Global Expert Technologies

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Global Expert Technologies. Contents. Company Overview Commitments to Quality Manufacturing Facility Technical Capabilities. Contents. Company Overview Commitments to Quality Manufacturing Facility Technical Capabilities. Global Expert Technologies. - PowerPoint PPT Presentation

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Global Expert Technologies

Contents

Company Overview

Commitments to Quality

Manufacturing Facility

Technical Capabilities

Contents

Company Overview

Commitments to Quality

Manufacturing Facility

Technical Capabilities

Global Expert Technologies

HK-based company with manufacturing in Huizhou Focus on PCB manufacturing Low to Mid volume production Specialised on technically-challenging processes / products Diversified customer base and business segments

Relentless commitments to Quality Stringent management in environmental control Passion in social responsibilities

Company Milestone

2002• Trading• Drilling & Film

Plotting• Obtained UL

2012• Phase 4 Expansion (Inner Layer)

Completed

2007• Phase 2 Expansion

Completed

2003• Huizhou Plant

Phase 1 Completed

2004• Accredited ISO9001 and TL9000• Obtained ISO14001 2008

• Obtained ISO16949

2010• Phase 3 Expansion

Completed• Roll out Quick Turn

Services

Corporate Culture

Our Philosophy Having Quality People and Providing Quality Products

Our MissionTo satisfy our customer’s needs, provide highly professional

service and deliver product excellence

Our Environmental CommitmentsTo produce environmental friendly products and apply

comprehensive environmental protection strategies throughout the manufacturing process

Account Management – One-Stop Solution

Order Placement

Technical communication

Contract Review

Enquiry/Quotation

Quality Improvement

Follow-up Services

Delivery

Production

CustomerAccountManager

You may always escalate issue to our director, Terence Khoo

(terence.khoo@getpwb.com)

Global Business ….. Customers from more than 50 countries

West EuropeChina

East Europe

Asia

America

South AfricaArgentina

Turkey

Ukraine

IRAN

Malaysia

Product Breakdown

Data : End 2011

DS40%

4 L26%

6 L20%

>= 10 L4%

8 L10%

Layer Count Product Segment

Computing & Consumer

7%

Medical & Instrument

3%

Communi-cation35%

Automotive30%

Industrial25%

Contents

Company Overview

Commitments to Quality

Manufacturing Facility

Technical Capabilities

Quality Certificates Accredited

Environmental Commitment

GET is a Green PCB Enterprise

A “Model Enterprise” awarded by Huizhou government

in 2008

500 Tons Waste Treatment FacilityRecycle Water System

Contents

Company Overview

Commitments to Quality

Manufacturing Facility

Technical Capabilities

Huizhou – A Green City with Rich History

• Huizhou lies strategically next to Guangzhou, Dongguan, Shenzhen and Hong Kong, with easy access to major air and sea ports in the fastest-growing region in the world.

• Huizhou’s two state-level development zones, Daya Bay Economic Development Zone and Zhongkai Hi-tech Industrial Park, Huizhou are home to manufacturing base of many MNCs like LG, Samsung, Lenovo, TCL/Thomson and etc.

• Huizhou was founded in 214 BC after Qin unified China and Emperor Qinshihuang set up the Boluo County.

• With permanent residents at 3.77 million. Huizhou has won numerous awards in China as a city, including China Top Tourism City, China Clean City, China Forestation City, Example City in Environment Protection, China Top 10 Gardening City, Best Residence Award, and China Leading City in Civilization etc.

Hong KongMacau

Huizhou Manufacturing Facility

Total Floor Area Total Floor Area :: 16,600 m2

Work ForceWork Force :: 400Annual CapacityAnnual Capacity :: 500,000 m2

1. Engineering (CAD/CAM)

4. CNC Drilling

5. Automatic Panel Plating Line

7. Automatic ENIG Plating Line

6. Stripping, Etching and Tin Stripping

8. Dry Film Imaging

10. Flying-probe Test9. Dry Film Development 11. E-Test 12. Final QC

2. Mass Lamination 3. Automatic Optical Inspection

Contents

Company Overview

Commitments to Quality

Manufacturing Facility

Technical Capabilities

Process and Product Capabilities

PRODUCT FINISHING LAMINATES BOARD THICKNESS

Rigid PCBMulti-layer ≤26 layers

Double SidedHeavy Copper PCB

(6oz finished)

Hot Air Leveling /HASL (lead free)

Immersion Gold,Immersion SilverGold Fingers

Carbon Ink, OSP

FR-4, Roger, High TG FR-4,

Halogen Free FR-4,

0.2~5.0mm(8 – 200 mil)

MIN FINISHED HOLE SIZE

SOLDER MASK INK OUTLINE PROFILE

MAX.PANEL SIZE

Laser Drill:0.10mm(4mil)Tolerance:0.01mmMechanical Drilling:

MIN:0.15mmTolerance:

± 0.05mm (PTH)±0.03mm (NPTH)Aspect rate: 1:8

LPI SoldermaskPeelable Soldermask

Punching, Routing,Punch And Push

Back

476mm X620mm

(18.7”X24”)

Technology Advancements

GET has a dedicated team focus on Research and Development

• Blind via• Buried via• Back panel• Half-moon

hole• Immersion

gold • Chemical tin• HAL (lead

free)

• Lead Free Products

• Immersion Silver

• Gold Finger• Rogers+FR4

• HDI• Micro-Vias• Al Base PCB

• Trace Space /Width:

• 0.075mm• Min. Finished

Hole• Size: 0.15mm • 4/L : 0.40mm

Board• thickness

2005 2006 2007 2008 2009

• Plugged via-holes

• with resin• NPG TG150

PCB

2010

• Aspect ratio 1:10

• Quick Turn Service