C3 Semiconductor, LLC - AMS Technologies · 2012. 1. 5. · C3-6-1-4Heatsink(Fig.30) 55~ 73 110...
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Specifications and availability subject to change. Dimensions are shown for reference purposes only. 1 Air Cooling Heatsink For power semiconductor modules Heatsink for power modules Air Cooling Heatsink For modules Only E Series Section Steel Heatsink(Fig.19) 93.3 Module 2540 25.2 Applicabledevice Sectionalarea(cm 2 ) m / g k ( t h g i e W ) Perimeter(mm) N Series Section Steel Heatsink(Fig.21) 29.3 Module 1924 7.95 Applicabledevice Sectionalarea(cm 2 ) m / g k ( t h g i e W ) Perimeter(mm) HS E 300 HS Letter Number 1: Air Cooling Heatsink for modules only 2: Outlook Code 3: Length(mm) 1 2 3 M Series Section Steel Heatsink(Fig.20) 44.45 Module 2 1 2 5 6 1 Applicabledevice Sectionalarea(cm 2 ) m / g k ( t h g i e W ) Perimeter(mm) Y Series Section Steel Heatsink(Fig.22) 77.78 Module 2302 21 Applicabledevice Sectionalarea(cm 2 ) m / g k ( t h g i e W ) Perimeter(mm) C3 Semiconductor, LLC WEB SITE: http://www.C3semi.com For recommended applications and more information contact: USA : Sales Support C3 Semiconductors, LLC. 501 West Broadway St, Suite 800, San Diego, CA 92101 Email : [email protected] (888) 882-8689 For recommended applications and more information contact: USA : Sales Support
Transcript of C3 Semiconductor, LLC - AMS Technologies · 2012. 1. 5. · C3-6-1-4Heatsink(Fig.30) 55~ 73 110...
Speci�cations and availability subject to change. Dimensions are shown for reference purposes only.
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Air Cooling Heatsink For power semiconductor modules
Heatsink for power modules
Air Cooling Heatsink For modules Only
E Series Section Steel Heatsink(Fig.19)
93.3Module 2540 25.2
Applicable device Sectional area(cm2 )m/gk(thgieW) Perimeter(mm)
N Series Section Steel Heatsink(Fig.21)
29.3Module 1924 7.95
Applicable device Sectional area(cm2 )m/gk(thgieW) Perimeter(mm)
HS E 300HS Letter Number
1: Air Cooling Heatsink for modules only2: Outlook Code3: Length(mm)
1 2 3
M Series Section Steel Heatsink(Fig.20)
44.45Module 212561
Applicable device Sectional area(cm2 )m/gk(thgieW) Perimeter(mm)
Y Series Section Steel Heatsink(Fig.22)
77.78Module 2302 21
Applicable device Sectional area(cm2 )m/gk(thgieW) Perimeter(mm)
C3 Semiconductor, LLC
WEB SITE: http://www.C3semi.com
For recommended applications and more information contact: USA : Sales SupportC3 Semiconductors, LLC. 501 West Broadway St, Suite 800, San Diego, CA 92101Email : [email protected]
(888) 882-8689
For recommended applications and more information contact: USA : Sales Support
Speci�cations and availability subject to change. Dimensions are shown for reference purposes only.
2
Air Cooling Heatsink For power semiconductor modules
L Series Section Steel Heatsink(Fig.23)
59.3Module 610803
Applicable device Sectional area(cm2 )m/gk(thgieW) Perimeter(mm)
P Series Section Steel Heatsink(Fig.24)
Applicable device
66.7Module 1205 18.8
Sectional area(cm2 )m/gk(thgieW) Perimeter(mm)
C3-4-4 Heatsink(Fig.25)
34~ 50 9.5315
Surfacedimension
Applicable casesurface
Sectional area(cm2)
Thisproductappliesto600~1200Aelementassemblings,andinverseparallel,seriesconnectionpowersets,wind speed 4m/sec
Application
1513
Perimeter(mm)
9.7
Weight(kg/m)
C3-4-8 Heatsink(Fig.26)
34~ 50 1345
Surfacedimension
Applicable casesurface
Sectional area(cm2)
This product applies to600~1200Aelementassemblings,andinverseparallel,seriesconnectionpowersets,wind speed 4m/sec
Application
1190
Perimeter(mm)
8.4
Weight(kg/m)
C3-4-7 Heatsink(Fig.27)
34~ 55 31.2665
Surfacedimension
Applicable casesurface
Sectional area(cm2)
This product applies to600~1200Aelementassemblings,andinverseparallel,seriesconnectionpowersets,wind speed 4m/sec
Application
2170
Perimeter(mm)
14.4
Weight(kg/m)
C3 Semiconductor, LLC
WEB SITE: http://www.C3semi.com
For recommended applications and more information contact: USA : Sales SupportC3 Semiconductors, LLC. 501 West Broadway St. Suite 800, San Diego, CA 92101Email : [email protected]
(888) 882-8689
For recommended applications and more information contact: USA : Sales Support
Speci�cations and availability subject to change. Dimensions are shown for reference purposes only.
3
Air Cooling Heatsink For power semiconductor modules
C3-6-4 Heatsink(Fig.28)
19~ 34 35.9253
Surfacedimension
Applicable casesurface
Sectional area(cm2)
This product applies to600~1200Aelementassemblings,andinverseparallel,seriesconnectionpowersets,windspeed
4m/sec
Application
1090
Perimeter(mm)
8
Weight(kg/m)
C3-6-3-1 Heatsink(Fig.29)
55~ 73 83.2
Applicable caseSurface
Sectional area(cm2)
This product applies to600~1200Aelementassemblings,andinverseparallelconnectionpowersets,andcommon-cathode,common-anodepowersets.wind speed 6m/sec
Application
2152
Perimeter(mm)
100
Surfacedimension
23
Weight(kg/m)
C3-6-1-4 Heatsink(Fig.30)
55~ 73 110
Applicable casesurface
Sectional area(cm2)
2233
Perimeter(mm)
29.7
Weight(kg/m)
9 8
Surfacedimension
This product applies to1200~2000Aelementassemblings,andinverseparallelconnectionpowersets,andcommon-cathode,common-anodepowersets.windspeed 6m/sec
Application
C3-F-12 Heatsink(Fig.31)
19~ 45 6.2306
Surfacedimension
Applicable casesurface
Sectional area(cm2)
This product appliesto 200~400A elementassemblings, andinverse parallelconnection powersets, and common-cathode, common-anode power sets.wind speed
4m/sec
Application
1371
Perimeter(mm)
8.8
Weight(kg/m)
WEB SITE: http://www.C3semi.com
For recommended applications and more information contact: USA : Sales SupportC3 Semiconductors, LLC. 501 West Broadway St, Suite 800, San Diego, CA 92101Email : [email protected]
(888) 882-8689
For recommended applications and more information contact: USA : Sales Support
C3 Semiconductor, LLC
