180 BCDLite UHV Analog and Power - GlobalFoundries · ANALOG AND POWER 55 BCDLite 180 BCDLite 180...
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ANALOG AND POWER 55 BCDLite 180 BCDLite 180 UHV 130 BCDLite 130 BCD Analog and Power Advanced BCDLite ® , BCD, and UHV Process Technologies GLOBALFOUNDRIES Analog and Power process technologies enable effective product development with cost-effective integration of diverse functionality and best-in-class power devices across a wide range of voltages. The high- volume, production-proven processes meet the needs of low and high power applications and are available in feature sizes from 180nm to 55nm and operating voltages from 5V to 700V. GF’s BCDLite ® , BCD (Bipolar-CMOS-DMOS) and UHV mixed-signal process technologies are highly efficient and configurable for cost-sensitive applications such as power, analog, RF front end modules, MEMS drivers and MCUs. BCDLite and BCD process technologies offer a modular platform architecture based on GF’s low power logic process with integrated low and high voltage bipolar transistors, high voltage EDMOS/LDMOS transistors, precision analog passives and non-volatile memory for low cost and high performance. BCDLite/BCD PDKs are tailored for first time tape out success via accurate modeling and silicon verification of mismatch, noise, self-heating and other effects. Extensive Safe Operating Area (SOA) and aging characterization ensures avoidance of overdesign to enable the smallest possible die with high reliability. Layout optimized scaling of multi-finger devices includes accurate prediction of power device performance. Applications Highlights • BCDLite, BCD, and Ultra High Voltage (UHV) Technologies span wide voltage (5V-700V) and density ranges (180nm to 55nm feature sizes) • Power and high voltage transistors enable maximum efficiency and performance with smaller die area + Improved R sp up to 50% on 180 BCDLite Gen2 and 130 BCDLite Gen2 • Rich IP portfolio of the base logic process can be leveraged across analog and power boundaries to lower cost and speed time-to-market • BCDLite and UHV processes are tailored for mobile/consumer applications, DC-DC, AC-DC, PMIC, wireless charging, and lighting applications • BCD offers high-temp rated transistors and rugged power devices for industrial and automotive applications • Comprehensive design ecosystem + Full Foundation IP library and Memory Compiler + PDK optimized for analog and power designs + Calibrated power device models + Robust DFM solution • Extensive supply chain and services + Regularly scheduled MPWs + Layout database consolidation and mask assembly services + Advanced packaging and test solutions 180 BCDLite • Power/battery management • DC-DC Converters • Motor Control • Smart Lighting 180UHV • Solid State Lighting (LED light bulbs) • AC-DC Converters • Wireless Charging • HV Controller for MEMS 130 BCDLite/BCD • Industrial, Automotive • High-end Consumer • Communications • Wireless and HV charger • Smart Lighting • PoE 55 BCDLite • Mobile (WiFi/RF DC-DC) • Audio Amp & Switches • Battery Charging • DC-DC Converters • Power Applications with High Digital Content
Transcript of 180 BCDLite UHV Analog and Power - GlobalFoundries · ANALOG AND POWER 55 BCDLite 180 BCDLite 180...
ANALOGAND
POWER
55BCDLite
180BCDLite
180UHV
130BCDLite
130BCD
Analog and PowerAdvanced BCDLite®, BCD, and UHV Process Technologies
GLOBALFOUNDRIES Analog and Power process technologies enable effective product development with cost-effective integration of diverse functionality and best-in-class power devices across a wide range of voltages. The high-volume, production-proven processes meet the needs of low and high power applications and are available in feature sizes from 180nm to 55nm and operating voltages from 5V to 700V.
GF’s BCDLite®, BCD (Bipolar-CMOS-DMOS) and UHV mixed-signal process technologies are highly efficient and configurable for cost-sensitive applications such as power, analog, RF front end modules, MEMS drivers and MCUs. BCDLite and BCD process technologies offer a modular platform architecture based on GF’s low power logic process with integrated low and high voltage bipolar transistors, high voltage EDMOS/LDMOS transistors, precision analog passives and non-volatile memory for low cost and high performance.
