2008 ITRS Public Conference San Francisco, USA 1 DRAFT – DO NOT PUBLISH ITRS Factory Integration...
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Transcript of 2008 ITRS Public Conference San Francisco, USA 1 DRAFT – DO NOT PUBLISH ITRS Factory Integration...
2008 ITRS Public Conference San Francisco, USA 1DRAFT – DO NOT PUBLISHDRAFT – DO NOT PUBLISH
ITRS Factory IntegrationShige Kobayashi, Tom Jefferson
July 2008
San Francisco, USA
Global Co-Chairs:Europe: Arieh GreenbergJapan: Shige Kobayashi, Michio HonmaKorea: S. H. ParkTaiwan: Thomas ChenUS: Tom Jefferson
2008 Contributors: Terry Francis, Gopal Rao, Al Chasey, Les Marshall, Todd Lasater, Brad van Eck, Kenjiro
Nawa, Daniel Babbs, Dave Eggleston, Mutaz Haddadin, Gavin Rider, Andreas Neuber, Eric Englhardt, Peter Csatary, Adrian Pyke, Mikio Otani, Bill Fosnight, Richard Oeschner
Junji Iwasaki, Mazafumi Fukushima, Tomoyuki Masui
2008 ITRS Public Conference San Francisco, USA 2DRAFT – DO NOT PUBLISHDRAFT – DO NOT PUBLISH
Factory Integration Scope and Drivers
WaferMfg
ChipMfg
ProductMfg
Dis
trib
uti
on
• FEOL• BEOL
• Probe/Test• Singulation
• Packaging• Test
Si SubstrateMfg
ReticleMfg
Increasing cost &Cycle time implications
Factory is driven by Cost, Quality, Productivity, Speed, and FlexibilityReduce factory capital and operating costs per functionFaster delivery of new and volume products to the end customerEfficient/Effective volume/mix production, high reliability, & high equipment reuseEnable rapid process technology shrinks and wafer size changes
FactoryOperations
ProductionEquipment AMHS Factory Information
& Control Systems Facilities
UI
2008 ITRS Public Conference San Francisco, USA 3DRAFT – DO NOT PUBLISHDRAFT – DO NOT PUBLISH
Key Technologies that will Impact Factory Design 2008 and future years are targeted to meet productivity and capture technology
requirements Key process & device technology intercepts that will impact the factory design are
Extreme Ultraviolet Litho (EUVL), new materials, 450mm conversion, significant productivity improvements, and waste (inefficiencies) reduction
Economic and business challenges are equal to our manufacturing and process technology challenges in scope and breadth to attain efficiency and effectiveness
Year 2008 2009 2010 2011
Technology trend (nm)
65 55 50 45
Wafer Size (mm) 300 300 300 300
Near Term Years
Long Term Years
Year 2012 2013 2014 2015 2016 2017 2018 2019 2020 2021
Technology trend (nm) 40 35 32 28 25 22 20 18 16 14
Wafer Size (mm) 450 450 450 450 450 450 450 450 450 450
450mm ?NGF ?
Planning for NGF/450mm
EUVL in Production?
2008 ITRS Public Conference San Francisco, USA 4DRAFT – DO NOT PUBLISHDRAFT – DO NOT PUBLISH
FI 2008 FocusEnable the Transition to NGF / 450mm for cost, cycle time & productivity improvement
2008 Topics Result
1 Incorporate waste (inefficiency) reduction as part of FI roadmap
-Defined initial factory integration high level metrics for creation of a waste reduction roadmap
-Equipment Output Waste-Wait Time Waste
-Completed initial draft of package to communicate waste reduction roadmap approach
2 Improve data quality, & time to information
- Defined strategy for integrating time synchronization and data handling requirements between production equipment and factory information and control systems.
