation” (2015)
“FDA is slow to adopt evaluation guidelines for novel medical device technologies… small companies are paying the price”
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Unique Challenges:
Robust Design for Daily Use
Hermetic
Mechanical and Thermal Stability
Biocompatibility (novel materials – leachable,
delamination)
Sterility and Packaging
EMC Compatibility
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System Safety and Reliability Designs
• Biocompatible, non-cytotoxic materials
– Chemically stable in in vivo environment
– Metals and ceramics exposed to in vivo environment: Ti, Alumina for
package body, Pt/Ir for electrodes, SS316 LVM, Pt/Ir, Au for lead wires
– Insulators: Silicone, epoxy
• Mechanical stability, reliability
– TRANSFORM – Impact resistance
– HAPTIX - reliable against muscular motion, pistoning of electrodes at the
percutaneous interface
• Safety
– Intrinsically safe electrical design (i.e. power consumption vs. T rise)
– Electronics safe during surgical insertion (against electrocautery etc.)
– HAPTIX - minimal damage to nerve during electrode insertion
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Future for Advanced Microelectronics
Packaging and Assembly
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• Increase functionality Increase power requirement and/or space
(volume, footprint)
• Increase channel sites Increase feedthrough I/O and connector
Unique Challenges:
Efficient Electrical Design
Wireless Design
Battery Technology
Connector Technology
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Future for Advanced Microelectronics
Packaging and Assembly
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• Increase functionality Increase power requirement and/or space
(volume, footprint)
• Increase channel sites Increase feedthrough I/O and connector
Areas for Innovation
Custom Designed ASIC’s Miniaturization, Performance
Wireless Design Reduction in connection cables, Removal of battery
Battery Technology
Connector Technology
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A Vision for Next-generation Therapies
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• Informed decisions
– Systems-level view of disease
• Precise & coordinated therapies
– Exactly the right place
– Exactly the right time
• Personalized care
– Responsive feedback to
patients and clinician
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Acknowledgements
• TRANSFORM DBS and HAPTIX work was supported by the Defense
Advanced Research Projects Agency (DARPA), Biological Technologies
Office (BTO).
• Neurostimulation Particle work originated as a Draper’s Internal
Research and Development Program. Current work supported by AHA
and NIH.
• Collaborative effort with:
– Massachusetts General Hospital
– Nerves, Inc.
– University of Texas-Southwestern
– Arizona State University
– University of Texas – Dallas
– Numerous members at Draper
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Questions?