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M1D11DMQ M ' $,)2$- ) )6 68 /* 4%' '*6 *./= O= %)/#-/ (%-*.8./(. %) '(%)/. ,)< ,% #'( )%5-.%/8 * '%*-)% -5%) '%*-)% ).1/4/ *- '*((4)%1*). ) )*-(1*) $)*'*#8 '/-%' )#%)-%)# ) *(+4/- %)= %*(%' )#%)-%)# = )/#- 5%. )/ '- *%/8 *5(- MM= NLMQ )5; $ )/-)/ * *+' *./ / #)-/ 8D*- #1'(- )'),,)3; $ )/-)/ * $%)#. *./ / #)-/ 8D*- .#$("- $'- , #("$(" Santa Clara Valley Chapter, Components, Packaging and Manufacturing Technology www.cpmt.org/scv
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1 11Santa Clara Valley Chapter, Components, Packaging and Manufacturing Technology
www.cpmt.org/scv
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3 Core Layers 10 Mask Layers Au Diaphragm Material
Non-Flow PrePreg gap material 2um Diaphragm Thickness 40um Condenser Plate Gap
X-Ray Cross-Section
Frequency (Hz)
Rela
tive
sig
nal (
dB)
Electronics Image sensor
Large diaphragms
Sensors -Active & Passive -Electrodes -Metals
Electronics -Thin Film -Organic
Power -Production -Storage -Management
Telemetry -Coupling to skin - Acoustic - Wireless
Materials -Substances -Packaging
Image credit: Adrienne Ho, Eugene Lee, Xiaolong Qiu