NEBS 2009 Optimization of Telecom Networks … TPRoGDW8.pdf · NEBS 2009 Optimization of Telecom...

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Transcript of NEBS 2009 Optimization of Telecom Networks … TPRoGDW8.pdf · NEBS 2009 Optimization of Telecom...

NEBS 2009 Optimization of Telecom Networks Through Energy EfficiencyEitan Amon Type Approval Team Leader – Comverse Ltd.

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Comverse Top Worldwide Customers *

* Partial list only

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Americas EMEA APAC

What is NEBS

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NEBS (Network Equipment-Building System)describes the environment of a typical United States Regional Bell Operating Company (RBOC) Central Office (CO). NEBS is the most common set of safety, spatial and environmental design guidelines applied to telecommunications equipment in the United States. It is an industry requirement, but not a legal requirement.NEBS was developed by Bell Labs in the 1970s with an objective to make it easier for a vendor to design equipment compatible with RBOC CO environment. Telcordia now manages the NEBS specifications.

Telecommunications Carrier Group (TCG)

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Although most standards are based on the same regulations (GR-63-CORE, GR-1089-CORE, etc), some carriers may require added testing over others. The Telecommunications Carrier Group (TCG) was formed in early 2004 to harmonize NEBS testing of telecommunications equipment throughout the industry (AT&T, Verizon, Bell South, Qwest). Since carriers require NEBS testing for their telecommunication network equipment, they realized it was critical to communicate their compliance concerns to the equipment suppliers and the independent test laboratories (ITLs).

Verizon TPR

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Verizon TPR (Technical Purchasing Requirements)WEB: http://www.verizonnebs.com/tprs.html•VZ.TPR.9205 Energy Efficiency Requirements for Telecommunications Equipment•VZ.TPR.9207 TEEER Metric Quantification•VZ.TPR.9208 Thermal Management Requirements for Improved Energy Efficiency of Telecommunications Equipment•VZ.TPR.9307 Qualification Requirements for Printed Board Assemblies Manufactured with Lead-Free Solder for use in Telecommunications Equipment

VZ.TPR.9205 & VZ.TPR.9207 (TEEER)

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To reduce its power consumption and energy costs and shrink its carbon footprint, Verizon has established its own energy-consumption standard and an associated measurement process for new telecommunications-related equipment. The standard,VZ.TPR.9205, is applicable to broadband, video, data-center, network and customer premises equipment purchased after Jan. 1, 2009.

VZ.TPR.9205

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The purpose of this Technical Purchasing Requirement (TPR) document is to provide a Telecommunications Equipment Energy Efficiency Rating (TEEER) methodology for procuring equipment assemblies used in Verizon’s telecommunications networks. The intent is to foster the creation of more energy efficient telecommunications equipment by Verizon’s supplier community thereby reducing the energy requirements in Verizon networks.

VZ.TPR.9205 (cont’d)

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This TPR document provides the test methodology for calculating the TEEER to be used by Verizon in evaluating the supplier’s equipment. This methodology is applicable to but not limited to shelf, frame and cabinet mounted DC powered network equipment to be installed in environmentally controlled environments and equipment located at the customer premises (CPE). AC powered customer premises equipment (CPE) and AC powered data center type equipment shall also be covered in this TPR.

Equipment Currently Covered by TEEER

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Transport Optical /Video /PtP Microwave Transport Switch/Router Gateways Access DSLAM OLT Power Rectifiers Converters Inverters etc.Data Center Equipment Servers CPE (Customer Premises Equipment) External Power Adapters, Set-Top Boxes, ONT Power Supplies Wireless Power Amplifiers

• Height = 7 feet • Width = 23 inches (typical rack width) • Depth = 42 inches

TEEER Utilization Conditions for EUT

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Utilization Conditions for EUT Percentage of Utilization

Utilization Condition 1 100% (Max)

Utilization Condition 2 50%

Utilization Condition 3 0% (Sleep)

PTotal = (0.35 x Pmax) + (0.4 x P50) + (0.25 x Psleep)

TEEER Formulas

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Equipment Type TEEER Formula

Transport -log(Ptotal/Throughput)

Switch/Router -log(PTotal / Forwarding Capacity)

Media Gateway -log(PTotal / Throughput)

Access (Access Lines / PTotal ) + 1

Power (POut Total / PIn Total) x 10

Power Amplifiers (Wireless) (Total RF Output Power / Total Input Power) x 10

Examples of TEEER Formulations (1)

