1 11Santa Clara Valley Chapter, Components, Packaging and Manufacturing Technology

www.cpmt.org/scv

• • 

• • 

 

 

 

 

602604

608

606

610

612

518

522

520

516

502504

506

508

510

302304

310

312

314

306

308

202204

208

212

210

214

102104

108

112

110

114

106

3 Core Layers 10 Mask Layers Au Diaphragm Material

Non-Flow PrePreg gap material 2um Diaphragm Thickness 40um Condenser Plate Gap

X-Ray Cross-Section

Frequency (Hz)

Rela

tive

sig

nal (

dB)

Electronics Image sensor

Large diaphragms

     

Sensors -Active & Passive -Electrodes -Metals

Electronics -Thin Film -Organic

Power -Production -Storage -Management

Telemetry -Coupling to skin - Acoustic - Wireless

Materials -Substances -Packaging

Image credit: Adrienne Ho, Eugene Lee, Xiaolong Qiu