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Budapest University of Technology and Economics

Department of Electron Devices

eet.bme.hu

Electronics, microelectronics, nanoelectronics, …

Part II

Mizsei, János www.eet.bme.hu

© BME Department of Electron Devices, 2012.eet.bme.hu February 6, 2013

© BME Department of Electron Devices, 2012.eet.bme.hu February 6, 2013

© BME Department of Electron Devices, 2012.eet.bme.hu February 6, 2013

© BME Department of Electron Devices, 2012.eet.bme.hu February 6, 2013

Outlinenanoscale effects•3-2-1-0 dimensions•atomic scales: different transport mechanisms (thermal, electrical, mechanical)

technology at nanoscale•lithography by nanoballs•nanoimprint•Langmuir-Blodgett technology•MBE – molecular beam epitaxy•FIB – focused ion beam •AFM, STM processes

nanoscale devices•QWFET•single electron devices•nanotubes •nanorelays •organic molecular integrated circuits •vacuum-electronics•spintronics •kvantum-computing•oxide electronics •thermal computing

© BME Department of Electron Devices, 2012.eet.bme.hu

Nanoscale effects

February 6, 2013

• density of states for 3

2 1 0 dimension objects

• tunnelling

• surface/interface scattering

• ballistic transport

© BME Department of Electron Devices, 2012.eet.bme.hu

Technologies at nanoscale

February 6, 2013

•lithography by nanoballs•nanoimprint•Langmuir-Blodgett technology•MBE – molecular beam epitaxy•FIB – focused ion beam •AFM, STM processes

© BME Department of Electron Devices, 2012.eet.bme.hu

Lithography by nanoballs

© BME Department of Electron Devices, 2012.eet.bme.hu

Nanoimprint

February 6, 2013

© BME Department of Electron Devices, 2012.eet.bme.hu

Nanoimprint

© BME Department of Electron Devices, 2012.eet.bme.hu

Langmuir-Blodgett technology

February 6, 2013

for molecular monolayer

© BME Department of Electron Devices, 2012.eet.bme.hu

MBE – molecular beam epitaxy

February 6, 2013

Computer controlled evaporation (PVD)

© BME Department of Electron Devices, 2012.eet.bme.hu

MBE – molecular beam epitaxy

© BME Department of Electron Devices, 2012.eet.bme.hu

FIB – focused ion beam

© BME Department of Electron Devices, 2012.eet.bme.hu

FIB – focused ion beam

Applications of FIB:

•cross-sectional imaging through semiconductor devices (or any layered structure)•modification of the electrical routing on semiconductor devices•failure analysis•preparation for physico-chemical analysis•preparation of specimens for transmission electron microscopy (TEM) or other analysis•micro-machining•mask repair

© BME Department of Electron Devices, 2012.eet.bme.hu

FIB – focused ion beam

FIB drilled nanohole for thermal nanoswitch with Pt overlayer

© BME Department of Electron Devices, 2012.eet.bme.hu

AFM processes

February 6, 2013

Hotplate for AFM excited agglomeration and peel off

Nanostructures by AFM tip excitation of hot (120 oC) silver nanolayers

© BME Department of Electron Devices, 2012.eet.bme.hu

AFM processes

February 6, 2013

Quantum corall by AFM tip (Fe on Cu surface)

© BME Department of Electron Devices, 2012.eet.bme.hu

AFM processes: anodic oxidation by AFM tip

February 6, 2013

© BME Department of Electron Devices, 2012.eet.bme.hu

Microscopic charges on SiO2

surfaces

100 nm native oxideoxide

Si: P type, <100>, 10 ohmcm

© BME Department of Electron Devices, 2012.eet.bme.hu

Charging process:(AFM, “conducting wire”)

Measuring process:Measuring process:(Kelvin electric force microscopy)(Kelvin electric force microscopy)

Low resolution, compared to the charging process !

© BME Department of Electron Devices, 2012.eet.bme.hu

11:30:29 AM Fri Aug 19 2005

04:11:07 PM Thu Aug 18 2005 04:11:07 PM Thu Aug 18 2005

3 V

2

1

-1

-2

-3

3 V

2

1

-1

-2

-3

© BME Department of Electron Devices, 2012.eet.bme.hu

04:11:07 PM Thu Aug 18 2005 04:11:07 PM Thu Aug 18 2005

11:30:29 AM Fri Aug 19 2005

3 V

2

1

-1

-2

-3

3 V

2

1

-1

-2

-3

Only after 300 C heat treatment !

© BME Department of Electron Devices, 2012.eet.bme.hu

Microscopic charge on the SiO2

surface

Extremely high and inhomogeneous electric field:

700000V/m

© BME Department of Electron Devices, 2012.eet.bme.hu

Nanoscale devices

February 6, 2013

• QWFET• single electron devices• nanotubes • nanorelays • organic molecular

integrated circuits • vacuum-electronics• spintronics • oxide electronics • thermal computing