BCDLite/BCD PDKs are tailored for first time tape out success via accurate modeling and silicon verification of mismatch, noise, self-heating and other effects. Extensive Safe Operating Area (SOA) and aging characterization ensures avoidance of overdesign to enable the smallest possible die with high reliability. Layout optimized scaling of multi-finger devices includes accurate prediction of power device performance.
Applications
Highlights• BCDLite, BCD, and Ultra High Voltage
(UHV) Technologies span wide voltage (5V-700V) and density ranges (180nm to 55nm feature sizes)
• Power and high voltage transistors enable maximum efficiency and performance with smaller die area
+ Improved Rsp up to 50% on 180 BCDLite Gen2 and 130 BCDLite Gen2
• Rich IP portfolio of the base logic process can be leveraged across analog and power boundaries to lower cost and speed time-to-market
• BCDLite and UHV processes are tailored for mobile/consumer applications, DC-DC, AC-DC, PMIC, wireless charging, and lighting applications
• BCD offers high-temp rated transistors and rugged power devices for industrial and automotive applications
• Comprehensive design ecosystem + Full Foundation IP library and
Memory Compiler + PDK optimized for analog and
power designs + Calibrated power device models + Robust DFM solution
• Extensive supply chain and services + Regularly scheduled MPWs + Layout database consolidation and
mask assembly services + Advanced packaging and test
solutions
180 BCDLite • Power/battery
management•DC-DC Converters•Motor Control• Smart Lighting
180UHV• Solid State Lighting
(LED light bulbs)• AC-DC Converters•Wireless Charging•HV Controller for
MEMS
130 BCDLite/BCD• Industrial, Automotive•High-end Consumer•Communications•Wireless and HV
charger• Smart Lighting• PoE
55 BCDLite•Mobile
(WiFi/RF DC-DC)• Audio Amp &
Switches•Battery Charging•DC-DC Converters• Power Applications
with High Digital Content
Key sub-segments HV Devices Temp Range Analog Embedded Memory GF TechnologyMobile
Battery 180/130 BCDLite®Core Processor 180/130 BCDLiteRF 130/55 BCDLiteImaging and Sensing 130/55 BCDLiteDisplay 130 BCDLite
AutomotiveHead End 130 BCDLite, BCDSensor / LV Network 130 BCDLite, BCDBody / Power Train
130 BCDLite, BCD
Interior 130 BCDLite, BCDIndustrial
Power Supplies
OTP, MTP 180UHVSolid State Lighting
OTP, MTP 180UHV
Motor / Generator
OTP, MTP 180/130 BCDLite, BCDData Center / Communications 180/130 BCDLite, BCD
Consumer / IoT TV / STB / Security 130 BCDLite, BCDAR / VR 130 BCDLiteWearables 130 BCDLite
Wireless Charging 130 BCDLite, BCDContact GF for latest availability by Automotive Grade. The table represents suitability of GF process nodes for each key requirement.