3 Develop Facilities modeling methodology
- Initial development of a modeling methodology for evaluating factory size and cost relationship
4 FOUP Airborne Molecular Contamination (AMC) requirements
- In conjunction with the Yield Enhancement TWG, reached consensus on monitoring and control methods, and developed initial requirements
2008 ITRS Public Conference San Francisco, USA 5DRAFT – DO NOT PUBLISHDRAFT – DO NOT PUBLISH
FI 2009 FocusEnable the Transition to NGF / 450mm for cost, cycle time & productivity improvement
Focus Areas 2009 Goals
1 Incorporate waste reduction as part of FI roadmap
Inclusion of initial high level Waste Reduction metrics and roadmap in FI Technical Requirements tables
2 Improve data quality, & time to information
Definition of requirements for equipment and factory data handling rates to improve equipment and productivity monitoring
3 Airborne Molecular Contamination Requirements
Incorporate AMC limits for wafer carriers into technical roadmaps and document potential solutions
4 Facility Modeling Methodology
Completion of a functional model validated against benchmarked data
5 Address FI Cross-cut issues
Address NGF/450mm and identify common areas of waste reduction needs and challenges.
Address FI key issues with FEP (Carrier Purging), Litho (Reticle Electrostatic Field, Double Patterning), ESH (Energy conservation), YE (AMC, PCS for Yield) and Metrology (Wafer map standards).
Other Focus Areas will be Addressed as RequiredOther Focus Areas will be Addressed as Required
2008 ITRS Public Conference San Francisco, USA 6DRAFT – DO NOT PUBLISHDRAFT – DO NOT PUBLISH
Supporting MaterialsFor ITRS Factory Integration 2008 and 2009 Focus Areas
2008 ITRS Public Conference San Francisco, USA 7DRAFT – DO NOT PUBLISHDRAFT – DO NOT PUBLISH
NGF/450mm Fab Guidelines
300mm プライム推進派JEITA Guidelines
Equipment maker Inputs
ISMI Guidelines
NG Factory Guidelines combined with ITRS TR & PS
ISMI Guideline AMHS Prod Eqp. FICS Facilities Operations25 wafer carrierFront opening carrierCarrier purging100% automated handlingReticle transportCommon reference platformBuffering exclusion zonePredictive MaintenanceParallel Maintenance and OperationSmart Idle ModeAdaptor PlateSetup Time / FWD eliminationSWP / mini-batchFlexible equipment CapacityContinuous Material ProcessingWafer level control during processingSingle, dedicated point of factory controlEquipment data for external monitoringMaterial Redirection (non unicassette) ops
Primary area(s) of relevanceSecondary area(s) of relevance
Factory Integration Sub-TeamsSOLUTIONS REQIURED - MAPPING
SourceXTime
DestXTimeSource STK
Wait TimeDest STKWait Time
Inter-BayXTimeSource Tool
Wait TimeDest ToolWait Time
Seasoningetc
Wafer by waferProcess
StartSpeed etcTool Tool
STK STK
Wafer PointOf View
2
6 45
3
ITRS FI TWG will synchronize with NGF and 450mm guidelines to address FI challenges, technology requirements and potential solutions
2005 2006 2007 2008 2009 2010 2011 2012?