© BME Department of Electron Devices, 2012.eet.bme.hu

QWFET – quantum well fet

• low bandgap enables lower supply voltage

• higher bangap substrate helps to keep electrons in the channel

• higher mobility results in higher current

Schottky-barrier type (depletion) device

© BME Department of Electron Devices, 2012.eet.bme.hu

QWFET

Problematic point: compound semiconductor in Si based technology

© BME Department of Electron Devices, 2012.eet.bme.hu

Advantages of QWFET

higher speed at lower power dissipation

© BME Department of Electron Devices, 2012.eet.bme.hu

Single electron transistor - SET

© BME Department of Electron Devices, 2012.eet.bme.hu

Fabrication of SET by STM tip anodisation

© BME Department of Electron Devices, 2012.eet.bme.hu

Single electron devices: charge-memorySET read-out

February 6, 2013

•50 nm head-

surface distance

•~10 nm grain

size

•~10 Terabit/inch2

© BME Department of Electron Devices, 2012.eet.bme.hu

Carbon

diamond

graphite

February 6, 2013

© BME Department of Electron Devices, 2012.eet.bme.hu

Graphene, carbon nanotubes

© BME Department of Electron Devices, 2012.eet.bme.hu

Carbon nanotubes as quantum wires

density of states depending of chirality

© BME Department of Electron Devices, 2012.eet.bme.hu

Carbon nanotube devices: CNT

© BME Department of Electron Devices, 2012.eet.bme.hu

Micro-, and nanorelays

Nanorelays

nanorelays: instable mechanical movement, stick down

© BME Department of Electron Devices, 2012.eet.bme.hu

Atom relay transistor (ART)

Molecular single electron switching transistor (MOSES)

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Organic molecular integrated circuits

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Organic molecular integrated circuits

~100 nm2

© BME Department of Electron Devices, 2012.eet.bme.hu

Organic molecular integrated circuits

Problems with the organic molecular ICs: • technology (it has not been realised until now) • metal contacts and wires (atomic contact)• chemical instability• slow operation depending on number of

electrons/bit ratio

© BME Department of Electron Devices, 2012.eet.bme.hu

Vacuum-electronics: nanosised „Vacuum tube”

Vertical field emission: Lateral field emission:

MOSFET- likegated devices

© BME Department of Electron Devices, 2012.eet.bme.hu

Field emission

by gate control

© BME Department of Electron Devices, 2012.eet.bme.hu

Technology

resist plasma treatment and reflow

© BME Department of Electron Devices, 2012.eet.bme.hu

Characteristics of the nanosised „Vacuum tube”

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Spintronics, Stern-Gerlach experiment

February 6, 2013

© BME Department of Electron Devices, 2012.eet.bme.hu

Spin: Einstein–de Haas effect

Switch on and off with the resonance frequency of the suspended mass

© BME Department of Electron Devices, 2012.eet.bme.hu

GMR - giant magnetoresistance

February 6, 2013

Low resistance high resistance

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Spin- valve MRAM

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Spin- transistor on

February 6, 2013

© BME Department of Electron Devices, 2012.eet.bme.hu

Spin- transistor off

February 6, 2013

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Quantum dot (QD) logika

Inverter

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Oxide electronics

February 6, 2013

© BME Department of Electron Devices, 2012.eet.bme.hu

© BME Department of Electron Devices, 2012.eet.bme.hu 54

S. D. Ha and S. Ramanathan J. Appl. Phys. 110, 071101 (2011)

© BME Department of Electron Devices, 2012.eet.bme.hu

© BME Department of Electron Devices, 2012.eet.bme.hu

(A) In high resistance state, there is a lack ofoxygen vacancies at the interface. Carriers must overcome Schottky barrierto contribute to current. (B) In low resistance state, oxygen vacancies accumulateat the interface, reducing depletion width such that tunneling is possible

Oxygen vacancy drift bipolar switching mechanismfor representative n-type oxide

© BME Department of Electron Devices, 2012.eet.bme.hu

Switchable Pt/TiOx/Pt rectifier

February 6, 2013

Opposite polarityvoltage pulses control location of oxygen vacancies, which determineswhich contact is rectifying and which is Ohmic

© BME Department of Electron Devices, 2012.eet.bme.hu

Experimental demonstration of spike-timing dependentplasticity (STDP) in Pt/Cu2O/W device

Appl. Phys. A, S.-J. Choi, G.-B. Kim, K. Lee, K.-H. Kim, W.-Y.Yang, S. Cho, H.-J. Bae, D.-S. Seo, S.-I. Kim, and K.-J. Lee, Synapticbehaviors of a single metal–oxide–metal resistive device, 102, 1019, 2011

(A) I-V curves of MIM deviceshowing bipolar resistive switching.

(B) For t>0 (pre-synaptic pulsefires before post-synaptic pulse), the synaptic weight increases, while for t<0, the synaptic weight decreases, in accordance with STDP.

© BME Department of Electron Devices, 2012.eet.bme.hu

© BME Department of Electron Devices, 2012.eet.bme.hu

„Nothing beats scaled silicon but nanotechnology can complement”

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Ethical issues concerning the nanotechnology

- „nano” is a good idea and a good word to get money from the government or from the EU

- many nanoobject have not fully been tested, some of them could be dangerous for health (?)

- self replicating nanomachines may live their own life -> catastrophe ?

- …

© BME Department of Electron Devices, 2012.eet.bme.hu

Problems with CMOS

device limits (6 or even more interfaces)

scale down: depletion layers, gate-tunnel current -> direct tunnel distance: 2 nm)

© BME Department of Electron Devices, 2012.eet.bme.hu

Problems with the nano self-replicated machines

Budapest University of Technology and Economics

Department of Electron Devices

eet.bme.hu

End of part II

www.eet.bme.hu