スライド 1 - semiexpo.rusemiexpo.ru/docs/themes/Dr_Shiro_HARA.pdf ·...
Transcript of スライド 1 - semiexpo.rusemiexpo.ru/docs/themes/Dr_Shiro_HARA.pdf ·...
Issues in enlarging silicon wafer 1
12” 8” 6” 4”
80chips 180chips
300chips
1975~ 1980~
1991~
2001~
18”
700chips MAGA-trend
2020? 1600chips
Estimated by a chip size of 1cm2
(1) Huge investment
(2) Enormous waste
(3) Valley of death in R&D
[ハイテクものづくり.ppt]
(3) The Valley of Death in R&D
Mega Manufacturing
Minimal Way
[基礎の谷.ai]
Valley of Death
Facto
ry
Ind
ustria
l Re
sea
rch
Sectio
n
Pure
Scie
nce a
nd
Engin
eerin
g
Hig
h L
ost
Wide Gap
Hig
h In
ve
stm
en
t co
st
Lo
w In
ve
stm
en
t co
st
Industrial Implementation
Directly to the research facility
Research = Manufacture
3
Market
(1) Research sample size
(2) High quality control
by local clean technology
In this Minimal way, we can shrink the fab size.
To what degree do we shrink the fab size? 4
Number of WIP product types at a certain moment
In device fabs,
→ ~ 1,000 types @ a moment
1 type at a certain moment is an ideal fab.
Therefore, we make a fab of 1/1,000.
We call this fab of 1/1,000 “Minimal Fab”.
→ We use a tiny wafer intentionally.
Trend to enlarge silicon wafer 5
12” 8” 6” 4”
80chips 180chips
300chips
1975~ 1980~
1991~
2001~
18”
700chips MAGA-trend
0.5”
1chip
2010~
Minimal way
2020? 1600chips
Estimated by a chip size of 1cm2
Room-sized Minimal FAB
Traditional MAGA FAB
Scaling down of fabrication factory 6
200m 2m
10m 0.3m
wafer size: 0.5”
Fab investment 5B$
Fab investment 5M$
wafer size: 12”
1/1
,000
1/1
,000
No clean room
7
1 10 100 1,000 10,000 100,000 million 10million 100million
Ch
ip P
rices [
$/c
m2]
Life Production Volumes of Chips
Pri
ces o
f C
on
su
mer
Pro
du
cts
[$]
Price zone of
Major products
No one wants to
produce under
10,000 chips
Fabrication Design rules
40nm
60nm
90nm
130nm
180nm
250nm
Low
er
limit o
f consum
er
pro
duct
volu
me
Yearly capacity of Minimal fab
Primary
Target
Volume
Target Advanced
Target
Cost trends for production volumes
10
100
1,000
10
10
10
10
10
4
5
6
7
8
1
10
100
10
10
10
10
10
3
4
5
6
7
100B$/year 100B$/year
Variable Cost
Global Market
Minimal Hermetic-Seal Transfer System
Standardized Wafer Transfer system
Minimal
Lithography
Minimal
Plasma
Minimal
I/I
Minimal
・・・・・・
Minimal
Analyzer
Minimal
High-tech.
Analyzer
Minimal
High-tech.
Process
minimal PLAD minimal PLAD minimal PLAD
Minimal
Inspection
minimal PLAD
Minimal
High-tech.
Fabrication
minimal PLAD
PLAD:Particle Lock Air-tight Docking
minimal PLAD minimal PLAD
Minimal
Specific
process
Minimal
Specific
Process
Research
MInimal
Coat./Dev. Minimal CVD
Minimal
Wet Cleaner
minimal PLAD minimal PLAD minimal PLAD minimal PLAD minimal PLAD minimal PLAD minimal PLAD
Production / Development 30cm
8
Ultra rapid RD, and P
Minimal Shuttle
PLAD: Particle Lock Air-tight Docking system
PLAD: Particle Lock Air-tight Docking
A front chamber where particles are absolutely protected during opening
process of a shuttle
Process compartment
control compartment
PLAD
Minimal shuttle
Localized clean system for minimal fab
absolutely sealed wafer carrier
人
PLAD
Localized clean system (EPS:Encapsulated Production System)
no cleanwear
no cleanroom
Process machine
前室 PLAD
Machine No.1 Machine No.2 Machine No.3
UV cut carrier (shutle)
Process machine Process
machine
10
September 17, 2011
Depositio
n
Coatin
g
Exposure
Develo
pm
ent
Etc
hin
g
Resis
t R
em
oval
Wet
Cle
anin
g
Mask-less DLP Exposure
Process Unit
Control Unit
Imperfect process Area
0.50mm
Non coating area
0.28mm
Resist pattern after exposure
No particle without clean room.
