a

a2

b

a

b

a2

sample iii SiNx surface with CdS wires ALD coated with SiO2 with APTES

sample iv SiNx surface with CdS wires ALD coated with SiO2 NO APTES

WITH PURIFIED DNA ORIGAMI FROM NORTON GROUP, CROSS DESIGN

the remainder of the chips not labeled a or b or a2 are untreated, these areas were never exposed to anything in our lab

WITH RECTANGULAR ORIGAMI CONSTRUCT (1.6nM NOT PURIFIED) FROM SEEMAN LAB WITH 20NM GOLD NANOPARTICLES ATTACHED VIA DNA OLIGO TETHERS

WITH PURIFIED DNA ORIGAMI FROM NORTON GROUP, CROSS DESIGN - no surface decoration seen

a

iii – SiNx chip surface with CdS nanowires with 3nm of ALD SiO2 and APTES

WITH PURIFIED DNA ORIGAMI FROM NORTON GROUP, CROSS DESIGN

cantilever is 115um long

this wire is from the same chip (iii), but from an untreated area, no surface decoration seen

checked construct on mica

iii – SiNx chip surface with CdS nanowires with 3nm of ALD SiO2 and APTES

b

WITH RECTANGULAR ORIGAMI CONSTRUCT (1.6nM NOT PURIFIED) FROM SEEMAN LAB WITH 20NM GOLD NANOPARTICLES ATTACHED VIA DNA OLIGO TETHERS

cantilever is 115um long

checked construct on mica

full-z scale overview of wire above

a2

iv – SiNx chip surface with CdS nanowires with 3nm of ALD SiO2 NO APTES

WITH PURIFIED DNA ORIGAMI FROM NORTON GROUP, CROSS DESIGN - NO surface decoration seen, apparently APTES is important for origami to CdS binding

this wire is from the same chip (iv), but from an untreated area