C3 Semiconductor, LLC - AMS Technologies · 2012. 1. 5. · C3-6-1-4Heatsink(Fig.30) 55~ 73 110...

Post on 19-Mar-2021

0 views 0 download

Transcript of C3 Semiconductor, LLC - AMS Technologies · 2012. 1. 5. · C3-6-1-4Heatsink(Fig.30) 55~ 73 110...

Speci�cations and availability subject to change. Dimensions are shown for reference purposes only.

1

Air Cooling Heatsink For power semiconductor modules

Heatsink for power modules

Air Cooling Heatsink For modules Only

E Series Section Steel Heatsink(Fig.19)

93.3Module 2540 25.2

Applicable device Sectional area(cm2 )m/gk(thgieW) Perimeter(mm)

N Series Section Steel Heatsink(Fig.21)

29.3Module 1924 7.95

Applicable device Sectional area(cm2 )m/gk(thgieW) Perimeter(mm)

HS E 300HS Letter Number

1: Air Cooling Heatsink for modules only2: Outlook Code3: Length(mm)

1 2 3

M Series Section Steel Heatsink(Fig.20)

44.45Module 212561

Applicable device Sectional area(cm2 )m/gk(thgieW) Perimeter(mm)

Y Series Section Steel Heatsink(Fig.22)

77.78Module 2302 21

Applicable device Sectional area(cm2 )m/gk(thgieW) Perimeter(mm)

C3 Semiconductor, LLC

WEB SITE: http://www.C3semi.com

For recommended applications and more information contact: USA : Sales SupportC3 Semiconductors, LLC. 501 West Broadway St, Suite 800, San Diego, CA 92101Email : sales@c3semi.com

(888) 882-8689

For recommended applications and more information contact: USA : Sales Support

Speci�cations and availability subject to change. Dimensions are shown for reference purposes only.

2

Air Cooling Heatsink For power semiconductor modules

L Series Section Steel Heatsink(Fig.23)

59.3Module 610803

Applicable device Sectional area(cm2 )m/gk(thgieW) Perimeter(mm)

P Series Section Steel Heatsink(Fig.24)

Applicable device

66.7Module 1205 18.8

Sectional area(cm2 )m/gk(thgieW) Perimeter(mm)

C3-4-4 Heatsink(Fig.25)

34~ 50 9.5315

Surfacedimension

Applicable casesurface

Sectional area(cm2)

Thisproductappliesto600~1200Aelementassemblings,andinverseparallel,seriesconnectionpowersets,wind speed 4m/sec

Application

1513

Perimeter(mm)

9.7

Weight(kg/m)

C3-4-8 Heatsink(Fig.26)

34~ 50 1345

Surfacedimension

Applicable casesurface

Sectional area(cm2)

This product applies to600~1200Aelementassemblings,andinverseparallel,seriesconnectionpowersets,wind speed 4m/sec

Application

1190

Perimeter(mm)

8.4

Weight(kg/m)

C3-4-7 Heatsink(Fig.27)

34~ 55 31.2665

Surfacedimension

Applicable casesurface

Sectional area(cm2)

This product applies to600~1200Aelementassemblings,andinverseparallel,seriesconnectionpowersets,wind speed 4m/sec

Application

2170

Perimeter(mm)

14.4

Weight(kg/m)

C3 Semiconductor, LLC

WEB SITE: http://www.C3semi.com

For recommended applications and more information contact: USA : Sales SupportC3 Semiconductors, LLC. 501 West Broadway St. Suite 800, San Diego, CA 92101Email : sales@c3semi.com

(888) 882-8689

For recommended applications and more information contact: USA : Sales Support

Speci�cations and availability subject to change. Dimensions are shown for reference purposes only.

3

Air Cooling Heatsink For power semiconductor modules

C3-6-4 Heatsink(Fig.28)

19~ 34 35.9253

Surfacedimension

Applicable casesurface

Sectional area(cm2)

This product applies to600~1200Aelementassemblings,andinverseparallel,seriesconnectionpowersets,windspeed

4m/sec

Application

1090

Perimeter(mm)

8

Weight(kg/m)

C3-6-3-1 Heatsink(Fig.29)

55~ 73 83.2

Applicable caseSurface

Sectional area(cm2)

This product applies to600~1200Aelementassemblings,andinverseparallelconnectionpowersets,andcommon-cathode,common-anodepowersets.wind speed 6m/sec

Application

2152

Perimeter(mm)

100

Surfacedimension

23

Weight(kg/m)

C3-6-1-4 Heatsink(Fig.30)

55~ 73 110

Applicable casesurface

Sectional area(cm2)

2233

Perimeter(mm)

29.7

Weight(kg/m)

9 8

Surfacedimension

This product applies to1200~2000Aelementassemblings,andinverseparallelconnectionpowersets,andcommon-cathode,common-anodepowersets.windspeed 6m/sec

Application

C3-F-12 Heatsink(Fig.31)

19~ 45 6.2306

Surfacedimension

Applicable casesurface

Sectional area(cm2)

This product appliesto 200~400A elementassemblings, andinverse parallelconnection powersets, and common-cathode, common-anode power sets.wind speed

4m/sec

Application

1371

Perimeter(mm)

8.8

Weight(kg/m)

WEB SITE: http://www.C3semi.com

For recommended applications and more information contact: USA : Sales SupportC3 Semiconductors, LLC. 501 West Broadway St, Suite 800, San Diego, CA 92101Email : sales@c3semi.com

(888) 882-8689

For recommended applications and more information contact: USA : Sales Support

C3 Semiconductor, LLC