12
Resist: TOK, OFPR-5000 4000rpm, 25sec ~1.00micron, Develop: NMD-3 35sec
R&D&P subjects of minimal fab 13
[3] Process technologies
[1] Materials, Parts, Modules
[2] Process equipment
We have to develop:
[5] Factory system
[4] Devices
In order to construct a minimal fab,
Back-end
DISCO
Adwelds
Kumamoto Bosei
Ishii Tool & Eng.
Apic Yamada
Ishida Sangyo
SS Techno Shibuya Kogyo
KAIJO
Invented Local Clean Technology
System Design
Nanotech Design Network
KOYU Sanyo Systec Inoue
Digital Electronics Phenomena Entertainment
Passage Yamaha Motor
Oki Engineering
Algo system
Factory construction
Taisei Asahikogyosha UEKI corporation
Rikenkeiki Epoch transport
Solution Ochanomizu PAT
Sano PAT Takewa PAT
TOOL Azbil
Yokogawa Solution Service
Rigaku
NTT DATA Mathematical Systems DAIWA
Mitsubishi UFJ Lease & Finance
Hugle Electronics
TRL
Meico Electronic
University, Public Sector
Yokohama Nat. Univ.
Waseda Univ.
Nagano PGIRC.
Hokkaido Univ.
Kyushu Univ. Yamaguchi Univ.
Nagoya Univ.
Akita Ind. Tech. Center
Kanazawa Univ.
Micromachine Center
Tohoku Univ.
Osaka Univ. Kyoto Univ.
Nara Inst. Sci. Tech. Toyohashi Univ. Tech.
Sanmei
Okamoto Glass CKD Fujikin
PRE-TECH Litho Tech Japan
PMT
Shin-Etsu Polymer
Dainichi Shoji
JEM
Fujikoshi machinery
FUJI IMVAC
Komatsuseiki
Beamtron
Riseone
VIYIA
Koyo Thermo
Kashiyama
Horiba STEC
TAZMO
Sakaguchi E.H VOC
STK technology
Yonekura MFG
Aichi system
KKE TCK
Seinan Industries VTEX
Hakuto
YGK
Oriental motor
SPP technologies
SMC
Sanyou
Nitto Reinetsu
Hirose Electric Japan Science Eng.
Epiquest
Surpass Industry
Taiyo Nissan
Tateyama Machine Kanto Chemical
ULVAC
Wide Techno Xevios
Cotec Shinkouseiki
Equipment, Parts, materials
Fab-less Logic Research
RF device tech.
Innovation Platform
R&D: 10 times faster Investment: 1/1,000
Device makers, Minimal Fab Users
Murata Manufacturing Renesas Semi. Manufacturing
Hitachi Toshiba Omron NEC Yokogawa EL
Kyowa Electric Instruments
Hamamatsu Photonic JTEKT TOKAI RIKA TDK
TAMURA Panasonic Factory Solutions
Fab System Research Consortium, AIST
RIX
Haruki Seisakusho
Edwards Japan
YAZAKI
NEDIA
NIMS
NAGASE
FUJI Tech.
Tomoe Shokai
JFE Shoji Electronics
Materials
Parts, Units
Flextronics Keiso Kogyo
Equipment
August 21, 2016.
