Seminar Report ‘08
Block-level 3D IC Design with Through-Silicon-Via Planning Dae Hyun Kim, Rasit Onur Topaloglu, and Sung Kyu Lim Department of Electrical and Computer Engineering,
3-Dimensional IC Fabrication and Devices ABSTRACT: 3-D ICS ARE PARTICULARLY SUITED FOR COMBINATIONS OF MEMORY WITH OTHER MEMORY OR LOGIC DEVICES. WITH.