2005 2006 2007 2008 2009 2010 2011 2012
Carrier & lot-sizedetermination
Direct TransportStandards
Production EquipmentStandards
Factory Control System Standards
Interoperability Testing& Reliability Verification
450mm waferStandards
Courtesy: JEITA/ISMI
300mmClassic
Today Next several years 450
Pro
duct
ivity
Axi
s
450mmEra
Time axis
300mmPrime
Driven by productivity & cost improvements (Cycle time & cost/cm2)
Cycle time &Cost/Cm2 reduction
2008 ITRS Public Conference San Francisco, USA 8DRAFT – DO NOT PUBLISHDRAFT – DO NOT PUBLISH
More Detailed Representation of Factory Waste
Wafer Equipment
Factory Integration Working Group Focus
People
Unit View
Silicon Waste
Equipment Resource
Waste
People Capability
Waste
Factory View
Wait time Waste
Equipment Output
Waste in Factory
People Output
Waste in Factory
2008 ITRS Public Conference San Francisco, USA 9DRAFT – DO NOT PUBLISHDRAFT – DO NOT PUBLISH
Waste Reduction Activity Time Table2008 2009
July Aug-Oct Nov Dec Jan Feb Mar April May Jun July
ITRS Events
2008 Focus Area manuscript
Winter meeting preparation
Material for IRC consideration
Spring meeting preparation
Finalizing ’09 ITRS
SummerMtg
WinterMtg
SpringMtg
Manuscript
SummerMtg
Working with Other TWGs
W/R Write Upfor 2009 ITRS
Work with other TWGsto pilot W/R
Review of W/R approach
FI W/R TR tables development
2008 ITRS Public Conference San Francisco, USA 10DRAFT – DO NOT PUBLISHDRAFT – DO NOT PUBLISH
Facility
Res
ou
rce
Vie
w
Wait Time (WTW) and Equipment (EOW) Output Waste
Cycle Time
WTWWTW
ReferenceReference
Wait TimeProduct
View
BottleneckResource
OperationEfficiency
Losses
AvailabilityEfficiency
Losses
AssignableQuality Losses
Rate EfficiencyLosses
E79
1
TheoreticalProduction
Time
Operation ViewLot SizeBatch SizeDandoriHot LotDispatch Rule
Trade-Off
X-FactorMetrics
2 ~N
AMHS
Raw ProcessTime
by Process Steps
OperatorsIssue: Comprehensive data collection of factory resource activitiesAddition of related factory resource activity data(; equipment, AMHS, operators, facility)
Standardization of data definition
Data collection automation
by Lotby Wafer
W/R :Waste ReductionWTW :Wait Time WasteEOW :Eqp Output Waste
W/R
Plan
Do
Check
KPIStructuredInformation
Action
EOWEOW
ReferenceReferenceOEE
Metrics
Waste Reduction Cycle
2008 ITRS Public Conference San Francisco, USA 11DRAFT – DO NOT PUBLISHDRAFT – DO NOT PUBLISH
Applying Waste Reduction to Drive The Industry in the Proper Direction
Wait Time Waste Baseline = time to process a single wafer in an un-loaded tool = CTmin Actual performance = cycle time of wafer when processed in production
with large lot Waste = (actual CT-CTmin)/CTmin
Equipment Output Waste Baseline = designed equipment output capability (wph) Actual performance = actual good production wafer output of the
equipment in production Waste = (capacity-actual good wfrs)/capacity * 100
2008 ITRS Public Conference San Francisco, USA 12DRAFT – DO NOT PUBLISHDRAFT – DO NOT PUBLISHFactory Integration - AMHS Sub-team June 18, 2008 12
Data Collection Roadmap
FICS PE
Tool
Sensor
HostSoftware
EDA
E148
(NTPv3)
FactoryTime Server
Data Frequency
Time Synchronization
2008 ITRS Public Conference San Francisco, USA 13DRAFT – DO NOT PUBLISHDRAFT – DO NOT PUBLISH
Process Mask LayersMetal LayersProcess Steps
Process Mask LayersMetal LayersProcess Steps
Process Tools
Physical Characteristics
(LxWxH, Weight, etc)
Process Materials
(New Technology Impact)
Facility (SF,M2)Clean space, Admin
Space, Non-clean space
Construction ImpactDesign/Build
TimeSchedule
Methodology for Methodology for Future Facility ModelingFuture Facility Modeling
High Level ApproachHigh Level Approach
HIGH LEVELFirst DraftAverage Tool Size Tool Scaling FactorAdmin Scaling FactorSupport Space Scaling FactorCost per square foot
2008 ITRS Public Conference San Francisco, USA 14DRAFT – DO NOT PUBLISHDRAFT – DO NOT PUBLISH
Total AMC Concept
WaferFOUP
Outgassing
Emissions
MonitoringCleaning
MonitoringCleaning
Tool/Mini-environment Residues, also
backside/bevel,
outgassingE
mission
s
Cleanroom(Outgassing)
Emissions
Emissions
Inlet air
MonitoringCleaning
Recirc airhandling
Make-up airhandling
StockerOperatorsSegregationSpillagesExhaust
CF
CF
CF
CF…Chemical filtration
YE Interface