180 UHV 180 BCDLite® 130 BCDLite® 130 BCD 55 BCDLite®
Capability
FET Offerings CMOS: 3.3V / 18V / 30VUHV: Up to 700V
CMOS: 1.8V / 6VDMOS: 10V / 65V
CMOS: 1.5V / 5VDMOS: 10V / 30V
CMOS: 1.5V / 5VDMOS: 10V / 85V
CMOS: 1.2V / 3.3VDMOS: 5V / 12V
Foundation IP
Standard Cells 3.3V: 9T 1.8V: ULL 7T/9T, IC 9T5V & 6V: ULL & IC 9T 1.5V: 7T, 9T 1.5V: 7T, 9T 1.2V, 0.9V:
7T, 8T, 9T, 12TMemory Compiler SRAM, TCAM, ROM SRAM, ROM SRAM, ROM SRAM, ROM
GPIO 3.3V non-CUP 1.8V, 5V 1.5V, 5V 1.5V, 5V 1.5V, 2.5V, 3.3V, 5V
PLLSpecialty IO 12C 12C, USB, PCI
ESDNon-Volatile Memory
NVM: eFuseNVM: OTPNVM: MTP In Development In Development
NVM: eFlash In Development
Design Enablement
SPICE BSIM4.5 with Sub Circuit
PDK Cadence
DRC/LVS Mentor
RCS Mentor / Synopsys
QualificationRating Industrial Automotive Gr-1 Automotive Gr-1 Automotive Gr-0 Consumer
Temp Range (TA) -40°C to 125°C -40°C to 125°C -40°C to 125°C -40°C to 150°C -40°C to 105°C
Contact GF for latest availability by Automotive Grade. The table represents suitability of GF process nodes for each key requirement.
Key Markets and Segments
GF Technology Capabilities/Overview
Available In Development
Analog and Power Solutions
Battery Management
AC/DC Converter(PFC+PLC)180UHV
Battery Monitoring
Complete solution
130 BCD 130 BCD
Lithium-ionBattery Cells
Ch
arg
ing S
tati
on
130 BCDLite®
130 BCDInverter Electrical/
Motor Generator
Partial solution
Others
PowerManagement
BATTERY CHARGING
Audio Ampand Switches55 BCDLite®
Power Mux & LDOs
130/180 BCDLite®
Sensors
130/180 BCDLite®
SwitchingChargers
WallAdapter
180 UHV
Wireless Inductive/Mag. Resonance
130 BCDLite®
Interface &Authentication
55 BCDLite®
IMAGING & DISPLAY
TFT LCD Camera,OIS, Shuttle
130/180 BCDLite®55/40 DDI
WLED Backlight
OLED
RF POWER SUPPLY
130/180 BCDLite® 55 BCDLite®
Tx/BB Wi-Fi PACellular PA
High CurrentBucks, Boosts
130/180 BCDLite®
Main PMICs
SecondaryPMICs
130/180 BCDLite®
Analog and Power Solutions
Mobility and Consumer Analog and Power Applications
Automotive Power – EV Battery System Solutions
GLOBALSOLUTIONS is the sum of our internal resources and ecosystem partners, combined to efficiently enable the fastest time-to-volume. This ecosystem includes partners in all aspects of design enablement and turnkey services, OPC and mask operations, and advanced capabilities in assembly solutions.
GLOBALSOLUTIONS® Design and Manufacturing EcosystemLibraries
(Standard Cells,Memories)
Full Suite PDK, Reference Flow
BCDLite®, BCD, and UHV Process Technologies
SoC Packaging 2.5D and 3D Packaging
Analog /Mixed-signal
ProcessorIP
High-speedInterfaces
The information contained herein is the property of GLOBALFOUNDRIES and/or its licensors. This document is for informational purposes only, is current only as of the date of publication and is subject to change by GLOBALFOUNDRIES at any time without notice. GLOBALFOUNDRIES, the GLOBALFOUNDRIES logo and combinations thereof are trademarks of GLOBALFOUNDRIES Inc. in the United States and/or other jurisdictions. Other product or service names are for identification purposes only and may be trademarks or service marks of their respective owners. © GLOBALFOUNDRIES Inc. 2019. Unless otherwise indicated, all rights reserved. Do not copy or redistribute except as expressly permitted by GLOBALFOUNDRIES.
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Largest privately held semiconductor company
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GF created
Launches 14 nm FinFET technology
Acquires Chartered Semiconductor
• Fab 8 delivers initial silicon 1st time right
• Dresden ships 250,000th 32 nm HKMG wafer
Collaborates w/ Samsungon 14 nm manufacturing
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FX-14™ ASIC offering
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• Announces differentiated foundry strategy
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2018
Analog and Power Solutions
