Global Expert Technologies
19
Global Expert Technologies
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Global Expert Technologies. Contents. Company Overview Commitments to Quality Manufacturing Facility Technical Capabilities. Contents. Company Overview Commitments to Quality Manufacturing Facility Technical Capabilities. Global Expert Technologies. - PowerPoint PPT Presentation
Transcript of Global Expert Technologies
Global Expert Technologies
Contents
Company Overview
Commitments to Quality
Manufacturing Facility
Technical Capabilities
Contents
Company Overview
Commitments to Quality
Manufacturing Facility
Technical Capabilities
Global Expert Technologies
HK-based company with manufacturing in Huizhou Focus on PCB manufacturing Low to Mid volume production Specialised on technically-challenging processes / products Diversified customer base and business segments
Relentless commitments to Quality Stringent management in environmental control Passion in social responsibilities
Company Milestone
2002• Trading• Drilling & Film
Plotting• Obtained UL
2012• Phase 4 Expansion (Inner Layer)
Completed
2007• Phase 2 Expansion
Completed
2003• Huizhou Plant
Phase 1 Completed
2004• Accredited ISO9001 and TL9000• Obtained ISO14001 2008
• Obtained ISO16949
2010• Phase 3 Expansion
Completed• Roll out Quick Turn
Services
Corporate Culture
Our Philosophy Having Quality People and Providing Quality Products
Our MissionTo satisfy our customer’s needs, provide highly professional
service and deliver product excellence
Our Environmental CommitmentsTo produce environmental friendly products and apply
comprehensive environmental protection strategies throughout the manufacturing process
Account Management – One-Stop Solution
Order Placement
Technical communication
Contract Review
Enquiry/Quotation
Quality Improvement
Follow-up Services
Delivery
Production
CustomerAccountManager
You may always escalate issue to our director, Terence Khoo
Global Business ….. Customers from more than 50 countries
West EuropeChina
East Europe
Asia
America
South AfricaArgentina
Turkey
Ukraine
IRAN
Malaysia
Product Breakdown
Data : End 2011
DS40%
4 L26%
6 L20%
>= 10 L4%
8 L10%
Layer Count Product Segment
Computing & Consumer
7%
Medical & Instrument
3%
Communi-cation35%
Automotive30%
Industrial25%
Contents
Company Overview
Commitments to Quality
Manufacturing Facility
Technical Capabilities
Quality Certificates Accredited
Environmental Commitment
GET is a Green PCB Enterprise
A “Model Enterprise” awarded by Huizhou government
in 2008
500 Tons Waste Treatment FacilityRecycle Water System
Contents
Company Overview
Commitments to Quality
Manufacturing Facility
Technical Capabilities
Huizhou – A Green City with Rich History
• Huizhou lies strategically next to Guangzhou, Dongguan, Shenzhen and Hong Kong, with easy access to major air and sea ports in the fastest-growing region in the world.
• Huizhou’s two state-level development zones, Daya Bay Economic Development Zone and Zhongkai Hi-tech Industrial Park, Huizhou are home to manufacturing base of many MNCs like LG, Samsung, Lenovo, TCL/Thomson and etc.
• Huizhou was founded in 214 BC after Qin unified China and Emperor Qinshihuang set up the Boluo County.
• With permanent residents at 3.77 million. Huizhou has won numerous awards in China as a city, including China Top Tourism City, China Clean City, China Forestation City, Example City in Environment Protection, China Top 10 Gardening City, Best Residence Award, and China Leading City in Civilization etc.
Hong KongMacau
Huizhou Manufacturing Facility
Total Floor Area Total Floor Area :: 16,600 m2
Work ForceWork Force :: 400Annual CapacityAnnual Capacity :: 500,000 m2
1. Engineering (CAD/CAM)
4. CNC Drilling
5. Automatic Panel Plating Line
7. Automatic ENIG Plating Line
6. Stripping, Etching and Tin Stripping
8. Dry Film Imaging
10. Flying-probe Test9. Dry Film Development 11. E-Test 12. Final QC
2. Mass Lamination 3. Automatic Optical Inspection
Contents
Company Overview
Commitments to Quality
Manufacturing Facility
Technical Capabilities
Process and Product Capabilities
PRODUCT FINISHING LAMINATES BOARD THICKNESS
Rigid PCBMulti-layer ≤26 layers
Double SidedHeavy Copper PCB
(6oz finished)
Hot Air Leveling /HASL (lead free)
Immersion Gold,Immersion SilverGold Fingers
Carbon Ink, OSP
FR-4, Roger, High TG FR-4,
Halogen Free FR-4,
0.2~5.0mm(8 – 200 mil)
MIN FINISHED HOLE SIZE
SOLDER MASK INK OUTLINE PROFILE
MAX.PANEL SIZE
Laser Drill:0.10mm(4mil)Tolerance:0.01mmMechanical Drilling:
MIN:0.15mmTolerance:
± 0.05mm (PTH)±0.03mm (NPTH)Aspect rate: 1:8
LPI SoldermaskPeelable Soldermask
Punching, Routing,Punch And Push
Back
476mm X620mm
(18.7”X24”)
Technology Advancements
GET has a dedicated team focus on Research and Development
• Blind via• Buried via• Back panel• Half-moon
hole• Immersion
gold • Chemical tin• HAL (lead
free)
• Lead Free Products
• Immersion Silver
• Gold Finger• Rogers+FR4
• HDI• Micro-Vias• Al Base PCB
• Trace Space /Width:
• 0.075mm• Min. Finished
Hole• Size: 0.15mm • 4/L : 0.40mm
Board• thickness
2005 2006 2007 2008 2009
• Plugged via-holes
• with resin• NPG TG150
PCB
2010
• Aspect ratio 1:10
• Quick Turn Service