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Access Access Lines = 284 Pmax = 120 W P50 = 80 W Psleep = 40 W PTotal = (0.35 x 120) + (0.4 x 80) + (0.25 x 40) = 84 W TEEER = (Access Lines / PTotal ) + 1 TEEER = (284 / 84) + 1 TEEER = 4.38 (Pass Limit = 2.50)

Examples of TEEER Formulations (2)

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Power POut max = 800 W POut 50 = 400 W PIn max = 844 W (94.8% Efficiency!)PIn 50 = 462 W (86.5% Efficiency)PTotal Out = (800 + 400)/2 = 600 PTotal In = (838 + 462)/2 = 650 TEEER = (PTotal Out / PTotal In) x 10 TEEER = (600 / 650) x 10 TEEER = 9.23 (Pass Limit = 9.00-9.20)

TEEER Pass/Fail Criteria

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Equipment Type Minimum TEEER Allowable

Transport 7.54

Optical and Video 7.54

Point-to-Point Microwave 5.75

Switch/Router 7.67

Media Gateway 6.54

Access 2.50

Power 9.20

Rectifier 9.20

Converter 9.10

Inverter 9.00

Power Amplifier (Wireless) 1.05

Server 6.53

ONT Power Supply 7.20

Industry Benchmarks used by TEEER

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• Servers – SPECpower_ssj2008TM• External Power Adapters – ENERGY STAR®• Set-Top Boxes – ENERGY STAR®

End of section 1

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VZ.TPR.9208 (Thermal)Thermal Management Requirements for Improved Energy Efficiency of Telecommunications Equipment

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This VZ.TPR document specifies the Verizon Thermal Modeling Simulation and Test (TMST) requirements to help improve the Energy Efficiency of Telecommunications Equipment purchased by Verizon. These equipments are for use in either Controlled (Central Office and CEV) or Uncontrolled (OSP and RT) environment applications.

VZ.TPR.9208 (Cont’d)

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The TMST program requires that thermal management be used, as part of an integrated equipment design process, to effectively and efficiently minimize and remove the heat generated by the equipment when it is powered up and in operation. This ensures the equipment functions at its optimum thermal operating point, has correctly sized fans for heat removal, if applicable, and results in the constituent components operating within their specific thermal constraints. The overall goal is to help reduce energy consumption and assure equipment reliability.

Highlights of VZ.TPR.9208 (Thermal)

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•Modeling•Computational fluid dynamics•Natural Convection and Forced air convection•Enclosure Thermal Impedance (Airflow Impedance)•Fan & Enclosure Characteristic Curve •Design through thermal simulation•Validation of abnormal conditions•Optimizing cooling efficiency

Thermal How -To?

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By the use of any of the many commercially available Computational Fluid Dynamics (CFD) software programs to execute the heat flow calculations based on a representative physical model of the equipment.

Thermal modeling, simulation and analysis of the equipment can be done by the equipment manufacturer or by a selected Verizon certified Independent Test Laboratory (ITL)

A Sample of Thermal Requirement:“Enclosure internal ambient temperature ”

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The equipment manufacturer or the ITL shall record the simulated ambient temperature profile and values internal to the enclosure at external ambient of 40°C (CO and CEV applications) and 65°C (OSP applications) The ITL shall verify the simulated ambient values by measurement. The internal ambient temperatures shall not exceed: TAMB = 50°C for CO (+10°C) and CEV applications or 85°C OSP applications (+20°C).

End of Section 2

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VZ.TPR.9307 (“Lead -Free”)

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Effective from June 1, 2010, PBAs manufactured with ‘lead-free’ solders should meet the service life and reliability requirements in Verizon applications. These PBAs are for use in either Controlled (Central Office and CEV) or Uncontrolled (OSP and RT) environment applications.The qualification tests and requirements are for both equipment manufacturers and Verizon certified ITL as the minimum set of requirements and tests for PBA qualification. Additional manufacturer-specific tests maybe added as needed to properly exercise the materials, technology, design and manufacturing processes used by the manufacturer.

“Lead -Free” Equipment Applicability

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1. Intended for delivery to Verizon2. Manufactured with lead-free solder3. Designed and manufactured in conformity to GR-357-CORE, GR-78-CORE and within the Technology and Reliability boundaries specified in Section 7.3 of the TPR

“Lead -Free” Tests Highlight

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Verizon requires that manufacturers submit samples of their PBAs, to a Verizon certified ITL to conduct qualification testing and verification of conformance to the lead-free PBA test requirements specified in the TPR document.Test spec is based on NEBS Generic requirements (GR), IPC, JEDEC, IEC, MIL STD and others.

Eitan Amon