Docking Port
Minimal Foundry
NEITAS
Kanagawa Ind. Tech. Center
TEI Solutions
PMT
Eco-system in minimal fab 14
Minimal fab@AIST
Gate Oxidation
Oxide Etcher
Resist Remover
Al wet etcher
Etcher
Developer Coater
Etcher Sputter
Maskless exposure
DRIE
Wafer Scanner
Packaging line
RCAstation
P Diffusion furnace
B Diffusion furnace
15
Ring Oscillator
PMOS
CMOS
Cantilever
MEMS core: cantilever
Hybrid
pMOSFET
nMOSFET
CMOSFET
CMOSFET
Minimal Device Fabrication History
2012
2013
2015
Ring Oscillator
Ring Oscillator
16
BGA package
Hybrid
Hybrid
Full Minimal
Full Minimal
Full Minimal
Hybrid
2016
Full Minimal
17 MOSFET by Full minimal processes
6mm
SiO2
Boron-doped P Boron-doped P
n-Si
DrainSource Gate60nm
8mm
Al 350nm
0 -2 -4 -6 -8 -10
0.0
-0.2
-0.4
-0.6
-0.8
-1.0
-1.2
-1.4
-1.6
-1.8
p -channel MOSFET
Vg = -3V
Vg = -4V
Vg = -5V
Vg = -6V
Vg = -2V D
rain
Curr
ent
I d [m
A]
Drain Voltage V d [V]
Vg = -1V, 0V
Wafer no. 17 L/W = 14/100micron, Tox = 62nm
Wafer no. 17 L/W = 14/100micron, Tox = 62nm
fabricated at Semicon Japan 2013.
Gate Source
Drain GND
7wafers, 35Tr. → Yeild100%
S. Khumpuang F. Imura, and S. Hara, "Analyses on Cleanroom-Free Performance and Transistor Manufacturing Cycle Time of Minimal Fab," IEEE Transactions on Semiconductor Manufacturing, 28(4), 551-556 (2015).
Interface states: Dit 7.7×1010states/cm2
Utilizing rate@Semicon Japan 2013
・wafer transfer time to machine process chamber → 30s
● Avg. total process completed time : 10h25m ● Avg. process availability : 60%
Typical developing line ・Fabrication time 1 month ・process availability ~1%
Process Avalability
60%
Process Idle
38%
Transfer time Between machine
2 %
● No. of wafers : 7 ● 30 processes (excl.alignment mark forming)
Raw Time complete time
Process availability(%)
=
18
S. Khumpuang F. Imura, and S. Hara, "Analyses on Cleanroom-Free Performance and Transistor Manufacturing Cycle Time of Minimal Fab," IEEE Transactions on Semiconductor Manufacturing, 28(4), 551-556 (2015).
2011 2012 2013 2014 2015 2016 2017 2018 2019 2020 2021 2022 2023
19
June 3, 2017.
FY
MEMS Core Structure
Discrete CMOS Device and Process
LSI Process
LSI trial Fab (160 tools)
LSI production Fab
Specific Tools Prototype
MEMS Process
Discrete Process Discrete Fab
MEMS Fab
Core Tools Prototype Advancing Tool Performance High Throughput,
Low Cost
Commercialize Core Tools
Commercialize Specific Tools
hybrid
MEMS
Discrete
LSI
Analog Process Analog Fab
Industria
lize
Min
imal T
ools
87%
Energ
y
Savin
g
Sm
all P
roductio
n F
ab
Industria
lize F
ab
for S
imple
devic
es
99%
Energ
y
Savin
g
Rea
lize
“M
y Io
T d
evic
e”
Susta
inable
Industry
1st : Tool Dev. 2nd : Fundamental Fab 3rd : LSI Fab
hybrid
CMOSFET
full minimal full minimal
nMOSFET pMOSFET
MEMS core: cantilever
Roadmap for minimal fab
Minimal Tools
Device & Fab
・Small Business, Small Factory(Minimal Fab) ・High-variation low-volume Production ・Contribute to local area, distribute the risk, ICT・Networking ・Smart business, customer-oriented, ・Less Valley of Death
・Monolithic Fab(Mega Fab) ・Low-variation large-volume production ・Centralized business group, Intensive risk ・Old tradition business, maker-oriented, ・Deep Valley of Death → Paradigm Shifts to 21st century
20th Century, Industrial Engines:
21st Century, Industrial Engines:
Industrie 4.0 Advanced Manufacturing (3D printer)
20 Industrial aspect of minimal fab
Minimal Fab is a good model.