ECB
EML 4561 Introduction to Electronic Packaging W. Kinzy Jones, Professor MME MWF 11:00-11:50 [email protected] 305-393-0506(mobile) 305-348-4663 (office )
1. Interconnection Networks ◦ Terminology, basics, examples Optical Interconnects ◦ Motivation ◦ Architecture examples for Data Centers and HPC ◦
AN OVERVIEW OF ADVANCED ELECTRONIC PACKAGING TECHNOLOGY.pdf
G93427.1 Modeling and Simulation of Conducted and Radiated EMI from HPM and UWB Sources on Printed Circuit Boards and Integrated Circuits A. C. Cangellaris.
Illinois June 20021 Task 2: Modeling and Simulation of Conducted and Radiated EMI from HPM and UWB Sources on PCBs and ICs A. C. Cangellaris and E. Michielssen.
